JAN1N5298UR [CDI-DIODE]
DIODE 1.1 mA, SILICON, CURRENT REGULATOR DIODE, DO-213AB, HERMETIC SEALED PACKAGE-2, Current Regulator Diode;型号: | JAN1N5298UR |
厂家: | COMPENSATED DEUICES INCORPORATED |
描述: | DIODE 1.1 mA, SILICON, CURRENT REGULATOR DIODE, DO-213AB, HERMETIC SEALED PACKAGE-2, Current Regulator Diode |
文件: | 总17页 (文件大小:94K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
INCH-POUND
MIL-PRF-19500/463G
2 April 2004
SUPERSEDING
MIL-PRF-19500/463F
24 June 2003
The documentation and process conversion
measures necessary to comply with this
revision shall be completed by 2 July 2004.
* PERFORMANCE SPECIFICATION SHEET
* SEMICONDUCTOR DEVICE, DIODE, SILICON, CURRENT REGULATOR, TYPES 1N5283-1
THROUGH 1N5314-1, AND 1N5283UR-1 THROUGH 1N5314UR-1, 1N7048-1 THROUGH 1N7055-1,
1N7048UR-1 THROUGH 1N7055UR-1, JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
* The requirements for acquiring the product described herein shall consist of
this specification sheet and MIL-PRF-19500.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for 100 volt, silicon, current regulator diodes.
Four levels of product assurance are provided for each encapsulated device type as specified in MIL-PRF-19500.
Two levels of product assurance are provided for each unencapsulated device type.
1.2 Physical dimensions. See figure 1 (DO-7), figure 2 (DO-213AB), and figure 3 (JANHC and JANKC).
1.3 Maximum ratings. Maximum ratings are as shown in maximum test ratings (see 3.10) and as follows:
a. P = 500 mW (DO-7) at T = +50°C, L = .375 inch (9.53 mm); both ends of case or diode body to heat sink
T
L
at L = .375 inch (9.53 mm). (Derate to 0 at +175°C).
b. P = 500 mW (DO-213AB) at T
= +125°C. (Derate to 0 at +175°C).
T
EC
c. -65°C ≤ T ≤ +175°C; -65°C ≤ T
≤ +175°C.
j
STG
1.4 Primary electrical characteristics. Primary electrical ratings are as shown in maximum test ratings (see 3.10)
and as follows, (nominally .22 mA dc ≤ I ≤ 4.70 mA dc):
P
a. R
b. R
= 250°C/W (maximum) at L = .375 inch (9.53 mm) (DO-7).
ΘJL
= 100°C/W (maximum) junction to end-caps (DO-213AB).
ΘJEC
* Comments, suggestions, or questions on this document should be addressed to Defense Supply Center,
Columbus, ATTN: DSCC-VAC, P.O. Box 3990, Columbus, OH 43216-5000, or emailed to
Semiconductor@dscc.dla.mil. Since contact information can change, you may want to verify the currency of
this address information using the ASSIST Online database at http://www.dodssp.daps.mil.
AMSC N/A
FSC 5961
MIL-PRF-19500/463G
DO-7
Dimensions
Inches Millimeters
Symbol
Notes
Min
.060
.120
.018
1.000
Max
.107
.300
.023
1.500
0.050
Min
1.52
3.05
0.46
25.40 38.10
1.27
Max
2.72
7.62
0.58
BD
BL
LD
LL
3
3
LL
4
1
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. The minimum body diameter shall be maintained over .15 inch (0.38 mm) inch of body length.
4. The specified lead diameter applies in the zone between .050 inch (1.27 mm) and
the end of the lead. Outside of this zone the lead diameter shall not exceed LD.
5. Both leads shall be within the specified dimension.
6. See 3.3 for L and T definitions.
L
7. In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology.
FIGURE 1. Physical dimensions (DO-7).
