TISP4350J1BJR-S [BOURNS]

Silicon Surge Protector, 350V V(BO) Max, 100A, DO-214AA, ROHS COMPLIANT, SMB, 2 PIN;
TISP4350J1BJR-S
型号: TISP4350J1BJR-S
厂家: BOURNS ELECTRONIC SOLUTIONS    BOURNS ELECTRONIC SOLUTIONS
描述:

Silicon Surge Protector, 350V V(BO) Max, 100A, DO-214AA, ROHS COMPLIANT, SMB, 2 PIN

光电二极管
文件: 总7页 (文件大小:560K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TISP4070J3BJ THRU TISP4395J3BJ  
BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS  
TISP4xxxJ3BJ Overvoltage Protector Series  
Ion-Implanted Breakdown Region  
-Precise and Stable Voltage  
SMB Package (Top View)  
-Low Voltage Overshoot Under Surge  
Designed for Transformer Center Tap (Ground Return)  
Overvoltage Protection  
R
1
2
T
-Enables GR-1089-CORE Compliance  
-High Holding Current Allows Protection of Data Lines  
with d.c. Power Feed  
MD-SMB-004-a  
Can be Used to Protect Rugged Modems Designed for Exposed  
Applications Exceeding TIA-968-A  
Device Symbol  
T
VDRM  
V
58  
V(BO)  
V
70  
Device Name  
TISP4070J3BJ  
TISP4080J3BJ  
TISP4095J3BJ  
TISP4115J3BJ  
TISP4125J3BJ  
TISP4145J3BJ  
TISP4165J3BJ  
TISP4180J3BJ  
TISP4200J3BJ  
TISP4219J3BJ  
TISP4250J3BJ  
TISP4290J3BJ  
TISP4350J3BJ  
TISP4395J3BJ  
65  
75  
90  
80  
95  
115  
125  
145  
165  
180  
200  
219  
250  
290  
350  
395  
R
100  
120  
135  
145  
155  
180  
190  
220  
275  
320  
SD-TISP4xxx-001-a  
Rated for International Surge Wave Shapes  
IPPSM  
A
Wave Shape  
Standard  
2/10  
8/20  
GR-1089-CORE  
IEC 61000-4-5  
TIA-968-A  
1000  
800  
400  
350  
250  
200  
10/160  
10/700  
10/560  
10/1000  
ITU-T K.20/21/45  
TIA-968-A  
GR-1089-CORE  
.................................................UL Recognized Component  
Description  
The range of TISP4xxxJ3BJ devices are designed to limit overvoltages on telecom lines. The TISP4xxxJ3BJ is primarily designed to address  
GR-1089-CORE compliance on data transmission lines with d.c. power feeding. When overvoltage protection is applied to transformer coupled  
lines from the transformer center tap to ground, the total ground return current can be 200 A, 10/1000 and 1000 A, 2/10. The high 150 mA  
holding current is set above common d.c. feed system levels to allow the TISP4xxxJ3BJ to reset following a disturbance.  
These devices allow signal voltages, without clipping, up to the maximum off-state voltage value, V  
, see Figure 1. Voltages above V  
DRM  
DRM  
are limited and will not exceed the breakover voltage, V  
, level. If sufficient current flows due to the overvoltage, the device switches into a  
(BO)  
low voltage on-state condition, which diverts the current from the overvoltage through the device. When the diverted current falls below the  
holding current, I , level the devices switches off and restores normal system operation.  
H
How to Order  
Device  
Package  
Carrier  
Order As  
TISP4xxxJ3BJR-S  
Marking Code Std. Qty.  
4xxxJ3 3000  
TISP4xxxJ3BJ SMB (DO-214AA) Embossed Tape Reeled  
Insert xxx value corresponding to device name.  
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.  
JULY 2003 - REVISED NOVEMBER 2013  
Specifications are subject to change without notice.  
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.  
Users should verify actual device performance in their specific applications.  
