SXT10A-3-5SA [BOURNS]
SIP Non-Isolated Power Module; SIP的非隔离电源模块
| 型号： | SXT10A-3-5SA |
| 厂家： | 
BOURNS ELECTRONIC SOLUTIONS |
| 描述： | SIP Non-Isolated Power Module |
| 文件： | 总13页 (文件大小：1132K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
■ High reliability
■ Remote on/off
■ Remote sense
Features
■ SIP (Single in-line package)
■ Output voltage programmable from
■ Output overcurrent protection
0.75 Vdc to 3.3 Vdc via external resistor
(non-latching)
■ Overtemperature protection
■ Up to 10 A output current
■ Up to 95 % efficiency
■ Constant switching frequency (300 kHz)
■ Wide operating temperature range
■ Optional sequencing function
■ Small size, low profile, cost-efficient open
frame design
■ Low output ripple and noise
SX(T)10A-3-5SA SIP Non-Isolated Power Module
How to Order
Description
S X (T) 10A - 3-5 S A (-P)
Bourns® SX(T)10A-3-5SA is a non-isolated DC-DC converter
offering designers a cost and space-efficient solution with
standard features such as remote on/off, remote sense, precisely
regulated programmable output voltage, overcurrent and over-
temperature protection, and optional output voltage sequencing.
These modules deliver up to 10 A of output current with full load
efficiency of 95 % at 3.3 V output.
Configuration
S = SIP
Internal Identifier
Identifies Sequencing Pin Function
Output Current (Amps)
Input Voltage (V)
Outputs
S = Single
Output Voltage (V)*
A = Adjustable
Optional Positive On/Off Logic
*Fixed output voltage parts and optional features available; contact factory.
Absolute Maximum Ratings
Stress in excess of absolute maximum ratings may cause permanent damage to the device. Device reliability may be affected if
exposed to absolute maximum ratings for extended time periods.
Characteristic
Min.
-0.3
-40
Max.
5.8
Units
Notes & Conditions
Continuous Input Voltage
Operating Temperature Range
Storage Temperature
Sequencing Function
V
dc
+85
°C
See Thermal Considerations section
-55
+125
°C
-0.3
V , max.
in
V
dc
Electrical Specifications
Unless otherwise specified, specifications apply over all input voltage, resistive load and temperature conditions.
Characteristic
Min.
2.4
-
Nom.
Max.
5.5
Units
Notes & Conditions
≤ V - 0.5 V
Operating Input Voltage
Maximum Input Current
Input No Load Current
V
V
out
dc
in
10.0
A
Over V range, I max, V
= 3.3 V
dc
in out dc
o
V
= 5.0 V , Io = 0 A, mod. enabled,
in
dc
25
30
mA
mA
-V
-V
= 0.75 V
out
out
dc
= 3.3 V
dc
Input Stand-by Current
1.5
mA
V
= 5.0 V , module disabled
in
dc
2
Inrush Transient
0.1
A s
Input Reflected Ripple Current
Input Ripple Rejection
100
30
mAp-p
dB
120 Hz
Caution: The power modules are not internally fused. An external input line time delay fuse with a maximum rating of 15 A is required.
See the Safety Considerations section of this data sheet.
Applications
■ Intermediate Bus architecture
■ Distributed power applications
■ Workstations and servers
■ Telecom equipment
■ Enterprise networks including LANs/WANs
■ Latest generation ICs (DSP, FPGA, ASIC) and microprocessor powered applications
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
1
SX(T)10A-3-5SA SIP Non-Isolated Power Module
Electrical Specifications (Continued)
Characteristic
Min.
-2.0
-3.0
Nom.
Max.
