CAT24C16YI-GT3 [CATALYST]

1-Kb, 2-Kb, 4-Kb, 8-Kb and 16-Kb CMOS Serial EEPROM; 1 - KB , 2 - KB, 4 KB , 8 KB和16 KB的CMOS串行EEPROM
CAT24C16YI-GT3
型号: CAT24C16YI-GT3
厂家: CATALYST SEMICONDUCTOR    CATALYST SEMICONDUCTOR
描述:

1-Kb, 2-Kb, 4-Kb, 8-Kb and 16-Kb CMOS Serial EEPROM
1 - KB , 2 - KB, 4 KB , 8 KB和16 KB的CMOS串行EEPROM

内存集成电路 光电二极管 可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 时钟
文件: 总17页 (文件大小:371K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
CAT24C01/02/04/08/16  
1-Kb, 2-Kb, 4-Kb, 8-Kb and 16-Kb CMOS Serial EEPROM  
FEATURES  
DEVICE DESCRIPTION  
Supports Standard and Fast I2C Protocol  
1.8 V to 5.5 V Supply Voltage Range  
16-Byte Page Write Buffer  
The CAT24C01/02/04/08/16 are 1-Kb, 2-Kb, 4-Kb,  
8-Kb and 16-Kb respectively CMOS Serial EEPROM  
devices organized internally as 8/16/32/64 and 128  
pages respectively of 16 bytes each.All devices support  
both the Standard (100 kHz) as well as Fast (400 kHz)  
I2C protocol.  
Hardware Write Protection for entire memory  
Schmitt Triggers and Noise Suppression Filters  
on I2C Bus Inputs (SCL and SDA).  
Data is written by providing a starting address, then  
loading 1 to 16 contiguous bytes into a Page Write  
Buffer, and then writing all data to non-volatile memory  
in one internal write cycle. Data is read by providing a  
starting address and then shifting out data serially while  
automatically incrementing the internal address count.  
Low power CMOS technology  
1,000,000 program/erase cycles  
100 year data retention  
Industrial temperature range  
External address pins make it possible to address  
up to eight CAT24C01 or CAT24C02, four CAT24C04,  
two CAT24C08 and one CAT24C16 device on the  
same bus.  
RoHS-compliant 8-lead PDIP, SOIC, MSOP  
and TSSOP, 8-pad TDFN and 5-lead TSOT-23  
packages.  
For Ordering Information details, see page 16.  
PIN CONFIGURATION  
FUNCTIONAL SYMBOL  
PDIP (L)  
SOIC (W)  
TSSOP (Y)  
MSOP (Z)  
V
CC  
TDFN (VP2)  
TSOT-23 (TD)  
CAT24C16 / 08 / 04 / 02 01  
/
SCL  
1
2
3
5
WP  
NC / NC / NC / A  
A
A
A
1
2
3
4
8
7
6
5
V
CC  
0 /  
1 /  
2 /  
0
1
2
SCL  
NC / NC / A / A  
1
WP  
V
SS  
NC / A / A / A  
SCL  
SDA  
2
2
A , A , A  
CAT24Cxx  
SDA  
2
1
0
SDA  
4
V
V
CC  
SS  
WP  
For the location of Pin 1, please consult the corresponding package drawing.  
PIN FUNCTIONS  
V
SS  
A0, A1, A2  
SDA  
SCL  
WP  
Device Address Inputs  
Serial Data Input/Output  
Serial Clock Input  
Write Protect Input  
Power Supply  
VCC  
VSS  
Ground  
NC  
No Connect  
* Catalyst carries the I2C protocol under a license from the Philips Corporation.  
