CAT3644_0710 [CATALYST]
4-Channel Ultra High Efficiency Quad-Mode⑩ LED Driver; 4通道超高效率四模式® LED驱动器
| 型号： | CAT3644_0710 |
| 厂家： | 
CATALYST SEMICONDUCTOR |
| 描述： | 4-Channel Ultra High Efficiency Quad-Mode⑩ LED Driver |
| 文件： | 总14页 (文件大小：305K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CAT3644
4-Channel Ultra High Efficiency Quad-Mode™
LED Driver
FEATURES
DESCRIPTION
The CAT3644 is a high efficiency Quad-ModeTM
fractional charge pump that can drive up to four LEDs
programmable by a one wire digital interface. The
inclusion of a 1.33x fractional charge pump mode
increases device efficiency by up to 10% over tradi–
tional 1.5x charge pumps with no added external
capacitors.
High efficiency 1.33x charge pump
Quad-mode charge pump: 1x, 1.33x, 1.5x, 2x
Drives up to 4 LEDs at 25mA each
1-wire EZDim™ LED current programming
Power efficiency up to 92%
Low noise input ripple in all modes
“Zero” current shutdown mode
Soft start and current limiting
Low noise input ripple is achieved by operating at a
constant switching frequency which allows the use of
small external ceramic capacitors. The multi-fractional
charge pump supports a wide range of input voltages
from 2.5V to 5.5V.
Short circuit protection
Thermal shutdown protection
3mm x 3mm, 16-pad TQFN package
The EN/DIM logic input functions as a chip enable and
a digital dimming interface for current setting of all
LEDs. Six different current ratios are available via the
interface.
APPLICATION
LCD Display Backlight
Cellular Phones
The device is available in the tiny 16-pad TQFN
3mm x 3mm package with a max height of 0.8mm.
Catalyst Semiconductor’s Quad-ModeTM 1.33x charge
pump switching architecture is patented.
Digital Still Cameras
Handheld Devices
ORDERING INFORMATION
Part Number
CAT3644HV3-T2
CAT3644HV3-GT2
Qty per Reel
2000 (1)
Marking
JAAG
For Ordering Information details, see page 13.
2000 (2)
JAAH
Notes: (1) Matte-Tin Plated Finish (RoHS-compliant)
(2) NiPdAu Plated Finish (RoHS-compliant)
PIN CONFIGURATION
TYPICAL APPLICATION CIRCUIT
Top View
1µF
1µF
C1+
IN
C1- C2+
C2-
16 15 14 13
V
IN
V
OUT
V
V
OUT
LED2
LED3
LED4
RSET
1
2
3
4
12 C2-
11 C2+
10 C1-
CIN
1µF
C
2.4V
to
5.5V
OUT
1µF
CAT3644
LED1
LED2
LED3
LED4
1-Wire
EZDimTMꢀ
EN/DIM
RSET
20mA
Programming
9
C1+
4.02kΩ
GND
5
6
7
8
© Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
1
Doc. No. MD-5023, Rev. E
CAT3644
ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Unit
V
VIN, LEDx, C1±, C2±, EN/DIM voltage
VOUT voltage
6
7
V
Storage Temperature Range
Junction Temperature Range
-65 to +160
-40 to +150
°C
°C
RECOMMENDED OPERATING CONDITIONS
Parameter
Rating
2.5 to 5.5
-40 to +85
up to 30
Unit
V
VIN
Ambient Temperature Range
ILED per LED pin
LED Forward Voltage Range
°C
mA
V
1.3 to 4.3
Typical application circuit with external components is shown on page 1.
