JAN1N5295UR [CDI-DIODE]

DIODE 0.82 mA, SILICON, CURRENT REGULATOR DIODE, DO-213AB, HERMETIC SEALED PACKAGE-2, Current Regulator Diode;


型号：	JAN1N5295UR
厂家：	COMPENSATED DEUICES INCORPORATED
描述：	DIODE 0.82 mA, SILICON, CURRENT REGULATOR DIODE, DO-213AB, HERMETIC SEALED PACKAGE-2, Current Regulator Diode
文件：	总17页 (文件大小：94K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

INCH-POUND

MIL-PRF-19500/463G

2 April 2004

SUPERSEDING

MIL-PRF-19500/463F

24 June 2003

The documentation and process conversion

measures necessary to comply with this

revision shall be completed by 2 July 2004.

* PERFORMANCE SPECIFICATION SHEET

* SEMICONDUCTOR DEVICE, DIODE, SILICON, CURRENT REGULATOR, TYPES 1N5283-1

THROUGH 1N5314-1, AND 1N5283UR-1 THROUGH 1N5314UR-1, 1N7048-1 THROUGH 1N7055-1,

1N7048UR-1 THROUGH 1N7055UR-1, JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC

This specification is approved for use by all Departments

and Agencies of the Department of Defense.

* The requirements for acquiring the product described herein shall consist of

this specification sheet and MIL-PRF-19500.

1. SCOPE

1.1 Scope. This specification covers the performance requirements for 100 volt, silicon, current regulator diodes.

Four levels of product assurance are provided for each encapsulated device type as specified in MIL-PRF-19500.

Two levels of product assurance are provided for each unencapsulated device type.

1.2 Physical dimensions. See figure 1 (DO-7), figure 2 (DO-213AB), and figure 3 (JANHC and JANKC).

1.3 Maximum ratings. Maximum ratings are as shown in maximum test ratings (see 3.10) and as follows:

a. P = 500 mW (DO-7) at T = +50°C, L = .375 inch (9.53 mm); both ends of case or diode body to heat sink

at L = .375 inch (9.53 mm). (Derate to 0 at +175°C).

b. P = 500 mW (DO-213AB) at T

= +125°C. (Derate to 0 at +175°C).

c. -65°C ≤ T ≤ +175°C; -65°C ≤ T

≤ +175°C.

STG

1.4 Primary electrical characteristics. Primary electrical ratings are as shown in maximum test ratings (see 3.10)

and as follows, (nominally .22 mA dc ≤ I ≤ 4.70 mA dc):

a. R

b. R

= 250°C/W (maximum) at L = .375 inch (9.53 mm) (DO-7).

ΘJL

= 100°C/W (maximum) junction to end-caps (DO-213AB).

ΘJEC

* Comments, suggestions, or questions on this document should be addressed to Defense Supply Center,

Columbus, ATTN: DSCC-VAC, P.O. Box 3990, Columbus, OH 43216-5000, or emailed to

Semiconductor@dscc.dla.mil. Since contact information can change, you may want to verify the currency of

this address information using the ASSIST Online database at http://www.dodssp.daps.mil.

AMSC N/A

FSC 5961

MIL-PRF-19500/463G

DO-7

Dimensions

Inches Millimeters

Symbol

Notes

Min

.060

.120

.018

1.000

Max

.107

.300

.023

1.500

0.050

Min

1.52

3.05

0.46

25.40 38.10

1.27

Max

2.72

7.62

0.58

NOTES:

1. Dimensions are in inches.

2. Millimeters are given for general information only.

3. The minimum body diameter shall be maintained over .15 inch (0.38 mm) inch of body length.

4. The specified lead diameter applies in the zone between .050 inch (1.27 mm) and

the end of the lead. Outside of this zone the lead diameter shall not exceed LD.

5. Both leads shall be within the specified dimension.

6. See 3.3 for L and T definitions.

7. In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology.

FIGURE 1. Physical dimensions (DO-7).

MIL-PRF-19500/463G

DO-213AB

Dimensions

Inches Millimeters

Symbol

Min

.094

.189

.016

Max

.105

.205

.022

Min

2.39

4.80

0.41

Max

2.67

5.21

0.55

ECT

.001 min

0.03 min

NOTES:

1. Dimensions are in inches.

2. Millimeters are given for general information only.

3. In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology.

FIGURE 2. Physical dimensions (DO-213AB).