© 2006 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. 1115, Rev. C  
1
CAT24C01/02/04/08/16  
ABSOLUTE MAXIMUM RATINGS(1)  
Storage Temperature  
Voltage on Any Pin with Respect to Ground(2)  
-65°C to +150°C  
-0.5 V to +6.5 V  
RELIABILITY CHARACTERISTICS(3)  
Symbol Parameter  
Min  
1,000,000  
100  
Units  
Program/ Erase Cycles  
Years  
(4)  
NEND  
TDR  
Endurance  
Data Retention  
D.C. OPERATING CHARACTERISTICS  
VCC = 1.8 V to 5.5 V, TA = -40°C to 85°C, unless otherwise specified.  
Symbol Parameter  
Test Conditions  
Min  
Max  
Units  
ICCR  
Read Current  
Read, fSCL = 400 kHz  
1
mA  
ICCW  
ISB  
Write Current  
Write, fSCL = 400 kHz  
1
mA  
All I/O Pins at GND or VCC  
μA  
Standby Current  
I/O Pin Leakage  
Input Low Voltage  
Input High Voltage  
Output Low Voltage  
Output Low Voltage  
1
1
IL  
Pin at GND or VCC  
μA  
V
VIL  
VIH  
-0.5  
VCC x 0.3  
VCC x 0.7 VCC + 0.5  
V
VOL1  
VOL2  
0.4  
0.2  
V
VCC 2.5 V, IOL = 3.0 mA  
VCC < 2.5 V, IOL = 1.0 mA  
V
PIN IMPEDANCE CHARACTERISTICS  
VCC = 1.8 V to 5.5 V, TA = -40°C to 85°C, unless otherwise specified.  
Symbol Parameter  
Conditions  
Max  
8
Units  
pF  
(3)  
CIN  
SDA I/O Pin Capacitance  
VIN = 0 V  
(3)  
CIN  
IWP  
Input Capacitance (other pins)  
WP Input Current  
VIN = 0 V  
6
pF  
(5)  
VIN < VIH, VCC = 5.5 V  
VIN < VIH, VCC = 3.3 V  
VIN < VIH, VCC = 1.8 V  
VIN > VIH  
200  
150  
100  
1
μA  
Note:  
(1) Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions outside of those listed in the operational sections of this speci-  
fication is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability.  
(2) The DC input voltage on any pin should not be lower than -0.5 V or higher than VCC + 0.5 V. During transitions, the voltage on any pin may  
undershoot to no less than -1.5 V or overshoot to no more than VCC + 1.5 V, for periods of less than 20 ns.  
(3) These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC-Q100  
and JEDEC test methods.  
(4) Page Mode, VCC = 5 V, 25°C  
(5) When not driven, the WP pin is pulled down to GND internally. For improved noise immunity, the internal pull-down is relatively strong;  
therefore the external driver must be able to supply the pull-down current when attempting to drive the input HIGH. To conserve power,  
as the input level exceeds the trip point of the CMOS input buffer (~ 0.5 x VCC), the strong pull-down reverts to a weak current source.  
© 2006 by Catalyst Semiconductor, Inc.  
Doc. No. 1115, Rev. C  
2
Characteristics subject to change without notice  
CAT24C01/02/04/08/16  
A.C. CHARACTERISTICS(1)  
VCC = 1.8 V to 5.5 V, TA = -40°C to 85°C.  
Standard  
Fast  
Symbol  
Parameter  
Min  
Max  
Min  
Max  
Units  
FSCL  
Clock Frequency  
100  
400  
kHz  
tHD:STA  
tLOW  
START Condition Hold Time  
Low Period of SCL Clock  
High Period of SCL Clock  
START Condition Setup Time  
Data In Hold Time  
4
4.7  
4
0.6  
1.3  
0.6  
0.6  
0
μs  
μs  
μs  
μs  
μs  
ns  
ns  
ns  
μs  
μs  
μs  
ns  
ns  
μs  
μs  
ms  
ms  
tHIGH  
tSU:STA  
tHD:DAT  
tSU:DAT  
tR  
4.7  
0
Data In Setup Time  
250  
100  
SDA and SCL Rise Time  
SDA and SCL Fall Time  
STOP Condition Setup Time  
Bus Free Time Between STOP and START  
SCL Low to Data Out Valid  
Data Out Hold Time  
1000  
300  
300  
300  
(2)  
tF  
tSU:STO  
tBUF  
4
0.6  
1.3  
4.7  
tAA  
3.5  
0.9  
tDH  
100  
100  
Ti(2)  
Noise Pulse Filtered at SCL and SDA Inputs  
WP Setup Time  
100  
100  
tSU:WP  
tHD:WP  
tWR  
0
0
WP Hold Time  
2.5  
2.5  
Write Cycle Time  
5
1
5
1
(2, 3)  
tPU  
Power-up to Ready Mode  
Note:  
(1) Test conditions according to “A.C. Test Conditions” table.  
