CAT34RC02SP2I-TE13REV-E [CATALYST]

EEPROM, 256X8, Serial, CMOS, TDFN-8;
CAT34RC02SP2I-TE13REV-E
型号: CAT34RC02SP2I-TE13REV-E
厂家: CATALYST SEMICONDUCTOR    CATALYST SEMICONDUCTOR
描述:

EEPROM, 256X8, Serial, CMOS, TDFN-8

可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 时钟 内存集成电路
文件: 总14页 (文件大小:666K)
中文:  中文翻译
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CAT34RC02  
2-kb I2C Serial EEPROM, Serial Presence Detect  
FEATURES  
I 400 kHz I2C bus compatible*  
I 1.7 to 5.5 volt operation  
I 16-byte page write buffer  
I Schmitt trigger on SCL and SDA inputs  
I Low power CMOS technology  
I 1,000,000 program/erase cycles  
I 100 year data retention  
I Hardware write protection for entire memory  
I Permanent and reversible software write  
I 8-pin TSSOP and TDFN packages  
I Industrial temperature range  
protection for lower 128 bytes  
DESCRIPTION  
a 16-byte page write buffer. The device operates via the  
I2C bus serial interface and is available in 8-pin TSSOP  
and TDFN packages.  
The CAT34RC02 is a 2-kb Serial CMOS EEPROM  
internallyorganizedas256wordsof8bitseach.Catalyst’s  
advanced CMOS technology substantially reduces  
device power requirements. The CAT34RC02 features  
PIN CONFIGURATION  
FUNCTIONAL SYMBOL  
TDFN Package (SP2, VP2)  
V
CC  
A
A
A
V
1
2
3
4
8
7
6
5
0
1
2
CC  
WP  
SCL  
SDA  
SCL  
V
SS  
A , A , A  
CAT34RC02  
SDA  
2
1
0
TSSOP Package (U, Y, GY)  
1
2
3
4
8
7
6
5
A
A
A
WP  
0
V
CC  
WP  
1
2
SCL  
SDA  
V
SS  
V
SS  
PIN FUNCTIONS  
Pin Name  
Function  
A0, A1, A2  
SDA  
SCL  
Device Address Inputs  
Serial Data/Address  
Serial Clock  
WP  
Write Protect  
VCC  
1.7 V to 5.5 V Power Supply  
Ground  
VSS  
2
* Catalyst Semiconductor is licensed by Philips Corporation to carry the I C Bus Protocol.  
© 2005 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. 1052, Rev. O  
1
CAT34RC02  
ABSOLUTE MAXIMUM RATINGS*  
*COMMENT  
Stresses above those listed under Absolute Maximum Ratingsmay  
cause permanent damage to the device. These are stress ratings only,  
and functional operation of the device at these or any other conditions  
outsideofthoselistedintheoperationalsectionsofthisspecificationisnot  
implied. Exposure to any absolute maximum rating for extended periods  
Temperature Under Bias .................. -55°C to +125°C  
Storage Temperature........................ -65°C to +150°C  
Voltage on Any Pin with  
Respect to Ground(1) ............ -2.0 V to VCC + 2.0 V  
may affect device performance and reliability.  
Voltage on A0 .................................................. -2.0 V to +12.0 V  
VCC with Respect to VSS.............................. -2.0 V to +7.0 V  
(2)  
RELIABILITY CHARACTERISTICS  
Symbol  
Parameter  
Endurance  
Min  
1,000,000  
100  
Units  
(*)  
NEND  
Program/ Erase Cycles  
(*)  
TDR  
Data Retention  
ESD Susceptibility  
Latch-up  
Years  
Volts  
mA  
(*)  
VZAP  
4000  
(3)  
ILTH  
100  
(*) Page Mode, VCC = 5 V, 25°C  
D.C. OPERATING CHARACTERISTICS  
V
= 1.7 V to 5.5 V, unless otherwise specified.  
