TIPP112LPR [BOURNS]

2000mA, 100V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-226AA, PLASTIC, TO-92, 3 PIN;


型号：	TIPP112LPR
厂家：	BOURNS ELECTRONIC SOLUTIONS
描述：	2000mA, 100V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-226AA, PLASTIC, TO-92, 3 PIN 晶体管
文件：	总6页 (文件大小：87K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TIPP110, TIPP111, TIPP112

NPN SILICON POWER DARLINGTONS

MAY 1989 - REVISED MARCH 1997

●

20 W Pulsed Power Dissipation

100 V Capability

LP PACKAGE

(TOP VIEW)

2 A Continuous Collector Current

4 A Peak Collector Current

MDTRAB

absolute maximum ratings at 25°C case temperature (unless otherwise noted)

RATING

SYMBOL

VALUE

UNIT

TIPP110

TIPP111

TIPP112

TIPP110

TIPP111

TIPP112

Collector-base voltage (I_E= 0)

Collector-emitter voltage (I_B= 0)

V_CBO

100

V_CEO

100

Emitter-base voltage

V_EBO

I_C

I_CM

I_B

Continuous collector current

Peak collector current (see Note 1)

Continuous base current

°C

Continuous device dissipation at (or below) 25°C case temperature (see Note 2)

Pulsed power dissipation (see Note 3)

P_tot

P_T

0.8

Operating junction temperature range

T_j

-55 to +150

260

Storage temperature range

T_stg

T_L

Lead temperature 3.2 mm from case for 10 seconds

NOTES: 1. This value applies for t_p£ 0.3 ms, duty cycle £ 10%.

2. Derate linearly to 150°C case temperature at the rate of 0.32 W/°C.

3. V_CE= 20 V, I_C= 1 A, P_W= 10 ms, duty cycle £ 2%.

P R O D U C T

I N F O R M A T I O N

Information is current as of publication date. Products conform to specifications in accordance

with the terms of Power Innovations standard warranty. Production processing does not

necessarily include testing of all parameters.

TIPP110, TIPP111, TIPP112

NPN SILICON POWER DARLINGTONS

MAY 1989 - REVISED MARCH 1997

electrical characteristics at 25°C case temperature

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

TIPP110

TIPP111

TIPP112

TIPP110

TIPP111

TIPP112

TIPP110

TIPP111

TIPP112

Collector-emitter

V_(BR)CEO

I_C

10 mA

I_B= 0

breakdown voltage

(see Note 4)

100

V_CE

30 V

40 V

50 V

60 V

80 V

_BE= 0

Collector-emitter

cut-off current

I_CEO

V_BE= 0

_B= 0

Collector-base

cut-off current

I_CBO

I_B= 0

V_CE= 100 V

Emitter cut-off

current

I_EBO

h_FE

V_CE(sat)

V_BE

V_EB

5 V

I_C= 0

Forward current

transfer ratio

Collector-emitter

saturation voltage

Base-emitter

voltage

V_CE

4 V

_C= 1 A

1000

500

(see Notes 4 and 5)

I_C= 2 A

I_B

V_CE

I_E

8 mA

4 V

I_C= 2 A

2.5

2.8

3.5

I_C= 2 A

I_B= 0

Parallel diode

forward voltage

V_EC

4 A

NOTES: 4. These parameters must be measured using pulse techniques, t_p= 300 µs, duty cycle £ 2%.

5. These parameters must be measured using voltage-sensing contacts, separate from the current carrying contacts and located

within 3.2 mm from device body.

P R O D U C T

I N F O R M A T I O N

TIPP110, TIPP111, TIPP112

NPN SILICON POWER DARLINGTONS

MAY 1989 - REVISED MARCH 1997

MECHANICAL DATA

LP003 (TO-92)

3-pin cylindical plastic package

This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic

compound. The compound will withstand soldering temperature with no deformation, and circuit performance

characteristics will remain stable when operated in high humidity conditions. Leads require no additional

cleaning or processing when used in soldered assembly.

LP003 Falls Within JEDEC

TO-226AA Dimensions

LP003 (TO-92)

5,21

4,44

4,19

3,17

3,43 MIN.

2,67

2,03

2,67

2,03

5,34

4,32

Seating Plane

1,27

(see Note A)

12,7 MIN.

0,56

0,40

1,40

1,14

0,41

0,35

2,67

2,41

ALL LINEAR DIMENSIONS IN MILLIMETERS

NOTE A: Lead dimensions are not controlled in this area.

MDXXAX

P R O D U C T

I N F O R M A T I O N

TIPP110, TIPP111, TIPP112

NPN SILICON POWER DARLINGTONS

MAY 1989 - REVISED MARCH 1997

MECHANICAL DATA

LP003 (TO-92)

3-pin cylindical plastic package

This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic

compound. The compound will withstand soldering temperature with no deformation, and circuit performance

characteristics will remain stable when operated in high humidity conditions. Leads require no additional

cleaning or processing when used in soldered assembly.

LP003 (TO-92) - Formed Leads Version

LP003 Falls Within JEDEC

TO-226AA Dimensions

5,21

4,44

4,19

3,17

3,43 MIN.

2,67

2,03

2,67

2,03

5,34

4,32

4,00 MAX.

0,56

0,40

2,90

2,40

0,41

0,35

2,90

2,40

ALL LINEAR DIMENSIONS IN MILLIMETERS

MDXXAR

P R O D U C T

I N F O R M A T I O N

TIPP110, TIPP111, TIPP112

NPN SILICON POWER DARLINGTONS

MAY 1989 - REVISED MARCH 1997

MECHANICAL DATA

LPR

tape dimensions

LP Package (TO-92) Tape (Formed Lead Version)

5,21

4,44

4,19

3,17

3,43 MIN.

2,67

2,03

2,67

2,03

5,34

4,32

4,00 MAX.

0,56

0,41

0,35

0,40

13,70

11,70

0,50

0,00

32,00

23,00

2,50 MIN.

27,68

17,66

16,50

15,50

11,00

8,50

9,75

8,50

19,00

5,50

19,00

17,50

2,90

2,40

4,30

3,70

2,90

2,40

6,75

5,95

13,00

12,40

ALL LINEAR DIMENSIONS IN MILLIMETERS

MDXXAS

P R O D U C T

I N F O R M A T I O N

TIPP110, TIPP111, TIPP112

NPN SILICON POWER DARLINGTONS

MAY 1989 - REVISED MARCH 1997

IMPORTANT NOTICE

Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any

semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the

information being relied on is current.

PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in

accordance with PI's standard warranty. Testing and other quality control techniques are utilized to the extent PI

deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily

performed, except as mandated by government requirements.

PI accepts no liability for applications assistance, customer product design, software performance, or infringement

of patents or services described herein. Nor is any license, either express or implied, granted under any patent

right, copyright, design right, or other intellectual property right of PI covering or relating to any combination,

machine, or process in which such semiconductor products or services might be or are used.

PI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE

SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS.

P R O D U C T

I N F O R M A T I O N

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