(2) Tested initially and after a design or process change that affects this parameter.  
(3) tPU is the delay between the time VCC is stable and the device is ready to accept commands.  
A.C. TEST CONDITIONS  
Input Levels  
0.2 x VCC to 0.8 x VCC  
50 ns  
Input Rise and Fall Times  
Input Reference Levels  
0.3 x VCC, 0.7 x VCC  
Output Reference Levels 0.5 x VCC  
Output Load  
Current Source: IOL = 3 mA (VCC 2.5 V); IOL = 1 mA (VCC < 2.5 V); CL = 100 pF  
© 2006 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. 1115, Rev. C  
3
CAT24C01/02/04/08/16  
I2C BUS PROTOCOL  
POWER-ON RESET (POR)  
The I2C bus consists of two ‘wires’, SCL and SDA. The  
two wires are connected to the VCC supply via pull-up  
resistors. Master and Slave devices connect to the 2-  
wire bus via their respective SCL and SDA pins. The  
transmitting device pulls down the SDAline to ‘transmit’  
a ‘0’ and releases it to ‘transmit’ a ‘1’.  
Each CAT24Cxx* incorporates Power-On Reset (POR)  
circuitry which protects the internal logic against  
powering up in the wrong state.  
A CAT24Cxx device will power up into Standby mode  
after VCC exceeds the POR trigger level and will power  
down into Reset mode when VCC drops below the POR  
trigger level. This bi-directional POR feature protects  
the device against ‘brown-out’ failure following a  
temporary loss of power.  
Data transfer may be initiated only when the bus is not  
busy (see A.C. Characteristics).  
During data transfer, the SDA line must remain stable  
while the SCL line is HIGH. An SDA transition while  
SCL is HIGH will be interpreted as a START or STOP  
condition (Figure 1). The START condition precedes all  
commands. It consists of a HIGH to LOW transition on  
SDAwhile SCLis HIGH. The STARTacts as a ‘wake-up’  
call to all receivers. Absent a START, a Slave will not  
respond to commands. The STOP condition completes  
all commands. It consists of a LOW to HIGH transition  
on SDA while SCL is HIGH.  
* For common features, the CAT24C01/02/04/08/16 will be refered  
to as CAT24Cxx  
PIN DESCRIPTION  
SCL:The Serial Clock input pin accepts the Serial Clock  
generated by the Master.  
Device Addressing  
SDA: The Serial Data I/O pin receives input data and  
transmitsdatastoredinEEPROM.Intransmitmode,this  
pin is open drain. Data is acquired on the positive edge,  
and is delivered on the negative edge of SCL.  
The Master initiates data transfer by creating a START  
condition on the bus. The Master then broadcasts an  
8-bitserialSlaveaddress.FornormalRead/Writeopera-  
tions, the first 4 bits of the Slave address are fixed at  
1010 (Ah). The next 3 bits are used as programmable  
address bits when cascading multiple devices and/or as  
internal address bits. The last bit of the slave address,  
R/W, specifies whether a Read (1) or Write (0) operation  
is to be performed. The 3 address space extension bits  
are assigned as illustrated in Figure 2. A2, A1 and A0  
must match the state of the external address pins, and  
a10, a9 and a8 are internal address bits.  