2
MIL-PRF-19500/463G
DO-213AB
Dimensions
Inches Millimeters
Symbol
Min
.094
.189
.016
Max
.105
.205
.022
Min
2.39
4.80
0.41
Max
2.67
5.21
0.55
BD
BL
ECT
S
.001 min
0.03 min
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology.
FIGURE 2. Physical dimensions (DO-213AB).
3
MIL-PRF-19500/463G
Dimensions
Inches Millimeters
Min Min Max
Symbol
Max
.014
.030
A
B
.012
.026
0.305 0.355
0.660 0.762
Design data
Metallization:
Top: (Anode) ......... Al.
Back: (Cathode) .... Au.
Al thickness ............ 25000 Å Min.
Gold thickness ........ 4000 Å Min.
Chip thickness ....... .010 ±.002 inch (0.254 ±0.0508 mm).
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
FIGURE 3. Physical dimensions, JANHCA and JANKCA die.
4
MIL-PRF-19500/463G
2. APPLICABLE DOCUMENTS
* 2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This
section does not include documents cited in other sections of this specification or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this
specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those cited in the solicitation or contract.
* DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-19500
* DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-750 Test Methods for Semiconductor Devices.
-
Semiconductor Devices, General Specification for.
-
* (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or
http://www.dodssp.daps.mil/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,
Philadelphia, PA 19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited
herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws
and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein.
3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before
contract award (see 4.2 and 6.3).
3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions shall be as specified in
MIL-PRF-19500 and as follows:
-
I
Pinch-off current. I Pinch-off current is defined as the regulator current at specified test voltage, V .
P S
P
L
- Lead thermal path length. Lead thermal path length is the distance from the end of the diode body to the
point of lead-temperature measurement. For purposes of this measurement, the same heat sinking at the
same distance from the diode body shall be applied to each lead. No heat sinking shall occur between the
diode body and the point of lead-temperature measurement. This measurement may be made from either
end of the diode body. (The diode body includes slugs, if any, but does not include braze fillet, paint, etc.,
within the zone of uncontrollable lead diameter.)
P
- Steady-state power dissipation. Power dissipated under steady-state conditions.
D
L
T
- Lead temperature. Lead temperature is the temperature of the lead measured at the lead thermal path
length, L. Lead temperature shall be measured by means of a No. 30 copper-constantan thermocouple, or
equivalent. All reference to T is T
for "UR" devices.
L
EC
V
POV - Peak operating voltage. Peak operating voltage is the maximum voltage that shall be applied to the device.
5
MIL-PRF-19500/463G
3.4 Interface and physical dimensions. Interface and physical dimensions shall be as specified in MIL-PRF-19500,
figure 1 (DO-7), figure 2 (DO-213AB), and figure 3 (JANHC and JANKC die) herein.
3.5 Dash-one construction. These devices shall be of double plug construction utilizing high temperature
metallurgical bonding between both sides of the silicon die and terminal pins. Metallurgical bond shall be in
accordance with the requirements of category I or II in appendix A of MIL-PRF-19500.
3.5.1 JANS construction. Construction shall be dash one, category I or II metallurgical bond in accordance with
appendix A of MIL-PRF-19500.
3.5.2 Encapsulant material. In addition to those categories of hermetically sealed package requirements specified
in MIL-PRF-19500, fused-metal-oxide to metal shall also be acceptable.
* 3.6 Lead finish. Unless otherwise specified, lead finish shall be solderable in accordance with
MIL-PRF-19500, MIL-STD-750, and herein. Where a choice of lead finish is desired, it shall be specified in the
acquisition document (see 6.2).
* 3.7 Marking. Marking shall be in accordance with MIL-PRF-19500. Manufacturers identification and date code
shall be marked on the devices. The polarity shall be indicated with a contrasting color band to denote the cathode
end. No color coding will be permitted. Initial container package marking shall be in accordance with
MIL-PRF-19500.