ELECTRICAL OPERATING CHARACTERISTICS
(over recommended operating conditions unless specified otherwise) VIN = 3.6V, EN = High, TAMB = 25°C
Symbol Name
Conditions
Min
Typ
Max
Units
1.0
1.7
2.2
2.4
mA
mA
mA
mA
1x mode, no load
1.33 x mode, no load
1.5x mode, no load
2x mode, no load
IQ
Quiescent Current
IQSHDN
Shutdown Current
VEN = 0V
1
µA
(ILEDAVG – INOMINAL) / INOMINAL
RSET = 5kΩ
ILED-ACC LED Current Accuracy
±2
%
ILED-DEV LED Channel Matching
(ILED - ILEDAVG) / ILEDAVG
±1.5
0.6
%
V
VRSET
RSET Regulated Voltage
0.58
0.62
1x mode
0.8
5
5
10
1
Ω
Ω
Ω
Ω
MHz
MHz
1.33x mode, VIN = 3V
1.5x mode, VIN = 2.7V
2x mode, VIN = 2.4V
1.33x and 2x mode
1.5x mode
ROUT
Output Resistance (open loop)
0.8
1
1.3
1.6
FOSC
Charge Pump Frequency
1.3
ISC_MAX Output short circuit Current Limit
VOUT < 0.5V
VOUT > 1V
50
mA
mA
IIN_MAX
LEDTH
Input Current Limit
250
1x to 1.33x or 1.33x to 1.5x or 1.5x to 2x
Transition Thresholds at any LED pin
130
mV
VHYS
TDF
1x Mode Transition Hysteresis
Transition Filter Delay
400
500
mV
µs
EN/DIM Pin
• Internal Pull-down Resistor
• Logic High Level
• Logic Low Level
REN/DIM
VHI
VLO
100
kΩ
V
V
1.3
1.6
0.4
2.0
TSD
THYS
VUVLO
Thermal Shutdown
150
20
°C
°C
V
Thermal Hysteresis
Undervoltage lockout (UVLO) threshold
1.8
Doc. No. MD-5023, Rev. E
2
© Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
CAT3644
RECOMMENDED EN/DIM TIMING
For 2.4V ≤ VIN ≤ 5.5V, over full ambient temperature range -40ºC to +85ºC.
Symbol Name
TSETUP EN/DIM setup from shutdown
TLO
Conditions
Min
10
Typ
Max
Units
μs
EN/DIM program low time
EN/DIM program high time
0.2
0.2
1.5
100
μs
THI
μs
TPWRDWN EN/DIM low time to shutdown
ms
μs
TLED
LED current settling time
40
T
T
T
HI
PWRDWN
SETUP
EN/DIM
T
LED
T
LO
100%
100%
50%
25%
12.5%
LED
Current
6.25%
3.12%
Shutdown
Shutdown
Figure 1. EN/DIM Digital Dimming Timing Diagram
LED Current Setting
The nominal LED current is set by the external
resistor connected between the RSET pin and
ground. Table 1 lists standard resistor values for
several LED current settings.
LED current (mA)
RSET (kΩ)
40.0
2
5
15.8
10
15
20
25
30
7.87
5.23
4.02
3.16
2.67
Table 1. Resistor RSET and LED current
© Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
3
Doc. No. MD-5023, Rev. E
CAT3644
TYPICAL PERFORMANCE CHARACTERISTICS
VIN = 3.6V, IOUT = 80mA (4 LEDs at 20mA), CIN = COUT = C1 = C2 = 1μF, TAMB = 25°C unless otherwise specified.
