TISP4250M3BJ [BOURNS]

BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS; 双向晶闸管过电压保护
TISP4250M3BJ
型号: TISP4250M3BJ
厂家: BOURNS ELECTRONIC SOLUTIONS    BOURNS ELECTRONIC SOLUTIONS
描述:

BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
双向晶闸管过电压保护

文件: 总15页 (文件大小:388K)
中文:  中文翻译
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TISP4070M3BJ THRU TISP4115M3BJ,  
TISP4125M3BJ THRU TISP4220M3BJ,  
TISP4240M3BJ THRU TISP4400M3BJ  
BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS  
TISP4xxxM3BJ Overvoltage Protector Series  
TISP4xxxM3BJ Overview  
This TISP® device series protects central office, access and customer premise equipment against overvoltages on the telecom line. The  
TISP4xxxM3BJ is available in a wide range of voltages and has a medium current capability. These protectors have been specified mindful of  
the following standards and recommendations: GR-1089-CORE, FCC Part 68, UL1950, EN 60950, IEC 60950, ITU-T K.20, K.21 and K.45. The  
TISP4350M3BJ meets the FCC Part 68 “B” ringer voltage requirement (V  
= ±275 V) and survives the Type B impulse tests. For FCC Part  
68 ADSL applications, the TISP4360H3BJ is recommended. The TISP4360H3BJ has an extra 15 V in working level (V = ±290 V) to avoid  
DRM  
DRM  
clipping the ADSL signal during ringing peaks. The TISP4xxxM3BJ series is housed in a surface mount SMB (DO-214AA) package.  
Summary Electrical Characteristics  
V
V
V @ I  
T
I
I
I
I
H
C @ -2 V  
o
Functionally  
Replaces  
P0640SA†  
P0720SA†  
P0900SA†  
P1100SA†  
DRM  
V
(BO)  
V
T
DRM  
µA  
(BO)  
T
Part #  
V
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
mA  
600  
600  
600  
600  
600  
600  
600  
600  
600  
600  
600  
600  
600  
600  
600  
600  
600  
600  
600  
A
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
mA  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
150  
pF  
72  
72  
72  
72  
52  
52  
52  
52  
52  
52  
42  
42  
42  
42  
42  
42  
42  
42  
42  
TISP4070M3  
TISP4080M3  
TISP4095M3  
TISP4115M3  
TISP4125M3  
TISP4145M3  
TISP4165M3  
TISP4180M3  
TISP4200M3  
TISP4220M3  
TISP4240M3  
TISP4250M3  
TISP4265M3  
TISP4290M3  
TISP4300M3  
TISP4350M3  
TISP4360M3  
TISP4395M3  
TISP4400M3  
58  
65  
75  
90  
70  
80  
95  
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
115  
125  
145  
165  
180  
200  
220  
240  
250  
265  
290  
300  
350  
360  
395  
400  
100  
120  
135  
145  
155  
160  
180  
190  
200  
220  
230  
275  
290  
320  
300  
P1300SA†  
P1500SA  
P1800SA  
P2300SA†  
P2600SA†  
P3100SA  
P3500SA†  
† Bourns part has an improved protection voltage  
Summary Current Ratings  
Parameter  
I
I
di/dt  
TSP  
A
TSM  
A
A/µs  
Waveshape  
Value  
2/10  
300  
1.2/50, 8/20  
220  
10/160  
120  
5/320  
100  
10/560  
75  
10/1000  
50  
1 cycle 60 Hz 2/10 Wavefront  
32 300  
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex  
NOVEMBER 1997 - REVISED FEBRUARY 2005  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP4xxxM3BJ Overvoltage Protector Series  
ITU-T K.20/21/44/45 rating ...............4 kV 10/700, 100 A 5/310  
SMBJ Package (Top View)  
Ion-Implanted Breakdown Region  
Precise and Stable Voltage  
Low Voltage Overshoot under Surge  
T(A)  
R(B) 1  
2
V
V
DRM  
(BO)  
Device  
V
V
MDXXBGE  
‘4070  
‘4080  
‘4095  
‘4115  
‘4125  
‘4145  
‘4165  
‘4180  
‘4200  
‘4220  
‘4240  
‘4250  
‘4265  
‘4290  
‘4300  
‘4350  
‘4360  
‘4395  
‘4400  
58  
65  
75  
90  
70  
80  
Device Symbol  
95  
T
115  
125  
145  
165  
180  
200  
220  
240  
250  
265  
290  
300  
350  
360  
395  
400  
100  
120  
135  
145  
155  
160  
180  
190  
200  
220  
230  
275  
290  
320  
300  
SD4XAA  
R
Terminals T and R correspond to the  
alternative line designators of A and B  
Rated for International Surge Wave Shapes  
I
TSP  
Wave Shape  
Standard  
A
2/10 µs  
8/20 µs  
GR-1089-CORE  
IEC 61000-4-5  
FCC Part 68  
300  
220  
120  
100  
75  
10/160 µs  
10/700 µs  
10/560 µs  
10/1000 µs  
ITU-T K.20/21/45  
FCC Part 68  
Low Differential Capacitance .................................39 pF max.  