* 3.7.1 UR devices. For UR version devices only, all marking, except polarity (and serial number for JANS) may be
omitted from the body, but shall be retained on the initial container. UR devices shall be marked with a cathode band
as a minimum; or a minimum of three evenly spaced contrasting color dots around the periphery of the cathode end
may be used.
3.8 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
characteristics are as specified in 1.3, 1.4, and tables I and II herein.
3.9 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table I herein.
3.10 Maximum test ratings. Test ratings shall be as shown in table II.
3.11 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
4. VERIFICATION
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3).
c. Conformance inspection (see 4.4).
* 4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as specified
herein.
4.2.1 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In
case qualification was awarded to a prior revision of the specification sheet that did not request the performance of
group E tests, the tests specified in 4.7.4 herein shall be performed on the first inspection lot to this revision to
maintain qualification.
6
MIL-PRF-19500/463G
4.2.2 JANHC and JANKC devices. Qualification for shall be in accordance with appendix G of MIL-PRF-19500.
4.3 Screening (JAN, JANTXV, JANTX, and JANS levels only). Screening shall be in accordance with
table IV of MIL-PRF-19500, and as specified herein. The following measurements shall be made in accordance with
table I herein. Devices that exceed the limits of table I herein shall not be acceptable.
Screen
(see table IV of
Measurement
MIL-PRF-19500)
JANS
Temperature cycling
JANTX and JANTXV levels
Temperature cycling
JAN level (3)
Temperature cycling (in
accordance with
3a
MIL-PRF-19500, JANTX level)
Thermal impedance (see
4.3.3)
(1) 3c
Thermal impedance (see
4.3.3)
Thermal impedance (see
4.3.3)
9
I
Not applicable
Not applicable
P1
10
V
= Col 11, table II at
V
= Col 11, table II at
V
= Col 11, table II at
POV
= +25°C t = 48 hours
POV
= +25°C t = 48 hours
POV
T = +25°C t = 48 hours
A
T
T
A
A
11
Subgroup 2 of table I herein; Subgroup 2 of table I herein
∆I ≤ 5 percent of initial
P1
Subgroup 2 of table I herein
value
12
See 4.3.2
See 4.3.2
Not applicable
(2) 13
Subgroup 2 of table I herein; Subgroup 2 of table I herein; Not applicable
∆I ≤ 5 percent of initial
P1
∆I ≤ 5 percent of initial
P1
value.
value.
(1) Thermal impedance may be performed any time after sealing provided temperature cycling is performed in
accordance with MIL-PRF-19500, screen 3 prior to this thermal test.
(2) When thermal impedance is performed prior to screen 13, it is not required to be repeated in screen 13.
(3) Screens 3a, 3c, 10, and 11 are the only screens required for JAN level product.
4.3.1 Screening (JANHC or JANKC). Screening of die shall be in accordance with appendix G of
MIL-PRF-19500. As a minimum, die shall be 100-percent probed to ensure compliance with table I, subgroup 2 (with
the exception of thermal impedance).
4.3.2 Power burn-in conditions. Power burn-in conditions are as follows: I = 200 mA dc minimum; mounting and
R
test conditions in accordance with method 1038 of MIL-STD-750, test condition B, T
= +75°C to +125°C for
surface mount devices. T = room ambient as defined in the general requirements of 4.5 of MIL-STD-750.
EC
A
* 4.3.3 Thermal impedance Z
measurements for screening. The Z
measurements shall be performed in
accordance with method 3101 of MIL-STD-750, (V to be used in lieu of V ). The maximum limit (not to exceed the
ΘJX
ΘJX
F
R
table I, subgroup 2 limit) for Z
ΘJX
in screening (table IV of MIL-PRF-19500) shall be derived by each vendor by
means of statistical process control. When the process has exhibited control and capability, the capability data shall
be used to establish the fixed screening limit. In addition to screening, once a fixed limit has been established,
monitor all future sealing lots using a random five piece sample from each lot to be plotted on the applicable X , R
chart. If a lot exhibits an out of control condition, the entire lot shall be removed from the line and held for engineering
evaluation and disposition.
a. I measurement current
1 mA - 10 mA.