A0, A1 and A2: The Address inputs set the device ad-  
dresswhencascadingmultipledevices.Whennotdriven,  
these pins are pulled LOW internally.  
WP: The Write Protect input pin inhibits all write opera-  
tions, when pulled HIGH. When not driven, this pin is  
pulled LOW internally.  
Acknowledge  
After processing the Slave address, the Slave responds  
with an acknowledge (ACK) by pulling down the SDA  
line during the 9th clock cycle (Figure 3). The Slave will  
also acknowledge the address byte and every data byte  
presented in Write mode. In Read mode the Slave shifts  
out a data byte, and then releases the SDA line during  
the 9th clock cycle.As long as the Master acknowledges  
thedata, theSlavewillcontinuetransmitting.TheMaster  
terminates the session by not acknowledging the last  
data byte (NoACK) and by issuing a STOP condition.  
Bus timing is illustrated in Figure 4.  
FUNCTIONAL DESCRIPTION  
TheCAT24CxxsupportstheInter-IntegratedCircuit(I2C)  
Bus data transmission protocol, which defines a device  
that sends data to the bus as a transmitter and a device  
receiving data as a receiver. Data flow is controlled by  
a Master device, which generates the serial clock and  
all START and STOP conditions. The CAT24Cxx acts  
as a Slave device. Master and Slave alternate as either  
transmitter or receiver.  
© 2006 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. 1115, Rev. C  
4
CAT24C01/02/04/08/16  
Figure 1. START/STOP Conditions  
SCL  
SDA  
START  
STOP  
CONDITION  
CONDITION  
Figure 2. Slave Address Bits  
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
A
A
A
A
A
A
R/W  
R/W  
R/W  
R/W  
CAT24C01 and CAT24C02  
CAT24C04  
2
2
2
1
1
9
9
0
8
8
8
a
a
a
a
a
CAT24C08  
a
CAT24C16  
10  
Figure 3. Acknowledge Timing  
BUS RELEASE DELAY (TRANSMITTER)  
BUS RELEASE DELAY (RECEIVER)  
SCL FROM  
MASTER  
1
8
9
DATA OUTPUT  
FROM TRANSMITTER  
DATA OUTPUT  
FROM RECEIVER  
ACK SETUP (t  
)
SU:DAT  
START  
ACK DELAY (t  
)
AA  
Figure 4. Bus Timing  
t
t
t
F
HIGH  
R
t
t
LOW  
LOW  
SCL  
t
t
SU:STA  
HD:DAT  
t
t
t
HD:STA  
SU:DAT  
SU:STO  
SDA IN  
t
BUF  
t
t
AA  
DH  
SDA OUT  
© 2006 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. 1115, Rev. C  
5
CAT24C01/02/04/08/16  
WRITE OPERATIONS  
Byte Write  
Hardware Write Protection  
In Byte Write mode, the Master sends the START condi-  
tion and the Slave address with the R/W bit set to zero  
to the Slave.After the Slave generates an acknowledge,  
the Master sends the byte address that is to be written  
into the address pointer of the CAT24Cxx. After receiv-  
ing another acknowledge from the Slave, the Master  
transmits the data byte to be written into the addressed  
memory location. The CAT24Cxx device will acknowl-  
edge the data byte and the Master generates the STOP  
condition, at which time the device begins its internal  
Write cycle to nonvolatile memory (Figure 5). While this  
internal cycle is in progress (tWR), the SDA output will  
be tri-stated and the CAT24Cxx will not respond to any  
request from the Master device (Figure 6).  
WiththeWPpinheldHIGH,theentirememoryisprotected  
against Write operations. If the WP pin is left floating or  
is grounded, it has no impact on the operation of the  
CAT24Cxx. The state of the WP pin is strobed on the  
last falling edge of SCL immediately preceding the first  
data byte (Figure 8). If the WP pin is HIGH during the  
strobe interval, the CAT24Cxx will not acknowledge the  
data byte and the Write request will be rejected.  
