TISP4300H4BJ-S [BOURNS]
HIGH HOLDING CURRENT BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS; 高保持电流的双向晶闸管过电压保护
| 型号： | TISP4300H4BJ-S |
| 厂家： | 
BOURNS ELECTRONIC SOLUTIONS |
| 描述： | HIGH HOLDING CURRENT BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS |
| 文件： | 总13页 (文件大小：382K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TISP4165H4BJ THRU TISP4200H4BJ,
TISP4265H4BJ THRU TISP4350H4BJ
T
N
A
I
L
P
S
M
N
E
O
O
I
L
C
B
S
S
A
R
H
L
E
I
o
V
A
V
*R
A
HIGH HOLDING CURRENT
BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS
TISP4xxxH4BJ Overvoltage Protector Series
ITU-T K.20/21 Rating ....................... 8 kV 10/700, 200 A 5/310
High Holding Current ........................................... 225 mA min.
SMBJ Package (Top View)
Ion-Implanted Breakdown Region
Precise and Stable Voltage
Low Voltage Overshoot under Surge
1
2
R(B)
T(A)
V
V
DRM
V
(BO)
V
Device
MDXXBG
‘4165
‘4180
‘4200
‘4265
‘4300
‘4350
135
145
155
200
230
275
165
180
200
265
300
350
Device Symbol
T
Rated for International Surge Wave Shapes
I
TSP
A
Waveshape
Standard
SD4XAA
R
2/10 µs
8/20 µs
GR-1089-CORE
IEC 61000-4-5
FCC Part 68
500
300
250
200
160
100
Terminals T and R correspond to the
alternative line designators of A and B
10/160 µs
10/700 µs
10/560 µs
10/1000 µs
ITU-T K.20/21
FCC Part 68
GR-1089-CORE
Low Differential Capacitance ................................. 67 pF max.
.............................................. UL Recognized Component
Description
These devices are designed to limit overvoltages on the telephone line. Overvoltages are normally caused by a.c. power system or lightning
flash disturbances which are induced or conducted on to the telephone line. A single device provides 2-point protection and is typically used
for the protection of 2-wire telecommunication equipment (e.g., between the Ring and Tip wires for telephones and modems). Combinations of
devices can be used for multi-point protection (e.g., 3-point protection between Ring, Tip and Ground).
The protector consists of a symmetrical voltage-triggered bidirectional thyristor. Overvoltages are initially clipped by breakdown clamping until
the voltage rises to the breakover level, which causes the device to crowbar into a low-voltage on state. This low-voltage on state causes the
current resulting from the overvoltage to be safely diverted through the device. The high crowbar holding current prevents d.c. latchup as the
diverted current subsides.
How To Order
For Standard
For Lead Free
Termination Finish Termination Finish
Order As
Embossed Tape Reeled TISP4xxxH4BJR
Bulk Pack TISP4xxxH4BJ
Insert xxx value corresponding to protection voltages of 165 through to 350.
Order As
Device
Package
Carrier
TISP4xxxH4BJR-S
TISP4xxxH4BJ-S
TISP4xxxH4BJ BJ (J-Bend DO-214AA/SMB)
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4xxxH4BJ Overvoltage Protector Series
Description
This TISP4xxxH4BJ range consists of six voltage variants to meet various maximum system voltage levels (135 V to 275 V). They are guaran-
teed to voltage limit and withstand the listed international lightning surges in both polarities. These high (H) current protection devices are in a
plastic package SMBJ (JEDEC DO-214AA with J-bend leads) and supplied in embossed carrier reel pack. For alternative voltage and holding
current values, consult the factory. For lower rated impulse currents in the SMB package, the 50 A 10/1000 TISP4xxxM3BJ series is available.