MIL-PRF-19500/463G

Dimensions

Inches Millimeters

Min Min Max

Symbol

Max

.014

.030

.012

.026

0.305 0.355

0.660 0.762

Design data

Metallization:

Top: (Anode) ......... Al.

Back: (Cathode) .... Au.

Al thickness ............ 25000 Å Min.

Gold thickness ........ 4000 Å Min.

Chip thickness ....... .010 ±.002 inch (0.254 ±0.0508 mm).

NOTES:

1. Dimensions are in inches.

2. Millimeters are given for general information only.

FIGURE 3. Physical dimensions, JANHCA and JANKCA die.

MIL-PRF-19500/463G

2. APPLICABLE DOCUMENTS

* 2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This

section does not include documents cited in other sections of this specification or recommended for additional

information or as examples. While every effort has been made to ensure the completeness of this list, document

users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this

specification, whether or not they are listed.

2.2 Government documents.

2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a

part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are

those cited in the solicitation or contract.

* DEPARTMENT OF DEFENSE SPECIFICATIONS

MIL-PRF-19500

* DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-750 Test Methods for Semiconductor Devices.

Semiconductor Devices, General Specification for.

* (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or

http://www.dodssp.daps.mil/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,

Philadelphia, PA 19111-5094.)

2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited

herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws

and regulations unless a specific exemption has been obtained.

3. REQUIREMENTS

3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein.

3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a

manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before

contract award (see 4.2 and 6.3).

3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions shall be as specified in

MIL-PRF-19500 and as follows:

Pinch-off current. I Pinch-off current is defined as the regulator current at specified test voltage, V .

P S

- Lead thermal path length. Lead thermal path length is the distance from the end of the diode body to the

point of lead-temperature measurement. For purposes of this measurement, the same heat sinking at the

same distance from the diode body shall be applied to each lead. No heat sinking shall occur between the

diode body and the point of lead-temperature measurement. This measurement may be made from either

end of the diode body. (The diode body includes slugs, if any, but does not include braze fillet, paint, etc.,

within the zone of uncontrollable lead diameter.)

- Steady-state power dissipation. Power dissipated under steady-state conditions.

- Lead temperature. Lead temperature is the temperature of the lead measured at the lead thermal path

length, L. Lead temperature shall be measured by means of a No. 30 copper-constantan thermocouple, or

equivalent. All reference to T is T

for "UR" devices.

POV - Peak operating voltage. Peak operating voltage is the maximum voltage that shall be applied to the device.

MIL-PRF-19500/463G

3.4 Interface and physical dimensions. Interface and physical dimensions shall be as specified in MIL-PRF-19500,

figure 1 (DO-7), figure 2 (DO-213AB), and figure 3 (JANHC and JANKC die) herein.

3.5 Dash-one construction. These devices shall be of double plug construction utilizing high temperature

metallurgical bonding between both sides of the silicon die and terminal pins. Metallurgical bond shall be in

accordance with the requirements of category I or II in appendix A of MIL-PRF-19500.

3.5.1 JANS construction. Construction shall be dash one, category I or II metallurgical bond in accordance with

appendix A of MIL-PRF-19500.

3.5.2 Encapsulant material. In addition to those categories of hermetically sealed package requirements specified

in MIL-PRF-19500, fused-metal-oxide to metal shall also be acceptable.

* 3.6 Lead finish. Unless otherwise specified, lead finish shall be solderable in accordance with

MIL-PRF-19500, MIL-STD-750, and herein. Where a choice of lead finish is desired, it shall be specified in the

acquisition document (see 6.2).

* 3.7 Marking. Marking shall be in accordance with MIL-PRF-19500. Manufacturers identification and date code

shall be marked on the devices. The polarity shall be indicated with a contrasting color band to denote the cathode

end. No color coding will be permitted. Initial container package marking shall be in accordance with

MIL-PRF-19500.

* 3.7.1 UR devices. For UR version devices only, all marking, except polarity (and serial number for JANS) may be

omitted from the body, but shall be retained on the initial container. UR devices shall be marked with a cathode band

as a minimum; or a minimum of three evenly spaced contrasting color dots around the periphery of the cathode end

may be used.