CC  
Symbol  
ICC  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Units  
mA  
mA  
µA  
µA  
µA  
V
Power Supply Current (Read)  
Power Supply Current (Write)  
Standby Current (VCC = 5.0 V)  
Input Leakage Current  
fSCL = 100 kHz  
fSCL = 100 kHz  
1
ICC  
3
(4)  
ISB  
VIN = GND or VCC  
VIN = GND to VCC  
VOUT = GND to VCC  
1
ILI  
ILO  
1
1
Output Leakage Current  
Input Low Voltage  
VIL  
1  
VCC x 0.3  
VCC + 1.0  
0.4  
VIH  
Input High Voltage  
VCC x 0.7  
V
VOL1  
VOL2  
VHV  
Output Low Voltage (VCC = 3.0 V)  
Output Low Voltage (VCC = 1.7 V)  
IOL = 3 mA  
IOL = 1.5 mA  
V
0.5  
V
RSWP Set/Clear Overdrive  
A0 High Voltage  
VHV - VCC > 4.8 V  
7
10  
V
CAPACITANCE T = 25°C, f = 400 kHz, V  
= 5 V  
CC  
A
Symbol  
Test  
Conditions  
VI/O = 0 V  
VIN = 0 V  
Min  
Typ  
Max  
8
Units  
pF  
(2)  
CI/O  
Input/Output Capacitance (SDA)  
Input Capacitance (other pins)  
WP Input Impedance  
(2)  
CIN  
6
pF  
ZWPL  
ZWPH  
VIN < 0.5 V  
VIN > VCC x 0.7  
5
70  
kΩ  
WP Input Impedance  
500  
kΩ  
Note:  
(1) The DC input voltage on any pin should not be lower than -0.5 V or higher than V + 0.5 V. During transitions, the voltage on any pin  
CC  
may undershoot to no less than -2.0 V or overshoot to no more than VCC + 2.0 V, for periods of less than 20 ns. The maximum DC  
voltage on address pin A is +12.0 V.  
0
(2) These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC-Q100  
and JEDEC test methods.  
(3) Latch-up protection is provided for stresses up to 100 mA on I/O pins from -1.0 V to V + 1.0 V.  
CC  
(4) Standby Current, I = 10 µA max at extended temperature range.  
SB  
© 2005 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. 1052, Rev. O  
2
CAT34RC02  
A.C. CHARACTERISTICS  
V
= 1.7 V to 5.5 V, unless otherwise specified.  
CC  
Read & Write Cycle Limits  
Symbol  
Parameter  
1.7 V - 5.5 V  
2.5 V - 5.5 V  
Min  
Max  
100  
100  
Min  
Max  
Units  
kHz  
ns  
FSCL  
TI(1)  
Clock Frequency  
400  
100  
Noise Suppression Time  
Constant at SCL, SDA Inputs  
tAA  
SCL Low to SDA Data Out  
and ACK Out  
3.5  
0.9  
µs  
µs  
(1)  
tBUF  
Time the Bus Must be Free Before  
a New Transmission Can Start  
4.7  
1.3  
tHD:STA  
tLOW  
Start Condition Hold Time  
Clock Low Period  
4
0.6  
1.3  
0.6  
0.6  
µs  
µs  
µs  
µs  
4.7  
4
tHIGH  
Clock High Period  
tSU:STA  
Start Condition Setup Time  
(for a Repeated Start Condition)  
4.7  
tHD:DAT  
tSU:DAT  
Data In Hold Time  
0
0
ns  
ns  
µs  
ns  
µs  
ns  
Data In Setup Time  
250  
100  
(1)  
tR  
SDA and SCL Rise Time  
SDA and SCL Fall Time  
Stop Condition Setup Time  
Data Out Hold Time  
1
0.3  
(1)  
tF  
300  
300  
tSU:STO  
tDH  
4
0.6  
100  
100  
(1)(2)  
Power-Up Timing  
Symbol  
Parameter  
Min  
Min  
Typ  
Max  
1
Units  
ms  
tPUR  
tPUW  
Power-up to Read Operation  
Power-up to Write Operation  
1
ms  
Write Cycle Limits  
Symbol  
Parameter  
Typ  
Max  
Units  
tWR  
Write Cycle Time  
5
ms  
The write cycle time is the time elapsed between the  
STOP command (following the write instruction) and the  
completion of the internal write cycle. During the internal  
write cycle, SDA is released by the Slave and the device  
does not acknowledge external commands.  
Note:  
(1) This parameter is tested initially and after a design or process change that affects the parameter.  
(2) t and t are the delays required from the time V is stable until the specified operation can be initiated.  