Absolute Maximum Ratings, T = 25 °C (Unless Otherwise Noted)
A
Rating
Symbol
Value
Unit
‘4165
‘4180
‘4200
‘4265
‘4300
‘4350
±135
±145
±155
±200
±230
±275
Repetitive peak off-state voltage, (see Note 1)
V
V
DRM
Non-repetitive peak on-state pulse current (see Notes 2, 3 and 4)
2/10 µs (GR-1089-CORE, 2/10 µs voltage wave shape)
500
300
250
220
200
200
200
160
100
8/20 µs (IEC 61000-4-5, 1.2/50 µs voltage, 8/20 current combination wave generator)
10/160 µs (FCC Part 68, 10/160 µs voltage wave shape)
5/200 µs (VDE 0433, 10/700 µs voltage wave shape)
0.2/310 µs (I3124, 0.5/700 µs voltage wave shape)
5/310 µs (ITU-T K.20/21, 10/700 µs voltage wave shape)
5/310 µs (FTZ R12, 10/700 µs voltage wave shape)
10/560 µs (FCC Part 68, 10/560 µs voltage wave shape)
10/1000 µs (GR-1089-CORE, 10/1000 µs voltage wave shape)
Non-repetitive peak on-state current (see Notes 2, 3 and 5)
20 ms (50 Hz) full sine wave
I
A
TSP
55
60
I
A
16.7 ms (60 Hz) full sine wave
TSM
2.1
1000 s 50 Hz/60 Hz a.c.
Initial rate of rise of on-state current, Exponential current ramp, Maximum ramp value < 200 A
Junction temperature
di /dt
400
A/µs
°C
T
T
-40 to +150
-65 to +150
J
Storage temperature range
T
°C
stg
NOTES: 1. See Applications Information and Figure 10 for voltage values at lower temperatures.
2. Initially, the TISP4xxxH4BJ must be in thermal equilibrium with T = 25 °C.
J
3. The surge may be repeated after the TISP4xxxH4BJ returns to its initial conditions.
4. See Applications Information and Figure 11 for current ratings at other temperatures.
5. EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint dimensions connected with 5 A rated printed wiring
track widths. See Figure 8 for the current ratings at other durations. Derate current values at -0.61 %/°C for ambient
temperatures above 25 °C.
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4xxxH4BJ Overvoltage Protector Series
Electrical Characteristics, T = 25 °C (Unless Otherwise Noted)
A
Parameter
Test Conditions
Min.
Typ.
Max.
±5
±10
Unit
Repetitive peak off-
state current
T = 25 °C
A
I
V
= V
DRM
µA
DRM
D
T = 85 °C
A
‘4165
‘4180
‘4200
‘4265
‘4300
‘4350
‘4165
‘4180
‘4200
‘4265
‘4300
‘4350
±165
±180
±200
±265
±300
±350
±174
±189
±210
±276
±311
±363
±0.8
±3
V
V
Breakover voltage
dv/dt = ±750 V/ms,
R
= 300 Ω
SOURCE
V
V
(BO)
dv/dt ≤ ±1000 V/µs, Linear voltage ramp,
Maximum ramp value = ±500 V
di/dt = ±20 A/µs, Linear current ramp,
Maximum ramp value = ±10 A
Impulse breakover
voltage
(BO)
I
Breakover current
On-state voltage
Holding current
dv/dt = ±750 V/ms,
R
= 300 Ω
±0.15
A
V
A
(BO)
SOURCE
V
I = ±5 A, t = 100 µs
T
T
W
I
I = ±5 A, di/dt = -/+30 mA/ms
±0.225
±5
±0.8
H
T
Critical rate of rise of
off-state voltage
Off-state current
dv/dt
Linear voltage ramp, Maximum ramp value < 0.85V
kV/µs
µA
DRM
I
V
= ±50 V
T = 85 °C
±10
90
84
79
67
74
62
35
28
33
26
D
D
A
f = 100 kHz, V = 1 V rms, V = 0,
‘4165 thru ‘4200
‘4265 thru ‘4350
‘4165 thru ‘4200
‘4265 thru ‘4350
‘4165 thru ‘4200
‘4265 thru ‘4350
‘4165 thru ‘4200
‘4265 thru ‘4350
‘4165 thru ‘4200
‘4265 thru ‘4350
80
70
71
60
65
55
30
24
28
22
d
D
f = 100 kHz, V = 1 V rms, V = -1 V
d
D
f = 100 kHz, V = 1 V rms, V = -2 V
d
D
C
Off-state capacitance
pF
off
f = 100 kHz, V = 1 V rms, V = -50 V
d
D
f = 100 kHz, V = 1 V rms, V = -100 V
d
D
(see Note 6)
NOTE 6: To avoid possible voltage clipping, the ‘4125 is tested with V = -98 V.