3.8 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance

characteristics are as specified in 1.3, 1.4, and tables I and II herein.

3.9 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table I herein.

3.10 Maximum test ratings. Test ratings shall be as shown in table II.

3.11 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and

shall be free from other defects that will affect life, serviceability, or appearance.

4. VERIFICATION

4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:

a. Qualification inspection (see 4.2).

b. Screening (see 4.3).

c. Conformance inspection (see 4.4).

* 4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as specified

herein.

4.2.1 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In

case qualification was awarded to a prior revision of the specification sheet that did not request the performance of

group E tests, the tests specified in 4.7.4 herein shall be performed on the first inspection lot to this revision to

maintain qualification.

MIL-PRF-19500/463G

4.2.2 JANHC and JANKC devices. Qualification for shall be in accordance with appendix G of MIL-PRF-19500.

4.3 Screening (JAN, JANTXV, JANTX, and JANS levels only). Screening shall be in accordance with

table IV of MIL-PRF-19500, and as specified herein. The following measurements shall be made in accordance with

table I herein. Devices that exceed the limits of table I herein shall not be acceptable.

Screen

(see table IV of

Measurement

MIL-PRF-19500)

JANS

Temperature cycling

JANTX and JANTXV levels

Temperature cycling

JAN level (3)

Temperature cycling (in

accordance with

MIL-PRF-19500, JANTX level)

Thermal impedance (see

4.3.3)

(1) 3c

Thermal impedance (see

4.3.3)

Thermal impedance (see

4.3.3)

Not applicable

= Col 11, table II at

POV

= +25°C t = 48 hours

POV

= +25°C t = 48 hours

POV

T = +25°C t = 48 hours

Subgroup 2 of table I herein; Subgroup 2 of table I herein

∆I ≤ 5 percent of initial

Subgroup 2 of table I herein

value

See 4.3.2

Not applicable

(2) 13

Subgroup 2 of table I herein; Subgroup 2 of table I herein; Not applicable

∆I ≤ 5 percent of initial

value.

(1) Thermal impedance may be performed any time after sealing provided temperature cycling is performed in

accordance with MIL-PRF-19500, screen 3 prior to this thermal test.

(2) When thermal impedance is performed prior to screen 13, it is not required to be repeated in screen 13.

(3) Screens 3a, 3c, 10, and 11 are the only screens required for JAN level product.

4.3.1 Screening (JANHC or JANKC). Screening of die shall be in accordance with appendix G of

MIL-PRF-19500. As a minimum, die shall be 100-percent probed to ensure compliance with table I, subgroup 2 (with

the exception of thermal impedance).

4.3.2 Power burn-in conditions. Power burn-in conditions are as follows: I = 200 mA dc minimum; mounting and

test conditions in accordance with method 1038 of MIL-STD-750, test condition B, T

= +75°C to +125°C for

surface mount devices. T = room ambient as defined in the general requirements of 4.5 of MIL-STD-750.

* 4.3.3 Thermal impedance Z

measurements for screening. The Z

measurements shall be performed in

accordance with method 3101 of MIL-STD-750, (V to be used in lieu of V ). The maximum limit (not to exceed the

ΘJX

table I, subgroup 2 limit) for Z

ΘJX

in screening (table IV of MIL-PRF-19500) shall be derived by each vendor by

means of statistical process control. When the process has exhibited control and capability, the capability data shall

be used to establish the fixed screening limit. In addition to screening, once a fixed limit has been established,

monitor all future sealing lots using a random five piece sample from each lot to be plotted on the applicable X , R

chart. If a lot exhibits an out of control condition, the entire lot shall be removed from the line and held for engineering

evaluation and disposition.

a. I measurement current

1 mA - 10 mA.

.5 A - 1.0 A.

10 ms.

b. I forward heating current

c. t heating time

d. t

measurement delay time

70 µs maximum.

MIL-PRF-19500/463G

* 4.3.3.1 For initial qualification or requalification. Read and record data (Z

) shall be supplied to the qualifying

ΘJX

activity on one lot (random sample of 500 devices minimum) prior to shipment. Twenty-two samples shall be

serialized and provided to the qualifying activity for test correlation.

* 4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500 and as

specified herein.

4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-PRF-19500, and table I

herein.

