CP147-MJ11014 [CENTRAL]
Power Bipolar Transistor,;
| 型号： | CP147-MJ11014 |
| 厂家： | 
CENTRAL SEMICONDUCTOR CORP |
| 描述： | Power Bipolar Transistor, 晶体管 |
| 文件： | 总4页 (文件大小：736K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CP147-MJ11014
NPN - Darlington Transistor Die
30 Amp, 90 Volt
www.centralsemi.com
The CP147-MJ11014 die is a silicon NPN Darlington power transistor designed for high
current applications.
MECHANICAL SPECIFICATIONS:
Die Size
195 x 195 MILS
11.4 MILS
Die Thickness
B
Base Bonding Pad Size
Emitter Bonding Pad Size
Top Side Metalization
Back Side Metalization
Scribe Alley Width
Wafer Diameter
28 x 28 MILS
70 x 44 MILS
Al – 60,000Å
Ti/Ni/Au – 1,100Å/4,000Å/500Å
3 MILS
E
5 INCHES
Gross Die Per Wafer
400
MAXIMUM RATINGS: (T =25°C)
Collector-Base Voltage
SYMBOL
UNITS
V
C
V
V
V
90
CBO
CEO
EBO
Collector-Emitter Voltage
90
5.0
V
Emitter-Base Voltage
V
Continuous Collector Current
Continuous Base Current
I
30
A
C
I
1.0
A
B
Operating and Storage Junction Temperature
T , T
-65 to +200
°C
J
stg
ELECTRICAL CHARACTERISTICS: (T =25°C unless otherwise noted)
C
SYMBOL
TEST CONDITIONS
MIN
MAX
UNITS
I
I
I
V
V
V
=90V, R =1.0kΩ
1.0
mA
CER
CEO
EBO
CE
CE
EB
BE
=50V
1.0
5.0
mA
mA
V
=5.0V
BV
I =100mA
90
CEO
CE(SAT)
CE(SAT)
BE(SAT)
BE(SAT)
FE
C
V
V
V
V
I =20A, I =200mA
3.0
4.0
3.5
5.0
V
C
B
I =30A, I =300mA
V
C
B
I =20A, I =200mA
V
C
B
I =30A, I =300mA
V
C
B
h
h
V
=5.0V, I =20A
1.0K
200
4.0
CE
CE
CE
C
V
V
=5.0V, I =30A
FE
C
f
=3.0V, I =10A, f=1.0MHz
MHz
T
C
R0 (4-February 2016)
CP147-MJ11014
Typical Electrical Characteristics
www.centralsemi.com
R0 (4-February 2016)
BARE DIE PACKING OPTIONS
BARE DIE IN TRAY (WAFFLE) PACK
CT: Singulated die in tray (waffle) pack.
(example: CP211-PART NUMBER-CT)
CM: Singulated die in tray (waffle) pack 100% visually inspected as
per MIL-STD-750, (method 2072 transistors, method 2073 diodes).
(example: CP211-PART NUMBER-CM)
UNSAWN WAFER
WN: Full wafer, unsawn, 100% tested with reject die inked.
(example: CP211-PART NUMBER-WN)
SAWN WAFER ON PLASTIC RING
WR: Full wafer, sawn and mounted on plastic ring,
100% tested with reject die inked.
(example: CP211-PART NUMBER-WR)
SAWN WAFER ON METAL FRAME
WS: Full wafer, sawn and mounted on metal frame,
100% tested with reject die inked.
(example: CP211-PART NUMBER-WS)
R0 (7-December 2015)
www.centralsemi.com
OUTSTANDING SUPPORT AND SUPERIOR SERVICES
PRODUCT SUPPORT
Central’s operations team provides the highest level of support to insure product is delivered on-time.
• Supply management (Customer portals)
• Inventory bonding
• Custom bar coding for shipments
• Custom product packing
• Consolidated shipping options
DESIGNER SUPPORT/SERVICES
Central’s applications engineering team is ready to discuss your design challenges. Just ask.
• Free quick ship samples (2nd day air)
• Online technical data and parametric search
• SPICE models
• Special wafer diffusions
• PbSn plating options
• Package details
• Custom electrical curves
• Application notes
• Environmental regulation compliance
• Customer specific screening
• Up-screening capabilities
• Application and design sample kits
• Custom product and package development
CONTACT US
Corporate Headquarters & Customer Support Team
Central Semiconductor Corp.
145 Adams Avenue
Hauppauge, NY 11788 USA
Main Tel: (631) 435-1110
Main Fax: (631) 435-1824
Support Team Fax: (631) 435-3388
www.centralsemi.com
Worldwide Field Representatives:
www.centralsemi.com/wwreps
Worldwide Distributors:
www.centralsemi.com/wwdistributors
For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER,
which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms
(000)
www.centralsemi.com
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