GR-1089-CORE  
50  
®
............................................ UL Recognized Component  
Description  
These devices are designed to limit overvoltages on the telephone line. Overvoltages are normally caused by a.c. power system or lightning  
flash disturbances which are induced or conducted on to the telephone line. A single device provides 2-point protection and is typically used  
for the protection of 2-wire telecommunication equipment (e.g. between the Ring and Tip wires for telephones and modems). Combinations of  
devices can be used for multi-point protection (e.g. 3-point protection between Ring, Tip and Ground).  
The protector consists of a symmetrical voltage-triggered bidirectional thyristor. Overvoltages are initially clipped by breakdown clamping until  
the voltage rises to the breakover level, which causes the device to crowbar into a low-voltage on state. This low-voltage on state causes the  
current resulting from the overvoltage to be safely diverted through the device. The high crowbar holding current prevents d.c. latchup as the  
diverted current subsides.  
How To Order  
For Standard  
Termination Finish Termination Finish  
Order As Order As  
For Lead Free  
Device  
Package  
Carrier  
Embossed Tape Reeled TISP4xxxM3BJR TISP4xxxM3BJR-S  
TISP4xxxM3BJ BJ (J-Bend DO-214AA/SMB)  
Bulk Pack  
TISP4xxxM3BJ  
TISP4xxxM3BJ-S  
Insert xxx value corresponding to protection voltages of 070, 080, 095, 115, etc.  
NOVEMBER 1997 - REVISED FEBRUARY 2005  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP4xxxM3BJ Overvoltage Protector Series  
Description (continued)  
The TISP4xxxM3BJ range consists of nineteen voltage variants to meet various maximum system voltage levels (58 V to 320 V). They are  
guaranteed to voltage limit and withstand the listed international lightning surges in both polarities. These medium (M) current protection  
devices are in a plastic package SMBJ (JEDEC DO-214AA with J-bend leads) and supplied in embossed tape reel pack. For alternative  
voltage and holding current values, consult the factory. For higher rated impulse currents in the SMB package, the 100 A 10/1000  
TISP4xxxH3BJ series is available.  
Absolute Maximum Ratings, T = 25 °C (Unless Otherwise Noted)  
A
Rating  
Symbol  
Value  
± 58  
Unit  
‘4070  
‘4080  
‘4095  
‘4115  
‘4125  
‘4145  
‘4165  
‘4180  
‘4200  
‘4220  
‘4240  
‘4250  
‘4265  
‘4290  
‘4300  
‘4350  
‘4360  
‘4395  
‘4400  
± 65  
± 75  
± 90  
±100  
±120  
±135  
±145  
±155  
±160  
±180  
±190  
±200  
±220  
±230  
±275  
±290  
±320  
±300  
Repetitive peak off-state voltage, (see Note 1)  
V
V
DRM  
Non-repetitive peak on-state pulse current (see Notes 2, 3 and 4)  
2/10 µs (GR-1089-CORE, 2/10 µs voltage wave shape)  
300  
220  
120  
110  
100  
100  
100  
75  
8/20 µs (IEC 61000-4-5,combination wave generator, 1.2/50 voltage, 8/20 current)  
10/160 µs (FCC Part 68, 10/160 µs voltage wave shape)  
5/200 µs (VDE 0433, 10/700 µs voltage wave shape)  
0.2/310 µs (I3124, 0.5/700 µs voltage wave shape)  
5/310 µs (ITU-T K.20/21/45, K.44 10/700 µs voltage wave shape)  
5/310 µs (FTZ R12, 10/700 µs voltage wave shape)  
10/560 µs (FCC Part 68, 10/560 µs voltage wave shape)  
10/1000 µs (GR-1089-CORE, 10/1000 µs voltage wave shape)  
Non-repetitive peak on-state current (see Notes 2, 3 and 5)  
20 ms (50 Hz) full sine wave  
I
A
TSP  
50  
30  
32  
16.7 ms (60 Hz) full sine wave  
I
A
TSM  
1000 s 50 Hz/60 Hz a.c.  