D
Thermal Characteristics
Parameter
Test Conditions
EIA/JESD51-3 PCB, I = I
Min.
Typ.
Max.
Unit
,
TSM(1000)
T
113
T = 25 °C, (see Note 7)
A
°
C /W
Rθ
Junction to free air thermal resistance
JA
265 mm x 210 mm populated line card,
4-layer PCB, I = I , T = 25 °C
50
T
TSM(1000)
A
NOTE 7: EIA/JESD51-2 environment and PCB has standard footprint dimensions connected with 5 A rated printed wiring track widths.
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4xxxH4BJ Overvoltage Protector Series
Parameter Measurement Information
+i
Quadrant I
Switching
ITSP
Characteristic
ITSM
IT
V(BO)
VT
I(BO)
IH
IDRM
ID
VDRM
VD
+v
-v
ID
VD
VDRM
IDRM
IH
I(BO)
VT
V(BO)
IT
ITSM
Quadrant III
ITSP
Switching
Characteristic
-i
PMXXAAB
Figure 1. Voltage-current Characteristic for T and R Terminals
All Measurements are Referenced to the R Terminal
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4xxxH4BJ Overvoltage Protector Series
Typical Characteristics
OFF-STATE CURRENT
vs
NORMALIZED BREAKDOWN VOLTAGE
vs
JUNCTION TEMPERATURE
JUNCTION TEMPERATURE
TC4HAF
TCHAG
1.10
100
VD = ±50 V
10
1.05
1
0·1
1.00
0·01
0.95
0·001
-25
0
25
50
75
100 125 150
-25
0
25
50
75
100 125 150
TJ - Junction Temperature - °C
TJ - Junction Temperature - °C
Figure 2.
Figure 3.
NORMALIZED HOLDING CURRENT
vs
ON-STATE CURRENT
vs
ON-STATE VOLTAGE
JUNCTION TEMPERATURE
TC4HAK
TC4HAHA
2.0
1.5
200
150
TA = 25 °C
tW = 100 µs
100
70
50
40
30
1.0
0.9
20
15
0.8
0.7
10
7
5
4
3
0.6
0.5
'4165
THRU
'4200
'4265
THRU
'4350
2
1.5
0.4
1
-25
0
25
50
75
100 125 150
0.7
1
1.5
2
3
4
5
7
10
TJ - Junction Temperature - °C
V - On-State Voltage - V
Figure 4.
Figure 5.
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4xxxH4BJ Overvoltage Protector Series
Typical Characteristics
NORMALIZED CAPACITANCE
vs
DIFFERENTIAL OFF-STATE CAPACITANCE
vs
OFF-STATE VOLTAGE
RATED REPETITIVE PEAK OFF-STATE VOLTAGE
TC4HAIA
TCHAJA
1
36
35
34
33
32
31
30
0.9
TJ = 25 °C
0.8
0.7
Vd = 1 Vrms
0.6
0.5
'4165 THRU '4200
'4265 THRU '4350
0.4
0.3
∆C = Coff(-2 V) - Coff(-50 V)
0.2
0.5
1
2
3
5
10
20 30 50 100150
130
150
170
200
230
270 300
VD - Off-state Voltage - V
VDRM - Repetitive Peak Off-State Voltage - V
Figure 6.
Figure 7.
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4xxxH4BJ Overvoltage Protector Series
Typical Characteristics
NON-REPETITIVE PEAK ON-STATE CURRENT
vs
THERMAL IMPEDANCE
vs
CURRENT DURATION
POWER DURATION
TI4HAC
TI4HAE
30
150
VGEN = 600 Vrms, 50/60 Hz
GEN = 1.4*VGEN/ITSM(t)
100
70
R
20
15
EIA/JESD51-2 ENVIRONMENT
EIA/JESD51-3 PCB
TA = 25 °C
50
40
30
10
9
20
15
8
7
6
10
7
5
4
5
4
ITSM(t) APPLIED FOR TIME t
3
3
EIA/JESD51-2 ENVIRONMENT
EIA/JESD51-3 PCB
TA = 25 °C
2
2
1.5
1.5
0·1
1
0·1
1
10
100
1000
1
10
100
1000
t - Current Duration - s
t - Power Duration - s
Figure 8.