2.0
Units
Notes & Conditions
Output Voltage Setpoint Accuracy
Output Voltage Tolerance
% V
V
min, I max, T = 25 °C
o,set
o,set
in
o
A
3.0
% V
Over all rated in out voltage, load and
temperature conditions
Voltage Adjustment Range
Line Regulation
0.7525
3.63
V
dc
0.3
0.4
0.4
% V
o,set
o,set
o,set
Load Regulation
% V
% V
A
Temperature Regulation
Output Current
0.0
10.0
dc
Output Current Limit Inception (Hiccup Mode)
Output Short Circuit Current
220
3
% I max
o
A
V ≤ 250 mV – Hiccup Mode
dc
o
Output Ripple and Noise Voltage
1 µF ceramic/10 µF tantalum capacitors
RMS
Peak-to-Peak
8
25
15
50
mVrms
mVpk-pk
5 Hz to 20 MHz bandwidth
External Capacitance
- ESR ≥ 1 mΩ
- ESR ≥ 10 mΩ
1000
5000
µF
µF
Efficiency
82.5
88.0
89.5
91.0
93.0
95.0
%
%
%
%
%
%
V
V
V
V
V
V
= 0.75 V
= 1.2 V
o,set
o,set
o,set
o,set
o,set
o,set
dc
dc
(V = 5 V , T = 25 °C, Full Load)
in
dc
A
= 1.5 V
= 1.8 V
= 2.5 V
= 3.3 V
dc
dc
dc
dc
Switching Frequency
300
kHz
Dynamic Load Response
5 A to 10 A; 10 A to 5 A;
(∆i/∆t = 2.5 A/µs; 25 °C)
1 µF ceramic/10 µF tantalum capacitor
Peak Deviation
200
25
mV
µs
Settling Time (V <10 % peak deviation)
o
3 x 100 µF polymer capacitors
5 A to 10 A; 10 A to 5 A;
(∆i/∆t = 2.5 A/µs; 25 °C)
100
100
mV
µs
Peak Deviation
Settling Time (V <10 % peak deviation)
o
General Specifications
Characteristic
Calculated MTBF
Weight
Nom.
Units
Notes & Conditions
13,675,000
hours
5.4
g
(0.19)
(oz.)
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
2
SX(T)10A-3-5SA SIP Non-Isolated Power Module
Feature Specifications
Characteristic
Min.
Nom.
Max.
Units
Notes & Conditions
10 µA max.
Remote Enable
Open = On (Logic Low)
Low = Off (Logic High)
0.4
5.5
V
V
dc
>2.5
1 mA max.
dc
Turn-On Delay and Rise Times
Case 1: On/Off Low – V Applied
Case 2: V Applied, then On/Off Set Low
in
Case 3: Output Voltage Rise
2.5
2.5
3.0
msec
msec
msec
in
(10 %-90 % of V setting)
o
Sequencing Delay Time
10
msec
Delay from V , min. to application of
in
voltage on SEQ pin
Tracking Accuracy
100
200
200
400
mV
mV
Power Up: 2 V/ms
Power Down: 1 V/ms
Output Voltage Overshoot
Remote Sense Range
1
% V
I
max, V =5.5, T =25 °C
in
o, set
o
A
0.5
V
dc
°C
Overtemperature Protection
125
See Thermal Consideration section
Input Undervoltage Lockout
-Turn-on Threshold
-Turn-off Threshold
2.2
2.0
V
V
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
3
SX(T)10A-3-5SA SIP Non-Isolated Power Module
Characteristic Curves
The curves provided below are typical characteristics for the SX(T)10A-3-5SA modules at 25 °C. For any specific test configurations or
any specific test requests, please contact Bourns.
100.0
95.0
90.0
85.0
80.0
100.0
95.0
90.0
85.0
80.0
Vin=5.5 V
Vin=5.0 V
Vin=2.4 V
Vin=5.5 V
Vin=5.0 V
Vin=2.4 V
75.0
70.0
75.0
70.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0
Output Current (A
)
Output Current (A
)
dc
dc
Fig. 4 Efficiency vs. Output Current (V
Fig. 1 Efficiency vs. Output Current (V
= 0.75 V )
dc
out
= 1.8 V
dc
)
out
100.0
95.0
90.0
85.0
80.0
100.0
95.0
90.0
85.0
80.0
Vin=5.5 V
Vin=5.0 V
Vin=2.4 V
Vin=5.5 V
Vin=5.0 V
Vin=3.0 V
75.0
70.0
75.0
70.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0 10.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0 10.0
Output Current (A
)
Output Current (A
)
dc
Fig. 2 Efficiency vs. Output Current (V
dc
Fig. 5 Efficiency vs. Output Current (V
= 1.2 V
dc
)
= 2.5 V
)
out
out
dc
100.0
95.0
90.0
85.0
80.0
100.0
95.0
90.0
85.0
80.0
Vin=5.5 V
Vin=5.0 V
Vin=2.4 V
Vin=5.5 V
Vin=5.0 V
Vin=4.5 V
75.0
70.0
75.0
70.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0 10.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0
Output Current (A
)
Output Current (A
)
dc
Fig. 3 Efficiency vs. Output Current (V
dc
Fig. 6 Efficiency vs. Output Current (V
= 3.3 V
dc
)
= 1.5 V
dc
)
out
out
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
4
SX(T)10A-3-5SA SIP Non-Isolated Power Module
Characteristic Curves (Continued)
12.0
10.0
8.0
6.0
4.0
2.0
Iin, Adc
Vo, Vdc
0.0
-0.5
?
