BL-XKD361-TR7 [BRTLED]
SURFACE MOUNT CHIP LED LAMPS SPECIFICATION; 贴片式芯片LED灯规格
| 型号： | BL-XKD361-TR7 |
| 厂家： | 
BRTLED |
| 描述： | SURFACE MOUNT CHIP LED LAMPS SPECIFICATION |
| 文件： | 总6页 (文件大小：219K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BRIGHT LED ELECTRONICS CORP.
SURFACE MOUNT CHIP LED LAMP SPECIFICATION
●COMMODITY：AXIAL TYPE LED
●DEVICE NUMBER：BL-XKD361-TR7
PAGE:
2
●ELECTRICAL AND OPTICAL CHARACTERISTICS (Ta=25℃)
REVISION:
1.1
Chip
Absolute Maximum
Electro-optical
Data (At 20mA)
Viewing
Angle
2θ1/2
(deg)
Rating
Lens
Peak Dominant
Wave Wave
Length Length
Emitted
Color
Vf(V)
Typ. Max. Min. Typ.
2.1 2.6 94 200
Iv(mcd)
Appearance
Δλ
Pd
If
Peak
(mW) (mA) If(mA)
(nm)
λP(nm) λd(nm)
Super Yellow 595
594±5 Water Clear
15
100
30
100
35
Remark：1. Viewing angle is the Off-axis angle at which the luminous intensity is half the axial luminous intensity.
2. This product doesn’t contain restriction Substance, comply ROHS standard.
●ABSOLUTE MAXIMUN RATINGS (Ta=25℃)
Reverse Voltage ………………………………………..……………………………….…..……………………….… 5V
Reverse Current (VR=5V) …………………………………………….………………………………………….. 100µA
Operating Temperature Range ……………………………………………..……….……………..…… -25℃ ～ 80℃
Storage Temperature Range ……………………………………………………………………..…… -30℃ ～ 85℃
●PACKAGE DIMENSIONS
NOTES: 1.All dimensions are in millimeters (inches).
2.Tolerance is ±0.25mm (0.01”) unless otherwise specified.
3.Specifications are subject to change without notice.
BRIGHT LED ELECTRONICS CORP.
LED LAMP SPECIFICATION
●COMMODITY：AXIAL TYPE LED LAMP
●DEVICE NUMBER：BL-XKD361-TR7
PAGE:
3
REVISION:
1.0
BRIGHT LED ELECTRONICS CORP.
AXIAL LED LAMP SPECIFICATION
●COMMODITY：AXIAL TYPE LED LAMP
●DEVICE NUMBER：BL-XKD361-TR7
● TAPPING AND PACKAGING SPECIFICA
PAGE:
4
REVISION: 1.0
SPECIFICATION
ITEM
SYMBOL
Minimum
Maximum
mm
1.40
1.65
5.45
3.10
3.00
3.90
3.90
1.95
－
inch
mm
1.55
1.85
5.55
3.30
3.20
4.10
4.10
2.05
0.30
12.30
180.0
13.50
21.50
9.30
17.00
2.40
4.10
inch
Tape Feed Hole Diameter (DIA)
Feed Hole Location
D0
E
0.055
0.065
0.215
0.122
0.118
0.153
0.153
0.076
－
0.061
0.072
0.218
0.130
0.126
0.161
0.161
0.080
0.012
0.484
7.087
0.531
0.846
0.366
0.669
0.094
0.161
Centers Line Dimensions Length Direction
Compartment Depth
F
K0
K
Carrier Tape Overall Thickness
Compartment Pitch
P
Sprocket Hole Diameter
Centers Line Dimensions Length Direction
Carrier Tape Thickness
Carrier Tape Width
P0
P2
t
W
A
12.00
178.0
12.50
20.00
9.00
16.00
2.20
3.90
0.472
7.008
0.492
0.788
0.354
0.629
0.087
0.154
Flange Diameter
Hub Spindle Hole
C
Hub Diameter
D2
W1
T
Fixing Tape Width
Flange Space Between Flanges
Compartment Length
A0
B0
Compartment Width
BRIGHT LED ELECTRONICS CORP.