Delivery State  
The CAT24Cxx is shipped erased, i.e., all bytes are  
FFh.  
Page Write  
The CAT24Cxx writes up to 16 bytes of data in a single  
write cycle, using the Page Write operation (Figure 7).  
ThePageWriteoperationisinitiatedinthesamemanner  
as the Byte Write operation, however instead of termi-  
nating after the data byte is transmitted, the Master is  
allowed to send up to fifteen additional bytes.After each  
byte has been transmitted the CAT24Cxx will respond  
with an acknowledge and internally increments the four  
low order address bits. The high order bits that define  
the page address remain unchanged. If the Master  
transmits more than sixteen bytes prior to sending the  
STOP condition, the address counter ‘wraps around’ to  
the beginning of page and previously transmitted data  
will be overwritten. Once all sixteen bytes are received  
and the STOP condition has been sent by the Master,  
the internal Write cycle begins. At this point all received  
data is written to the CAT24Cxx in a single write cycle.  
Acknowledge Polling  
The acknowledge (ACK) polling routine can be used to  
take advantage of the typical write cycle time. Once the  
stop condition is issued to indicate the end of the host’s  
writeoperation, theCAT24Cxxinitiatestheinternalwrite  
cycle. TheACKpollingcanbeinitiatedimmediately. This  
involves issuing the start condition followed by the slave  
address for a write operation. If the CAT24Cxx is still  
busy with the write operation, NoACK will be returned. If  
theCAT24Cxxhascompletedtheinternalwriteoperation,  
an ACK will be returned and the host can then proceed  
with the next read or write operation.  
© 2006 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. 1115, Rev. C  
6
CAT24C01/02/04/08/16  
Figure 5. Byte Write Sequence  
S
T
A
R
T
BUS ACTIVITY:  
MASTER  
S
ADDRESS  
BYTE  
DATA  
BYTE  
T
O
P
SLAVE  
ADDRESS  
a
÷ a  
d ÷ d  
7 0  
7
0
S
P
A
C
K
A
C
K
A
C
K
SLAVE  
* For the CAT24C01 a = 0  
7
Figure 6. Write Cycle Timing  
SCL  
th  
SDA  
8
Bit  
ACK  
Byte n  
t
WR  
STOP  
CONDITION  
START  
CONDITION  
ADDRESS  
Figure 7. Page Write Sequence  
S
T
A
R
T
BUS ACTIVITY:  
MASTER  
DATA  
BYTE  
n
DATA  
BYTE  
n+1  
DATA  
BYTE  
n+P  
S
T
O
P
ADDRESS  
BYTE  
SLAVE  
ADDRESS  
S
P
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
SLAVE  
n = 1  
P 15  
Figure 8. WP Timing  
ADDRESS  
BYTE  
DATA  
BYTE  
1
8
9
1
8
SCL  
SDA  
a
a
d
d
0
7
0
7
t
SU:WP  
WP  
t
HD:WP  
© 2006 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. 1115, Rev. C  
7
CAT24C01/02/04/08/16  
READ OPERATIONS  
Immediate Read  
Upon receiving a Slave address with the R/W bit set  
to ‘1’, the CAT24Cxx will interpret this as a request for  
data residing at the current byte address in memory.  
The CAT24Cxx will acknowledge the Slave address,  
will immediately shift out the data residing at the current  
address, and will then wait for the Master to respond.  
If the Master does not acknowledge the data (NoACK)  
and then follows up with a STOP condition (Figure 9),  
the CAT24Cxx returns to Standby mode.  
Selective Read  
Selective Read operations allow the Master device to  
select at random any memory location for a read opera-  
tion. The Master device first performs a ‘dummy’ write  
operation by sending the START condition, slave ad-  
dress and byte address of the location it wishes to read.  
After the CAT24Cxx acknowledges the byte address,  
the Master device resends the START condition and  
the slave address, this time with the R/W bit set to one.  