.5 A - 1.0 A.
10 ms.
M
b. I forward heating current
H
c. t heating time
H
d. t
MD
measurement delay time
70 µs maximum.
7
MIL-PRF-19500/463G
* 4.3.3.1 For initial qualification or requalification. Read and record data (Z
) shall be supplied to the qualifying
ΘJX
activity on one lot (random sample of 500 devices minimum) prior to shipment. Twenty-two samples shall be
serialized and provided to the qualifying activity for test correlation.
* 4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500 and as
specified herein.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-PRF-19500, and table I
herein.
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table VIa (JANS) and VIb (JAN, JANTX and JANTXV) of MIL-PRF-19500, and as follows.
Electrical measurements (end-points) and delta requirements shall be in accordance with table I, subgroup 2 herein.
* 4.4.2.1 Group B inspection, table VIa (JANS) of MIL-PRF-19500.
Subgroup
B4
Method
1037
Condition
2,000 cycles; test conditions in accordance with 4.3.2: t = t 30 seconds
on off
minimum.
B5
1027
I
= 200 mA dc, T = +125°C or adjusted as required to give an average lot
A
R
T
J = +175°C. Marking legibility requirements shall not apply.
* 4.4.2.2 Group B inspection, table VIb (JAN, JANTX, and JANTXV) of MIL-PRF-19500.
Subgroup
B3
Method
1027
Condition
= Col 11, table II; T = +25°C; L = .375 inch (9.53 mm) (non-surface
V
POV
A
mount), L = 0 inch for surface mount.
B5
B6
Not applicable.
1032
T = +175°C.
A
4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table VII of MIL-PRF-19500, and as follows. Electrical measurements (end-points) and delta
requirements shall be in accordance with table I, subgroup 2 herein.
Subgroup
C2
Method
2036
Condition
(Not applicable to surface mount devices); lead fatigue conditions:
Test condition E; .062 inch (1.57 mm) lead restriction from case.
Test condition A; 4 pounds, 15 seconds.
C5
3101
R
at L = .375 inch (9.52 mm) ≤ 250°C/W, R JEC at L = 0 lead length ≤
Θ
ΘJL
100°C/W, see 4.5.3. R
or 4081
= 100°C/W (maximum) at zero lead length (for UR)
ΘJEC
C6
C7
1026
V
= Col 11, table II; T = +25°C; L = .375 inch (9.53 mm) (non-surface
POV A
mount), L = 0 inch for surface mount.
See 4.6 and 4.7.3.
8
MIL-PRF-19500/463G
* 4.5 Thermal resistance. Thermal resistance measurement shall be in accordance with method 3101 of
MIL-STD-750. Forced moving air or draft shall not be permitted across the device during heat. The maximum limit
for R
under these test conditions shall be R
(max) = 250°C/W or R = 100°C/W. The following
ΘJL
ΘJL
ΘJEC
conditions shall apply:
a. I
1 mA to 10 mA.
M
H
H
b. I
200 mA to 400 mA.
30 seconds minimum.
c. t
d. t
MD
70 µs maximum.
LS = lead spacing = .375 inch (9.53 mm) (2 places) for non-surface mount and 0 inch for surface mount (see figure
4).
FIGURE 4. Mounting conditions.
4.5.1 For initial qualifications and re-qualifications. Read and record data in accordance with 4.7.4 herein and
shall be included in the qualification report.