Figure 9.
V
DERATING FACTOR
DRM
IMPULSE RATING
vs
vs
MINIMUM AMBIENT TEMPERATURE
AMBIENT TEMPERATURE
TI4HAFA
TC4HAA
1.00
0.99
0.98
0.97
0.96
0.95
0.94
0.93
700
600
500
BELLCORE 2/10
400
IEC 1.2/50, 8/20
300
250
FCC 10/160
ITU-T 10/700
FCC 10/560
'4165 THRU '4200
200
150
120
BELLCORE 10/1000
100
90
'4265 THRU '4350
-40 -35 -30 -25 -20 -15 -10 -5
-40 -30 -20 -10
0
10 20 30 40 50 60 70 80
0
5 10 15 20 25
TA - Ambient Temperature - °C
TAMIN - Minimum Ambient Temperature - °C
Figure 10.
Figure 11.
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4xxxH4BJ Overvoltage Protector Series
APPLICATIONS INFORMATION
Deployment
These devices are two terminal overvoltage protectors. They may be used either singly to limit the voltage between two conductors (Figure 12)
or in multiples to limit the voltage at several points in a circuit (Figure 13).
Th3
Th1
Th1
Th2
Figure 12. Two Point Protection
Figure 13. Multi-point Protection
In Figure 12, protector Th1 limits the maximum voltage between the two conductors to ±V
. This configuration is normally used to protect
(BO)
circuits without a ground reference, such as modems. In Figure 13, protectors Th2 and Th3 limit the maximum voltage between each conduc-
tor and ground to the ±V of the individual protector. Protector Th1 limits the maximum voltage between the two conductors to its ±V
(BO)
(BO)
value. If the equipment being protected has all its vulnerable components connected between the conductors and ground, then protector Th1
is not required.
Impulse Testing
To verify the withstand capability and safety of the equipment, standards require that the equipment is tested with various impulse wave forms.
The table below shows some common values.
Voltage
Peak Voltage
Peak Current
Current
Waveform
µs
TISP4xxxH4
25 °C Rating
A
Series
Resistance
Ω
Standard
Setting
V
Value
A
Waveform
µs
2500
1000
1500
800
2/10
500
100
200
100
37.5
25
2/10
500
100
250
160
200
200
200
GR-1089-CORE
0
10/1000
10/160
10/560
9/720 †
9/720 †
0.5/700
10/1000
10/160
10/560
5/320 †
5/320 †
0.2/310
0
0
0
0
0
FCC Part 68
(March 1998)
1500
1000
1500
1500
4000
I3124
37.5
37.5
100
ITU-T K.20/K.21
10/700
5/310
200
0
† FCC Part 68 terminology for the waveforms produced by the ITU-T recommendation K.21 10/700 impulse generator
If the impulse generator current exceeds the protector’s current rating, then a series resistance can be used to reduce the current to the
protector’s rated value to prevent possible failure. The required value of series resistance for a given waveform is given by the following
calculations. First, the minimum total circuit impedance is found by dividing the impulse generator’s peak voltage by the protector’s rated
current. The impulse generator’s fictive impedance (generator’s peak voltage divided by peak short circuit current) is then subtracted from the
minimum total circuit impedance to give the required value of series resistance. In some cases, the equipment will require verification over a
temperature range. By using the rated waveform values from Figure 11, the appropriate series resistor value can be calculated for ambient
temperatures in the range of -40 °C to 85 °C.