The CAT24Cxx then responds with its acknowledge and  
sends the requested data byte. The Master device does  
not acknowledge the data (NoACK) but will generate a  
STOP condition (Figure 10).  
Sequential Read  
IfduringaReadsession,theMasteracknowledgesthe1st  
data byte, then the CAT24Cxx will continue transmitting  
data residing at subsequent locations until the Master  
responds with a NoACK, followed by a STOP (Figure  
11). In contrast to Page Write, during Sequential Read  
the address count will automatically increment to and  
then wrap-around at end of memory (rather than end  
of page). In the CAT24C01, the internal address count  
will not wrap around at the end of the 128 byte memory  
space.  
© 2006 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. 1115, Rev. C  
8
CAT24C01/02/04/08/16  
Figure 9. Immediate Read Sequence and Timing  
N
O
S
T
A
R
T
BUS ACTIVITY:  
MASTER  
S
A T  
C O  
K P  
SLAVE  
ADDRESS  
S
P
A
C
K
DATA  
BYTE  
SLAVE  
SCL  
SDA  
8
9
th  
8
Bit  
DATA OUT  
NO ACK  
STOP  
Figure 10. Selective Read Sequence  
N
O
S
T
A
R
T
S
T
A
R
T
BUS ACTIVITY:  
MASTER  
S
A T  
C O  
K P  
ADDRESS  
BYTE  
SLAVE  
ADDRESS  
SLAVE  
ADDRESS  
S
S
P
A
C
K
A
C
K
A
C
K
DATA  
BYTE  
SLAVE  
Figure 11. Sequential Read Sequence  
N
O
BUS ACTIVITY:  
SLAVE  
S
T
O
P
A
C
K
A
C
K
A
C
K
A
C
K
MASTER  
ADDRESS  
P
A
C
K
SLAVE  
DATA  
BYTE  
n
DATA  
BYTE  
n+1  
DATA  
BYTE  
n+2  
DATA  
BYTE  
n+x  
© 2006 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. 1115, Rev. C  
9
CAT24C01/02/04/08/16  
PACKAGE OUTLINE  
8-lead 300 MIL Wide Plastic DIP (L)  
E1  
E
D
A2  
A
L
A1  
e
eB  
b2  
b
SYMBOL  
MIN  
NOM  
MAX  
A
A1  
A2  
b
4.57  
0.38  
3.05  
0.36  
1.14  
9.02  
7.62  
6.09  
3.81  
0.56  
1.77  
10.16  
8.25  
7.11  
0.46  
b2  
D
E
7.87  
6.35  
E1  
e
2.54 BSC  
eB  
L
7.87  
0.115  
9.65  
0.150  
0.130  
Notes:  
(1) All dimensions are in millimeters. Angels in degrees.  
(2) Complies with JEDEC Standard MS001.  
(3) Dimensioning and tolerancing per ANSI Y14.5M-1982  
© 2006 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. 1115, Rev. C  
10  
CAT24C01/02/04/08/16  
8-lead 150 Mil Wide Soic (W)  
E1  
E
h x 45  
D
C
A
θ1  
e
A1  
L
b
SYMBOL  
MIN  
0.10  
1.35  
0.33  
0.19  
4.80  
5.80  
3.80  
NOM  
MAX  
0.25  
1.75  
0.51  
0.25  
5.00  
6.20  
4.00  
A1  
A
b
C
D
E
E1  
e
1.27 BSC  
h
0.25  
0.40  
0°  
0.50  
1.27  
8°  
L
θ1  
For current Tape and Reel information, download the PDF file from:  
http://www.catsemi.com/documents/tapeandreel.pdf.  
Notes:  
(1) All dimensions are in millimeters. Angels in degrees.  
(2) Complies with JEDEC specification MS-012 dimensions.  
