CAT28LV65JI-15T [CATALYST]

64K-Bit CMOS PARALLEL EEPROM; 64K位CMOS并行EEPROM
CAT28LV65JI-15T
型号: CAT28LV65JI-15T
厂家: CATALYST SEMICONDUCTOR    CATALYST SEMICONDUCTOR
描述:

64K-Bit CMOS PARALLEL EEPROM
64K位CMOS并行EEPROM

存储 内存集成电路 光电二极管 可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器
文件: 总12页 (文件大小:74K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
E
CAT28LV65  
64K-Bit CMOS PARALLEL EEPROM  
TM  
FEATURES  
CMOS and TTL compatible I/O  
3.0V to 3.6V supply  
Automatic page write operation:  
– 1 to 32 bytes in 5ms  
Read access times:  
– 150/200/250ns  
– Page load timer  
Low power CMOS dissipation:  
– Active: 8 mA max.  
End of write detection:  
– Toggle bit  
– Standby: 100 µA max.  
DATA polling  
– RDY/BUSY  
Simple write operation:  
– On-chip address and data latches  
– Self-timed write cycle with auto-clear  
Hardware and software write protection  
100,000 program/erase cycles  
100 year data retention  
Fast write cycle time:  
– 5ms max.  
Commercial, industrial and automotive  
temperature ranges  
DESCRIPTION  
The CAT28LV65 is manufactured using Catalyst’s  
advancedCMOSfloatinggatetechnology.Itisdesigned  
to endure 100,000 program/erase cycles and has a data  
retention of 100 years. The device is available in JEDEC  
approved 28-pin DIP, 28-pin TSOP, 28-pin SOIC or 32-  
pin PLCC packages.  
The CAT28LV65 is a low voltage, low power, CMOS  
parallel EEPROM organized as 8K x 8-bits. It requires a  
simple interface for in-system programming. On-chip  
address and data latches, self-timed write cycle with  
auto-clear and VCC power up/down write protection  
eliminate additional timing and protection hardware.  
DATA Polling, RDY/BUSY and Toggle status bit signal  
thestartandendoftheself-timedwritecycle.Additionally,  
the CAT28LV65 features hardware and software write  
protection.  
BLOCK DIAGRAM  
8,192 x 8  
E2PROM  
ARRAY  
ROW  
DECODER  
ADDR. BUFFER  
A –A  
5
12  
& LATCHES  
INADVERTENT  
WRITE  
PROTECTION  
HIGH VOLTAGE  
GENERATOR  
32 BYTE PAGE  
REGISTER  
V
CC  
CE  
OE  
WE  
CONTROL  
LOGIC  
I/O BUFFERS  
DATA POLLING,  
RDY/BUSY &  
TOGGLE BIT  
TIMER  
I/O –I/O  
0
7
ADDR. BUFFER  
& LATCHES  
A –A  
COLUMN  
DECODER  
0
4
RDY/BUSY  
© 2005 by Catalyst Semiconductor, Inc.  
Doc. No. 1024, Rev. D  
Characteristics subject to change without notice  
1
CAT28LV65  
PIN CONFIGURATION  
DIP Package (P, L)  
SOIC Package (J, W) (K, X)  
RDY/BUSY  
1
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
V
CC  
WE  
RDY/BUSY  
1
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
V
CC  
WE  
A
2
A
2
12  
12  
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
3
NC  
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
3
NC  
4
A
8
A
9
4
A
8
A
9
5
5
6
A
6
A
11  
11  
7
OE  
7
OE  
8
A
8
A
10  
10  
9
CE  
9
CE  
10  
11  
12  
13  
14  
I/O  
7
I/O  
6
I/O  
5
I/O  
4
10  
11  
12  
13  
14  
I/O  
7
I/O  
6
I/O  
5
I/O  
4
I/O  
0
I/O  
1
I/O  
2
I/O  
0
I/O  
1
I/O  
2
V
I/O  
3
V
I/O  
3
SS  
SS  
PLCC Package (N, G)  
TSOP Top View (8mm x 13.4mm) (T13, H13)  
A
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
1
2
3
4
5
6
7
8
OE  
10  
A
CE  
I/0  
I/0  
I/0  
I/0  
I/0  