2.1  
Initial rate of rise of on-state current, Exponential current ramp, Maximum ramp value < 100 A  
Junction temperature  
di /dt  
300  
A/µs  
°C  
T
T
-40 to +150  
-65 to +150  
J
Storage temperature range  
T
°C  
stg  
NOTES: 1. See Applications Information and Figure 11 for voltage values at lower temperatures.  
2. Initially,the TISP4xxxM3BJ must be in thermal equilibrium with T = 25 °C.  
J
3. The surge may be repeated after the TISP4xxxM3BJ returns to its initial conditions.  
4. See Applications Information and Figure 12 for current ratings at other temperatures.  
5. EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint dimensions connected with 5 A rated printed wiring  
track widths. See Figure 9 for the current ratings at other durations. Derate current values at -0.61 %/°C for ambient temperatures  
above 25 ° C.  
NOVEMBER 1997 - REVISED FEBRUARY 2005  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP4xxxM3BJ Overvoltage Protector Series  
Electrical Characteristics, T = 25 °C (Unless Otherwise Noted)  
A
Parameter  
Test Conditions  
Min  
Typ  
Max  
±5  
Unit  
Repetitive peak off-  
state current  
T = 25 °C  
A
I
V
= V  
DRM  
µA  
DRM  
D
T = 85 °C  
±10  
A
‘4070  
‘4080  
‘4095  
‘4115  
‘4125  
‘4145  
‘4165  
‘4180  
‘4200  
‘4220  
‘4240  
‘4250  
‘4265  
‘4290  
‘4300  
‘4350  
‘4360  
‘4395  
‘4400  
‘4070  
‘4080  
‘4095  
‘4115  
‘4125  
‘4145  
‘4165  
‘4180  
‘4200  
‘4220  
‘4240  
‘4250  
‘4265  
‘4290  
‘4300  
‘4350  
‘4360  
‘4395  
‘4400  
±70  
±80  
±95  
±115  
±125  
±145  
±165  
±180  
±200  
±220  
±240  
±250  
±265  
±290  
±300  
±350  
±360  
±395  
±400  
±78  
V
Breakover voltage  
dv/dt = ±250 V/ms,  
R
= 300  
SOURCE  
V
(BO)  
±88  
±102  
±122  
±132  
±151  
±171  
±186  
±207  
±227  
±247  
±257  
±272  
±298  
±308  
±359  
±370  
±405  
±410  
±0.6  
±3  
dv/dt ±1000 V/µs, Linear voltage ramp,  
Maximum ramp value = ±500 V  
Impulse breakover  
voltage  
V
V
(BO)  
di/dt = ±20 A/µs, Linear current ramp,  
Maximum ramp value = ±10 A  
I
Breakover current  
On-state voltage  
Holding current  
dv/dt = ±250 V/ms,  
R
= 300 Ω  
SOURCE  
±0.15  
A
V
A
(BO)  
V
I
I
= ±5 A, t = 100 µs  
W
= ±5 A, di/dt = +/-30 mA/ms  
T
T
T
I
±0.15  
±5  
±0.35  
H
Critical rate of rise of  
off-state voltage  
Off-state current  
dv/dt  
Linear voltage ramp, Maximum ramp value < 0.85V  
kV/µs  
DRM  
I
V
= ±50 V  
T = 85 °C  
±10  
µ
A
D
D
A
NOVEMBER 1997 - REVISED FEBRUARY 2005  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP4xxxM3BJ Overvoltage Protector Series  
Electrical Characteristics, T = 25 °C (Unless Otherwise Noted)  
A
Parameter  
Test Conditions  
f = 1 MHz, V = 1 V rms, V = 0,  
Min  
Typ  
83  
62  
50  
78  
56  
45  
72  
52  
42  
36  
26  
19  
21  
15  
Max  
100  
74  
60  
94  
67  
54  
87  
62  
50  
44  
31  
22  
25  
18  
Unit  
4070 thru ‘4115  
‘4125 thru ‘4220  
‘4240 thru ‘4400  
‘4070 thru ‘4115  
‘4125 thru ‘4220  
‘4240 thru ‘4400  
‘4070 thru ‘4115  
‘4125 thru ‘4220  
‘4240 thru ‘4400  
‘4070 thru ‘4115  
‘4125 thru ‘4220  
‘4240 thru ‘4400  
‘4125 thru ‘4220  
‘4240 thru ‘4400  
d
D
f = 1 MHz, V = 1 V rms, V = -1 V  
d
D
f = 1 MHz, V = 1 V rms, V = -2 V  
d
D
C
Off-state capacitance  
pF  
off  
f = 1 MHz, V = 1 V rms, V = -50 V  
d
D
f = 1 MHz, V = 1 V rms, V = -100 V  
d
D
(see Note 6)  
NOTE 6: To avoid possible voltage clipping, the ‘4125 is tested with V = -98 V.  