SURFACE MOUNT CHIP LED LAMP SPECIFICATION
RELIABILITY TEST
PAGE:
5
REVISION:
1.0
Classification
Test Item
Reference Standard
Test Conditions
Result
Operation Life MIL-STD-750:1026 Connect with a power If=20mA
MIL-STD-883:1005 Ta=Under room temperature
0/20
JIS C 7021 :B-1
Test time=1,000hrs
Ta=+65℃±5℃
High
Temperature MIL-STD-202:103B
RH=90%-95%
0/20
High Humidity JIS C 7021
:B-11
Test time=240hrs
Endurance
Test
Storage
High
Temperature
Storage
Low
High Ta=+85℃±5℃
MIL-STD-883:1008
JIS C 7021 :B-10
0/20
0/20
Test time=1,000hrs
Low Ta=-35℃±5℃
Temperature JIS-C-7021 :B-12
Storage
Test time=1,000hrs
-35℃ ~ +25℃ ~ +85℃ ~ +25℃
Temperature MIL-STD-202:107D
Cycling
MIL-STD-750:1051
MIL-STD-883:1010
JIS C 7021 :A-4
MIL-STD-202:107D
MIL-STD-750:1051
MIL-STD-883:1011
60min 20min
Test Time=5cycle
60min
20min
0/20
0/20
0/20
-35℃±5℃ ~+85℃±5℃
Thermal Shock
Environmental
Test
20min
Test Time=10cycle
Preheating：
140℃-160℃,within 2 minutes.
Operation heating：
20min
Solder
Resistance
MIL-STD-202:201A
MIL-STD-750:2031
JIS C 7021 :A-1
260℃(Max.), within 10seconds. (Max.)
JUDGMENT CRITERIA OF FAILURE FOR THE RELIABILITY
Measuring items
Forward voltage
Reverse current
Symbol
VF ( V)
Ir(uA)
Measuring conditions
If=20mA
Judgement criteria for failure
Over Ux1.2
Vr=5V
Over Ux2
Luminous intensity
Iv ( mcd )
If=20mA
Below SX0.5
Note: 1.U means the upper limit of specified characteristics. S means initial value.
2. Measurment shall be taken between 2 hours and after the test pieces have been returned to normal
ambient conditions after completion of each test.
BRIGHT LED ELECTRONICS CORP.
SURFACE MOUNT CHIP LED LAMP SPECIFICATION
PAGE:
6
REVISION:
1.0
1. SOLDERING:
● Manual Of Soldering
The temperature of the iron tip should not be higher than 300℃(572℉) and Soldering within 3
seconds per solder-land is to be observed.
● Reflow Soldering
Preheating : 140℃~160℃±5℃,within 2 minutes.
Operation heating : 260℃(MAX.) within 10 seconds.(Max)
Gradual Cooling (Avoid quenching).
10 SEC. MAX.
260℃ MAX.
140~160℃
4℃ /SEC. MAX.
4℃ /SEC. MAX.
OVER 2 MIN.
TIME
● DIP soldering (Wave Soldering)
Preheating : 120℃~150℃,within 120~180 sec.
Operation heating : 245℃±5℃ within 5 sec.260℃ (Max)
Gradual Cooling (Avoid quenching).
Soldering heat Max. 260 ℃
245 ±5℃ within 5 sec.
120~150℃
Preheat
120~180 sec.
TIME
2. Handling :
Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to
high temperature.
Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such
as the sand blast and the metal hook.
BRIGHT LED ELECTRONICS CORP.
SURFACE MOUNT CHIP LED LAMP SPECIFICATION
PAGE:
7
REVISION:
1.0
3. Notes for designing:
Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT
LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with
instantaneous voltage at the turning ON and OFF of the circuit.
When using the pulse drive care must be taken to keep the average current within the rated figures.
Also, the circuit should be designed so as be subjected to reverse voltage when turning off the
BRIGHT LEDs.
4. Storage:
In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as
possible after unpacking the sealed envelope.
If the envelope is still packed, to store it in the environment as following:
(1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max.
(2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or
equivalent soldering process must be:
a. Completed within 24 hours.
b. Stored at less than 30% RH.
(3) Devices require baking before mounting, if:
(2) a or (2) b is not met.
(4) If baking is required, devices must be baked under below conditions:
12 hours at 60℃±3℃.
5. Package and Label of Products:
(1) Package: Products are packed in one bag of 3000 pcs (one taping reel) and a label is attached on
each bag.
(2) Label:
BRIGHT LED LOGO
Part No.
Quantity
BIN.
Sealing Date
x
xx
xx
xx
Year Month Day
Manufacture Location
相关型号：
©2020 ICPDF网 联系我们和版权申明