Output Voltage: 200 mVolt 5 µs
Output Current (3.1 A/Div): 2 Volt 5 µs
0.5
1.5
2.5
3.5
4.5
5.5
Input Voltage (V
)
dc
Time (5 µs/div)
Fig. 10 Transient Response - 5 A - 10 A Step
Fig. 7 Input Voltage vs. I and V
o
o
(V = 2.5 V , I = 10.0 A)
dc
o
o
(V = 3.3 V
)
o
dc
No Load: 20 mVolt 2.5 µs
Half Load: 20 mVolt 2.5 µs
Full Load: 20 mVolt 2.5 µs
Output Voltage: 200 mVolt 5 µs
Output Current (3.1 A/Div): 2 Volt 5 µs
Time (2.5 µs/div)
Time (5 µs/div)
Fig. 8 Typical Output Ripple and Noise
Fig. 11 Transient Response - 10 A - 5 A Step
(V = 5.0 V, V = 0.75 V, I = 10.0 A)
(V = 3.3 V
dc
)
in
o
o
o
No Load: 20 mVolt 2.5 µs
Half Load: 20 mVolt 2.5 µs
Full Load: 20 mVolt 2.5 µs
Output Voltage: 200 mVolt 5 µs
Output Current (3.1 A/Div): 2 Volt 5 µs
Time (2.5 µs/div)
Fig. 9 Typical Output Ripple and Noise
Time (5 µs/div)
Fig. 12 Transient Response - 5 A - 10 A Step
(V = 5.0 V, V = 3.3 V, I = 10.0 A)
in
o
o
(V = 3.3 V , C
dc ext
= 3x100 µF Polymer Capacitors)
o
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
5
SX(T)10A-3-5SA SIP Non-Isolated Power Module
Characteristic Curves (Continued)
?
Output Voltage:
500 mVolt 1 ms
Input Voltage:
2 Volt 1 ms
Output Voltage: 100 mVolt 10 µs
Output Current (3.1 A/Div): 2 Volt 10 µs
Time (1 ms/div)
Fig. 16 Typical Start-up with Application of V
Time (10 µs/div)
Fig. 13 Transient Response - 10 A - 5 A Step
in
(V = 5 V , V = 3.3 V , I = 10 A)
in dc dc
(V = 3.3 V , C
dc ext
= 3x100 µF Polymer Capacitors)
o
o
o
Output Current:
500 mVolt 1 ms
On/Off Voltage:
2 Volt 1 ms
Output Voltage: 500 mVolt 1 ms
On/Off Voltage: 2 Volt 1 ms
Time (1 ms/div)
Fig. 17 Typical Start-up using Remote On/Off with Prebias
(V = 5 V , V = 3.3 V , I = 1 A, V = 1 V
Time (1 ms/div)
Fig. 14 Typical Start-up using Remote On/Off
)
(V = 5 V , V = 3.3 V , I = 10 A)
in dc dc bias dc
o
o
in
dc
o
dc o
Output Voltage:
500 mVolt 1 ms
On/Off Voltage:
2 Volt 1 ms
Output Current (4 A/div): 20 mVolt 5 ms
Time (5 ms/div)
Time (1 ms/div)
Fig. 15 Typical Start-up using Remote On/Off
with Low-ESR External Capacitors (100x100 µF Polymer)
(V = 5.0 V , V = 3.3 V , I = 10.0 A, C = 1000 µF)
Fig. 18 Output Short Circuit Current
(V = 5.0 V , V = 0.75 V
)
in dc dc
o
in dc dc
o
o
o
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
6
SX(T)10A-3-5SA SIP Non-Isolated Power Module
Characteristic Curves (Continued)
12
12
100 LFM
0 LFM
100 LFM
0 LFM
10
8
10
8
6
6
3
3
2
2
0
0
15 25 35 45 55 65 75 85
Ambient Temperature (°C)
15 25 35 45 55 65 75 85
Ambient Temperature (°C)
Fig. 19 Derating Output Current vs.
