PACDN3401R [CALMIRCO]
Trans Voltage Suppressor Diode, 5.8V V(RWM), Bidirectional,;
| 型号： | PACDN3401R |
| 厂家： | 
CALIFORNIA MICRO DEVICES CORP |
| 描述： | Trans Voltage Suppressor Diode, 5.8V V(RWM), Bidirectional, 二极管 |
| 文件： | 总3页 (文件大小：34K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PACDN3401C
Transient Voltage Suppressor, Single 5V, 0402 SMD
Features
Applications
• Single channel voltage suppressor in a surface
mount EIA standard 0402-sized device
• Cell phones
• PDAs
• Compact 0402 size saves board space and eases
layout in area critical applications compared to
traditional wire bonded IC packages
• Palmtop PCs
• Notebook PCs
• Set-top box audio and video ports
• In-system ESD protection to 30kV contact
discharge per IEC 61000-4-2 international ESD
standard
• Protection of interface ports or IC pins which are
exposed to ESD hazards
• Only 1nA leakage at 3.3V (typ.)
• PCMCIA cards (PC card)
Product Description
contact discharge, well beyond the maximum require-
ments of the IEC 61000-4-2 international standard (Level
4, 8kV contact discharge).
The PACDN3401C is a transient voltage suppressor that
is ideal for very high level protection for sensitive 5V
electronic components that may be subjected to electro-
static discharge (ESD). The bipolar configuration pro-
vides symmetrical ESD protection in cases where nodes
with AC signals are present. This device is designed and
characterized to safely dissipate ESD strikes at 30kV
Using the MIL-STD-883D (Method 3015) specification for
Human Body Model (HBM) ESD, signal pins are pro-
tected for contact discharges to greater than 30kV.
Schematic Configuration
Standard Part Ordering Information
Ordering Part Number
Package
Style
Bumps
Tape & Reel
Chip Scale
2
PACDN3401C/R
C1561000
© 2001 California Micro Devices Corp. All rights reserved.
215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
6/26/2001
1
PACDN3401C
Specifications: (At 25°C unless specified otherwise)
MIN
TYP
MAX
UNIT
V
Reverse Stand-off Voltage, I = 10µA
±5.9
Leakage current with 3.3V across device
1
100
nA
Signal Clamp Voltage:
Positive Clamp, 10mA
Negative Clamp, 10mA
6.0
–9.2
7.5
–7.5
9.2
–6.0
V
V
In-system ESD withstand voltage*:
Human Body Model (MIL-STD-883D, method 3015)
IEC 61000-4-2, contact discharge method
±30
±30
kV
kV
Clamping voltage during ESD discharge*
MIL-STD-883D (Method 3015), 8kV
13
45
V
Capacitance at 0V dc, 1MHz
pF
Temperature Range:
Operating
–40
–65
85
150
°C
Storage
* This parameter is guaranteed by design and characterization.
Device Dimensions
40 mils/1.0mm
3 mils
14 mils
20 mils/0.5mm
14 mils
3 mils
6 mils
3 ± 0.5 mils
Dimensions are ±2 mils unless specified
1000 mils = 1 inch
50
Device Capacitance
40
30
20
10
0
0
1
2
3
4
5
Voltage Across Device (V)
Typical Device Capacitance vs.Voltage
©2001 California Micro Devices Corp. All rights reserved.
215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
2
6/26/2001
PACDN3401C
Printed Circuit Board Recommendations
14 x 6 mils (0.356 x 0.152mm)
Rectangle
Pad Size in PCB
Pad Shape
Pad Definition
Non Solder Mask Defined Pads (NSMD)
18 x 10 mils (0.457 x 0.254mm)
6 mils (0.152mm)
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening
Solder Flux Ratio
14 x 6 mils (0.356 x 0.152mm)
50/50
Solder Paste Type
Bond Trace Finish
No Clean
OSP (Entek Cu Plus 106A)
Recommended PCB Land Pattern
Typical Solder Reflow Thermal Profile (No-Clean Flux)
250
EXH
PH
Z2
Z3
Z4
Z5
RF
CD
EXH
225
200
175
150
125
100
75
50
25
0
48
97
145
194
Time (s)
242
290
339
387
435
The solder bump contacts on the PACDN3401C are a 63/37 Sn/Pb alloy, and it is intended that this device be placed on an FR4 printed
circuit board using conventional assembly techniques.
© 2001 California Micro Devices Corp. All rights reserved.
215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
6/26/2001
3
相关型号：
©2020 ICPDF网 联系我们和版权申明