TISP4xxxJ3BJ Overvoltage Protector Series  
Absolute Maximum Ratings, T = 25 °C (Unless Otherwise Noted)  
A
Rating  
Symbol  
Value  
Unit  
‘4171J3BJ  
‘4181J3BJ  
‘4195J3BJ  
‘4±±5J3BJ  
‘4±25J3BJ  
‘4±45J3BJ  
‘4±65J3BJ  
‘4±81J3BJ  
‘4211J3BJ  
‘42±9J3BJ  
‘4251J3BJ  
‘4291J3BJ  
‘4351J3BJ  
‘4395J3BJ  
±58  
±65  
±75  
±91  
±±11  
±±21  
±±35  
±±45  
±±55  
±±81  
±±91  
±221  
±275  
±321  
Repetitive peak off-state voltage  
VDRM  
V
Non-repetitive peak impulse current (see Notes ± and 2)  
2/±1 µs (GR-±189-CORE, 2/±1 µs voltage wave shape)  
8/21 µs (IEC 6±111-4-5, combination wave generator, ±.2/51 µsvoltage wave shape)  
±1/±61 µs (TIA-968-A, ±1/±61 µs voltage wave shape)  
4/251 µs (ITU-T K.21/2±, ±1/711 µs voltage waveshape, simultaneous)  
5/3±1 µs (ITU-T K.21/2±, ±1/711 µs voltage wave shape, single)  
5/321 µs (TIA-968-A, 9/721 µs voltage waveshape, single)  
±1/561 µs (TIA-968-A, ±1/561 µs voltage wave shape)  
±±111  
±811  
±411  
±371  
±351  
±351  
±251  
±211  
IPPSM  
A
±1/±111 µs (GR-±189-CORE, ±1/±111 µs voltage wave shape)  
Non-repetitive peak on-state current (see Notes ± and 2)  
21 ms, 51 Hz (full sine wave)  
ITSM  
diT/dt  
TJ  
51  
A
Initial rate of rise of on-state current. Linear current ramp. Maximum ramp value < 51 A  
Junction temperature  
811  
A/µs  
-41 to +±51 °C  
-65 to +±51 °C  
Storage temperature range  
Tstg  
NOTES: ±. Initially the device must be in thermal equilibrium with TJ = 25 °C.  
2. These non-repetitive rated currents are peak values of either polarity. The surge may be repeated after the device returns to its  
initial conditions.  
Electrical Characteristics, T = 25 °C (Unless Otherwise Noted)  
A
Parameter  
Test Conditions  
Min Typ Max Unit  
Repetitive peak  
off-state current  
TA = 25 °C  
TA = 85 °C  
±5  
µA  
IDRM  
VD = VDRM  
±±1  
‘4171J3BJ  
‘4181J3BJ  
‘4195J3BJ  
‘4±±5J3BJ  
‘4±25J3BJ  
‘4±45J3BJ  
‘4±65J3BJ  
‘4±81J3BJ  
‘4211J3BJ  
‘42±9J3BJ  
‘4251J3BJ  
‘4291J3BJ  
‘4351J3BJ  
‘4395J3BJ  
±71  
±81  
±95  
±±±5  
±±25  
±±45  
±±65  
±±81  
V(BO)  
AC Breakover voltage  
dv/dt = ±251 V/ms, RSOURCE = 311 Ω  
V
±211  
±2±9  
±251  
±291  
±351  
±395  
JULY 2003 - REVISED NOVEMBER 2013  
Specifications are subject to change without notice.  
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.  
Users should verify actual device performance in their specific applications.  
TISP4xxxJ3BJ Overvoltage Protector Series  
Electrical Characteristics, T = 25 °C (Unless Otherwise Noted)  
A
Parameter  
Test Conditions  
Min Typ Max Unit  
‘4171J3BJ  
‘4181J3BJ  
‘419ꢀJ3BJ  
‘4±±ꢀJ3BJ  
‘4±ꢁꢀJ3BJ  
‘4±4ꢀJ3BJ  
‘4±6ꢀJ3BJ  
‘4±81J3BJ  
‘4ꢁ11J3BJ  
‘4ꢁ±9J3BJ  
‘4ꢁꢀ1J3BJ  
‘4ꢁ91J3BJ  
