MSB303 [BYTESONIC]

SINGLE PHASE 3.0 AMP SURFACE MOUNT BRIDGE RECTIFIERS;
MSB303
型号: MSB303
厂家: Bytesonic Electronics    Bytesonic Electronics
描述:

SINGLE PHASE 3.0 AMP SURFACE MOUNT BRIDGE RECTIFIERS

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THRU MSB307  
MSB301  
o
SINGLE PHASE 3.0 AMP SURFACE MOUNT BRIDGE RECTIFIERS  
Features  
MSBL  
.256(6.70)  
The plastic package carries Underwriters Laboratory  
.059(1.50)  
.051(1.30)  
.264(6.50)  
Flammability Classification 94V-0  
Idea for printed circuit board  
.205(5.20)  
.197(5.00)  
.016(0.40)  
.005(0.15)  
Glass passivated Junction chip  
Low reverse leakage  
+
-
High forward surge current capability  
High temperature soldering guaranteed  
265 C/10 seconds at terminals  
~ ~  
Mechanical Data  
Case : Molded plastic body  
Terminals : Solder plated, solderable per  
MIL-STD-750,Method 2026  
.045(1.15)  
.037(0.95)  
Polarity : Polarity symbol marking on body  
Mounting Position: Any  
Dimensions in inches and (millimeters)  
Lead Free Finish/RoHS 2.0 Compliant  
Maximum Ratings And Electrical Characteristics  
Single phase half-wave 60Hz,resistive or inductive load,  
Ratings at 25 C ambient temperature unless otherwise specified.  
for capacitive load current derate by 20%.  
SYMBOLS  
MSB307  
UNITS  
MSB305 MSB  
306  
Parameter  
MSB  
3
02 MSB  
3
03  
MSB301  
50  
MSB304  
V
VRRM  
VRMS  
1000  
700  
Maximum repetitive peak reverse voltage  
Maximum RMS voltage  
600  
420  
600  
400  
280  
400  
100  
70  
200  
140  
800  
560  
800  
V
V
35  
Maximum DC blocking voltage  
Maximum average forward rectified current  
VDC  
I(AV)  
1000  
100  
200  
50  
3.0  
A
A
at TC  
=110 C  
Peak forward surge current, 8.3ms single half  
sine-wave superimposed on rated load  
IFSM  
90.0  
I2t  
A2s  
Rating for fusing (t=8.3ms, Ta=25 C)  
33.6  
1.0  
VF  
Maximum instantaneous forward voltage at 3.0A  
V
A =25 C  
T
Maximum DC reverse current  
5.0  
500  
IR  
u
A
at rated DC blocking voltage TA=125 C  
Typical junction capacitance (Note 1)  
Typical thermal resistance  
CJ  
35.0  
55.0  
pF  
RqJA  
C/W  
Operating junction and storage temperature range  
TJ,TSTG  
C
-55 to +150  
Note:  
1.Measured at 1MHz and applied reverse voltage of 4.0V D.C.  
http://www  
.bytesonic.com  
.tw/  
Version 1.1  
2020/5/8  
MSB301~MSB307  
RATINGAND CHARACTERISTIC CURVES (MSB301 THRU MSB307  
)
FIG. 2 – MAXIMUM NON-REPETITIVE SURGE CURRENT  
FIG. 1 – FORWARD CURRENT DERATING CURVE  
3.0  
2.0  
1.0  
120  
90  
PULSE WIDTH 8.3ms  
SINGLE HALF-SINE-  
WAVE  
60  
30  
0
0
0
50  
CASE TEMPERATURE,℃  
FIG.3-TYPICAL FORWARD CHARACTERISTICS  
100  
150  
100  
1
2
5
50  
10  
20  
NUMBER OF CYCLES AT 60Hz  
FIG.4- TYPICAL REVERSE CHARACTERISTICS  
TJ=125°  
100  
10  
10  
TJ=75°C  
TJ=25°  
1.0  
0.1  
1.0  
TJ = 25°C  
0.01  
0.1  
20  
40  
1000  
140  
0
60  
80  
120  
1.8  
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6  
INSTANTANEOUS FORWARD VOLTAGE  
0
RATED PEAK REVERSE VOLTAGE, (V)  
Suggested Pad Layout  
Symbol  
Unit (mm)  
1.8  
Unit (inch)  
0.071  
A
B
C
D
E
F
2.0  
0.078  
5.50  
9.15  
2.6  
0.216  
0.360  
0.102  
0.289  
7.35  
http://www  
.bytesonic.com  
.tw/  
Version 1.1  
2020/5/8  
MSB301~MSB307  
Suggested Soldering Temperature Profile  
Note  
phase oven, hot air oven, wave solder.  
Recom m ended reflow m ethods: IR, vapor  
The device can be exposed to a m axim um tem perature of 265°C for 10 seconds.  
industry m ethods and solvents.  
Devices can be cleaned using standard  
If reflow temperatures exceed the  
perform ance requirem ents.  
recom m ended profile, devices m ay not m eet the  
Package Information  
Carrier Dimension(mm)  
D0  
1.55  
T
E
1.75  
W
B0  
F
A0  
6.90  
P0  
K0  
1.65  
P2  
8.60  
7.50  
Tolerance  
P1  
12.0  
2.0  
4.0  
0.30  
16  
0.1  
Package Specifications  
Box Size  
(mm)  
QTY/Box  
(Kpcs)  
Q'TY/Carton  
(Kpcs)  
Carton Size  
(mm)  
Q'TY/Reel  
(Kpcs)  
Reel DIA.  
(mm)  
Package  
Reel Size  
13'  
3
338  
6
48  
MSBL  
330  
365*365*360  
http://www  
.bytesonic.com  
.tw/  
Version 1.1  
2020/5/8  

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