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4108T-2-2222FAL [BOURNS]

Thin Film Molded DIP; 薄膜模压DIP

4108T-2-2222FAL


元器件型号：	4108T-2-2222FAL
生产厂家：	BOURNS ELECTRONIC SOLUTIONS
描述和应用：	Thin Film Molded DIP 薄膜模压DIP
PDF文件：	总1页 (文件大小：178K)
下载文档：	下载PDF数据表文档文件
型号参数：4108T-2-2222FAL参数

4108T-2-2222FB

Thin Film Molded DIP

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5 BOURNS

4108T-2-2222FBL

Thin Film Molded DIP

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6 BOURNS

4108T-2-2222FC

Thin Film Molded DIP

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8 BOURNS

4108T-2-2222FCL

Thin Film Molded DIP

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6 BOURNS

4108T-2-6571BCL

Array/Network Resistor, Bussed, Thin Film, 1.09W, 50V, 0.1% +/-Tol, 25ppm/Cel, Surface Mount, DIP, ROHS COMPLIANT

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0 BOURNS

4108T-L

Networks

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10 BOURNS

4109

Logic IC

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43 ETC

410-91-208-41-001000

Board Connector

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0 MILL-MAX

410-91-214-10-001

Sockets for specific applications Solder tail

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15 PREDIP

410-91-214-10-002

Sockets for specific applications Solder tail

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7 PREDIP

410-91-216-10-001

Sockets for specific applications Solder tail

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7 PREDIP

410-91-216-10-002

Sockets for specific applications Solder tail

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5 PREDIP

410-91-216-41-001

PCB connectors 2.54 mm Single row / double row Solder tail

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6 PREDIP

410-91-216-41-001000

Board Connector

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0 MILL-MAX

410-91-216-41-105

PCB connectors 2.54 mm Single row / double row Surface mount

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4 PREDIP

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