D
Thermal Characteristics  
Parameter  
Test Conditions  
EIA/JESD51-3 PCB, I = I  
Min  
Typ  
Max  
Unit  
,
TSM(1000)  
T
115  
T = 25 °C, (see Note 7)  
A
RθJA  
Junction to free air thermal resistance  
°C/W  
265 mm x 210 mm populated line card,  
4-layer PCB, I = I , T = 25 °C  
52  
T
TSM(1000)  
A
NOTE 7: EIA/JESD51-2 environment and PCB has standard footprint dimensions connected with 5 A rated printed wiring track widths.  
NOVEMBER 1997 - REVISED FEBRUARY 2005  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP4xxxM3BJ Overvoltage Protector Series  
Parameter Measurement Information  
+i  
Quadrant I  
Switching  
ITSP  
Characteristic  
ITSM  
IT  
V
(BO)  
VT  
I(BO)  
IH  
IDRM  
ID  
VDRM  
VD  
+v  
-v  
ID  
VD  
VDRM  
IDRM  
IH  
I(BO)  
VT  
V(BO)  
IT  
ITSM  
I
Quadrant III  
ITSP  
Switching  
Characteristic  
-i  
PMXXAAB  
Figure 1. Voltage-Current Characteristic for T and R Terminals  
All Measurements are Referenced to the R Terminal  
NOVEMBER 1997 - REVISED FEBRUARY 2005  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP4xxxM3BJ Overvoltage Protector Series  
Typical Characteristics  
NORMALIZED BREAKOVER VOLTAGE  
OFF-STATE CURRENT  
vs  
JUNCTION TEMPERATURE  
vs  
JUNCTION TEMPERATURE  
TC4MAF  
TCMAG  
1.10  
100  
VD = ±50 V  
10  
1.05  
1
0·1  
1.00  
0·01  
0.95  
0·001  
-25  
0
25  
50  
75  
100 125 150  
-25  
0
25  
50  
75  
100  
125  
150  
TJ - Junction Temperature - °C  
T - JunctionTemperature- °C  
J
Figure 3.  
Figure 2.  
ON-STATE CURRENT  
vs  
ON-STATE VOLTAGE  
NORMALIZED HOLDING CURRENT  
vs  
JUNCTION TEMPERATURE  
TC4MAD  
2.0  
1.5  
TC4MACA  
100  
70  
TA = 25 °C  
tW = 100 µs  
50  
40  
30  
20  
15  
1.0  
0.9  
10  
7
0.8  
0.7  
'4125  
THRU  
'4200  
5
4
0.6  
0.5  
3
'4240  
THRU  
'4400  
'4070  
THRU  
'4115  
2
1.5  
0.4  
1
0.7  
-25  
0
25  
50  
75  
100 125 150  
1
1.5  
2
3 1  
4
5
7
10  
T - Junction Temperature - °C  
J
VT - On-State Voltage - V  
Figure 5.  
Figure 4.  