4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for

subgroup testing in table VIa (JANS) and VIb (JAN, JANTX and JANTXV) of MIL-PRF-19500, and as follows.

Electrical measurements (end-points) and delta requirements shall be in accordance with table I, subgroup 2 herein.

* 4.4.2.1 Group B inspection, table VIa (JANS) of MIL-PRF-19500.

Subgroup

Method

1037

Condition

2,000 cycles; test conditions in accordance with 4.3.2: t = t 30 seconds

on off

minimum.

1027

= 200 mA dc, T = +125°C or adjusted as required to give an average lot

J = +175°C. Marking legibility requirements shall not apply.

* 4.4.2.2 Group B inspection, table VIb (JAN, JANTX, and JANTXV) of MIL-PRF-19500.

Subgroup

Method

1027

Condition

= Col 11, table II; T = +25°C; L = .375 inch (9.53 mm) (non-surface

POV

mount), L = 0 inch for surface mount.

Not applicable.

1032

T = +175°C.

4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for

subgroup testing in table VII of MIL-PRF-19500, and as follows. Electrical measurements (end-points) and delta

requirements shall be in accordance with table I, subgroup 2 herein.

Subgroup

Method

2036

Condition

(Not applicable to surface mount devices); lead fatigue conditions:

Test condition E; .062 inch (1.57 mm) lead restriction from case.

Test condition A; 4 pounds, 15 seconds.

3101

at L = .375 inch (9.52 mm) ≤ 250°C/W, R _JECat L = 0 lead length ≤

ΘJL

100°C/W, see 4.5.3. R

or 4081

= 100°C/W (maximum) at zero lead length (for UR)

ΘJEC

1026

= Col 11, table II; T = +25°C; L = .375 inch (9.53 mm) (non-surface

POV A

mount), L = 0 inch for surface mount.

See 4.6 and 4.7.3.

MIL-PRF-19500/463G

* 4.5 Thermal resistance. Thermal resistance measurement shall be in accordance with method 3101 of

MIL-STD-750. Forced moving air or draft shall not be permitted across the device during heat. The maximum limit

for R

under these test conditions shall be R

(max) = 250°C/W or R = 100°C/W. The following

ΘJL

ΘJEC

conditions shall apply:

a. I

1 mA to 10 mA.

b. I

200 mA to 400 mA.

30 seconds minimum.

c. t

d. t

70 µs maximum.

LS = lead spacing = .375 inch (9.53 mm) (2 places) for non-surface mount and 0 inch for surface mount (see figure

4).

FIGURE 4. Mounting conditions.

4.5.1 For initial qualifications and re-qualifications. Read and record data in accordance with 4.7.4 herein and

shall be included in the qualification report.

4.6 Temperature coefficient of regulator current. The temperature coefficient of regulator current shall be tested

under the following conditions: (sampling plan: 22 devices, c = 0).

a. Test 1: V = 25 V dc, T = -55°C, T = +25°C, L = .375 inch (9.53 mm) (non-surface mount), L = 0 inch

L1 L2

(surface mount) (see 3.3 and 4.7.3) with the maximum limit in accordance with column 8 of table II.

b. Test 2: V = 25 V dc, T = +25°C, T = +150°C, L = .375 inch (9.53 mm) (non-surface mount), L = 0 inch

L1 L2

(surface mount) (see 3.3 and 4.7.3) with the maximum limit in accordance with column 9 of table II.

4.7 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows:

4.7.1 Knee ac impedance (Z ) at test voltage V . To test for Z , a 90 Hz signal V (mod) with rms value equal to

10 percent of test voltage, V , is superimposed on the test voltage (see figure 5).

4.7.2 Regulator impedance (Z ) at test voltage V . To test for Z , a 90 Hz signal V (mod) with rms value equal

to 10 percent of test voltage, V , is superimposed on the test voltage (see figure 6).

MIL-PRF-19500/463G

4.7.3 Temperature coefficient of regulator current ( I ). Temperature coefficient of regulator current shall be

calculated as follows:

(T ) - I (T

)

= _________________

100

(T = +25°C)∆T

L L

4.7.4 Group E inspection. Group E inspection shall be conducted in accordance with the conditions specified for

subgroup testing in table IX of MIL-PRF-19500. Electrical measurements (end-points) and delta requirements shall

be in accordance with the applicable steps and footnotes of table I, subgroup 2 herein.