PUR  
PUW  
CC  
© 2005 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. 1052, Rev. O  
3
CAT34RC02  
FUNCTIONAL DESCRIPTION  
PIN DESCRIPTIONS  
The CAT34RC02 supports the I2C (2-wire) Bus data  
transmission protocol. This Inter-Integrated Circuit Bus  
protocol defines any device that sends data to the bus to  
be a transmitter and any device receiving data to be a  
receiver.DatatransferiscontrolledbytheMasterdevice  
which generates the serial clock and all START and  
STOP conditions for bus access. The CAT34RC02  
operates as a Slave device. Both the Master and Slave  
devicescanoperateaseithertransmitterorreceiver,but  
the Master alone assigns those roles. A maximum of 8  
devices may be connected to the bus as determined by  
the device address inputs A0, A1, and A2.  
SCL: Serial Clock  
The serial clock input pin is used to clock all data  
transfers into or out of the device.  
SDA: Serial Data/Address  
The bidirectional serial data/address pin is used to  
transfer data into and out of the device. This pin is an  
open drain output in transmit mode.  
A0, A1, A2: Device Address Inputs  
These inputs set the device address. When left floating,  
the address pins are internally pulled to ground.  
WP: Write Protect  
This input, when grounded or left floating, allows write  
operations to the entire memory. When this pin is tied to  
VCC, the entire memory is write protected.  
Figure 1. Bus Timing  
t
t
t
F
HIGH  
R
t
t
LOW  
LOW  
SCL  
t
t
HD:DAT  
SU:STA  
t
t
t
t
HD:STA  
SU:DAT  
SU:STO  
BUF  
SDA IN  
t
t
DH  
AA  
SDA OUT  
Figure 2. Write Cycle Timing  
SCL  
th  
SDA  
8
Bit  
ACK  
Byte n  
t
WR  
STOP  
CONDITION  
START  
CONDITION  
ADDRESS  
Figure 3. Start/Stop Timing  
SDA  
SCL  
START BIT  
STOP BIT  
© 2005 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. 1052, Rev. O  
4
CAT34RC02  
I2C BUS PROTOCOL  
Device Addressing  
The I2C bus consists of two wires, SCL and SDA. The  
two wiresare connected to the supply (VCC) via pull-up  
resistors. Master and Slave devices connect to the bus  
via their respective SCL and SDA pins. The transmitting  
device pulls down the SDA line to transmita 0and  
releases it to transmita 1.  
TheMasterinitiatesadatatransferbycreatingaSTART  
condition on the bus. The Master then broadcasts an 8-  
bit serial Slave address. The four most significant bits of  
the Slave address (the preamble) are fixed to 1010  
(Ah), for normal read/write operations and 0110 (6h) for  
Software Write Protect (SWP) operations (Fig. 5). The  
nextthreebits,A2,A1 andA0,selectoneofeightpossible  
Slave devices. The last bit, R/W, specifies whether a  
Read (1) or Write (0) operation is to be performed.  
(1) Data transfer may be initiated only when the bus is  
not busy (see A.C. Characteristics).  
(2) During a data transfer, the data line must remain  
stable whenever the SCL line is high. An SDA  
transition while SCL is high will be interpreted as a  
START or STOP condition.  
Acknowledge  
After processing the Slave address, the Slave responds  
with an acknowledge (ACK) by pulling down the SDA  
line during the 9th clock cycle. The Slave will aslo  
acknowledge the 8-bit byte address and every data byte  
presented in WRITE mode. In READ mode the Slave  
shifts out eight bits of data, and then releasesthe SDA  
linedurngthe9th clockcycle.IftheMasteracknowledges  
in the 9th clock cycle (by pulling down the SDA line), then  
the Slave continues transmitting. When data transfer is  
complete, the Master responds with a NoACK (it does  
not acknowledge the last data byte) and the Slave stops  
transmitting and waits for a STOP condition.  
START Condition  
TheSTARTConditionprecedesallcommands.Itconsists  
of a HIGH to LOW transition on SDA while SCL is HIGH.  
The START condition acts as a wake-upcall for the  
Slave devices. A Slave will not respond to commands  
unless the MASTER generates a START condition.  
STOP Condition  
TheSTOPconditioncompletesallcommands.Itconsists  
of a LOW to HIGH transition on SDA while SCL is HIGH.  
The STOP condition starts the internal write cycle, when  
following a WRITE command and sends the Slave into  
standby mode, when following a READ command.  