NOVEMBER 1997 - REVISED FEBRUARY 2005  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP4xxxM3BJ Overvoltage Protector Series  
Typical Characteristics  
NORMALIZED CAPACITANCE  
vs  
DIFFERENTIAL OFF-STATE CAPACITANCE  
vs  
OFF-STATE VOLTAGE  
RATED REPETITIVE PEAKOFF-STATE VOLTAGE  
TC4MABB  
TCMAEB  
1
40  
0.9  
TJ = 25 °C  
0.8  
0.7  
Vd = 1 Vrms  
35  
0.6  
0.5  
C = Coff(-2V) - Coff (-50 V)  
'4070 THRU '4115  
30  
0.4  
0.3  
'4125 THRU '4220  
25  
'4240 THRU '4400  
0.2  
0.5  
20  
1
2
3
5
10  
20 30 50 100 150  
50 60 70 80 90 100  
150  
200 250 300 350  
VD - Off-state Voltage - V  
VDRM - Repetitive Peak Off-StateVoltage - V  
Figure 6.  
Figure 7.  
TYPICAL CAPACITANCE ASYMMETRY  
vs  
OFF-STATE VOLTAGE  
TC4XBB  
3
2
1
0
Vd = 10 mVrms, 1 MHz  
Vd = 1 Vrms, 1 MHz  
0.5 0.7  
1
2
3
4 5  
7
10  
20 30 4050  
VD — Off-State Voltage — V  
Figure 8.  
NOVEMBER 1997 - REVISED FEBRUARY 2005  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP4xxxM3BJ Overvoltage Protector Series  
Rating and Thermal Information  
THERMALIMPEDANCE  
vs  
NON-REPETITIVE PEAK ON-STATE CURRENT  
vs  
POWER DURATION  
CURRENT DURATION  
TI4MAE  
TI4MAC  
150  
30  
VGEN = 600 Vrms, 50/60 Hz  
RGEN = 1.4*VGEN /ITSM(t)  
100  
90  
20  
15  
80  
EIA/JESD51-2 ENVIRONMENT  
EIA/JESD51-3 PCB  
TA = 25 °C  
70  
60  
50  
40  
10  
9
30  
8
7
6
20  
15  
5
4
10  
9
ITSM(t) APPLIED FOR TIME t  
3
EIA/JESD51-2 ENVIRONMENT  
EIA/JESD51-3 PCB  
TA = 25 °C  
8
7
6
5
2
4
0·1  
1.5  
0·1  
1
10  
100  
1000  
1
10  
100  
1000  
t - PowerDuration - s  
Figure 10.  
t - Current Duration - s  
Figure 9.  
IMPULSE RATING  
vs  
AMBIENT TEMPERATURE  
VDRM DERATING FACTOR  
vs  
MINIMUMAMBIENT TEMPERATURE  
TC4MAA  
TI4MADA  
400  
1.00  
0.99  
0.98  
0.97  
0.96  
0.95  
0.94  
0.93  
BELLCORE 2/10  
300  
250  
'4125 THRU '4200  
IEC 1.2/50, 8/20  
200  
150  
120  
FCC 10/160  
100  
90  
80  
ITU-T10/700  
FCC 10/560  
70  
'4070 THRU '4115  
60  
50  
40  
'4240 THRU '4400  
BELLCORE 10/1000  
-40 -30 -20 -10  
0
10 20 30 40 50 60 70 80  
-40 -35 -30 -25 -20 -15 -10 -5  
0
5
10 15 20 25  
T - Ambient Temperature - °C  
A
TAMIN - Minimum Ambient Temperature - °C  
Figure 12.  
Figure 11.  
NOVEMBER 1997 - REVISED FEBRUARY 2005  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP4xxxM3BJ Overvoltage Protector Series  
APPLICATIONS INFORMATION  
Deployment  
These devices are two terminal overvoltage protectors. They may be used either singly to limit the voltage between two conductors (Figure 13)  
or in multiples to limit the voltage at several points in a circuit (Figure 14).  
Th3  
Th1  
Th1  
Th2  
Figure 14. Multi-Point Protection  
In Figure 13, protector Th1 limits the maximum voltage between the two conductors to ±V . This configuration is normally used to protect  
Figure 13. Two Point Protection  
(BO)  
circuits without a ground reference, such as modems. In Figure 14, protectors Th2 and Th3 limit the maximum voltage between each conduc-  
tor and ground to the ±V of the individual protector. Protector Th1 limits the maximum voltage between the two conductors to its ±V  
(BO)  
(BO)  
value. If the equipment being protected has all its vulnerable components connected between the conductors and ground, then protector Th1  
is not required.  
