CP736V-2N5401-CT [CENTRAL]
Power Bipolar Transistor;
| 型号： | CP736V-2N5401-CT |
| 厂家： | 
CENTRAL SEMICONDUCTOR CORP |
| 描述： | Power Bipolar Transistor 放大器 晶体管 |
| 文件： | 总4页 (文件大小：922K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CP736V-2N5401
PNP - Silicon Transistor Die
600mA, 80 Volt
www.centralsemi.com
The CP736V-2N5401 die is a PNP silicon transistor designed for high voltage amplifier
applications.
MECHANICAL SPECIFICATIONS:
Die Size
17.3 x 17.3 MILS
7.1 MILS
Die Thickness
Base Bonding Pad Size
Emitter Bonding Pad Size
Top Side Metalization
Back Side Metalization
Scribe Alley Width
Wafer Diameter
3.9 x 3.9 MILS
3.9 x 3.9 MILS
Al-Si - 30,000Å
Au - 9,000Å
1.8 MILS
5 INCHES
Gross Die Per Wafer
57,735
MAXIMUM RATINGS: (T =25°C)
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Operating and Storage Junction Temperature
SYMBOL
UNITS
V
V
V
mA
°C
A
V
V
V
160
150
5.0
CBO
CEO
EBO
I
600
C
T , T
-65 to +150
J
stg
ELECTRICAL CHARACTERISTICS: (T =25°C unless otherwise noted)
A
SYMBOL
TEST CONDITIONS
MIN
MAX
UNITS
I
I
I
V
V
V
=120V
=120V, T =100°C
=3.0V
50
50
50
nA
CBO
CBO
EBO
CBO
CEO
CB
CB
EB
μA
nA
V
V
V
V
V
V
V
A
BV
BV
BV
V
V
V
V
h
h
h
I =100μA
160
150
5.0
C
I =1.0mA
C
I =10μA
EBO
E
I =10mA, I =1.0mA
0.2
0.5
1.0
1.0
CE(SAT)
CE(SAT)
BE(SAT)
BE(SAT)
FE
FE
FE
T
ob
fe
C
B
B
B
B
I =50mA, I =5.0mA
C
I =10mA, I =1.0mA
C
I =50mA, I =5.0mA
C
V
=5.0V, I =1.0mA
=5.0V, I =10mA
=5.0V, I =50mA
=10V, I =10mA, f=100MHz
=10V, I =0, f=1.0MHz
=10V, I =1.0mA, f=1.0kHz
50
60
50
CE
CE
CE
CE
CB
CE
C
C
C
V
V
V
V
V
240
f
C
h
100
300
6.0
200
MHz
pF
C
E
C
40
PACKING OPTIONS:
• CP736V-2N5401-CT: Singulated die in waffle pack; 400 die per tray.
• CP736V-2N5401-WN: Full wafer, unsawn, 100% tested with reject die inked.
• CP736V-2N5401-WR: Full wafer, sawn and mounted on plastic ring, 100% tested with reject die inked.
R0 (6-March 2015)
www.centralsemi.com
CP736V-2N5401
Typical Electrical Characteristics
www.centralsemi.com
R0 (6-March 2015)
BARE DIE PACKING OPTIONS
BARE DIE IN TRAY (WAFFLE) PACK
CT: Singulated die in tray (waffle) pack.
(example: CP211-PART NUMBER-CT)
CM: Singulated die in tray (waffle) pack 100% visually inspected as
per MIL-STD-750, (method 2072 transistors, method 2073 diodes).
(example: CP211-PART NUMBER-CM)
UNSAWN WAFER
WN: Full wafer, unsawn, 100% tested with reject die inked.
(example: CP211-PART NUMBER-WN)
SAWN WAFER ON PLASTIC RING
WR: Full wafer, sawn and mounted on plastic ring,
100% tested with reject die inked.
(example: CP211-PART NUMBER-WR)
SAWN WAFER ON METAL FRAME
WS: Full wafer, sawn and mounted on metal frame,
100% tested with reject die inked.
(example: CP211-PART NUMBER-WS)
R0 (7-December 2015)
www.centralsemi.com
OUTSTANDING SUPPORT AND SUPERIOR SERVICES
PRODUCT SUPPORT
Central’s operations team provides the highest level of support to insure product is delivered on-time.
• Supply management (Customer portals)
• Inventory bonding
• Custom bar coding for shipments
• Custom product packing
• Consolidated shipping options
DESIGNER SUPPORT/SERVICES
Central’s applications engineering team is ready to discuss your design challenges. Just ask.
• Free quick ship samples (2nd day air)
• Online technical data and parametric search
• SPICE models
• Special wafer diffusions
• PbSn plating options
• Package details
• Custom electrical curves
• Application notes
• Environmental regulation compliance
• Customer specific screening
• Up-screening capabilities
• Application and design sample kits
• Custom product and package development
CONTACT US
Corporate Headquarters & Customer Support Team
Central Semiconductor Corp.
145 Adams Avenue
Hauppauge, NY 11788 USA
Main Tel: (631) 435-1110
Main Fax: (631) 435-1824
Support Team Fax: (631) 435-3388
www.centralsemi.com
Worldwide Field Representatives:
www.centralsemi.com/wwreps
Worldwide Distributors:
www.centralsemi.com/wwdistributors
For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER,
which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms
www.centralsemi.com
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