11  
A
A
NC  
9
8
7
6
5
4
3
4
3 2 1 32 31 30  
WE  
5
6
7
8
9
29  
28  
27  
26  
25  
24  
23  
22  
21  
A
A
A
A
A
A
A
A
A
A
6
5
4
3
2
1
0
8
9
V
cc  
GND  
I/O  
RDY/BUSY  
A
9
11  
12  
2
10  
11  
12  
13  
14  
A
7
I/O  
1
NC  
OE  
A
I/O  
0
6
TOP VIEW  
A
5
A
0
10  
11  
12  
13  
A
10  
CE  
A
4
A
1
A
3
A
2
NC  
I/O  
I/O  
7
6
I/O  
0
14 15 16 17 18 19 20  
PIN FUNCTIONS  
Pin Name  
Function  
Address Inputs  
Pin Name  
WE  
Function  
Write Enable  
A0–A12  
I/O0–I/O7  
CE  
Data Inputs/Outputs  
Chip Enable  
VCC  
3.0 to 3.6 V Supply  
Ground  
VSS  
OE  
Output Enable  
NC  
No Connect  
RDY/BSY  
Ready/Busy Status  
Doc. No. 1024, Rev. D  
2
CAT28LV65  
ABSOLUTE MAXIMUM RATINGS*  
*COMMENT  
Temperature Under Bias ................. –55°C to +125°C  
Storage Temperature....................... –65°C to +150°C  
Stresses above those listed under “Absolute Maximum  
Ratings” may cause permanent damage to the device.  
These are stress ratings only, and functional operation  
of the device at these or any other conditions outside of  
those listed in the operational sections of this specifica-  
tion is not implied. Exposure to any absolute maximum  
rating for extended periods may affect device perfor-  
mance and reliability.  
Voltage on Any Pin with  
Respect to Ground(2) ........... –2.0V to +VCC + 2.0V  
V
CC with Respect to Ground ............... –2.0V to +7.0V  
Package Power Dissipation  
Capability (Ta = 25°C)................................... 1.0W  
Lead Soldering Temperature (10 secs) ............ 300°C  
Output Short Circuit Current(3) ........................ 100 mA  
RELIABILITY CHARACTERISTICS  
Symbol  
Parameter  
Endurance  
Min.  
105  
Max.  
Units  
Cycles/Byte  
Years  
Test Method  
(1)  
NEND  
MIL-STD-883, Test Method 1033  
MIL-STD-883, Test Method 1008  
MIL-STD-883, Test Method 3015  
JEDEC Standard 17  
(1)  
TDR  
Data Retention  
ESD Susceptibility  
Latch-Up  
100  
(1)  
VZAP  
2000  
100  
Volts  
(1)(4)  
ILTH  
mA  
MODE SELECTION  
Mode  
CE  
WE  
OE  
L
I/O  
DOUT  
DIN  
Power  
ACTIVE  
ACTIVE  
ACTIVE  
STANDBY  
ACTIVE  
Read  
L
L
H
Byte Write (WE Controlled)  
Byte Write (CE Controlled)  
Standby, and Write Inhibit  
Read and Write Inhibit  
H
L
X
H
H
DIN  
H
X
X
High-Z  
High-Z  
H
CAPACITANCE T = 25°C, f = 1.0 MHz  
A
Symbol  
Test  
Max.  
10  
Units  
pF  
Conditions  
(1)  
CI/O  
Input/Output Capacitance  
Input Capacitance  
VI/O = 0V  
VIN = 0V  
(1)  
CIN  
6
pF  
Note:  
(1) This parameter is tested initially and after a design or process change that affects the parameter.  
(2) The minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.0V for periods of less than 20 ns. Maximum DC  
voltage on output pins is V +0.5V, which may overshoot to V +2.0V for periods of less than 20 ns.  
CC  
CC  
(3) Output shorted for no more than one second. No more than one output shorted at a time.  
(4) Latch-up protection is provided for stresses up to 100mA on address and data pins from –1V to V +1V.  
CC  
Doc. No. 1024, Rev. D  
3
CAT28LV65  
D.C. OPERATING CHARACTERISTICS  
V
cc  
= 3.0V to 3.6V, unless otherwise specified.  
Limits  
Symbol  
Parameter  
Min. Typ.  
Max.  
