CSPRC032A [CALMIRCO]
4 Channel EMI Filter Network; 4通道EMI滤波器网络
| 型号： | CSPRC032A |
| 厂家： | 
CALIFORNIA MICRO DEVICES CORP |
| 描述： | 4 Channel EMI Filter Network |
| 文件： | 总5页 (文件大小：218K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CSPRC032A
4 Channel EMI Filter Network
Product Description
Features
•
•
•
•
4 EMI filter lines per device
The CSPRC032A is a 4-channel low pass EMI filter (R-
C-R configuration) in a Chip Scale Package (CSP).
Many portable applications require the attenuation of
signals in the 800-3000 MHz band. California Micro
Devices’ unique thin film technology provides a mini-
mum of –25dB of attenuation over this frequency band.
Filters attenuate to –30dB at 3GHz
CSP package minimizes cross-talk
9-bump 2.485mm X 0.985mm Chip Scale
Package (CSP), 0.5mm pitch
0.30mm Eutectic solder bumps
Ultra small footprint suitable for portable devices
Lead-free version available
•
•
•
The bump size and pitch of these filters are selected
such that the device can be placed directly on an FR4
printed circuit board using conventional assembly tech-
niques. The pin-out for the device features a signal
‘flow through’ design, allowing optimal signal routing.
The solder bump contacts are a 63/37 Sn/Pb alloy (Sn/
Ag/Cu for lead-free finish) and are 0.30 mm in diame-
ter.
Applications
•
•
•
•
•
•
EMI filtering for RF sections of wireless devices
Cellular phones
Cordless phones
Internet appliances
PDAs
The CSPRC032A is available in a space-saving, low-
profile Chip Scale Package with optional lead-free fin-
ishing.
Laptop computers
Electrical Schematic
50
Ω
A1
A2
50
Ω
B1
B2
R
R
C
43pF
GND
50
Ω
50
Ω
R
R
C
43pF
GND
GND
B3
B4
50
Ω
A4
A5
50
Ω
R
R
C
43pF
GND
GND
50
Ω
50
Ω
B5
R
R
C
43pF
© 2005 California Micro Devices Corp. All rights reserved.
11/09/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
1
CSPRC032A
PACKAGE / PINOUT DIAGRAMS
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
Orientation
Marking
(see note 2)
Orientation
Marking
1
2
3
4
5
A
A5
B5
A4
B4
A2
B2
A1
B1
A
B
032A
B3
CSPRC032A
CSP Package
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
Ordering Information
PART NUMBERING INFORMATION
Standard Finish
Lead-free Finish2
Ordering Part
Number1
CSPRC032AG
Ordering Part
Number1
Bumps
Package
Part Marking
Part Marking
9
CSP
CSPRC032A
032A
032A
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
-55 to +150
25
UNITS
Storage Temperature Range
Power Rating per Resistor
°C
mW
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
Operating Temperature Range
-40 to +85
°C
© 2005 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com 11/09/05
CSPRC032A
(NOTE 1)
ELECTRICAL OPERATING CHARACTERISTICS
SYMBOL PARAMETER
ILEAK Leakage Current, An or Bn to GND
R
CONDITIONS
MIN
TYP
MAX
UNITS
VIN=6.0V
1
µA
Resistance
45
34
50
43
55
Ω
pF
C
Capacitance
52
TOLR
TOLC
TCR
Resistor Absolute Tolerance
Capacitor Absolute Tolerance
+10
+20
+150
%
R = 50
Ω
C=43pF
Note 2
%
Temperature Coefficient of
Resistance
ppm/°C
TCC
FC
Temperature Coefficient of
Capacitance
Note 2
+500
ppm/°C
Filter Cutoff Frequency
R=50Ω, C=43pF;
74
82
MHz
MHz
Z
SOURCE=0
Ω
Ω
, ZLOAD=∞
ZSOURCE=50
, ZLOAD=50
Ω
Note 1: Electrical Operating Characteristics are guaranteed over the Operating Temperature Range unless otherwise specified.
Note 2: Parameters guaranteed by design or characterization.
Filter Performance
CSPRC032 Filter Typical Measured Frequency Response (S21) Measurement
The measurement is done with 50Ω-source and 50Ω-load impedance using a HP8753C Network Analyzer with a
HP85047A S-parameter Test Set.
© 2005 California Micro Devices Corp. All rights reserved.
11/09/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
3
CSPRC032A
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
0.275mm
Pad Size on PCB
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
0.325mm Round
0.125 - 0.150mm
0.330mm Round
50/50 by volume
No Clean
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
OSP (Entek Cu Plus 106A)
+50µm
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
+20µm
Maximum Dwell Time Above Liquidous
Maximum Soldering Temperature for Eutectic Devices using Eutectic Solder Paste
Maximum Soldering Temperature for Lead-free Devices using Lead-free Solder Paste
60 seconds
240°C
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 1. Recommended Non-Solder Mask Defined Pad Illustration
250
200
150
100
50
0
1:00.0
2:00.0
3:00.0
4:00.0
Time (minutes)
Figure 2. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 3. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2005 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com 11/09/05
CSPRC032A
Mechanical Details
CSP Mechanical Specifications
Mechanical Package Diagrams
The CSPRC032A is offered in a custom Chip Scale
Package (CSP). Dimensions are presented below. For
complete information on CMD’s Chip Scale Packaging,
see the California Micro Devices CSP Package Infor-
mation document.
BOTTOM VIEW
A1
SIDE
VIEW
C1
B1
5
4
3
2
1
PACKAGE DIMENSIONS
Package
Bumps
Custom CSP
9
A
B
Millimeters
Nom
Inches
Nom
Dim
Min
Max
Min
Max
A1
A2
B1
B2
0.940 0.985
2.440 2.485
0.495 0.500
0.495 0.500
1.030 0.0370 0.0388 0.0406
2.530 0.0961 0.0978 0.0996
0.505 0.0195 0.0197 0.0199
0.505 0.0195 0.0197 0.0199
D1
D2
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
C1 0.1925 0.2425 0.2925 0.0076 0.0095 0.0115
C2 0.1925 0.2425 0.2925 0.0076 0.0095 0.0115
DIMENSIONS IN MILLIMETERS
D1
D2
0.561 0.605
0.355 0.380
0.649 0.0221 0.0238 0.0256
0.405 0.0140 0.0150 0.0160
3500 pieces
Package Dimensions for
CSPRC032A 9-bump Chip Scale Package
# per tape
and reel
Controlling dimension: millimeters
CSP Tape and Reel Specifications
QTY
PER
REEL
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIA.
P0
P1
PART NUMBER
PKG. SIZE (mm)
CSPRC032A
2.485 X 0.985 X 0.605 2.62 X 1.12 X 0.762
8mm
178mm (7")
3500
4mm 4mm
10 Pitches Cumulative
Tolerance On Tape
0.2 mm
P
o
±
Top
Cover
Tape
A
o
W
B
o
K
o
For tape feeder reference
Embossment
only including draft.
P
Center Lines
of Cavity
1
Concentric around B.
User Direction of Feed
Figure 4. Tape and Reel Mechanical Data
© 2005 California Micro Devices Corp. All rights reserved.
11/09/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
5
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