© 2006 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. 1115, Rev. C  
11  
CAT24C01/02/04/08/16  
8-Lead TSSOP (Y)  
D
5
8
SEE DETAIL A  
c
E
E1  
E/2  
GAGE PLANE  
0.25  
1
4
PIN #1 IDENT.  
θ1  
L
A2  
SEATING PLANE  
SEE DETAIL A  
A
e
A1  
b
SYMBOL  
MIN  
NOM  
MAX  
A
A1  
A2  
b
1.20  
0.15  
1.05  
0.30  
0.20  
3.10  
6.50  
4.50  
0.05  
0.80  
0.19  
0.09  
2.90  
6.30  
4.30  
0.90  
c
D
3.00  
6.4  
E
E1  
e
4.40  
0.65 BSC  
0.60  
L
0.50  
0.00  
0.75  
8.00  
θ
1
For current Tape and Reel information, download the PDF file from:  
http://www.catsemi.com/documents/tapeandreel.pdf.  
Notes:  
(1) All dimensions are in millimeters. Angels in degrees.  
(2) Complies with JEDEC specification MO-153.  
© 2006 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. 1115, Rev. C  
12  
CAT24C01/02/04/08/16  
8-Lead MSOP (Z)  
E1  
E
e
D
GAUGE  
PLANE  
A2  
A
L2  
L
b
A1  
L1  
SYMBOL  
MIN  
NOM  
MAX  
1.1  
A
A1  
A2  
b
0.05  
0.75  
0.28  
0.10  
0.85  
0.33  
0.15  
0.95  
0.38  
c
D
2.90  
4.80  
2.90  
3.00  
4.90  
3.00  
3.10  
5.00  
3.10  
E
E1  
e
0.65 BSC  
0.45  
L
0.35  
0.55  
For current Tape and Reel information,  
download the PDF file from:  
http://www.catsemi.com/documents/tapeandreel.pdf.  
L1  
L2  
0°  
6°  
Notes:  
(1) All dimensions are in millimeters. Angels in degrees.  
(2) Complies with JEDEC specification MS-187.  
(3) Stand off height/coplanarity are considered as special characteristics.  
© 2006 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. 1115, Rev. C  
13  
CAT24C01/02/04/08/16  
8-PAD TDFN 2X3 PACKAGE (VP2)  
A
E
PIN 1 INDEX AREA  
A1  
D
D2  
A2  
A3  
SYMBOL  
MIN  
0.70  
0.00  
0.45  
NOM  
0.75  
MAX  
0.80  
0.05  
0.65  
A
A1  
A2  
A3  
b
0.02  
E2  
0.55  
0.20 REF  
0.25  
0.20  
1.90  
1.30  
2.90  
1.20  
0.30  
2.10  
1.50  
3.10  
1.40  
PIN 1 ID  
D
2.00  
D2  
E
1.40  
3.00  
E2  
e
1.30  
L
0.50 TYP  
0.30  
L
0.20  
0.40  
b
e
3 x e  
For current Tape and Reel information, download the PDF file from:  
http://www.catsemi.com/documents/tapeandreel.pdf.  
Notes:  
(1) All dimensions are in millimeters. Angels in degrees.  
(2) Complies with JEDEC specification MO-229.  
© 2006 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. 1115, Rev. C  
14  
CAT24C01/02/04/08/16  
5-Lead TSOT-23 (TD)  
e
e
E
E1  
E1  
e1  
D
GAUGE  
PLANE  
A2  
c
A
L2  
θ
L
A1  
b
L1  
SYMBOL  
MIN  
NOM  
MAX  
1.0  
A
A1  
A2  
b
0.01  
0.80  
0.30  
0.12  
0.05  
0.1  
0.87  
0.9  
0.45  
0.20  
c
0.15  
D
2.90 BSC  
2.80 BSC  
1.60 BSC  
0.95 BSC  
1.90 BSC  
0.40  
E
E1  
e
e1  
L
0.30  
0.50  
L1  
L2  
θ
0.60 REF  
0.25 BSC  
0°  
8°  
For current Tape and Reel information, download the PDF file from:  
http://www.catsemi.com/documents/tapeandreel.pdf.  