Units  
Test Conditions  
CE = OE = VIL,  
f = 1/tRC min, All I/O’s Open  
CE = VIHC  
ICC  
VCC Current (Operating, TTL)  
8
mA  
(3)  
ISBC  
VCC Current (Standby, CMOS)  
100  
µA  
,
All I/O’s Open  
ILI  
Input Leakage Current  
Output Leakage Current  
–1  
–5  
1
5
µA  
µA  
VIN = GND to VCC  
ILO  
VOUT = GND to VCC  
,
CE = VIH  
(3)  
VIH  
High Level Input Voltage  
Low Level Input Voltage  
High Level Output Voltage  
Low Level Output Voltage  
Write Inhibit Voltage  
2
–0.3  
2
VCC +0.3  
0.6  
V
V
V
V
V
VIL  
VOH  
VOL  
VWI  
IOH = –100µA  
0.3  
IOL = 1.0mA  
2
A.C. CHARACTERISTICS, Read Cycle  
= 3.0V to 3.6V, unless otherwise specified.  
V
cc  
28LV65-15  
28LV65-20  
Min. Max.  
28LV65-25  
Symbol  
tRC  
Parameter  
Min.  
Max.  
Min.  
Max.  
Units  
ns  
Read Cycle Time  
150  
200  
250  
tCE  
CE Access Time  
150  
150  
70  
200  
200  
80  
250  
250  
100  
ns  
tAA  
Address Access Time  
OEAccess Time  
ns  
tOE  
ns  
(1)  
tLZ  
CE Low to Active Output  
OE Low to Active Output  
CE High to High-Z Output  
OE High to High-Z Output  
0
0
0
0
0
ns  
(1)  
tOLZ  
0
ns  
(1)(2)  
tHZ  
50  
50  
50  
50  
55  
55  
ns  
(1)(2)  
tOHZ  
ns  
Output Hold from  
Address Change  
(1)  
tOH  
0
0
0
ns  
Note:  
(1) This parameter is tested initially and after a design or process change that affects the parameter.  
(2) Output floating (High-Z) is defined as the state when the external data line is no longer driven by the output buffer.  
(3) V = V –0.3V to V +0.3V.  
IHC  
CC  
CC  
Doc. No. 1024, Rev. D  
4
CAT28LV65  
(4)  
Figure 1. A.C. Testing Input/Output Waveform  
V
- 0.3 V  
CC  
2.0 V  
0.6 V  
INPUT PULSE LEVELS  
REFERENCE POINTS  
0.0 V  
Figure 2. A.C. Testing Load Circuit (example)  
Vcc  
1.8 K  
DEVICE  
UNDER  
TEST  
OUTPUT  
1. 3K  
C
= 100 pF  
L
C INCLUDES JIG CAPACITANCE  
L
A.C. CHARACTERISTICS, Write Cycle  
= 3.0V to 3.6V, unless otherwise specified.  
V
cc  
28LV65-15  
Min Max  
28LV65-20  
Min Max  
28LV65-25  
Symbol  
tWC  
Parameter  
Min  
Max  
Units  
ms  
ns  
Write Cycle Time  
Address Setup Time0  
Address Hold Time  
CE Setup Time  
CE Hold Time  
5
5
5
tAS  
0
100  
0
0
100  
0
0
100  
0
tAH  
ns  
tCS  
ns  
tCH  
0
0
0
ns  
(2)  
tCW  
CE Pulse Time  
OE Setup Time  
OE Hold Time  
110  
0
150  
10  
10  
150  
100  
0
150  
10  
10  
150  
100  
0
ns  
tOES  
tOEH  
ns  
0
ns  
(2)  
tWP  
WE Pulse Width  
Data Setup Time  
Data Hold Time  
110  
60  
0
ns  
tDS  
tDH  
ns  
ns  
(1)  
tINIT  
Write Inhibit Period  
After Power-up  
5
10  
5
10  
5
10  
ms  
µs  
ns  
(1)(3)  
tBLC  
Byte Load Cycle Time  
0.05  
100  
220  
0.1  
100  
220  
0.1  
100  
220  
tRB  
WE Low to RDY/Busy Low  
Note:  
(1) This parameter is tested initially and after a design or process change that affects the parameter.  
(2) A write pulse of less than 20ns duration will not initiate a write cycle.  