Efficiency vs. Input Voltage
Efficiency vs. Li-Ion Voltage
100
90
80
70
60
50
40
100
90
80
70
60
50
40
1.33x
VF = 3.3V
1x
VF = 3.3V
1.5x
1x
1.33x
2x
4.2 4.0 3.8 3.6 3.4 3.2 3.0
INPUT VOLTAGE [V]
4.5
4.0
3.5
3.0
2.5
2.0
INPUT VOLTAGE [V]
Quiescent Current vs. Input Voltage
4.0
Quiescent Current vs. Temperature
4.0
3.0
2.0
1.0
0.0
VF = 3.3V
2x
1.5x
3.0
2.0
1.0
0.0
1.33x
1x
LEDs Off
-40
0
40
80
120
5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0
INPUT VOLTAGE [V]
TEMPERATURE [°C]
LED Current Change vs. Temperature
LED Current Change vs. Input Voltage
10
10
VF = 3.3V
8
VF = 3.3V
8
6
4
6
4
2
2
0
0
-2
-4
-6
-8
-10
-2
-4
-6
-8
-10
-40
0
40
80
120
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
INPUT VOLTAGE [V]
TEMPERATURE [°C]
Doc. No. MD-5023, Rev. E
4
© Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
CAT3644
TYPICAL PERFORMANCE CHARACTERISTICS
VIN = 3.6V, IOUT = 80mA (4 LEDs at 20mA), CIN = COUT = C1 = C2 = 1μF, TAMB = 25°C unless otherwise specified.
Switching Frequency vs. Temperature
Output Resistance vs. Input Voltage
12
1.3
2x
1.2
10
8
1.5x Mode
1.1
1.0
6
1.33x
1.5x
4
0.9
1.33x, 2x Mode
2
1x
0.8
0.7
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
INPUT VOLTAGE [V]
-40
0
40
80
120
TEMPERATURE [°C]
Power Up in 1x Mode
Power Up in 1.33x Mode
Power Up in 1.5x Mode
Power Up in 2x Mode
© Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
5
Doc. No. MD-5023, Rev. E
CAT3644
TYPICAL PERFORMANCE CHARACTERISTICS
VIN = 3.6V, IOUT = 80mA (4 LEDs at 20mA), CIN = COUT = C1 = C2 = 1μF, TAMB = 25°C unless otherwise specified.
Power Up Delay (1x Mode)
Power Down Delay (1x Mode)
Operating Waveforms in 1x Mode
Switching Waveforms in 1.33x Mode
Switching Waveforms in 1.5x Mode
Switching Waveforms in 2x Mode
Doc. No. MD-5023, Rev. E
6
© Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
CAT3644
TYPICAL PERFORMANCE CHARACTERISTICS
VIN = 3.6V, IOUT = 80mA (4 LEDs at 20mA), CIN = COUT = C1 = C2 = 1μF, TAMB = 25°C unless otherwise specified.
Foldback Current Limit
LED Current vs. LED Pin Voltage
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
40
30
20
10
0
1x Mode
0
100
200
300
400
0
50 100 150 200 250 300
LED PIN VOLTAGE [mV]
OUTPUT CURRENT [mA]
Dimming Waveform
LED Current vs. RSET
50
40
30
20
10
0
1
10
100
RSET RESISTANCE [kΩ]
© Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
7
Doc. No. MD-5023, Rev. E
CAT3644
PIN DESCRIPTION
Pin #
1
Name
LED2
LED3
LED4
RSET
Function
LED2 cathode terminal.
LED3 cathode terminal.
LED4 cathode terminal.
Connect resistor RSET to set the LED current.
2
3
4
5
EN/DIM Device enable (active high) and Dimming Control.
6
VOUT
NC
Charge pump output connected to the LED anodes.
Not connected inside the package.
Charge pump input, connect to battery or supply.
Bucket capacitor 1 Positive terminal
Bucket capacitor 1 Negative terminal
Bucket capacitor 2 Positive terminal
Bucket capacitor 2 Negative terminal
Not connected inside the package.
Not connected inside the package.
Ground Reference
7
8
VIN
9
C1+
C1-
10
11
12
13
14
15
16
TAB
C2+
C2-
NC
NC
GND
LED1
GND
LED1 cathode terminal.
Connect to GND on the PCB.
PIN FUNCTION
VIN is the supply pin for the charge pump. A small
1μF ceramic bypass capacitor is required between the
VIN pin and ground near the device. The operating
input voltage range is from 2.5V to 5.5V. Whenever
the input supply falls below the under-voltage
threshold (1.8V), all the LED channels are disabled
and the device enters shutdown mode.