Notes:  
(1) All dimensions are in millimeters. Angels in degrees.  
(2) Complies with JEDEC specification MO-193.  
© 2006 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. 1115, Rev. C  
15  
CAT24C01/02/04/08/16  
EXAMPLE OF ORDERING INFORMATION  
Prefix  
Device #  
24C16  
Suffix  
CAT  
Y
I
G
T3  
Company ID  
Product Number  
24C01  
Temperature Range  
I = Industrial (-40°C to +85°C)  
T: Tape & Reel  
3: 3000/Reel  
24C02  
24C04  
24C08  
24C16  
Lead Finish  
G: NiPdAu  
Blank: Matte-Tin  
Package  
L: PDIP  
W: SOIC, JEDEC  
Y: TSSOP  
Z: MSOP (4)  
VP2: TDFN  
TD: TSOT  
Notes:  
(1) All packages are RoHS-compliant (Lead-free, Halogen-free).  
(2) The standard lead finish is NiPdAu pre-plated (PPF) lead frames.  
(3) The device used in the above example is a CAT24C16YI-GT3 (TSSOP, Industrial Temperature, NiPdAu, Tape & Reel).  
(4) For availability, please contact your nearest Catalyst Semiconductor Sales Office.  
(5) For additional package and temperature options, please contact your nearest Catalyst Semiconductor Sales office.  
© 2006 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. 1115, Rev. C  
16  
REVISION HISTORY  
Date  
Revision Comments  
07/18/06  
07/31/06  
11/29/06  
A
B
C
Combine 5 data sheets into one data sheet.  
Update Package Marking  
Update Features  
Update Pin Configuration  
Update Functional Symbol  
Added 8-Lead MSOP Package Outline  
Remove Package Marking  
Update Example of Ordering Information  
Copyrights, Trademarks and Patents  
Trademarks and registered trademarks of Catalyst Semiconductor include each of the following:  
AE2 ™,  
Beyond Memory ™, DPP ™, EZDim ™, MiniPot™ and Quad-Mode ™  
Catalyst Semiconductor has been issued U.S. and foreign patents and has patent applications pending that protect its products.  
CATALYST SEMICONDUCTOR MAKES NO WARRANTY, REPRESENTATION OR GUARANTEE, EXPRESS OR IMPLIED, REGARDING THE SUITABILITY OF ITS  
PRODUCTS FOR ANY PARTICULAR PURPOSE, NOR THAT THE USE OF ITS PRODUCTS WILL NOT INFRINGE ITS INTELLECTUAL PROPERTY RIGHTS OR THE  
RIGHTS OF THIRD PARTIES WITH RESPECT TO ANY PARTICULAR USE OR APPLICATION AND SPECIFICALLY DISCLAIMS ANY AND ALL LIABILITY ARISING  
OUT OF ANY SUCH USE OR APPLICATION, INCLUDING BUT NOT LIMITED TO, CONSEQUENTIAL OR INCIDENTAL DAMAGES.  
Catalyst Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or  
other applications intended to support or sustain life, or for any other application in which the failure of the Catalyst Semiconductor product could create a  
situation where personal injury or death may occur.  
Catalyst Semiconductor reserves the right to make changes to or discontinue any product or service described herein without notice. Products with data sheets  
labeled “Advance Information” or “Preliminary” and other products described herein may not be in production or offered for sale.  
Catalyst Semiconductor advises customers to obtain the current version of the relevant product information before placing orders. Circuit diagrams illustrate  
typical semiconductor applications and may not be complete.  
Catalyst Semiconductor, Inc.  
Corporate Headquarters  
2975 Stender Way  
Santa Clara, CA 95054  
Publication #: 1115  
Phone: 408.542.1000  
Fax: 408.542.1200  
www.catsemi.com  
Revison:  
C
Issue date:  
11/29/06  

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