* 4.7.4.1 Group E inspection, table IX of MIL-PRF-19500.

Inspections

MIL-STD-750

Condition

Sample

plan

Method

1051

500 cycles

45 devices, c = 0

1037

2101

6,000 cycles (see 4.3.2)

= t = 30 seconds minimum

on off

Cross section; scribe and break.

Separate samples to be used for

each test.

Each supplier shall submit their

(typical) design thermal impedance

curves. In addition, test conditions

3 devices, c = 0

and Z

limit shall be provided to

ΘJX

the qualifying activity in the

qualification report.

As applicable.

1020

3 devices, c = 0

MIL-PRF-19500/463G

* TABLE I. Group A inspection.

MIL-STD-750

Inspection 1/

Subgroup 1

Limit 2/

Unit

Symbol

Method

2071

Conditions

Min

Max

Visual and mechanical

examination

Subgroup 2

Regulator current

= 25 V dc, t = 90 s or thermal

Column 3

Column 4

Column 7

mA dc

equilibrium, 1N5283-1 - 1N5314-1

t = pulse measurement, 10mS max

1N7048-1 - 1N7055-1

= +30°C ±3°C (see figure 5)

Limiting voltage

Reverse voltage

= .8 I (min), col. 3 of table II

V dc

(see figure 6)

= 200 mA

2.5

V dc

Thermal impedance

Subgroup 3

3101

See 4.3.3

°C/W

ΘJX

Not applicable

Subgroup 4

Regulator impedance

= 25 V dc; (see figure 7 and

Column 5

Column 6

MΩ

4.7.2)

Knee impedance

= 6.0 V dc, (see figure 8 and

4.7.1)

Subgroups 5 and 6

Not applicable

Subgroup 7

Column 10

mA dc

Regulator current

V = Col 11, table II, T = 90s or

thermal equilibrium,

1N5283-1 - 1N5314-1

t = pulse measurement, 10 mS max

1N7048-1 - 1N7055-1

= +30°C ±3°C (see figure 5)

1/ For sampling plan, see MIL-PRF-19500.

2/ Column references are to table II herein.

TABLE II. Electrical characteristics. 1/

Col 1

Type

Col 2

Col 3

Col 4

Col 5

Col 6

Col 7

Col 8

α I

Col 9

α I

Col 10

Col 11

POV

(Electrical

characteristics

for "UR" and

"-1" suffix

devices are

identical.)

regulator current (mA)

minimum

regulator

impedance

minimum

knee

maximum

limiting

voltage at

regulator

current (mA)

maximum

regulator current

maximum

regulator current

Peak

Operating

Volts (DC)

= 25 V

impedance

C at

C at V = 25V

at V = 25

= 0.8 I

V = Col 11

at V = 6 V

= 25V

(min)

-55°C

(%/°C)

Max

+25°C +25°C

+150°C

(%/°C)