4.6 Temperature coefficient of regulator current. The temperature coefficient of regulator current shall be tested
under the following conditions: (sampling plan: 22 devices, c = 0).
a. Test 1: V = 25 V dc, T = -55°C, T = +25°C, L = .375 inch (9.53 mm) (non-surface mount), L = 0 inch
L1 L2
S
(surface mount) (see 3.3 and 4.7.3) with the maximum limit in accordance with column 8 of table II.
b. Test 2: V = 25 V dc, T = +25°C, T = +150°C, L = .375 inch (9.53 mm) (non-surface mount), L = 0 inch
L1 L2
S
(surface mount) (see 3.3 and 4.7.3) with the maximum limit in accordance with column 9 of table II.
4.7 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows:
4.7.1 Knee ac impedance (Z ) at test voltage V . To test for Z , a 90 Hz signal V (mod) with rms value equal to
k
K
k
K
10 percent of test voltage, V , is superimposed on the test voltage (see figure 5).
K
4.7.2 Regulator impedance (Z ) at test voltage V . To test for Z , a 90 Hz signal V (mod) with rms value equal
s
S
s
S
to 10 percent of test voltage, V , is superimposed on the test voltage (see figure 6).
S
9
MIL-PRF-19500/463G
4.7.3 Temperature coefficient of regulator current ( I ). Temperature coefficient of regulator current shall be
s
calculated as follows:
I
(T ) - I (T
L2
)
P
P
L1
I
= _________________
x
100
s
I
(T = +25°C)∆T
L L
P
4.7.4 Group E inspection. Group E inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table IX of MIL-PRF-19500. Electrical measurements (end-points) and delta requirements shall
be in accordance with the applicable steps and footnotes of table I, subgroup 2 herein.
* 4.7.4.1 Group E inspection, table IX of MIL-PRF-19500.
Inspections
MIL-STD-750
Condition
Sample
plan
Method
1051
E1
E2
500 cycles
45 devices, c = 0
45 devices, c = 0
1037
2101
6,000 cycles (see 4.3.2)
= t = 30 seconds minimum
t
on off
E3
E4
Cross section; scribe and break.
Separate samples to be used for
each test.
Each supplier shall submit their
(typical) design thermal impedance
curves. In addition, test conditions
3 devices, c = 0
and Z
limit shall be provided to
ΘJX
the qualifying activity in the
qualification report.
As applicable.
E6
1020
3 devices, c = 0
10
MIL-PRF-19500/463G
* TABLE I. Group A inspection.
MIL-STD-750
Inspection 1/
Subgroup 1
Limit 2/
Unit
Symbol
Method
2071
Conditions
Min
Max
Visual and mechanical
examination
Subgroup 2
Regulator current
V
= 25 V dc, t = 90 s or thermal
I
Column 3
Column 4
Column 7
mA dc
S
P1
equilibrium, 1N5283-1 - 1N5314-1
t = pulse measurement, 10mS max
1N7048-1 - 1N7055-1
T
= +30°C ±3°C (see figure 5)
L
Limiting voltage
Reverse voltage
I
= .8 I (min), col. 3 of table II
V
V dc
L
p
L
(see figure 6)
I
= 200 mA
V
2.5
25
V dc
R
R
Thermal impedance
Subgroup 3
3101
See 4.3.3
Z
°C/W
ΘJX
Not applicable
Subgroup 4
Regulator impedance
V
= 25 V dc; (see figure 7 and
Z
S
Column 5
Column 6
MΩ
MΩ
S
4.7.2)
Knee impedance
V
= 6.0 V dc, (see figure 8 and
Z
K
K
4.7.1)
Subgroups 5 and 6
Not applicable
Subgroup 7
I
Column 10
mA dc
P2
Regulator current
V = Col 11, table II, T = 90s or
S
thermal equilibrium,
1N5283-1 - 1N5314-1
t = pulse measurement, 10 mS max
1N7048-1 - 1N7055-1
T
= +30°C ±3°C (see figure 5)
L
1/ For sampling plan, see MIL-PRF-19500.
2/ Column references are to table II herein.