(3) A timer of duration t  
max. begins with every LOW to HIGH transition of WE. If allowed to time out, a page or byte write will begin;  
BLC  
however a transition from HIGH to LOW within t  
max. stops the timer.  
BLC  
(4) Input rise and fall times (10% and 90%) < 10 ns.  
Doc. No. 1024, Rev. D  
5
CAT28LV65  
Byte Write  
DEVICE OPERATION  
A write cycle is executed when both CE and WE are low,  
and OE is high. Write cycles can be initiated using either  
WE or CE, with the address input being latched on the  
falling edge of WE or CE, whichever occurs last. Data,  
conversely, is latched on the rising edge of WE or CE,  
whichever occurs first. Once initiated, a byte write cycle  
automatically erases the addressed byte and the new  
data is written within 5 ms.  
Read  
Data stored in the CAT28LV65 is transferred to the data  
bus when WE is held high, and both OE and CE are held  
low. The data bus is set to a high impedance state when  
either CE or OE goes high. This 2-line control architec-  
ture can be used to eliminate bus contention in a system  
environment.  
Figure 3. Read Cycle  
t
RC  
ADDRESS  
t
CE  
CE  
t
OE  
OE  
V
IH  
t
WE  
LZ  
t
OHZ  
t
t
HZ  
DATA VALID  
t
OH  
OLZ  
HIGH-Z  
DATA OUT  
DATA VALID  
t
AA  
Figure 4. Byte Write Cycle [WE Controlled]  
t
WC  
ADDRESS  
t
t
AH  
AS  
t
t
CH  
CS  
CE  
OE  
t
t
t
OEH  
OES  
WP  
WE  
t
t
BLC  
RB  
HIGH-Z  
HIGH-Z  
RDY/BUSY  
HIGH-Z  
DATA OUT  
DATA IN  
DATA VALID  
DS  
t
t
DH  
Doc. No. 1024, Rev. D  
6
CAT28LV65  
Page Write  
(which can be loaded in any order) during the first and  
subsequent write cycles. Each successive byte load  
cycle must begin within tBLC MAX of the rising edge of the  
preceding WE pulse. There is no page write window  
The page write mode of the CAT28LV65 (essentially an  
extended BYTE WRITE mode) allows from 1 to 32 bytes  
ofdatatobeprogrammedwithinasingleEEPROMwrite  
cycle. This effectively reduces the byte-write time by a  
factor of 32.  
limitation as long as WE is pulsed low within tBLC MAX  
.
Upon completion of the page write sequence, WE must  
stay high a minimum of tBLC MAX for the internal auto-  
matic program cycle to commence. This programming  
cycle consists of an erase cycle, which erases any data  
that existed in each addressed cell, and a write cycle,  
whichwritesnewdatabackintothecell. Apagewritewill  
only write data to the locations that were addressed and  
will not rewrite the entire page.  
FollowinganinitialWRITEoperation(WEpulsedlow,for  
tWP, and then high) the page write mode can begin by  
issuing sequential WE pulses, which load the address  
anddatabytesintoa32bytetemporarybuffer. Thepage  
address where data is to be written, specified by bits A5  
to A12, is latched on the last falling edge of WE. Each  
byte within the page is defined by address bits A0 to A4  
Figure 5. Byte Write Cycle [CE Controlled]  
t
WC  
ADDRESS  
t
t
t
BLC  
AS  
AH  
t
CW  
CE  
OE  
WE  
t
OEH  
t
OES  
t
t
CH  
CS  
t
RB  
HIGH-Z  
HIGH-Z  
RDY/BUSY  
DATA OUT  
DATA IN  
HIGH-Z  
DATA VALID  
DS  
t
t
DH  
Figure 6. Page Mode Write Cycle  
OE  
CE  
WE  
t
t
BLC  
WP  
ADDRESS  
I/O  
t
WC  
LAST BYTE  
BYTE n+2  
BYTE 0 BYTE 1  
BYTE 2  
7
BYTE n  
BYTE n+1  
Doc. No. 1024, Rev. D  
CAT28LV65  
DATA Polling  
data from the device will result in I/O6 toggling between  
one and zero. However, once the write is complete, I/O6  
stops toggling and valid data can be read from the  
device.  