Nom

0.22

0.24

0.27

0.30

0.33

0.39

0.43

0.47

0.56

0.62

0.68

0.75

0.82

0.91

1.00

1.10

1.20

1.30

1.40

1.50

Min

Max

0.242

0.264

0.297

0.330

0.363

0.429

0.473

0.517

0.616

0.682

0.748

0.825

0.902

1.001

1.100

1.210

1.32

Volts

1.00

1.05

1.10

1.13

1.15

1.20

1.25

1.29

1.35

1.40

1.45

1.50

1.55

1.60

Min

Max

0.60

0.56

0.48

0.42

0.37

0.28

0.23

0.18

0.10

0.05

0.02

- .03

- .07

- .10

Max

.27

.30

.33

.36

.40

.47

.52

.57

.68

.75

.82

.91

Volts

100

MΩ

25.0

19.0

14.0

9.0

MΩ

2.75

2.35

1.95

1.60

1.35

1.00

0.870

0.750

0.560

0.470

0.400

0.335

0.290

0.240

0.205

0.180

0.155

0.135

0.115

0.105

1N5283-1

1N5284-1

1N5285-1

1N5286-1

1N5287-1

1N5288-1

1N5289-1

1N5290-1

1N5291-1

1N5292-1

1N5293-1

1N5294-1

1N5295-1

1N5296-1

1N5297-1

1N5298-1

1N5299-1

1N5300-1

1N5301-1

1N5302-1

0.198

0.216

0.243

0.270

0.297

0.351

0.387

0.423

0.504

0.558

0.612

0.675

0.738

0.819

0.900

0.990

1.08

- .20

- .30

- .35

- .40

- .50

- .52

- .55

- .60

- .62

- .65

- .70

- .72

- .76

- .78

- .80

- .83

- .85

- .88

- .90

1.15

1.05

0.95

0.85

0.75

0.62

0.55

0.50

0.35

0.25

0.20

0.15

0.07

0.0

0.05

-.10

-.15

-.20

- .16

- .20

- .22

- .25

- .26

- .30

- .32

- .33

- .36

- .37

- .38

- .40

- .41

- .42

- .44

- .46

- .47

- .48

- .49

- .50

6.6

4.10

3.30

2.70

1.90

1.55

1.35

1.15

1.00

0.880

0.800

0.700

0.640

0.580

0.540

0.510

.99

1.10

1.21

1.33

1.45

1.57

1.69

1.81

1.17

1.26

1.35

1.43

1.54

1.65

TABLE II. Electrical characteristics - Continued. 1/

Col 1

Type

Col 2

Col 3

Col 4

Col 5

Col 6

Col 7

Col 8

α I

Col 9

α I

Col 10

Col 11

POV

(Electrical

characteristics

for "UR" and

"-1" suffix

devices are

identical.)

regulator current (mA)

minimum

regulator

impedance

minimum

knee

impedance

maximum

limiting

voltage at I

regulator

current (mA)

maximum

regulator

current

maximum

regulator current

Peak

Operating

Volts (DC)

= 25 V

C at V = 25V

at V = 25 V

at V = 6 V

V = Col 11

0.8 I (min)

C at V = 25V

-55°C

+25°C +25°C

+150°C

(%/°C)

Nom

1.60

1.80

2.00

2.20

2.40

2.70

3.00

3.30

3.60

3.90

4.30

4.70

5.1

5.6

6.2

6.8

7.5

8.2

9.1

10.0

Min

Max

1.76

1.98

2.20

2.42

2.64

2.97

3.30

3.63

3.96

4.29

4.73

5.17

5.61

6.16

6.82

7.48

8.25

9.02

10.01

11.10

Volts

1.65

1.75

1.85

1.95

2.00

2.15

2.25

2.35

2.50

2.60

2.75

2.90

3.67

4.03

4.46

4.90

5.40

5.90

6.55

7.20

Min

Max

-.20

Min

Max

- .10

Max

1.92

2.18

2.42

2.66

2.90

3.27

3.63

3.99

4.36

4.72

5.20

5.69

6.89

7.54

8.38

9.20

10.20

11.20

12.40

14.40

Volts

100

MΩ

0.092

0.074

0.061

0.052

0.044

0.035

0.029

0.024

0.020

0.017

0.014

0.012

0.004

0.003

0.002

0.0015

0.001

1N5303-1

1N5304-1

1N5305-1

1N5306-1

1N5307-1

1N5308-1

1N5309-1

1N5310-1

1N5311-1

1N5312-1

1N5313-1

1N5314-1

1N7048-1

1N7049-1

1N7050-1

1N7051-1

1N7052-1

1N7053-1

1N7054-1

1N7055-1

1.44

1.62

1.80

1.98

2.16

2.43

2.70

2.97

3.24

3.51

3.87

4.23

4.59

5.04

5.58

6.12

6.75

7.38

8.19

9.00

0.475

0.420

0.395

0.370

0.345

0.320

0.300

0.280

0.265

0.255

0.245

0.235

0.100

0.090

0.080

0.070

0.050

0.030

0.020

0.010

- .90

- .92

- .95

- .96

- .98

-1.0

-1.01

-1.02

-1.03

-1.04

-1.05

-1.06

- .50

- .51

- .52

- .53

- .54

- .55

1/ Electrical characteristics are for all package styles.

MIL-PRF-19500/463G

NOTES:

1. Adjust voltage source so that V = 25 V dc.

2. Measure current I .

3. The device is acceptable if the current falls within the limits specified.

4. The ammeter shall represent essentially a short-circuit to the terminals between which the current is

being measured. If not, the voltmeter reading shall be corrected for the drop across the ammeter.