11
TABLE II. Electrical characteristics. 1/
Col 1
Type
Col 2
Col 3
Col 4
Col 5
Col 6
Col 7
Col 8
α I
Col 9
α I
Col 10
Col 11
Z
Z
V
I
V
s
k
L
P2
POV
S
S
(Electrical
characteristics
for "UR" and
"-1" suffix
devices are
identical.)
I
regulator current (mA)
at
P1
minimum
regulator
impedance
minimum
knee
maximum
limiting
voltage at
regulator
current (mA)
at
maximum
regulator current
maximum
regulator current
Peak
Operating
Volts (DC)
V
= 25 V
S
impedance
T
T
C at
C at V = 25V
S
at V = 25
I
= 0.8 I
V = Col 11
S
at V = 6 V
L
P
S
K
V
= 25V
S
V
(min)
-55°C
(%/°C)
Max
+25°C +25°C
+150°C
(%/°C)
Nom
0.22
0.24
0.27
0.30
0.33
0.39
0.43
0.47
0.56
0.62
0.68
0.75
0.82
0.91
1.00
1.10
1.20
1.30
1.40
1.50
Min
Max
0.242
0.264
0.297
0.330
0.363
0.429
0.473
0.517
0.616
0.682
0.748
0.825
0.902
1.001
1.100
1.210
1.32
Volts
1.00
1.00
1.00
1.00
1.00
1.05
1.05
1.05
1.10
1.13
1.15
1.20
1.25
1.29
1.35
1.40
1.45
1.50
1.55
1.60
Min
Min
Max
0.60
0.56
0.48
0.42
0.37
0.28
0.23
0.18
0.10
0.05
0.02
- .03
- .07
- .10
- .10
- .10
- .10
- .10
- .10
- .10
Max
.27
.30
.33
.36
.40
.47
.52
.57
.68
.75
.82
.91
Volts
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
MΩ
25.0
19.0
14.0
9.0
MΩ
2.75
2.35
1.95
1.60
1.35
1.00
0.870
0.750
0.560
0.470
0.400
0.335
0.290
0.240
0.205
0.180
0.155
0.135
0.115
0.105
1N5283-1
1N5284-1
1N5285-1
1N5286-1
1N5287-1
1N5288-1
1N5289-1
1N5290-1
1N5291-1
1N5292-1
1N5293-1
1N5294-1
1N5295-1
1N5296-1
1N5297-1
1N5298-1
1N5299-1
1N5300-1
1N5301-1
1N5302-1
0.198
0.216
0.243
0.270
0.297
0.351
0.387
0.423
0.504
0.558
0.612
0.675
0.738
0.819
0.900
0.990
1.08
- .20
- .20
- .30
- .35
- .40
- .50
- .52
- .55
- .60
- .62
- .65
- .70
- .72
- .76
- .78
- .80
- .83
- .85
- .88
- .90
1.15
1.05
0.95
0.85
0.75
0.62
0.55
0.50
0.35
0.25
0.20
0.15
0.07
0.0
0.05
-.10
-.15
-.20
-.20
-.20
- .16
- .20
- .22
- .25
- .26
- .30
- .32
- .33
- .36
- .37
- .38
- .40
- .41
- .42
- .44
- .46
- .47
- .48
- .49
- .50
6.6
4.10
3.30
2.70
1.90
1.55
1.35
1.15
1.00
0.880
0.800
0.700
0.640
0.580
0.540
0.510
.99
1.10
1.21
1.33
1.45
1.57
1.69
1.81
1.17
1.26
1.35
1.43
1.54
1.65
TABLE II. Electrical characteristics - Continued. 1/
Col 1
Type
Col 2
Col 3
Col 4
Col 5
Col 6
Col 7
Col 8
α I
Col 9
α I
Col 10
Col 11
Z
Z
V
I
V
s
k
L
P2
POV
S
S
(Electrical
characteristics
for "UR" and
"-1" suffix
devices are
identical.)