Figure 4. Acknowledge Timing  
SCL FROM  
MASTER  
1
8
9
DATA OUTPUT  
FROM TRANSMITTER  
DATA OUTPUT  
FROM RECEIVER  
START  
ACKNOWLEDGE  
Figure 5. Slave Address Bits  
1
0
0
1
1
0
0
A
A
A
0
R/W  
R/W  
Normal Read and Write  
2
1
DEVICE ADDRESS  
Programming the Write  
Protect Register  
1
A
A
A
0
2
1
© 2005 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. 1052, Rev. O  
5
CAT34RC02  
acknowledge the Slave address, as long as internal  
write is in progress.  
WRITE OPERATIONS  
Byte Write  
WRITE PROTECTION  
InByteWritemodetheMastercreatesaSTARTcondition,  
and then broadcasts the Slave address, byte address  
and data to be written. The Slave acknowledges the  
three bytes by pulling down the SDA line during the 9th  
clock cycle following each byte. The Master creates a  
STOP condition after the last ACK from the Slave, which  
then starts the internal write operation (Fig. 6). During  
internalwrite,theSlavewillignoreanyread/writerequest  
from the Master.  
Hardware Write Protection  
With the WP pin held HIGH, the entire memory, as well  
astheSWPflagsareprotectedagainstWRITEoperations  
(Fig. 9). If the WP pin is left floating or is grounded. then  
it has no impact on the operation of the CAT34RC02.  
Software Write Protection  
Page Write  
The lower half of memory (first 128 bytes) can be  
protected against WRITE operations by setting one of  
two Software Write Protection (SWP) flags/switches.  
The PSWP (Permanent Software Write Protection) flag  
can be set but not cleared by the user. The RSWP  
(Reversible Software Write Protection) flag can be set  
and cleared by the user. Whereas the PSWP flag can be  
set in-system, the RSWP flag is meant to be used  
during testing. RSWP commands require the presence  
of a very high voltage (higher than VCC) on address pin  
A0 and fixed logic levels for the other two address pins.  
The CAT34RC02 contains 256 bytes of data, arranged  
in16pagesof16byteseach.Thepageisselectedbythe  
four most significant bits of the address byte presented  
tothedeviceaftertheSlaveaddress, whilethefourleast  
significant bits point to the byte within the page. By  
loadingmore than one data byte into the device, up to  
an entire page can be written in one write cycle (Fig. 7).  
The internal byte address counter will increment after  
each data byte. If the Master transmits more than 16  
data bytes, then earlier bytes will be overwritten by later  
bytes in a wrap-aroundfashion within the selected  
page. The internal write cycle is started following the  
STOP condition created by the Master.  
The CAT34RC02 is shipped unprotected. The state of  
the SWP flags can be read by issuing an Immediate  
Address Readcommand, with the Slave address  
preambleset to 0110 (6h) instead of the normal1010  
(Ah).ASWPREADwillreturnthecomplementedversions  
of the two flags in the last two slots of the resulting data  
byte; the other six more significant bits in the data byte  
have no meaning to the user (Fig. 11).  
Acknowledge Polling  
Acknowledge polling can be used to determine if the  
CAT34RC02 is busy writing or is ready to accept  
commands. Polling is implemented by sending a  
Selective Readcommand (described under READ  
OPERATIONS) to the device. The CAT34RC02 will not  
Figure 6. Byte Write Timing  
S
T
S
A
R
T
T
O
P
BUS ACTIVITY:  
MASTER  
SLAVE  
ADDRESS  
BYTE  
ADDRESS  
DATA  
SDA LINE  
S
P
A
C
K
A
C
K
A
C
K
Figure 7. Page Write Timing  
S
T
A
R
T
S
T
O
P
BUS ACTIVITY:  
MASTER  
SLAVE  
ADDRESS  
BYTE  
ADDRESS (n)  
DATA n  
DATA n+1  
DATA n+P  
SDA LINE  
S
P
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
NOTE: IN THIS EXAMPLE n = XXXX 0000(B); X = 1 or 0  
© 2005 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. 1052, Rev. O  
6
CAT34RC02  
The PSWP flag can be set (forever) by issuing a Byte  
Writecommand,withtheSlaveaddresspreamblesetto  
6h, followedbyadontcareaddress, followedbydont  
caredata and a STOP condition. The CAT34RC02 will  
acknowledge the Slave address, dummy byte address  
and dummy data (Fig. 10). The PSWP flag will be  
permanently set (after the internal write cycle is  
completed).  
command attempts to reaffirmone of the two switches,  
thentheCAT34RC02willnotacknowledgethecommand  
itself. In addition, the CAT34RC02 will not acknowledge  
a reaffirmingSWP command, even if the WP pin is  
LOW.  
