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NRGB3R3M16V8X11.5F  VBO105  VBO160-16NO7  M95040-WMB3T/G  M95320-MB3T/P  C0603C508B3UAC  NRGB3R3M16V6.3X11F  VBO125  M95320-WMB3T/B  NRGB3R3M25V5X11F  
UPG2314T5N POWER AMPLIFIER FOR BluetoothTM Class 1
Prototype PCB
Part No.:   UPG2314T5N
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Description:   POWER AMPLIFIER FOR BluetoothTM Class 1
File Size :   288 K    
Page : 10 Pages
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Maker   CEL [ CALIFORNIA EASTERN LABS ]http://www.cel.com
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  UPG2314T5N Datasheet PDF page 2 UPG2314T5N Datasheet PDF page 3 UPG2314T5N Datasheet PDF page 4 UPG2314T5N Datasheet PDF page 5 UPG2314T5N Datasheet PDF page 6 UPG2314T5N Datasheet PDF page 7 UPG2314T5N Datasheet PDF page 8 UPG2314T5N Datasheet PDF page 10  
100%
µ
PG2314T5N
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Soldering Conditions
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Wave Soldering
Peak temperature (molten solder temperature)
Time at peak temperature
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
Partial Heating
Peak temperature (terminal temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 260°C or below
: 10 seconds or less
: 60 seconds or less
: 120±30 seconds
: 3 times
: 0.2%(Wt.) or below
: 260°C or below
: 10 seconds or less
: 1 time
: 0.2%(Wt.) or below
: 350°C or below
: 3 seconds or less
: 0.2%(Wt.) or below
HS350
WS260
Condition Symbol
IR260
For soldering
Preheating temperature (package surface temperature) : 120°C or below
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PG10624EJ01V0DS
9
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