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4xxxH4BJ Overvoltage Protector Series
APPLICATIONS INFORMATION
AC Power Testing
The protector can withstand currents applied for times not exceeding those shown in Figure 8. Currents that exceed these times must be
terminated or reduced to avoid protector failure. Fuses, PTC (Positive Temperature Coefficient) resistors and fusible resistors are overcurrent
protection devices which can be used to reduce the current flow. Protective fuses may range from a few hundred milliamperes to one ampere.
In some cases, it may be necessary to add some extra series resistance to prevent the fuse opening during impulse testing. The current versus
time characteristic of the overcurrent protector must be below the line shown in Figure 8. In some cases, there may be a further time limit
imposed by the test standard (e.g. UL 1459 wiring simulator failure).
Capacitance
The protector characteristic off-state capacitance values are given for d.c. bias voltage, V , values of 0, -1 V, -2 V and -50 V. Where possible,
D
values are also given for -100 V. Values for other voltages may be calculated by multiplying the V = 0 capacitance value by the factor given in
D
Figure 6. Up to 10 MHz, the capacitance is essentially independent of frequency. Above 10 MHz, the effective capacitance is strongly
dependent on connection inductance. In many applications, such as Figure 15 and Figure 17, the typical conductor bias voltages will be about
-2 V and -50 V. Figure 7 shows the differential (line unbalance) capacitance caused by biasing one protector at -2 V and the other at -50 V.
Normal System Voltage Levels
The protector should not clip or limit the voltages that occur in normal system operation. For unusual conditions, such as ringing without the
line connected, some degree of clipping is permissible. Under this condition, about 10 V of clipping is normally possible without activating the
ring trip circuit. Figure 10 allows the calculation of the protector V
be less than the maximum normal system voltages. The TISP4265H4BJ, with a V
DRM
value at temperatures below 25 °C. The calculated value should not
of 200 V, can be used for the protection of ring
DRM
generators producing 100 V r.m.s. of ring on a battery voltage of -58 V (Th2 and Th3 in Figure 17). The peak ring voltage will be 58 + 1.414*100
= 199.4 V. However, this is the open circuit voltage and the connection of the line and its equipment will reduce the peak voltage. In the
extreme case of an unconnected line, clipping the peak voltage to 190 V should not activate the ring trip. This level of clipping would occur at
the temperature when the V
has reduced to 190/200 = 0.95 of its 25 °C value. Figure 10 shows that this condition will occur at an ambient
DRM
temperature of -22 °C. In this example, the TISP4265H4BJ will allow normal equipment operation provided that the minimum expected
ambient temperature does not fall below -22 °C.
JESD51 Thermal Measurement Method
To standardize thermal measurements, the EIA (Electronic Industries Alliance) has created the JESD51 standard. Part 2 of the standard
3
3
(JESD51-2, 1995) describes the test environment. This is a 0.0283 m (1 ft ) cube which contains the test PCB (Printed Circuit Board)
horizontally mounted at the center. Part 3 of the standard (JESD51-3, 1996) defines two test PCBs for surface mount components; one for
packages smaller than 27 mm on a side and the other for packages up to 48 mm. The SMBJ measurements used the smaller 76.2 mm x 114.3
mm (3.0 ” x 4.5 “) PCB. The JESD51-3 PCBs are designed to have low effective thermal conductivity (high thermal resistance) and represent a
worse case condition. The PCBs used in the majority of applications will achieve lower values of thermal resistance and so can dissipate
higher power levels than indicated by the JESD51 values.
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4xxxH4BJ Overvoltage Protector Series
APPLICATIONS INFORMATION
Typical Circuits
MODEM
TIP
RING
WIRE
FUSE
R1a
RING DETECTOR
HOOK SWITCH
D.C. SINK
Th3
Th2
PROTECTED
EQUIPMENT
Th1
E.G. LINE CARD
TISP4350H4
SIGNAL
R1b
RING
WIRE
AI6XBK
TIP
AI6XBPA
Figure 14. Modem Inter-wire Protection
R1a
Figure 15. Protection Module
Th3
Th2
SIGNAL
Th1
R1b
AI6XBL
D.C.