Power-On Reset (POR)  
The CAT34RC02 incorporates Power-On Reset (POR)  
circuitrywhichprotectsthedeviceagainstmalfunctioning  
while VCC is lower than the recommended operating  
voltage.  
The SWP commands are shown in Table 1.  
Table 1. SWP Commands  
The device will power up into a read-only state and will  
power-down into a reset state when VCC crosses the  
POR level of ~1.3V.  
Slave Address  
PIN  
Preamble  
Device Address  
R/W  
READ OPERATIONS  
Command  
A2  
A2  
0
A1  
A0  
A0  
B7  
0
B6  
1
B5  
1
B4  
0
B3  
A2  
0
B2  
A1  
0
B1  
A0  
1
B0  
SWP  
READ  
Immediate Address Read  
A1  
0
1
0
0
0
In standby mode, the CAT34RC02 internal address  
counterpointstothedatabyteimmediatelyfollowingthe  
last byte accessed by a previous operation. If the  
previousbyte was the last byte in memory, then the  
address counter will point to the first memory byte, etc.  
If the CAT34RC02 decodes a Slave address with a 1in  
the R/W bit position (Fig. 8), it will issue an ACK in the 9th  
clock cycle, and will then transmit the data byte being  
pointed at by the address counter. The Master can then  
stop further transmission by issuing a NoACK, followed  
by a STOP condition.  
RSWP SET  
VHV  
VHV  
A0  
0
1
1
0
RSWP  
CLEAR  
0
1
0
1
1
0
0
1
1
PSWP SET  
A2  
A1  
0
1
1
0
A2  
A1  
A0  
TheCAT34RC02willnotacknowledgeRSWPorPSWP  
commands, once the PSWP flag is set. If the PSWP flag  
is not set, but the WP pin is HIGH, then the CAT34RC02  
willreacttoRSWPorPSWPcommandsasfollows:ifthe  
commandattemptstofliponeofthetwoSWPswitches,  
then the CAT34RC02 will respond the same way the  
regular memory would, i.e. the command and address  
(in this case dummy) are acknowledged, but the data (in  
this case dummy) will not be acknowledged; if the  
Selective Read  
The READ operation can also be started at an address  
differentfromtheonestoredintheaddresscounter. The  
Figure 8. Immediate Address Read Timing  
S
T
A
R
T
S
T
O
P
BUS ACTIVITY:  
MASTER  
SLAVE  
ADDRESS  
SDA LINE  
S
P
A
C
K
N
O
DATA  
A
C
K
SCL  
SDA  
8
9
th  
8
Bit  
DATA OUT  
NO ACK  
STOP  
© 2005 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. 1052, Rev. O  
7
CAT34RC02  
address counter can be initializedby performing a  
dummyWRITE operation (Fig. 12). The START  
condition is followed by the Slave address (with the R/W  
bit set to 0) and the desired byte address. Instead of  
following up with data, the Master then issues a 2nd  
START, followed by the Immediate Address Read’  
sequence, as described earlier.  
Sequential Read  
If the Master acknowledges the 1st data byte transmitted  
by the CAT34RC02, then the device will continue  
transmitting as long as each data byte is acknowledged  
by the Master (Fig. 13). If the end of memory is reached  
during sequential READ, the address counter will wrap-  
aroundto the beginning of memory, etc. Sequential  
READ works with either Immediate Address Reador  
Selective Read, the only difference being the starting  
byte address.  
Figure 9. Memory Array  
FFH  
Hardware Write Protectable  
(by connecting WP pin to  
Vcc)  
7FH  
Software Write Protectable  
(by setting the write  
protect flags)  
00H  
Figure 10. Software Write Protect (Write)  
S
T
A
R
T
S
T
O
P
BUS ACTIVITY:  
MASTER  
SLAVE  
ADDRESS  
BYTE  
ADDRESS  
DATA  
SDA LINE  
S
X X X X X X X X X X X X X X X X  
P
A
C
K
A
C
K
A
C
K
X = Don't Care  
* For PSWP A0 is at normal CMOS levels and for RSWP, A0 is at VHV which must be held high beyond the end  
of the STOP condition (approximately 1µs of overlapis sufficient).  