I
regulator current (mA)
at
P1
minimum
regulator
impedance
minimum
knee
impedance
maximum
limiting
voltage at I
regulator
current (mA)
at
maximum
regulator
current
maximum
regulator current
T
Peak
Operating
Volts (DC)
V
= 25 V
=
S
L
C at V = 25V
S
at V = 25 V
at V = 6 V
V = Col 11
S
K
0.8 I (min)
P
T
S
C at V = 25V
S
-55°C
+25°C +25°C
+150°C
(%/°C)
(%/°C)
Nom
1.60
1.80
2.00
2.20
2.40
2.70
3.00
3.30
3.60
3.90
4.30
4.70
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10.0
Min
Max
1.76
1.98
2.20
2.42
2.64
2.97
3.30
3.63
3.96
4.29
4.73
5.17
5.61
6.16
6.82
7.48
8.25
9.02
10.01
11.10
Volts
1.65
1.75
1.85
1.95
2.00
2.15
2.25
2.35
2.50
2.60
2.75
2.90
3.67
4.03
4.46
4.90
5.40
5.90
6.55
7.20
Min
Max
-.20
-.20
-.20
-.20
-.20
-.20
-.20
-.20
-.20
-.20
-.20
-.20
-.20
-.20
-.20
-.20
-.20
-.20
-.20
-.20
Min
Max
- .10
- .10
- .10
- .10
- .10
- .10
- .10
- .10
- .10
- .10
- .10
- .10
- .10
- .10
- .10
- .10
- .10
- .10
- .10
- .10
Max
1.92
2.18
2.42
2.66
2.90
3.27
3.63
3.99
4.36
4.72
5.20
5.69
6.89
7.54
8.38
9.20
10.20
11.20
12.40
14.40
Volts
100
100
100
100
100
100
100
100
100
100
100
100
80
80
70
70
60
60
50
50
MΩ
MΩ
0.092
0.074
0.061
0.052
0.044
0.035
0.029
0.024
0.020
0.017
0.014
0.012
0.004
0.004
0.003
0.002
0.0015
0.0015
0.001
0.001
1N5303-1
1N5304-1
1N5305-1
1N5306-1
1N5307-1
1N5308-1
1N5309-1
1N5310-1
1N5311-1
1N5312-1
1N5313-1
1N5314-1
1N7048-1
1N7049-1
1N7050-1
1N7051-1
1N7052-1
1N7053-1
1N7054-1
1N7055-1
1.44
1.62
1.80
1.98
2.16
2.43
2.70
2.97
3.24
3.51
3.87
4.23
4.59
5.04
5.58
6.12
6.75
7.38
8.19
9.00
0.475
0.420
0.395
0.370
0.345
0.320
0.300
0.280
0.265
0.255
0.245
0.235
0.100
0.090
0.080
0.070
0.050
0.030
0.020
0.010
- .90
- .92
- .95
- .96
- .98
-1.0
-1.01
-1.02
-1.03
-1.04
-1.05
-1.06
-1.06
-1.06
-1.06
-1.06
-1.06
-1.06
-1.06
-1.06
- .50
- .51
- .52
- .52
- .53
- .53
- .53
- .54
- .54
- .55
- .55
- .55
- .55
- .55
- .55
- .55
- .55
- .55
- .55
- .55
1/ Electrical characteristics are for all package styles.
MIL-PRF-19500/463G
NOTES:
1. Adjust voltage source so that V = 25 V dc.
S
2. Measure current I .
P
3. The device is acceptable if the current falls within the limits specified.
4. The ammeter shall represent essentially a short-circuit to the terminals between which the current is
being measured. If not, the voltmeter reading shall be corrected for the drop across the ammeter.
FIGURE 5. Regulator current test circuit.
NOTES:
1. Adjust current source so that I
L = .8 I (min).
P
2. Measure voltage V .
L
3. The device is acceptable if the voltage is less than the limit specified.
4. The ammeter shall represent essentially a short-circuit to the terminals between which the current is
being measured. If not, the voltmeter reading shall be corrected for the drop across the ammeter.