C1+, C1- are connected to each side of the ceramic
bucket capacitor C1.
C2+, C2- are connected to each side of the ceramic
bucket capacitor C2.
LED1 to LED4 provide the internal regulated current
source for each of the LED cathodes. These pins
enter high-impedance zero current state whenever the
device is placed in shutdown mode.
EN/DIM is the enable and one wire dimming input for
all LED channels. Levels of logic high and logic low
are set at 1.3V and 0.4V respectively. When EN/DIM
is initially taken high, the device becomes enabled
and all LED currents are set to the full scale according
to the resistor RSET. To place the device into “zero
current” shutdown mode, the EN/DIM pin must be
held low for at least 1.5ms.
TAB is the exposed pad underneath the package. For
best thermal performance, the tab should be soldered
to the PCB and connected to the ground plane.
RSET is connected to the resistor (RSET) to set the full
scale current for the LEDs. The voltage at this pin
regulated to 0.6V. The ground side of the external
resistor should be star connected back to the GND of
the PCB. In shutdown mode, RSET beomes high
impedance.
VOUT is the charge pump output that is connected to
the LED anodes. A small 1μF ceramic bypass
capacitor is required between the VOUT pin and ground
near the device.
GND is the ground reference for the charge pump. The
pin must be connected to the ground plane on the PCB.
Doc. No. MD-5023, Rev. E
8
© Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
CAT3644
BLOCK DIAGRAM
C
C
1+
C
2-
C
2+
1-
V
IN
V
OUT
1x mode (LDO)
4/3x, 3/2x, 2x Charge Pump
Mode Control
1, 1.3MHz
Oscillator
EN/DIM
LED1
LED2
LED3
LED4
100kΩ
Serial
Reference
Voltage
Interface
LED Channel
Current Regulators
Current
Setting DAC
Registers
RSET
GND
Figure 2. CAT3644 Functional Block Diagram
BASIC OPERATION
At power-up, the CAT3644 starts operating in 1x
mode where the output will be approximately equal
to the input supply voltage (less any internal voltage
losses). If the output voltage is sufficient to regulate
all LED currents, the device remains in 1x operating
mode.
This sequence repeats in the 1.33x and 1.5x mode until
the driver enters the 2x mode. In 1.5x mode, the output
voltage is approximately equal to 1.5 times the input
supply voltage. While in 2x mode, the output is
approximately equal to 2 times the input supply voltage.
If the device detects a sufficient input voltage is present
to drive all LED currents in 1x mode, it will change
automatically back to 1x mode. This only applies for
changing back to the 1x mode. The difference between
the input voltage when exiting 1x mode and returning to
1x mode is called the 1x mode transition hysteresis
(VHYS) and is about 500mV.
If the input voltage is insufficient or falls to a level
where the regulated currents cannot be maintained,
the device automatically switches into 1.33x mode
(after a fixed delay time of about 400μs). In 1.33x
mode, the output voltage is approximately equal to
1.33 times the input supply voltage (less any internal
voltage losses).
© Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
9
Doc. No. MD-5023, Rev. E
CAT3644
LED Current Selection
At power-up, the initial LED current is set to full scale
(100% brightness) by the external resistor RSET as
follows:
levels by pulsing the input signal, as shown on Figure 3.
On each consecutive pulse rising edge, the LED current
is divided by half to 50%, then 25%, 12.5%, 6.25% and
3.125% dimming levels. Pulses faster than the mini-
mum TLO may be ignored and filtered by the device.
Pulses longer than the maximum TLO may shutdown the
device.
0.6V
LED current =
132×
RSET
The EN/DIM pin has two primary functions. One
function enables and disables the device. The other
function is LED current dimming with six different
The LED driver enters a “zero current” shutdown mode
if EN/DIM is held low for 1.5ms or more.