© 2005 by Catalyst Semiconductor, Inc.  
Doc. No. 1052, Rev. O  
8
Characteristics subject to change without notice  
CAT34RC02  
Figure 11. Software Write Protect (Read)  
RSWP  
S
T
A
R
T
S
T
O
P
PSWP  
BUS ACTIVITY:  
MASTER  
SLAVE  
ADDRESS  
SDA LINE  
S
P
0 0 0 0 0 0  
DATA  
N
A
C
K
O
A
C
K
Figure 12. Selective Read Timing  
S
T
A
R
T
S
T
A
R
T
S
T
O
P
BUS ACTIVITY:  
MASTER  
SLAVE  
ADDRESS  
BYTE  
ADDRESS (n)  
SLAVE  
ADDRESS  
SDA LINE  
S
S
P
A
C
K
A
C
K
A
C
K
N
O
DATA n  
A
C
K
Figure 13. Sequential Read Timing  
S
T
O
P
BUS ACTIVITY:  
MASTER  
SLAVE  
ADDRESS  
DATA n  
DATA n+1  
DATA n+2  
DATA n+x  
SDA LINE  
P
A
C
K
A
C
K
A
C
K
A
C
K
N
O
A
C
K
© 2005 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. 1052, Rev. O  
9
CAT34RC02  
8-PAD TDFN 2X3 PACKAGE (VP2, SP2)  
A
E
PIN 1 INDEX AREA  
D
A1  
D2  
A2  
A3  
K
SYMBOL  
MIN  
0.70  
0.00  
0.45  
NOM  
0.75  
MAX  
0.80  
0.05  
0.65  
A
A1  
A2  
A3  
b
0.02  
E2  
0.55  
0.20 REF  
0.25  
0.18  
1.90  
1.27  
2.90  
1.23  
0.30  
2.10  
1.75  
3.10  
1.90  
PIN 1 ID  
D
2.00  
D2  
E
3.00  
0.50 TYP  
0.40  
E2  
e
L
K
0.20  
0.30  
b
L
0.50  
e
3 x e  
NOTE:  
1. ALL DIMENSIONS IN MM. ANGLES IN DEGREES.  
2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMNALS. COPLANARITY SHALL NOT EXCEED 0.08 MM.  
3. WARPAGE SHALL NOT EXCEED 0.10 MM.  
4. PACKAGE LENGTH / PACKAGE WIDTH ARE NOT CONSIDERED AS SPECIAL CHARACTERISTIC.  
TDFN2X3_(02).eps  
© 2005 by Catalyst Semiconductor, Inc.  
Doc. No. 1052, Rev. O  
10  
Characteristics subject to change without notice  
CAT34RC02  
8-LEAD TSSOP (U, Y, GY)  
+
3.0 0.1  
-A-  
5
8
7.72 TYP  
4.16 TYP  
6.4  
+
4.4 0.1  
-B-  
(1.78 TYP)  
3.2  
0.42 TYP  
0.65 TYP  
LAND PATTERN RECOMMENDATION  
0.2 C B A  
ALL LEAD TIPS  
1
4
PIN #1 IDENT.  
SEE DETAIL A  
1.1 MAX TYP  
0.1  
C
ALL LEAD TIPS  
0.09 - 0.20 TYP  
(0.9)  
-C-  
+
0.10 0.05 TYP  
0.65 TYP  
GAGE PLANE  
0.25  
0.19 - 0.30 TYP  
0.3 M  
A B S C S  
0o- 8o  
0.6+0.1  
SEATING PLANE  
DETAIL A  
Notes:  
