BVS-166QF2 概述
SUPER BRIGHTNESS SMD LED 超高亮度SMD LED
BVS-166QF2 数据手册
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ELECTRONICS CO.,LTD
SUPER BRIGHTNESS SMD LED
PACKAGE CONFIGURATION
BVS-166QF2
Cathode mark
LED die
0.8
0.6
Soldering terminal
Cathode line
Soldering Pattem
1.6
0.8
0.8
1.0
0.8
1.0
0.8
0.7
Polarity
P C .board
0.3
0.4
0.4
Resin
Soldering terminal
Tolerance 0.1 р
DESCRIPTION
Dice Material : AlGaInP/GaAs Amber
Light Color : Amber Color
Lens Color : Milky Diffused
ABSOLUTE MAXIMUM RATINGS AT Ta = 25 к
UNIT
mW
mA
PARAMETER
Power Dissipation
Continuous Forward Current
MAX.
55
20
Peak Forward Current ( 1/10 Duty Cycle , 0.1ms Pulse Width )
Reverse Voltage
Derating Linear From 25 к
Operating Temperature Range
Storage Temperature Range
100
5
0.35
mA
V
mA/oC
oC
oC
Ё30 to Ѐ 80
Ё40 to Ѐ 85
Infrared Soldering Condition 260 к for 5 seconds
Reflow Soldering Condition 230 к for 10 seconds
ELECTRICAL / OPTICAL CHARACTERISTICS AT Ta = 25 к
SYMBOL
V F
I R
UNIT
PARAMETER
Forward Voltage
Reverse Current
TEST COND.
I F = 20 mA
V R = 5V
MIN.
TYP.
2.1
MAX.
2.6
100
V
ӴA
Peak Emission Wavelength
Dominant Wavelength
Viewing Angle
I F = 20 mA
I F = 20 mA
I F = 20 mA
611
605
130
ӳp
ӳd
2Ӱ1/2
n m
n m
Deg
BIN GRADE LIMITS ( I F = 20 mA ) LUMINOUS INTENSITY / mcd
Bin
y
z
A
B
C
D
Min.
Max.
60
78
78
100
100
130
130
168
168
218
218
280
Tolerance 15%mcd
*Bright View reserves the rights to alter specifications and remove availability of products at any time without notice.
*Dominant Wavelength, ӳd is according to CIE Chromaticity Diagram base on color of lamps.
*Ӱ1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity.
2004/2/4
– A
BRIGHT VIEW
ELECTRONICS CO.,LTD
SMD APPLICATION ( PB FREE SOLDERING )
Apply to BVS-3XXΕ1XX series.
Description:
(1) Manual soldering (We do not recommend this method strongly.)
(1.1) To prevent cracking,please bake (65к,24hrs)before soldering.
(1.2) Temperature at tip of iron: 250к Max.(25W)
(1.3) It's banned to load any stress on the resin during soldering.
(1.4) Soldering time: 3 sec. Max.(one time only)
(2) Reflow Soldering
(2.1) To prevent cracking,please bake (65к,24hrs)before soldering.
(2.2) When soldering,do not put stress on the LEDs during heating.
(2.3) Never take next process until the component is cooled down to room
temperature after reflow.
(2.4) After soldering,do not warp the circuit board.
(2.5) The recommended reflow soldering profile(measuring on the surface
of the LED resin)is following:
10 SEC. MAX.
245 C MAX.
0.5к/SEC MAX.
217к
217к
150к
TEMPERATURE
1к/SEC. MAX.
~25к
50 SEC. MAX.
~75к
100 SEC. MAX.
210 SEC. MIN.
TIME
The reflow temperature 240к~245к is recommended and the soldering temperature
should be not higher than 245к(one time only)
2005 / 10 / 20 - B
BRIGHT VIEW
ELECTRONICS CO.,LTD
CHIP LEDS PACKING
BVS-166/167 Series
2.0 0.05
1.5 0.10
0.23 0.05
4.0 0.10
Cathode mark
4.0 0.10
1.75 0.10
3.5 0.05
1.80 0.10
8.0 0.20
- BVS-166
0.60 0.10 - BVS-167
0.75 0.10
Feeding direction
UNIT : mm
178 1.0
60 0.5
Reel : 4,000PCS
UNIT : mm
12 0.5
Label
2
Label
1
Electronics Co.,Ltd.
Bright View
PART NO.:
LOT NO.:
Electronics Co.,Ltd.
Bright View
PART NO.:
LOT NO.:
BVS-16XXXX
GRADE:
Q'ty
pcs
QA
ńłŖŕŊŐŏ
X-
-
GRADE:
Q'ty
ELECTROSTATIC SENSITIVE DEVICES
DO NOT OPEN OR HANDLE EXCEPT
AT A STATIC-FREE WORKSTATION
pcs
QA
24
Anti-electrostatic bag
Normal
X: Bin grade
: Wavelength
: Vf
39
CARTON
Dimension(cm): 39*24*22
ITEM NO.
DEVICE:
Q'TY
22
PCS.
KGS.
KGS.
N. W.:
G. W.:
Carton : 30 Reels
Total : 120,000PCS
2003 / 11 / 12 - A
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