DATA polling is provided to indicate the completion of  
write cycle. Once a byte write or page write cycle is  
initiated, attempting to read the last byte written will  
output the complement of that data on I/O7 (I/O0–I/O6  
are indeterminate) until the programming cycle is com-  
plete. Upon completion of the self-timed write cycle, all  
I/O’s will output true data during a read cycle.  
Ready/BUSY (RDY/BUSY)  
The RDY/BUSY pin is an open drain output which  
indicates device status during programming. It is pulled  
low during the write cycle and released at the end of  
programming. Several devices may be OR-tied to the  
same RDY/BUSY line.  
Toggle Bit  
In addition to the DATA Polling feature, the device offers  
an additional method for determining the completion of  
a write cycle. While a write cycle is in progress, reading  
Figure 7. DATA Polling  
ADDRESS  
CE  
WE  
t
OEH  
t
OES  
t
OE  
OE  
t
WC  
= X  
I/O  
D
IN  
= X  
D
D
= X  
OUT  
7
OUT  
28LV65 F11  
Figure 8. Toggle Bit  
WE  
CE  
OE  
t
OEH  
t
OES  
t
OE  
(1)  
(1)  
I/O  
6
t
WC  
Note:  
(1) Beginning and ending state of I/O is indeterminate.  
6
Doc. No. 1024, Rev. D  
8
CAT28LV65  
HARDWARE DATA PROTECTION  
(4) Noise pulses of less than 20 ns on the WE or CE  
inputs will not result in a write cycle.  
The following is a list of hardware data protection fea-  
tures that are incorporated into the CAT28LV65.  
SOFTWARE DATA PROTECTION  
(1) VCC sense provides for write protection when VCC  
falls below 2.0V min.  
The CAT28LV65 features a software controlled data  
protectionschemewhich, onceenabled, requiresadata  
algorithmtobeissuedtothedevicebeforeawritecanbe  
performed. The device is shipped from Catalyst with the  
software protection NOT ENABLED (the CAT28LV65 is  
in the standard operating mode).  
(2) A power on delay mechanism, tINIT (see AC charac-  
teristics), provides a 5 to 10 ms delay before a write  
sequence, after VCC has reached 2.40V min.  
(3) Write inhibit is activated by holding any one of OE  
low, CE high or WE high.  
Figure 9. Write Sequence for Activating Software  
Data Protection  
Figure 10. Write Sequence for Deactivating  
Software Data Protection  
WRITE DATA:  
ADDRESS:  
AA  
WRITE DATA:  
ADDRESS:  
AA  
1555  
1555  
WRITE DATA:  
ADDRESS:  
55  
WRITE DATA:  
ADDRESS:  
55  
0AAA  
0AAA  
WRITE DATA:  
ADDRESS:  
80  
WRITE DATA:  
ADDRESS:  
A0  
1555  
1555  
WRITE DATA:  
ADDRESS:  
AA  
(1)  
SOFTWARE DATA  
PROTECTION ACTIVATED  
1555  
WRITE DATA:  
ADDRESS:  
55  
WRITE DATA:  
XX  
0AAA  
TO ANY ADDRESS  
WRITE DATA:  
ADDRESS:  
20  
WRITE LAST BYTE  
TO  
LAST ADDRESS  
1555  
Note:  
(1) Write protection is activated at this point whether or not any more writes are completed. Writing to addresses must occur within t  
Max., after SDP activation.  
BLC  
Doc. No. 1024, Rev. D  
9
CAT28LV65  
Toactivatethesoftwaredataprotection,thedevicemust  
besentthreewritecommandstospecificaddresseswith  
specific data (Figure 9). This sequence of commands  
(along with subsequent writes) must adhere to the page  
writetimingspecifications(Figure11).Oncethisisdone,  
all subsequent byte or page writes to the device must be  
preceded by this same set of write commands. The data  
protection mechanism is activated until a deactivate  
sequence is issued regardless of power on/off transi-  
tions. This gives the user added inadvertent write pro-  
tection on power-up in addition to the hardware protec-  
tion provided.  
To allow the user the ability to program the device with  
anEEPROMprogrammer(orfortestingpurposes)there  
is a software command sequence for deactivating the  
data protection. The six step algorithm (Figure 10) will  
reset the internal protection circuitry, and the device will  
return to standard operating mode (Figure 12 provides  
reset timing). After the sixth byte of this reset sequence  
has been issued, standard byte or page writing can  
commence.  