1. Lead coplanarity is 0.004" (0.102mm) maximum.  
© 2005 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. 1052, Rev. O  
11  
CAT34RC02  
ORDERING INFORMATION  
Prefix  
Device #  
34RC02  
Suffix  
TE13  
REV-E  
CAT  
J
I
Company ID  
Temperature Range  
I = Industrial (-40°C to +85°C)  
Product  
Number  
Die Revision  
34RC02: E  
Tape & Reel  
Package  
U: TSSOP  
Y: TSSOP (Lead-free, Halogen-free)  
SP2: TDFN  
VP2: TDFN (Lead-free, Halogen-free)  
GY: TSSOP (Lead-free, Halogen-free, NiPdAu lead plating)  
Notes:  
(1) The device used in the above example is a CAT34RC02UI-TE13 REV E (TSSOP, Industrial Temperature, 1.7 Volt to 5.5 Volt  
Operating Voltage, Tape & Reel)  
© 2005 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc. No. 1052, Rev. O  
12  
CAT34RC02  
REVISION HISTORY  
Date  
Revision Comments  
09/22/03  
A
B
Initial Issue  
12/09/03  
Removed Automotive temperature range  
Changed Industrial Temp to Ifrom Blankin ordering information  
01/12/04  
C
Updated Features  
Replaced Block Diagram with Functional Symbol  
Updated Notes for Reliability Characteristics, D.C. Operating  
Characteristics and Capacitance  
Updated TDFN package  
Updated packaging information to reflect new TDFN package  
02/20/04  
03/22/04  
D
E
Re-labeled TDFN package to A0, A1, A2 instead of A1, A2, A3  
Updated Absolute Max. Ratings  
Updated DC Operating Characteristics  
Updated Table 1 (SWP Commands)  
Updated Fig 11  
Added mechanical package drawings  
Corrected TDFN drawing  
03/31/04  
05/16/04  
F
Corrected table 1 SWP Commands  
G
Update D.C. Operating Characteristics  
Update Write Cycle Limits  
Update Revision History  
Update Rev Number  
06/03/04  
H
Update Die Revision in Ordering Information  
Eliminate data sheet designation  
Updated DC Operating Characteristics  
06/07/04  
9/27/04  
I
Updated Write Cycle Limits  
J
Added Power-On Reset (POR) description  
Added VHV and deleted VHV in DC Operating Characteristics  
10/18/04  
1/11/05  
K
L
Updated DC Operating Characteristics & notes (removed Note 5)  
Deleted DIP and SOIC packages in all areas  
Deleted Extended temperature range in all areas  
2/17/05  
07/19/05  
08/05/05  
M
N
O
Update Reliability Characteristics table and notes  
Update Ordering Information  
Update 8-Pad TDFN 2X3 Package (VP2, SP2)  
© 2005 by Catalyst Semiconductor, Inc.  
Characteristics subject to change without notice  
Doc No. 1052, Rev. O  
13  
Copyrights, Trademarks and Patents  
Trademarks and registered trademarks of Catalyst Semiconductor include each of the following:  
DPP ™  
AE2 ™  
MiniPot™  
Catalyst Semiconductor has been issued U.S. and foreign patents and has patent applications pending that protect its products. For a complete list of patents  
issued to Catalyst Semiconductor contact the Company’s corporate office at 408.542.1000.  
CATALYST SEMICONDUCTOR MAKES NO WARRANTY, REPRESENTATION OR GUARANTEE, EXPRESS OR IMPLIED, REGARDING THE SUITABILITY OF ITS  
PRODUCTS FOR ANY PARTICULAR PURPOSE, NOR THAT THE USE OF ITS PRODUCTS WILL NOT INFRINGE ITS INTELLECTUAL PROPERTY RIGHTS OR THE  
RIGHTS OF THIRD PARTIES WITH RESPECT TO ANY PARTICULAR USE OR APPLICATION AND SPECIFICALLY DISCLAIMS ANY AND ALL LIABILITY ARISING  
OUT OF ANY SUCH USE OR APPLICATION, INCLUDING BUT NOT LIMITED TO, CONSEQUENTIAL OR INCIDENTAL DAMAGES.  
Catalyst Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or  
other applications intended to support or sustain life, or for any other application in which the failure of the Catalyst Semiconductor product could create a  
situation where personal injury or death may occur.  
Catalyst Semiconductor reserves the right to make changes to or discontinue any product or service described herein without notice. Products with data sheets  
labeled "Advance Information" or "Preliminary" and other products described herein may not be in production or offered for sale.  
Catalyst Semiconductor advises customers to obtain the current version of the relevant product information before placing orders. Circuit diagrams illustrate  
typical semiconductor applications and may not be complete.  
Catalyst Semiconductor, Inc.  
Corporate Headquarters  
1250 Borregas Avenue  
Sunnyvale, CA 94089  
Phone: 408.542.1000  
Publication #: 1052  
Fax: 408.542.1200  
Revison:  
O
www.caalyst-semiconductor.com  
Issue date:  
08/05/05  

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