Local Ambient Temp. and Airflow
Fig. 22 Derating Output Current vs.
Local Ambient Temp. and Airflow
(V = 5.0 V , V = 0.75 V
in dc dc
)
(V = 5.0 V , V = 3.3 V
in dc dc
)
o
o
12
12
100 LFM
0 LFM
10
8
10
8
0 LFM
6
6
3
3
2
2
0
0
15 25 35 45 55 65 75 85
Ambient Temperature (°C)
15 25 35 45 55 65 75 85
Ambient Temperature (°C)
Fig. 20 Derating Output Current vs.
Local Ambient Temp. and Airflow
Fig. 23 Derating Output Current vs.
Local Ambient Temp. and Airflow
(V = 5.0 V , V = 1.8 V
)
in
dc
o
dc
(V = 3.3 V , V = 2.5 V )
in dc dc
o
12
100 LFM
10
8
0 LFM
6
3
2
0
15 25 35 45 55 65 75 85
Ambient Temperature (°C)
Fig. 21 Derating Output Current vs.
Local Ambient Temp. and Airflow
(V = 5.0 V , V = 2.5 V
in dc dc
)
o
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
7
SX(T)10A-3-5SA SIP Non-Isolated Power Module
Operating Information
Remote On/Off
The SX(T)10A-3-5SA comes standard with Active LOW Negative On/Off logic, i.e., OPEN or LOW (< 0.4 V) will turn ON the device.
To turn the device OFF, increase the voltage level on the On/Off pin above 2.4 V, as shown in Figure 24(a), placing the part into low
dissipation sleep mode.
The SX(T)10A-3-5SA-P comes with Active HIGH Positive On/Off logic, i.e., OPEN or HIGH (>2.4 V) will turn on the device. To turn OFF,
decrease the voltage level on the On/Off pin below 0.4 V.
The signal levels of the On/Off pin input is defined with respect to ground.
Fig. 24(a) Circuit Configuration for using
Negative Logic On/Off
Fig. 24(b) Circuit Configuration for using
Positive On/Off
Input Considerations
The input must have a stable low impedance AC source for optimum performance. This can be accomplished with external ceramic
capacitors, tantalum capacitors and/or polymer capacitors. Using low impedance tantalum capacitors requires about 20 µF per amp
and an ESR of 250 mΩ per amp of output current. Tantalum capacitors with a combined value of 200 µF and less than 25mΩ ESR
would be adequate. This can be implemented with (2) 100 µF tantalum capacitors with an ESR less than of 50mΩ. Ceramic capacitors
are also recommended to reduce high frequency ripple on the input.
Output Considerations
To maintain the specified output ripple and transient response, external capacitors must be used. An external 1 µF ceramic capacitor in
parallel with a 10 µF low ESR tantalum capacitor will usually meet the specified performance. Improved performance can be achieved
by using more capacitance. Low ESR polymer capacitors may also be used. Two 100 µF, 9 mΩ or lower ESR capacitors are
recommended.
Safety Information
In order to comply with safety requirements the user must provide a fuse in the unearthed input line. This is to prevent earth being
disconnected in the event of a failure.
The converter must be installed as per guidelines outlined by the various safety approvals if safety agency approval is required for the
overall system. The positive input lead must be provided with a time-delay fuse with a maximum rating of 15 A.
Overtemperature Protection
The device will shut down if it becomes too hot (typically 125 °C). Once the converter cools, it automatically restarts. This feature does
not guarantee the converter won’t be damaged by temperatures above its rating.
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
8
SX(T)10A-3-5SA SIP Non-Isolated Power Module
Operating Information (Continued)
Overcurrent Protection
The device has an internally set output current limit to protect it from overloads, placing the unit in hiccup mode. Once the overload is
removed the converter automatically resumes normal operation. No user adjustments are available. An external fuse in series with the
input voltage is also required for complete overload protection.
Input Undervoltage Lockout
The device operation is disabled if the input voltage drops below the specified input range. Once the input returns to the specified
range operation automatically resumes. No user adjustments are available.
