CP704-MPSA55-WS [CENTRAL]
Transistor;
| 型号： | CP704-MPSA55-WS |
| 厂家： | 
CENTRAL SEMICONDUCTOR CORP |
| 描述： | Transistor |
| 文件： | 总2页 (文件大小：133K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TM
PROCESS CP704
Small Signal Transistors
PNP - High Current Transistor Chip
Central
Semiconductor Corp.
PROCESS DETAILS
Process
EPITAXIAL PLANAR
Die Size
22 x 22 MILS
9.0 MILS
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
3.7 X 3.7 MILS
4.2 X 4.2 MILS
Al - 30,000Å
Au - 18,000Å
GEOMETRY
GROSS DIE PER 4 INCH WAFER
23,450
PRINCIPAL DEVICE TYPES
MPSA55
MPSA56
BACKSIDE COLLECTOR
145 Adams Avenue
Hauppauge, NY
USA
11788
Tel: (631) 435-1110
Fax: (631) 435-1824
R1 (15 -April 2005)
TM
PROCESS CP704
Typical Electrical Characteristics
Central
Semiconductor Corp.
145 Adams Avenue
Hauppauge, NY
USA
11788
Tel: (631) 435-1110
Fax: (631) 435-1824
R1 (15 -April 2005)
相关型号：
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