FIGURE 6. Limiting voltage test circuit.
14
MIL-PRF-19500/463G
NOTES:
1. Adjust voltage source so that V = 25 Vdc.
S
2. Apply an ac signal of 2.5 V rms at 90 Hz through an isolating capacitor C.
3. Measure the ac rms voltage.
4. z = V mod x (R
1÷ V ac) where V mod equals ac signal for note 2 and V ac equals the voltage across R .
S 1
s
S
5. Device is acceptable if the regulator impedance meets the specified minimum limit.
FIGURE 7. Regulator impedance test circuit.
NOTES:
1. Adjust voltage source so that V = 6.0 Vdc.
K
2. Apply an ac signal of .6 Vrms at 90 Hz through an isolating capacitor C.
3. Measure the ac rms voltage.
4. z = V mod x (R
1÷ V ac) where V mod equals ac signal for note 2 and V ac equals the voltage across R .
K 1
K
K
5. Device is acceptable if the knee impedance meets the specified minimum limit.
FIGURE 8. Knee impedance test circuit.
15
MIL-PRF-19500/463G
5. PACKAGING
* 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order
(see 6.2). When actual packaging of materiel is to be performed by DoD or in-house contractor personnel, these
personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging
requirements are maintained by the Inventory Control Point's packaging activities within the Military Service or
Defense Agency, or within the Military Service’s system commands. Packaging data retrieval is available from the
managing Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting
the responsible packaging activity.
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)
6.1 Intended use. The notes specified in MIL-PRF-19500 are applicable to this specification.
* 6.2 Acquisition requirements. Acquisition documents should specify the following:
a. Title, number, and date of this specification.
b. Packaging requirements (see 5.1).
c. Lead finish (see 3.6).
d. Product assurance level and type designator.
6.3 Qualification. With respect to products requiring qualification, awards will be made only for products which are,
at the time of award of contract, qualified for inclusion in Qualified Manufacturers List (QML No. 19500) whether or
not such products have actually been so listed by that date. The attention of the contractors is called to these
requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal
Government tested for qualification in order that they may be eligible to be awarded contracts or orders for the
products covered by this specification. Information pertaining to qualification of products may be obtained from
Defense Supply Center, Columbus, ATTN: DSCC/VQE, P.O. Box 3990, Columbus, OH 43216-5000 or e-mail
vqe.chief@dla.mil.
6.4 Suppliers of die. The qualified die suppliers with the applicable letter version (example JANHCA1N5283) will
be identified on the QML.
JANC ordering information
PIN
Manufacturer
43611
1N5283-1 through 1N5314-1
JANHCA1N5283 through JANHCA1N5314
or
JANKCA1N5283 through JANKCA1N5314
JANHCA1N7048 through JANHCA1N7055
or
1N7048-1 through 1N7055-1
JANKCA1N7048 through JANKCA1N7055
6.5 Substitutability. Non-dash-one devices have been deleted from this specification. Dash-one devices are a
direct substitute for non dash-one devices and are preferred.
6.6 Changes from previous issue. The margins of this specification are marked with asterisks to indicate where
changes from the previous issue were made. This was done as a convenience only and the Government assumes
no liability whatsoever for any inaccuracies in these notations. Bidders and contractors are cautioned to evaluate the
requirements of this document based on the entire content irrespective of the marginal notations and relationship to
the last previous issue.
16
MIL-PRF-19500/463G
Custodians:
Army - CR
Navy - EC
Air Force - 11
NASA - NA
DLA - CC
Preparing activity:
DLA - CC
Review activities:
Army - AR, MI, SM
Navy - AS, MC
(Project 5961-2839)
Air Force - 19, 99
* NOTE: The activities listed above were interested in this document as of the date of this document. Since
organizations and responsibilities can change, you should verify the currency of the information above using the
ASSIST Online database at http://www.dodssp.daps.mil/.
17
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