T
T
T
HI
PWRDWN
SETUP
EN/DIM
T
LED
T
LO
100%
100%
50%
25%
12.5%
LED
Current
6.25%
3.12%
Shutdown
Shutdown
Figure 3. EN/DIM Digital Dimming Timing Diagram
Table 1. LED Current Dimming Levels
EN/DIM
RSET Gain
LED Current
# of pulses *
132×0.6V RSET
66×0.6V RSET
EN = High
132
1st
2nd
3rd
4th
5th
6th
xth
66
33×0.6V RSET
33
16.5× 0.6V RSET
8.25× 0.6V RSET
4.125× 0.6V RSET
132×0.6V RSET
GAIN× 0.6V RSET
16.5
8.25
4.125
132
Device cycling through gain selection
* The gain is changed on the rising edges of the EN/DIM input.
Doc. No. MD-5023, Rev. E
10
© Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
CAT3644
Unused LED Channels
External Components
For applications not requiring all the channels, it is
recommended the unused LED pins be tied directly to
VOUT (see Figure 4).
The driver requires four external 1μF ceramic capa-
citors for decoupling input, output, and for the charge
pump. Both capacitors type X5R and X7R are
recommended for the LED driver application. In all
charge pump modes, the input current ripple is kept
very low by design and an input bypass capacitor of
1μF is sufficient.
1µF
1µF
C1+
IN
C1- C2+
C2-
V
IN
V
V
OUT
C
IN
In 1x mode, the device operates in linear mode and
does not introduce switching noise back onto the
supply.
C
OUT
1µF
CAT3644
1µF
LED1
LED2
LED3
LED4
ENABLE
DIMMING
EN/DIM
RSET
Recommended Layout
In charge pump mode, the driver switches internally at
a high frequency. It is recommended to minimize trace
length to all four capacitors. A ground plane should
cover the area under the driver IC as well as the
bypass capacitors. Short connection to ground on
capacitors CIN and COUT can be implemented with the
use of multiple via. A copper area matching the TQFN
exposed pad (TAB) must be connected to the ground
plane underneath. The use of multiple via improves
the package heat dissipation.
GND
R
SET
Figure 4. Application with 3 LEDs
Protection Mode
If an LED is disconnected, the driver senses that and
automatically ignores that channel. When all LEDs are
disconnected, the driver goes to 1x mode where the
output is equal to the input voltage.
GND
As soon as the output exceeds about 6V, the driver
resets itself and reevaluate the mode.
Pin1
If the die temperature exceeds +150°C, the driver will
enter a thermal protection shutdown mode. When the
device temperature drops by about 20°C, the device
will resume normal operation.
C2
LED Selection
LEDs with forward voltages (VF) ranging from 1.3V to
4.3V may be used. Selecting LEDs with lower VF is
recommended in order to improve the efficiency by
keeping the driver in 1x mode longer as the battery
voltage decreases.
EN/DIM
C1
RSET
VIN
COUT
CIN
GND
For example, if a white LED with a VF of 3.3V is
selected over one with VF of 3.5V, the driver will stay
in 1x mode for lower supply voltage of 0.2V. This
helps improve the efficiency and extends battery life.
GND
Figure 5. Recommended Layout
© Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
11
Doc. No. MD-5023, Rev. E
CAT3644
PACKAGE OUTLINE DRAWING
TQFN 16-Pad 3 x 3mm (HS3, HV3)(1)(2)
A
D
e
b
L
E
E2
PIN#1 ID
PIN#1 INDEX AREA
A1
SIDE VIEW
D2
BOTTOM VIEW
TOP VIEW
SYMBOL
MIN
0.70
0.00
0.178
0.18
2.90
1.40
2.90
1.40
NOM
0.75
0.02
0.203
0.23
3.00
–
MAX
0.80
0.05
0.228
0.30
3.10
1.80
3.10
1.80
A
A
A1
A3
b
A1
A3
FRONT VIEW
D
D2
E
3.00
–
E2
e
0.50 BSC
0.40
L
0.30
0.50
For current Tape and Reel information, download the PDF file from:
http://www.catsemi.com/documents/tapeandreel.pdf.