Impulse Testing  
To verify the withstand capability and safety of the equipment, standards require that the equipment is tested with various impulse wave forms.  
The table below shows some common values.  
Voltage  
Peak Voltage  
Peak Current  
Current  
Wave Shape  
µs  
TISP4XXXM3  
25 °C Rating  
A
Series  
Resistance  
Standard  
Setting  
V
Value  
A
Wave Shape  
µs  
2500  
1000  
1500  
800  
2/10  
500  
100  
200  
100  
37.5  
25  
2/10  
300  
50  
GR-1089-CORE  
11  
10/1000  
10/160  
10/560  
9/720 †  
9/720 †  
0.5/700  
10/1000  
10/160  
10/560  
5/320 †  
5/320 †  
0.2/310  
120  
75  
2x5.6  
FCC Part 68  
(March 1998)  
3
0
0
0
1500  
1000  
1500  
1500  
4000  
100  
100  
100  
I3124  
37.5  
37.5  
100  
ITU-T K.20/K.21  
10/700  
5/310  
100  
0
† FCC Part 68 terminology for the waveforms produced by the ITU-T recommendation K.21 10/700 impulse generator  
If the impulse generator current exceeds the protector’s current rating, then a series resistance can be used to reduce the current to the  
protector’s rated value to prevent possible failure. The required value of series resistance for a given waveform is given by the following  
calculations. First, the minimum total circuit impedance is found by dividing the impulse generators peak voltage by the protector’s rated  
current. The impulse generators fictive impedance (generator’s peak voltage divided by peak short circuit current) is then subtracted from the  
minimum total circuit impedance to give the required value of series resistance.  
For the FCC Part 68 10/560 waveform, the following values result. The minimum total circuit impedance is 800/75 = 10.7 and the generators  
fictive impedance is 800/100 = 8 . This gives a minimum series resistance value of 10.7 - 8 = 2.7 . After allowing for tolerance, a 3 ±10%  
resistor would be suitable. The 10/160 waveform needs a standard resistor value of 5.6 per conductor. These would be R1a and R1b in  
Figure 16 and Figure 17. FCC Part 68 allows the equipment to be non-operational after the 10/160 (conductor to ground) and 10/560 (inter-  
conductor) impulses. The series resistor value may be reduced to zero to pass FCC Part 68 in a non-operational mode, e.g. Figure 15. For this  
2
2
type of design, the series fuse must open before the TISP4xxxM3 fails. For Figure 15, the maximum fuse i t is 2.3 A s. In some cases, the  
equipment will require verification over a temperature range. By using the rated waveform values from Figure 12, the appropriate series resistor  
value can be calculated for ambient temperatures in the range of -40 °C to 85 °C.  
NOVEMBER 1997 - REVISED FEBRUARY 2005  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP4xxxM3BJ Overvoltage Protector Series  
AC Power Testing  
The protector can withstand currents applied for times not exceeding those shown in Figure 9. Currents that exceed these times must be  
terminated or reduced to avoid protector failure. Fuses, PTC (Positive Temperature Coefficient) thermistors and fusible resistors are overcurrent  
protection devices which can be used to reduce the current flow. Protective fuses may range from a few hundred milliamperes to one ampere.  
In some cases, it may be necessary to add some extra series resistance to prevent the fuse opening during impulse testing. The current versus  
time characteristic of the overcurrent protector must be below the line shown in Figure 9. In some cases, there may be a further time limit  
imposed by the test standard (e.g. UL 1459 wiring simulator failure).  
Capacitance  
The protector characteristic off-state capacitance values are given for d.c. bias voltage, V , values of 0, -1 V, -2 V and -50 V. Where possible  
D
values are also given for -100 V. Values for other voltages may be calculated by multiplying the V = 0 capacitance value by the factor given in  
D
Figure 6. Up to 10 MHz, the capacitance is essentially independent of frequency. Above 10 MHz, the effective capacitance is strongly  
dependent on connection inductance. In many applications, such as Figure 16 and Figure 18, the typical conductor bias voltages will be about  
-2 V and -50 V. Figure 7 shows the differential (line unbalance) capacitance caused by biasing one protector at -2 V and the other at -50 V.  
Figure 8 shows the typical capacitance asymmetry; the difference between the capacitance measured with a positive value of V and the  
D
capacitance value when the polarity of V is reversed. Capacitance asymmetry is an important parameter in ADSL systems where the  
D
protector often has no d.c. bias and the signal level is in the region of ±10 V.  