FIGURE 5. Regulator current test circuit.

NOTES:

1. Adjust current source so that I

L = .8 I (min).

2. Measure voltage V .

3. The device is acceptable if the voltage is less than the limit specified.

4. The ammeter shall represent essentially a short-circuit to the terminals between which the current is

being measured. If not, the voltmeter reading shall be corrected for the drop across the ammeter.

FIGURE 6. Limiting voltage test circuit.

MIL-PRF-19500/463G

NOTES:

1. Adjust voltage source so that V = 25 Vdc.

2. Apply an ac signal of 2.5 V rms at 90 Hz through an isolating capacitor C.

3. Measure the ac rms voltage.

4. z = V mod x (R

1÷ V ac) where V mod equals ac signal for note 2 and V ac equals the voltage across R .

S 1

5. Device is acceptable if the regulator impedance meets the specified minimum limit.

FIGURE 7. Regulator impedance test circuit.

NOTES:

1. Adjust voltage source so that V = 6.0 Vdc.

2. Apply an ac signal of .6 Vrms at 90 Hz through an isolating capacitor C.

3. Measure the ac rms voltage.

4. z = V mod x (R

1÷ V ac) where V mod equals ac signal for note 2 and V ac equals the voltage across R .

K 1

5. Device is acceptable if the knee impedance meets the specified minimum limit.

FIGURE 8. Knee impedance test circuit.

MIL-PRF-19500/463G

5. PACKAGING

* 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order

(see 6.2). When actual packaging of materiel is to be performed by DoD or in-house contractor personnel, these

personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging

requirements are maintained by the Inventory Control Point's packaging activities within the Military Service or

Defense Agency, or within the Military Service’s system commands. Packaging data retrieval is available from the

managing Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting

the responsible packaging activity.

6. NOTES

(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)

6.1 Intended use. The notes specified in MIL-PRF-19500 are applicable to this specification.

* 6.2 Acquisition requirements. Acquisition documents should specify the following:

a. Title, number, and date of this specification.

b. Packaging requirements (see 5.1).

c. Lead finish (see 3.6).

d. Product assurance level and type designator.

6.3 Qualification. With respect to products requiring qualification, awards will be made only for products which are,

at the time of award of contract, qualified for inclusion in Qualified Manufacturers List (QML No. 19500) whether or

not such products have actually been so listed by that date. The attention of the contractors is called to these

requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal

Government tested for qualification in order that they may be eligible to be awarded contracts or orders for the

products covered by this specification. Information pertaining to qualification of products may be obtained from

Defense Supply Center, Columbus, ATTN: DSCC/VQE, P.O. Box 3990, Columbus, OH 43216-5000 or e-mail

vqe.chief@dla.mil.

6.4 Suppliers of die. The qualified die suppliers with the applicable letter version (example JANHCA1N5283) will

be identified on the QML.

JANC ordering information

Manufacturer

43611

1N5283-1 through 1N5314-1

JANHCA1N5283 through JANHCA1N5314

JANKCA1N5283 through JANKCA1N5314

JANHCA1N7048 through JANHCA1N7055

1N7048-1 through 1N7055-1

JANKCA1N7048 through JANKCA1N7055

6.5 Substitutability. Non-dash-one devices have been deleted from this specification. Dash-one devices are a

direct substitute for non dash-one devices and are preferred.

6.6 Changes from previous issue. The margins of this specification are marked with asterisks to indicate where

changes from the previous issue were made. This was done as a convenience only and the Government assumes

no liability whatsoever for any inaccuracies in these notations. Bidders and contractors are cautioned to evaluate the

requirements of this document based on the entire content irrespective of the marginal notations and relationship to

the last previous issue.

MIL-PRF-19500/463G

Custodians:

Army - CR

Navy - EC

Air Force - 11

NASA - NA

DLA - CC

Preparing activity:

DLA - CC

Review activities:

Army - AR, MI, SM

Navy - AS, MC

(Project 5961-2839)

Air Force - 19, 99

* NOTE: The activities listed above were interested in this document as of the date of this document. Since

organizations and responsibilities can change, you should verify the currency of the information above using the

ASSIST Online database at http://www.dodssp.daps.mil/.

JAN1N5295UR [CDI-DIODE]

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