Notes:
(1) All dimensions are in millimeters.
(2) Complies with JEDEC standard MO-229.
Doc. No. MD-5023, Rev. E
12
© Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
CAT3644
EXAMPLE OF ORDERING INFORMATION (1)
Prefix
Device #
Suffix
CAT
3644
HV3
-G
T2
Lead Finish
Blank: Matte-Tin
G: NiPdAu
Product Number
Optional
Package
Company ID
HV3: TQFN
Tape & Reel
T: Tape & Reel
2: 2000/Reel
Notes:
(1) All packages are RoHS-compliant (Lead-free, Halogen-free).
(2) The standard lead finish is NiPdAu.
(3) The device used in the above example is a CAT3644HV3-GT2 (TQFN, NiPdAu, Tape & Reel).
(4) For additional package and temperature options, please contact your nearest Catalyst Semiconductor Sales office.
© Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
13
Doc. No. MD-5023, Rev. E
REVISION HISTORY
Date
Rev. Reason
01/29/2007
A
Initial Release
Electrical Operating Characteristics – Add the pull-down resistor value 100kΩ
Block Diagram – Add a 100kΩ pull-down resistor
Updated Example of Ordering Information
02/26/2007
06/15/2007
B
C
D
Added MD- to document number
Added RSET in Absolute Maximum Ratings table
Updated Recommended Operating Condition table
Updated Electrical Operating Characteristics table
Added LED Current section
07/25/2007
10/16/2007
Updated Package Outline Drawing
Update Description
Update Absolute Maximum Ratings
Update Updated Package Outline Drawing
E
Copyrights, Trademarks and Patents
© Catalyst Semiconductor, Inc.
Trademarks and registered trademarks of Catalyst Semiconductor include each of the following:
Adaptive Analog™, Beyond Memory™, DPP™, EZDim™, LDD™, MiniPot™, Quad-Mode™ and Quantum Charge Programmable™
Catalyst Semiconductor has been issued U.S. and foreign patents and has patent applications pending that protect its products.
CATALYST SEMICONDUCTOR MAKES NO WARRANTY, REPRESENTATION OR GUARANTEE, EXPRESS OR IMPLIED, REGARDING THE SUITABILITY OF ITS
PRODUCTS FOR ANY PARTICULAR PURPOSE, NOR THAT THE USE OF ITS PRODUCTS WILL NOT INFRINGE ITS INTELLECTUAL PROPERTY RIGHTS OR THE
RIGHTS OF THIRD PARTIES WITH RESPECT TO ANY PARTICULAR USE OR APPLICATION AND SPECIFICALLY DISCLAIMS ANY AND ALL LIABILITY ARISING
OUT OF ANY SUCH USE OR APPLICATION, INCLUDING BUT NOT LIMITED TO, CONSEQUENTIAL OR INCIDENTAL DAMAGES.
Catalyst Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Catalyst Semiconductor product could create a situation where personal
injury or death may occur.
Catalyst Semiconductor reserves the right to make changes to or discontinue any product or service described herein without notice. Products with data sheets labeled
"Advance Information" or "Preliminary" and other products described herein may not be in production or offered for sale.
Catalyst Semiconductor advises customers to obtain the current version of the relevant product information before placing orders. Circuit diagrams illustrate typical
semiconductor applications and may not be complete.
Catalyst Semiconductor, Inc.
Corporate Headquarters
2975 Stender Way
Santa Clara, CA 95054
Phone: 408.542.1000
Fax: 408.542.1200
www.catsemi.com
Document No: MD-5023
Revision:
E
Issue date:
10/16/07
相关型号：
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