Normal System Voltage Levels  
The protector should not clip or limit the voltages that occur in normal system operation. For unusual conditions, such as ringing without the  
line connected, some degree of clipping is permissible. Under this condition, about 10 V of clipping is normally possible without activating the  
ring trip circuit.  
Figure 11 allows the calculation of the protector V  
value at temperatures below 25 °C. The calculated value should not be less than the  
maximum normal system voltages. The TISP4265M3BJ, with a V of 200 V, can be used for the protection of ring generators producing  
DRM  
DRM  
100 V rms of ring on a battery voltage of -58 V (Th2 and Th3 in Figure 18). The peak ring voltage will be 58 + 1.414*100 = 199.4 V. However,  
this is the open circuit voltage and the connection of the line and its equipment will reduce the peak voltage. In the extreme case of an  
unconnected line, clipping the peak voltage to 190 V should not activate the ring trip. This level of clipping would occur at the temperature  
when the V  
has reduced to 190/200 = 0.95 of its 25 °C value. Figure 11 shows that this condition will occur at an ambient temperature of  
DRM  
-28 °C. In this example, the TISP4265M3BJ will allow normal equipment operation provided that the minimum expected ambient temperature  
does not fall below -28 °C.  
JESD51 Thermal Measurement Method  
To standardize thermal measurements, the EIA (Electronic Industries Alliance) has created the JESD51 standard. Part 2 of the standard  
3
3
(JESD51-2, 1995) describes the test environment. This is a 0.0283 m (1 ft ) cube which contains the test PCB (Printed Circuit Board)  
horizontally mounted at the center. Part 3 of the standard (JESD51-3, 1996) defines two test PCBs for surface mount components; one for  
packages smaller than 27 mm on a side and the other for packages up to 48 mm. The SMBJ measurements used the smaller 76.2 mm x  
114.3 mm (3.0 “ x 4.5 “) PCB. The JESD51-3 PCBs are designed to have low effective thermal conductivity (high thermal resistance) and  
represent a worst case condition. The PCBs used in the majority of applications will achieve lower values of thermal resistance, and can  
dissipate higher power levels than indicated by the JESD51 values.  
NOVEMBER 1997 - REVISED FEBRUARY 2005  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP4xxxM3BJ Overvoltage Protector Series  
Typical Circuits  
MODEM  
TIP  
RING  
WIRE  
FUSE  
R1a  
RING DETECTOR  
HOOK SWITCH  
D.C. SINK  
Th3  
Th2  
PROTECTED  
EQUIPMENT  
Th1  
E.G. LINE CARD  
TISP4350  
SIGNAL  
R1b  
RING  
WIRE  
AI6XBK  
TIP  
AI6XBMA  
Figure 15. Modem Inter-Wire Protection  
R1a  
Figure 16. PROTECTION MODULE  
Th3  
Th2  
SIGNAL  
Th1  
R1b  
AI6XBL  
D.C.  
Figure 17. ISDN Protection  
OVER-  
CURRENT  
PROTECTION  
SLIC  
PROTECTION  
RING/TEST  
PROTECTION  
TEST  
RELAY  
RING  
RELAY  
SLIC  
RELAY  
TIP  
WIRE  
S3a  
R1a  
Th4  
Th3  
S1a  
S2a  
SLIC  
Th1  
Th2  
Th5  
R1b  
RING  
WIRE  
S3b  
TISP6xxxx,  
TISPPBLx,  
TISP6NTP2  
S1b  
S2b  
VBAT  
C1  
220 nF  
TEST  
EQUIP-  
MENT  
RING  
GENERATOR  
AI6XBJ  
Figure 18. Line Card Ring/Test Protection  
NOVEMBER 1997 - REVISED FEBRUARY 2005  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP4xxxM3BJ Overvoltage Protector Series  
MECHANICAL DATA  
Recommended Printed Wiring Footprint  
2.54  
(.100)  
SMB Pad Size  
2.40  
(.095)  
2.16  
(.085)  
MILLIMETERS  
(INCHES)  
DIMENSIONS ARE:  
MDXXBIA  
Device Symbolization Code  
Devices will be coded as below. As the device parameters are symmetrical, terminal 1 is not identified.  
