BL-PMRTB-CJB [BRTLED]
High brightness tri-color surface mount LED.; 高亮度三色表面贴装LED 。
| 型号： | BL-PMRTB-CJB |
| 厂家： | 
BRTLED |
| 描述： | High brightness tri-color surface mount LED. |
| 文件： | 总8页 (文件大小：639K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MULTI DOMILED BL-PMRTB
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High brightness tri-color surface mount LED.
Capable for all video-standards. The RGB-LED chips can be controlled
separately.
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120° viewing angle.
Small package outline (LxWxH) of 2.8 x 3.2 x 1.9 mm.
Qualified according to JEDEC moisture sensitivity Level 2.
Compatible to both IR reflow soldering and TTW soldering.
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Multi DomiLED Multi DMRTB-CJ -v19
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Part Ordering Number
Luminous Intensity @ If = 20mA . Iv ( mcd )
Color ,λdom (nm)
Chip#1 Chip#2 Chip#3
Chip#1
Chip#2
Chip#3
BL-PMRTB-CJB
35.5 ... 100.0
140.0 ... 285.0
100.0 ... 200.0
TRUE BLUE
RED
GREEN
625
470
525
100.0 ... 140.0 140.0 ... 200.0
100.0 ... 140.0 140.0 ... 200.0
100.0 ... 140.0 140.0 ... 200.0
35.5 ... 50.5
50.5 ... 71.5
71.5 ... 100.0
- BIN R3 S3 N3
- BIN R3 S3 P3
- BIN R3 S3 Q3
- BIN R3 T3 N3
- BIN R3 T3 P3
- BIN R3 T3 Q3
100.0 ... 140.0 200.0 ... 285.0
100.0 ... 140.0 200.0 ... 285.0
100.0 ... 140.0 200.0 ... 285.0
35.5 ... 50.5
50.5 ... 71.5
71.5 ... 100.0
140.0 ... 200.0 140.0 ... 200.0
140.0 ... 200.0 140.0 ... 200.0
140.0 ... 200.0 140.0 ... 200.0
35.5 ... 50.5
50.5 ... 71.5
71.5 ... 100.0
- BIN S3 S3 N3
- BIN S3 S3 P3
- BIN S3 S3 Q3
140.0 ... 200.0 200.0 ... 285.0
140.0 ... 200.0 200.0 ... 285.0
140.0 ... 200.0 200.0 ... 285.0
35.5 ... 50.5
50.5 ... 71.5
71.5 ... 100.0
- BIN S3 T3 N3
- BIN S3 T3 P3
- BIN S3 T3 Q3
1. Reel comes in a quantity of 1025 and 2050 units per reel.
2. Luminous intensity is measured with an accuracy of ±11%.
3. All electrical and optical data are measured at room temperature; Ta = 25°C.
Half Group For Luminous Intensity
Only one IV group is allowed for each chip within a reel.
Groupings
Min. (mcd)
Max. (mcd)
N3
P3
Q3
R3
S3
T3
35.5
50.5
50.5
71.5
71.5
100.0
140.0
200.0
285.0
100.0
140.0
200.0
Wavelength Grouping.
If wavelength binning is required, only one wavelength group is allowed for each chip within a reel.
Color
Group
Wavelength distribution (nm)
Red
Full
620 – 630
True Green
Blue
Full
A
521 - 536
521 - 526
526 - 531
531 - 536
B
C
Full
A
B
465 - 475
465 - 470
470 - 475
Dominant wavelength is measured with an accuracy of ±1 nm.
Electrical Characteristics at Ta = 25 oC
Vf at If=20mA; (V)
Temperature coefficient of Vf
(I=20mA; -10oC<T<100o
Typ.
Max
2.45
4.25
4.25
Typ. ( mV/K )
Red
True Green
Blue
1.8
3.7
3.6
-2.0
-3.6
-3.1
Optical Characteristics at TA = 25 oC
Temperature coefficient (If =20mA; -10oC<T<100oC, typ.)