Figure 16. ISDN Protection
OVER-
CURRENT
PROTECTION
SLIC
PROTECTION
RING/TEST
PROTECTION
TEST
RELAY
RING
RELAY
SLIC
RELAY
TIP
WIRE
S3a
R1a
Th4
Th5
Th3
S1a
S2a
SLIC
Th1
Th2
R1b
RING
WIRE
S3b
TISP6xxxx,
TISPPBLx,
1/2TISP6NTP2
S1b
S2b
VBAT
C1
220 nF
TEST
EQUIP-
MENT
RING
GENERATOR
AI6XBJ
Figure 17. Line Card Ring/Test Protection
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4xxxH4BJ Overvoltage Protector Series
MECHANICAL DATA
Recommended Printed Wiring Footprint
SMB Pad Size
2.54
(.100)
2.40
(.094)
2.16
(.085)
METRIC
(INCHES)
DIMENSIONS ARE:
MDXXBI
Device Symbolization Code
Devices will be coded as below. As the device parameters are symmetrical, terminal 1 is not identified.
Symbolization
Device
Code
TISP4165H4BJ
TISP4180H4BJ
TISP4200H4BJ
TISP4265H4BJ
TISP4300H4BJ
TISP4350H4BJ
4165H4
4180H4
4200H4
4265H4
4300H4
4350H4
Carrier Information
Devices are shipped in one of the carriers below. Unless a specific method of shipment is specified by the customer, devices will be shipped in
the most practical carrier. For production quantities, the carrier will be embossed tape reel pack. Evaluation quantities may be shipped in bulk
pack or embossed tape.
For Standard
Termination Finish Termination Finish
Order As Order As
TISP4xxxH4BJR TISP4xxxH4BJR-S
TISP4xxxH4BJ TISP4xxxH4BJ-S
For Lead Free
Carrier
Embossed Tape Reel Pack
Bulk Pack
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4xxxH4BJ Overvoltage Protection Series
MECHANICAL DATA
SMBJ (DO-214AA)
This surface mount package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will
withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high
humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.
SMB
4.06 - 4.57
(.160 - .180)
3.30 - 3.94
(.130 - .155)
2
Index
Mark
(if needed)
METRIC
DIMENSIONS ARE:
(INCHES)
2.00 - 2.40
(.079 - .094)
1.90 - 2.10
(.075 - .083)
1.96 - 2.32
(.077 - .091)
0.10 - 0.20
(.004 - .008)
0.76 - 1.52
(.030 - .060)
5.21 - 5.59
(.205 - .220)
MDXXBHA
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4xxxH4BJ Overvoltage Protector Series
MECHANICAL DATA
Tape Dimensions
SMB Package Single-Sprocket Tape
1.55 - 1.65
(.061 - .065)
3.90 - 4.10
(.154 - .161)
1.95 - 2.05
(.077 - .081)
0.40
(.016)
MAX.
1.65 - 1.85
(.065 - .073)
5.54 - 5.55
(.215 - .219)
11.70 - 12.30
(.461 - .484)
8.20
(.323)
MAX.
Cover
Tape
7.90 - 8.10
(.311 - .319)
1.50
(.059)
Ø
0 MIN.
MIN.
Carrier Tape
Embossment
4.50
(.177)
MAX.
Direction of Feed
Maximium component
rotation
20°
Typical component
cavity center line
Index
Mark
Typical component
center line
METRIC
(INCHES)
DIMENSIONS ARE:
NOTES: A. The clearance between the component and the cavity must be within 0.05 mm (.002 in.) MIN. to 0.65 mm (.026 in.)
MAX. so that the component cannot rotate more than 20 ° within the determined cavity.
B. Taped devices are supplied on a reel of the following dimensions:-
MDXXBJ
Reel diameter:
330 ± 3.0 mm (12.99 ± .118 in.)
(2.95 in.)
Reel hub diameter 75 mm
MIN.
Reel axial hole:
13.0 ± 0.5 mm (.512 ± .020 in.)
C. 3000 devices are on a reel.
“TISP” is a trademark of Bourns, Ltd., a Bourns Company, and is Registered in U.S. Patent and Trademark Office.
“Bourns” is a registered trademark of Bourns, Inc. in the U.S. and other countries.
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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