Output Voltage Setting
The output voltage can be programmed to any voltage between 0.75 Vdc and 3.3 Vdc by connecting a single resistor between the trim
pin and the GND pin of the module, as shown in Fig. 25 below.
If left open circuit the output voltage will default to 0.75 Vdc. The correct Rtrim value for a specific voltage can be calculated using the
following equation:
VIN (+)
VO (+)
Rtrim = [21.07/(Vo-0.7525)-5.11] KΩ
For example, to set the SX(T)10A-3-5SA to 3.3 V the following
Rtrim resistor must be used:
LOAD
ON/OFF
TRIM
Rtrim
Rtrim = [21.07/(3.3-0.7525)-5.11] KΩ
GND
Rtrim = 3.161 kΩ,
The closest standard 1 % E96 value is 3.16 kΩ.
Fig. 25 Circuit Configuration to Program Output
Voltage using an External Resistor
Table 1 provides the Rtrim values required for some common output
voltage set points. The nearest standard E96 1 % resistor value is also given.
SX(T)10A-3-5SA Rtrim Values
Vo (V)
0.75
1.0
Rtrim (kΩ)
Open
1 % Value
Open
80.6
80.02
1.2
41.97
42.2
1.5
23.08
23.2
1.8
15.00
15.0
2.0
11.78
11.8
2.5
6.947
6.98
3.3
3.161
3.16
Table 1
The output voltage of the device can also be set by applying a voltage between the TRIM and GND pins. The Vtrim equation can be
written as follows:
Vtrim = (0.7 – 0.1698 x{Vo – 0.7225))
To set Vo = 3.3 V, the Vtrim required would therefore be 0.2670 V.
Table 2 provides the Vtrim values required for some common output voltage set points.
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
9
SX(T)10A-3-5SA SIP Non-Isolated Power Module
Operating Information (Continued)
SX(T)10A-3-5SA Vtrim Values
Vo (V)
0.75
1.0
Vtrim (V)
Open
0.6580
0.6240
0.5731
0.5221
0.4882
0.4033
0.2674
1.2
1.5
1.8
2.0
2.5
3.3
Table 2
Voltage Margining
Output voltage margining can be implemented as follows and as shown in Figure 26.
1) Trim-up: Connect a resistor, Rm-up, from the Trim pin to the ground pin for adjusting the voltage upwards, and
2) Trim-down: Connect a resistor, Rm-down, from the Trim pin to the output pin for adjusting the voltage downwards.
Please consult your local Bourns field applications engineer for more details and the calculation of the required resistor values.
Vo
Vo
Vin
R
margin-down
Q2
Trim
On/Off
R
margin-up
R
trim
Q1
COM
Fig. 26 Circuit Configuration for Margining Output Voltage
Sequencing Function
Bourns XT Series modules have a sequencing feature that enables users to implement various types of output voltage sequencing in
their applications. When an analog voltage is applied to the SEQ pin, the output voltage tracks this voltage until the output reaches the
set-point voltage. The final SEQ pin voltage must be set higher than the set-point voltage of the module. The output voltage follows the
voltage on the SEQ pin on a one-to-one basis. By connecting multiple modules together, customers can get multiple modules to track
their output voltages to the voltage applied on the SEQ pin.
For proper voltage sequencing, the input voltage is applied to the module. The On/Off pin should be set so as the module is ON by
default. An analog voltage is applied to the SEQ pin and the output voltage of the module will track this voltage on a 1:1 basis until
output reaches the set-point voltage, as shown in Figure 27.
To initiate simultaneous shutdown of the modules, the SEQ pin voltage is lowered in a controlled manner. Output voltage of the
modules tracks the voltages below their set-point voltages on a one-to-one basis, as shown in Figure 28. A valid input voltage must be
maintained until the tracking and output voltages reach ground potential to ensure a controlled shutdown of the modules.
When not using the sequencing feature, tie the SEQ pin to V . For additional guidelines please contact your local Bourns field
out
applications engineer.