‘43ꢀ1J3BJ  
‘439ꢀJ3BJ  
±77  
±88  
±±14  
±±ꢁꢀ  
±±3ꢀ  
±±ꢀ6  
dv/dt ±±111 V/µs, Linear voltage ramp,  
Maximum ramp value = ±ꢀ11 V  
di/dt = ±ꢁ1 A/µs, Linear current ramp,  
Maximum ramp value = ±±1 A  
±±77  
±±9ꢁ  
V(BO)  
Ramp breakover voltage  
V
±ꢁ±ꢁ  
±ꢁ3±  
±ꢁ63  
±313  
±364  
±419  
‘4171J3BJ thru ‘4±±ꢀJ3BJ  
‘4±ꢁꢀJ3BJ thru ‘4ꢁ±9J3BJ  
‘4ꢁꢀ1J3BJ thru ‘439ꢀJ3BJ  
±911  
I(BO)  
Breakover current  
Holding current  
dv/dt = ±ꢁꢀ1 V/ms, RSOURCE = 311 Ω  
±811 mA  
±611  
IH  
dv/dt  
ID  
IT = ±ꢀ A, di/dt = ±31 mA/ms  
±±ꢀ1  
±ꢀ  
±611 mA  
Critical rate of rise of  
off-state voltage  
Linear voltage ramp  
Maximum ramp value < 1.8ꢀVDRM  
kV/µs  
Off-state current  
VD = ±ꢀ1 V  
TA = 8ꢀ °C  
‘4171J3BJ thru ‘4±±ꢀJ3BJ  
‘4±ꢁꢀJ3BJ thru ‘4ꢁ±9J3BJ  
‘4ꢁꢀ1J3BJ thru ‘439ꢀJ3BJ  
‘4171J3BJ thru ‘4±±ꢀJ3BJ  
‘4±ꢁꢀJ3BJ thru ‘4ꢁ±9J3BJ  
‘4ꢁꢀ1J3BJ thru ‘439ꢀJ3BJ  
‘4171J3BJ thru ‘4±±ꢀJ3BJ  
‘4±ꢁꢀJ3BJ thru ‘4ꢁ±9J3BJ  
‘4ꢁꢀ1J3BJ thru ‘439ꢀJ3BJ  
‘4171J3BJ thru ‘4±±ꢀJ3BJ  
‘4±ꢁꢀJ3BJ thru ‘4ꢁ±9J3BJ  
‘4ꢁꢀ1J3BJ thru ‘439ꢀJ3BJ  
‘4±ꢁꢀJ3BJ thru ‘4ꢁ±9J3BJ  
‘4ꢁꢀ1J3BJ thru ‘439ꢀJ3BJ  
±±1  
±9ꢀ ꢁ3ꢀ  
±ꢁ1 ±4ꢀ  
±1ꢀ ±ꢁꢀ  
±81 ꢁ±ꢀ  
±±1 ±3ꢁ  
9ꢀ ±±ꢀ  
±6ꢀ ꢁ11  
±11 ±ꢁ1  
91 ±1ꢀ  
8ꢀ ±11  
µA  
f = ± MHz, Vd = ± V rms, VD = 1  
f = ± MHz, Vd = ± V rms, VD = -± V  
f = ± MHz, Vd = ± V rms, VD = -ꢁ V  
f = ± MHz, Vd = ± V rms, VD = -ꢀ1 V  
CO  
Off-state capacitance  
pF  
ꢀ1  
4ꢁ  
41  
3ꢀ  
61  
ꢀ1  
ꢀ1  
41  
f = ± MHz, Vd = ± V rms, VD = -±11 V  
(see Note 3)  
NOTE: 3. To avoid possible clipping, the TISP4±ꢁꢀJ3BJ is tested with VD = -98 V.  
Thermal Characteristics  
Parameter  
Test Conditions  
EIA/JESDꢀ±-3 PCB, IT = ITSM(±111)  
(see Note 4)  
Min Typ Max Unit  
91 °C/W  
RθJA  
Junction to ambient thermal resistance  
NOTE: 4. EIA/JESDꢀ±-ꢁ environment and PCB has standard footprint dimensions connected with ꢀ A rated printed wiring track widths.  
JULY 2003 - REVISED NOVEMBER 2013  
Specifications are subject to change without notice.  
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.  
Users should verify actual device performance in their specific applications.  
TISP4xxxJ3BJ Overvoltage Protector Series  
Parameter Measurement Information  
+i  
IPPSM  
Quadrant I  
Switching  
Characteristic  
ITSM  
ITRM  
IT  
V(BO)  
VT  
I(BO)  
IH  
V(BR)  
I(BR)  
V(BR)M  
IDRM  
VDRM  
VD  
ID  
+v  
-v  
ID  
VD  
VDRM  
I(BR)  
V(BR)  
IDRM  
V(BR)M  
IH  
I(BO)  
VT  
V(BO)  
IT  
ITRM  
ITSM  
Quadrant III  
Switching  
Characteristic  
IPPSM  
PM-TISP4xxx-001-a  
-i  
Figure 1. Voltage-Current Characteristic for T and R Terminals  
All Measurements are Referenced to the R Terminal  
JULY 2003 - REVISED NOVEMBER 2013  
Specifications are subject to change without notice.  