Symbolization  
Device  
Code  
TISP4070M3BJ  
TISP4080M3BJ  
TISP4095M3BJ  
TISP4115M3BJ  
TISP4125M3BJ  
TISP4145M3BJ  
TISP4165M3BJ  
TISP4180M3BJ  
TISP4200M3BJ  
TISP4220M3BJ  
TISP4240M3BJ  
TISP4250M3BJ  
TISP4265M3BJ  
TISP4290M3BJ  
TISP4300M3BJ  
TISP4350M3BJ  
TISP4360M3BJ  
TISP4395M3BJ  
TISP4400M3BJ  
4070M3  
4080M3  
4095M3  
4115M3  
4125M3  
4145M3  
4165M3  
4180M3  
4200M3  
4220M3  
4240M3  
4250M3  
4265M3  
4290M3  
4300M3  
4350M3  
4360M3  
4395M3  
4400M3  
Device Symbolization Code  
Devices are shipped in one of the carriers below. Unless a specific method of shipment is specified by the customer, devices will be shipped in  
the most practical carrier. For production quantities, the carrier will be embossed tape reel pack. Evaluation quantities may be shipped in bulk  
pack or embossed tape.  
For Standard  
For Lead Free  
Termination Finish Termination Finish  
Order As  
Order As  
Carrier  
Embossed Tape Reel Pack  
Bulk Pack  
TISP4xxxM3BJR  
TISP4xxxM3BJ  
TISP4xxxM3BJR-S  
TISP4xxxM3BJ-S  
NOVEMBER 1997 - REVISED FEBRUARY 2005  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP4xxxM3BJ Overvoltage Protector Series  
MECHANICAL DATA  
SMBJ (DO-214AA) Plastic Surface Mount Diode Package  
This surface mount package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will  
withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high  
humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.  
SMB  
4.06 - 4.57  
(.160 - .180)  
3.30 - 3.94  
(.130 - .155)  
1
2
Index  
Mark  
(if needed)  
2.00 - 2.40  
(.079 - .094)  
0.10 - 0.20  
(.004 - .008)  
1.90 - 2.10  
(.075 - .083)  
1.96 - 2.32  
(.077 - .091)  
0.76 - 1.52  
(.030 - .060)  
5.21 - 5.59  
(.205 - .220)  
MILLIMETERS  
(INCHES)  
DIMENSIONS ARE:  
MDXXBHAA  
NOVEMBER 1997 - REVISED FEBRUARY 2005  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
TISP4xxxM3BJ Overvoltage Protector Series  
MECHANICAL DATA  
Tape Dimensions  
SMB Package Single-Sprocket Tape  
1.55 -  
(.061 - .065 )  
3.90 - 4.10  
(.154 - .161 )  
1.65  
1.95 - 2.05  
(.077 - .081)  
0.40  
(.016)  
1.65 -  
1.85  
(.065 - .073 )  
MAX .  
5.45 -  
(.215 - .219 )  
5.55  
11.70 -  
(.461 - .484 )  
12.30  
8.20  
MAX .  
(.323)  
7.90 - 8  
.10  
(.311 - .319 )  
Cover  
Ta pe  
1.5  
(.059)  
MIN.  
0 MIN.  
4.5  
(.177)  
Carrier Tape  
Embossment  
MAX .  
Direction of Feed  
Maximium component  
rotation  
20°  
Ty pical component  
cavity center line  
Index  
Mark  
(if needed)  
Typical component  
center line  
NOTES: A. The clearance between the component and the cavity must be within 0.05 mm (.002 in) MIN. to 0.65 mm (.026 in)  
MDXXBJA  
MAX. so that the component cannot rotate more than 20° within the determined cavity.  
B. Taped devices are supplied on a reel of the following dimensions:  
Reel diameter:  
330 mm ± 3.0 mm (12.99 in ± .118 in)  
Reel hub diameter: 75 mm (2.95 in) MIN.  
Reel axial hole:  
13.0 mm ± 0.5 mm (.512 in ± .020 in)  
C. 3000 devices are on a reel.  
“TISP” is a trademark of Bourns, Ltd., a Bourns Company, and is Registered in U.S. Patent and Trademark Office.  
“Bourns” is a registered trademark of Bourns, Inc. in the U.S. and other countries.  
NOVEMBER 1997 - REVISED FEBRUARY 2005  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  

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