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
10
SX(T)10A-3-5SA SIP Non-Isolated Power Module
Operating Information (Continued)
Vo: 1 Volt 1 ms
Vseq: 1 Volt 1 ms
Vo: 1 Volt 500 µs
Vseq: 1 Volt 500 µs
Time (0.5 ms/div)
Time (0.5 ms/div)
Fig. 28 Voltage Sequencing at Power Down
Fig. 27 Voltage Sequencing at Power Up
(V = 5.0 V , V = 3.3 V , I = 10.0 A)
(V = 5.0 V , V = 3.3 V , I = 10.0 A)
in
dc
o
dc o
in
dc
o
dc o
Remote Sense
The Remote Sense feature is used to minimize the effects of distribution losses by regulating the voltage at the Remote Sense pin (See
Figure 29). The voltage between the Sense pin and V pin must not exceed 0.5 V.
o
When the Remote Sense feature is not being used, connect the Remote Sense pin to the output pin of the module.
It is very important to make sure that the maximum output power (V x I ) of the module remains less than or equal to the maximum
o
o
rated power. Using Remote Sense, the output voltage of the module can increase, which may increase the power output by the module.
Rdistribution
Rcontact
Rdistribution Rcontact
V (+) Vo
IN
Sense
RLOAD
R
Rdistribution
Rcontact
distribution Rcontact
COM
Fig. 29 Remote Sense Circuit Configuration
Thermal Considerations
Sufficient cooling must always be considered to ensure reliable operation, as these devices operate in a variety of thermal environments.
Factors such as ambient temperature, airflow, power dissipation and reliability must be taken into consideration.
The data presented in Figures 19 to 23 is based on physical test results taken in a wind tunnel test. The test set-up is shown in
Figure 31.
The thermal reference points are (1) T
and T
ref2
as shown in Figure 30, and (2) T = temperature at controller IC. For reliable
ref3
ref1
operation, none of these T points should exceed 115 °C.
ref
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
11
SX(T)10A-3-5SA SIP Non-Isolated Power Module
Thermal Considerations (Continued)
Air
Flow
WIND TUNNEL
Airflow and ambient
temp sensor probes
location
Air Flow
Tref1 Tref2
Q1
UNIT UNDER TEST
Q2
C4 C5 C6
L1
C2
C1
C3
PCB
Fig. 30 T
ref1
Temperature Measurement Location
Fig. 31
Thermal Test Set-up
Product Dimensions
FRONT VIEW (INDUCTOR SIDE)
SIDE VIEW
50.8
(2.00)
7.43
(0.293)
6.96
(0.274)
MAX.
REF.
12.7
(0.50) (0.485)
12.32
L1 (REF.)
11 PINS
0.64 0.38
(0.025) (0.015)
X
1
2
3
4
5
6
7
8
B*
9
10
7.6
(0.30)
1.28
(0.050)
0.64
(0.025)
6.32
(0.249)
2.54
(0.100)
5.08
(0.200)
7.62
(0.300)
DIMENSIONS:
MM
(INCHES)
10.16
(0.400)
35.56
(1.400)
38.10
(1.500)
TOLERANCES:
DECIMAL .X –
40.64
(1.600)
0.5
(0.02)
43.18
(1.700)
0.25
DECIMAL .XX –
(0.010)
45.72
(1.800)
48.26
(1.900)
Fig. 32 Product Dimensions
*Pin Stuffed with SXT10A option only, absent with SX10A standard
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
12
SX(T)10A-3-5SA SIP Non-Isolated Power Module
Recommended Hole Pattern
48.26
(1.900)
PIN
FUNCTION
45.72
(1.800)
1
VOUT
VOUT
SENSE
VOUT
GND
2
43.18
(1.700)
3
40.64
(1.600)
4
5
38.10
(1.500)
6
GND
35.56
(1.400)
7
VIN
10.16
(0.400)
8
VIN
B (optional)
SEQ
7.62
(0.300)
THROUGH-HOLE
PLATED
1.09
9
TRIM
ON/OFF
5.08
(0.200)
10
(0.043)
2.54
(0.100)
BOTH SIDES
PAD SIZE
1.63
DIMENSIONS:
MM
(INCHES)
1.27
(0.050)
(0.064)
OUTLINE AREA
1
2
3
4
5
6
7
8
B*
9
10
1.3
7.9
(0.05)
(0.31)
50.8
(2.00)
*Hole required with SXT10A option only, not required with SX10A standard
Fig. 33 Recommended Hole Pattern
Asia-Pacific:
Europe:
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
LONGFORM REV. A 07/06
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
13
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