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.  
Users should verify actual device performance in their specific applications.  
TISP4xxxJ3BJ Overvoltage Protector Series  
Typical Characteristics  
OFF-STATE CURRENT  
vs  
JUNCTION TEMPERATURE  
NORMALIZED BREAKOVER VOLTAGE  
vs  
JUNCTION TEMPERATURE  
TC4JAF  
TC4JAG  
1.15  
100  
VD  
= 50 V  
1.10  
1.05  
1.00  
0.95  
0.90  
10  
1
0·1  
0·01  
0·001  
-25  
0
25  
50  
75  
100 125 150  
-25  
0
25  
50  
75  
100 125 150  
TJ - Junction Temperature - °C  
TJ - Junction Temperature - °C  
Figure 2.  
Figure 3.  
NORMALIZED CAPACITANCE  
vs  
NORMALIZED HOLDING CURRENT  
vs  
JUNCTION TEMPERATURE  
TC4JAD  
OFF-STATE VOLTAGE  
TC4JABB  
2.0  
1.5  
1
0.9  
TJ = 25 °C  
0.8  
0.7  
Vd = 1 Vrms  
0.6  
0.5  
1.0  
0.9  
0.8  
0.7  
0.4  
0.3  
0.6  
0.5  
0.4  
0.2  
0.5  
-25  
0
25  
50  
75  
100 125 150  
1
2
3
5
10  
20 30 50  
100 150  
TJ - Junction Temperature - °C  
VD - Off-state Voltage - V  
Figure 4.  
Figure 5.  
JULY 2003 - REVISED NOVEMBER 2013  
Specifications are subject to change without notice.  
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.  
Users should verify actual device performance in their specific applications.  
TISP4xxxJ3BJ Overvoltage Protector Series  
Rating and Thermal Characteristics  
VDRM DERATING FACTOR  
NON-REPETITIVE PEAK ON-STATE CURRENT  
vs  
vs  
MINIMUM AMBIENT TEMPERATURE  
CURRENT DURATION  
TI4JADCa  
TI4JAA  
1.00  
0.99  
0.98  
0.97  
0.96  
0.95  
0.94  
0.93  
40  
30  
VGEN = 600 Vrms, 50/60 Hz  
RGEN = 1.4*VGEN/ITSM(t)  
EIA/JESD51-2 ENVIRONMENT  
EIA/JESD51-3 PCB  
TA = 25 °C  
20  
15  
10  
9
8
7
6
'4070J3BJ thru '4115J3BJ  
'4125J3BJ thru '4219J3BJ  
5
4
3
2
'4250J3BJ thru '4395J3BJ  
-40 -35 -30 -25 -20 -15 -10 -5  
0
5
10 15 20 25  
0·1  
1
10  
100  
1000  
t - Current Duration - s  
TA(MIN) - Minimum Ambient Temperature - °C  
Figure 7.  
Figure 6.  
JULY 2003 - REVISED NOVEMBER 2013  
Specifications are subject to change without notice.  
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.  
Users should verify actual device performance in their specific applications.  
TISP4xxxJ3BJ Overvoltage Protector Series  
Applications Information  
Protection  
F1  
Ring  
Detector  
Polarity  
Bridge  
R
Relay  
High current  
Fuse  
C1  
R1  
C2  
D1 D2  
D3 D4  
Th1  
D5  
D6  
Hook  
Switch  
T1  
C3  
DC  
Signal  
Sink  
R2  
T
TISP  
4350J3BJ  
D7  
Isolation Barrier  
AI4MMABB  
OC1  
Figure 8. Typical Application Circuit  
F1a  
Tx  
T
F1b  
R
TISP4350J3BJ  
d.c.  
feed  
F2a  
F2b  
Rx  
T
R
TISP4350J3BJ  
AI4MMAB  
F1 & F2 = B1250T  
Figure 9. Typical Application Circuit  
“TISP” is a registered trademark of Bourns Ltd., a Bourns Company, in the United States and other countries, except that “TISP” is a registered trademark of Bourns, Inc. in China.“Bourns” is  
a registered trademark of Bourns, Inc. in the U.S. and other countries.  
JULY 2003 - REVISED NOVEMBER 2013  
Specifications are subject to change without notice.  
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.  
Users should verify actual device performance in their specific applications.  

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