Figure 11. Software Data Protection Timing  
t
WC  
DATA  
ADDRESS  
AA  
1555  
55  
0AAA  
A0  
1555  
BYTE OR  
PAGE  
CE  
WRITES  
ENABLED  
t
t
BLC  
WP  
WE  
Figure 12. Resetting Software Data Protection Timing  
t
DATA  
ADDRESS  
AA  
1555  
55  
0AAA  
80  
1555  
AA  
1555  
55  
0AAA  
20  
1555  
WC  
SDP  
RESET  
CE  
DEVICE  
UNPROTECTED  
WE  
Doc. No. 1024, Rev. D  
10  
CAT28LV65  
ORDERING INFORMATION  
Prefix  
Device #  
Suffix  
CAT  
28LV65  
N
-25  
T
I
Optional  
Company  
ID  
Tape & Reel  
Product  
Number  
Temperature Range  
Blank = Commercial (0˚C to +70˚C)  
I = Industrial (-40˚C to +85˚C)  
A = Automotive (-40˚ to +105˚C)*  
Package  
P: PDIP  
Speed  
15: 150ns  
20: 200ns  
25: 250ns  
J: SOIC (JEDEC)  
K: SOIC (EIAJ)  
N: PLCC  
T13: TSOP (8mmx13.4mm)  
L: PDIP (Lead free, Halogen free)  
W: SOIC (JEDEC) (Lead free, Halogen free)  
X: SOIC (EIAJ) (Lead free, Halogen free)  
G: PLCC (Lead free, Halogen free)  
H13: TSOP (8mmx13.4mm) (Lead free, Halogen free)  
* -40˚C to +125˚C is available upon request  
Notes:  
(1) The device used in the above example is a CAT28LV65NI-25T (PLCC, Industrial temperature, 250 ns Access Time, Tape & Reel).  
Doc. No. 1024, Rev. D  
11  
REVISION HISTORY  
Date  
Revision Comments  
03/29/04  
04/20/04  
B
C
Added Green packages in all areas  
Delete data sheet designation  
Update Ordering Information  
Update Revision History  
Update Rev Number  
03/29/05  
D
Update A.C Characteristics, Write Cycle  
Copyrights, Trademarks and Patents  
Trademarks and registered trademarks of Catalyst Semiconductor include each of the following:  
2
DPP ™  
AE ™  
Catalyst Semiconductor has been issued U.S. and foreign patents and has patent applications pending that protect its products. For a complete list of patents  
issued to Catalyst Semiconductor contact the Companys corporate office at 408.542.1000.  
CATALYST SEMICONDUCTOR MAKES NO WARRANTY, REPRESENTATION OR GUARANTEE, EXPRESS OR IMPLIED, REGARDING THE SUITABILITY OF ITS  
PRODUCTS FOR ANY PARTICULAR PURPOSE, NOR THAT THE USE OF ITS PRODUCTS WILL NOT INFRINGE ITS INTELLECTUAL PROPERTY RIGHTS OR THE  
RIGHTS OF THIRD PARTIES WITH RESPECT TO ANY PARTICULAR USE OR APPLICATION AND SPECIFICALLY DISCLAIMS ANY AND ALL LIABILITY ARISING  
OUT OF ANY SUCH USE OR APPLICATION, INCLUDING BUT NOT LIMITED TO, CONSEQUENTIAL OR INCIDENTAL DAMAGES.  
Catalyst Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or  
other applications intended to support or sustain life, or for any other application in which the failure of the Catalyst Semiconductor product could create a  
situation where personal injury or death may occur.  
Catalyst Semiconductor reserves the right to make changes to or discontinue any product or service described herein without notice. Products with data sheets  
labeled "Advance Information" or "Preliminary" and other products described herein may not be in production or offered for sale.  
Catalyst Semiconductor advises customers to obtain the current version of the relevant product information before placing orders. Circuit diagrams illustrate  
typical semiconductor applications and may not be complete.  
Catalyst Semiconductor, Inc.  
Corporate Headquarters  
1250 Borregas Avenue  
Sunnyvale, CA 94089  
Phone: 408.542.1000  
Publication #: 1024  
Revison:  
D
Issue date:  
03/29/05  
Fax: 408.542.1200  
www.catalyst-semiconductor.com  

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