View Angle
(deg.)
λpeak (nm/K)
λdom. (nm/K)
Red
0.15
0.05
True Green
Blue
0.04
0.04
0.03
0.02
120
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Absolute Maximum Ratings
Maximum Value
Unit
mA
Red
Green, Blue
DC forward current.
30
20
Red
1000
Green, Blue
200
Peak pulse current.
mA
(tp ≤ 10 µs, Duty cycle = 0.005)
Red
12
Green, Blue
5
Reverse voltage.
V
Red
75
Green, Blue
Power consumption.
V
85
Red
Green, Blue
Thermal resistance junction/ambient, Rth JA
K/W
480
530
1chip on
770
820
3 chips on
Red
Green, Blue
Thermal resistance junction/solder point, Rth JS
K/W
260
290
1chip on
420
470
3 chips on
LED junction temperature.
125
°C
°C
°C
Operating temperature.
Storage temperature.
-40 … +100
-40 … +100
Recommended Solder Pad
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Luminous intensity vs. forward current.
Wavelength vs. forward current.
Intensity vs. DC Forward Current
Wavelength vs. Forward Current
470
469.5
469
535
533
531
529
527
525
523
521
519
517
515
2.2
2
1.8
AlInGaP
1.6
1.4
InGaN
468.5
Blue
468
1.2
1
0.8
0.6
0.4
0.2
0
467.5
467
Green
466.5
466
0
10
20
30
40
50
60
10
20
30
40
50
Forward Current(mA)
Wavelength Distribution.
Forward current vs. forward voltage.
Relative Spectral Emission
Forward Current vs. Forward Voltage
35
30
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
Red
True
25
Blue
Red
20
15
Blue &
Green
InGaN
10
5
0
400
450
500
550
600
650
700
750
800
1
1.5
2
2.5
3
3.5
4
4.5
Wavelength (nm)
Forward Voltage (V)
Radiation pattern.
30°
20°
10°
0°
1.0
40°
50°
0.8
0.6
0.4
0.2
60°
70°
80°
90°
0
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Max forward current vs. temperature (1 chip on)
Max forward current vs. temperature (3 chips on)
35
35
Red
30
30
Red
25
25
True green
True Green
20
15
20
15
Blue
10
Blue
10
5
5
0
0
0
10 20 30 40 50 60 70 80 90 100
0
10 20 30 40 50 60 70 80 90 100
Ambient Temperature (oC)
Ambient Temperature (oC)
Max forward current vs. temperature (1 chip on)
Max forward current vs. temperature (3 chips on)
35
35
Red
Red
30
30
25
25
True Green
True Green
20
15
20
15
Blue
10
10
Blue
5
5
0
0
0
10 20 30 40 50 60 70 80 90 100
0
10 20 30 40 50 60 70 80 90 100
Solder point temperature Ts ( oC)
Solder point temperature Ts ( oC)
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Taping And Orientation.
Reels come in quantity of 1025 or 2050 units.
Reel diameter is 180 mm.
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Recommended IR-reflow Soldering Profile.
Classification Reflow Profile (JEDEC J-STD-020B)
275
250
225
200
175
150
125
100
75
235-240oC
10-30s
Ramp-up
3 oC/sec max.
183 oC
60-150s
Ramp-down
6 oC/sec max.
Preheat
60-120s
50
360s max
100
25
0
50
150
200
Time (sec)
Recommended Pb Free IR-Reflow Soldering Profile.
Classification Reflow Profile (JEDEC J-STD-020C)
300
275
250
225
200
175
150
125
100
75
255-260oC
10-30s
Ramp-up
3 oC/sec
217 oC
60-150s
Ramp-down
6 oC/sec max.
Preheat
60-180s
50
480s max
25
0
50
100
150
200
Time (sec)
05/01/06
Multi DomiLED Multi DMRTB-CJ -v19
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