CPD06-CMR3-06-CM [CENTRAL]

Rectifier Diode,;


型号：	CPD06-CMR3-06-CM
厂家：	CENTRAL SEMICONDUCTOR CORP
描述：	Rectifier Diode,
文件：	总4页 (文件大小：510K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

CPD06-CMR3-06

General Purpose Rectifier Die

3.0 Amp, 600 Volt

www.centralsemi.com

The CPD06-CMR3-06 is a silicon 3.0 Amp, 600 Volt general purpose rectiﬁer ideal for all types of

commercial, industrial, entertainment, and computer applications.

MECHANICAL SPECIFICATIONS:

Die Size

87 x 87 MILS

9.8 MILS

Die Thickness

Anode Bonding Pad Size

Top Side Metalization

Back Side Metalization

Scribe Alley Width

Wafer Diameter

64 x 64 MILS

Ni/Au – 5,000Å/1,350Å

2.75 MILS

4 INCHES

Gross Die Per Wafer

1,367

MAXIMUM RATINGS: (T =25°C)

Peak Repetitive Reverse Voltage

SYMBOL

UNITS

600

RRM

DC Blocking Voltage

RMS Reverse Voltage

420

R(RMS)

Average Forward Current (T =75°C)

3.0

Peak Forward Surge Current, tp=8.3ms

200

FSM

T , T

Operating and Storage Junction Temperature

-65 to +150

°C

stg

ELECTRICAL CHARACTERISTICS: (T =25°C unless otherwise)

SYMBOL

TEST CONDITIONS

V =600V

MIN

MAX

5.0

UNITS

µA

I =3.0A

1.2

V =0, f=1.0MHz

120

R1 (7-March 2019)

CPD06-CMR3-06

Typical Electrical Characteristics

www.centralsemi.com

R1 (7-March 2019)

BARE DIE PACKING OPTIONS

BARE DIE IN TRAY (WAFFLE) PACK

CT: Singulated die in tray (waffle) pack.

(example: CP211-PART NUMBER-CT)

CM: Singulated die in tray (waffle) pack 100% visually inspected as

per MIL-STD-750, (method 2072 transistors, method 2073 diodes).

(example: CP211-PART NUMBER-CM)

UNSAWN WAFER

WN: Full wafer, unsawn, 100% tested with reject die inked.

(example: CP211-PART NUMBER-WN)

SAWN WAFER ON PLASTIC RING

WR: Full wafer, sawn and mounted on plastic ring,

100% tested with reject die inked.

(example: CP211-PART NUMBER-WR)

Please note: Sawn Wafer on Metal Frame (WS)

is possible as a special order. Please contact your

Central Sales Representative at 631-435-1110.

Visit the Central website for a complete listing of specifications:

www.centralsemi.com/bdspecs

R2 (3-April 2017)

www.centralsemi.com

OUTSTANDING SUPPORT AND SUPERIOR SERVICES

PRODUCT SUPPORT

Central’s operations team provides the highest level of support to insure product is delivered on-time.

• Supply management (Customer portals)

• Inventory bonding

• Custom bar coding for shipments

• Custom product packing

• Consolidated shipping options

DESIGNER SUPPORT/SERVICES

Central’s applications engineering team is ready to discuss your design challenges. Just ask.

• Free quick ship samples (2^ndday air)

• Online technical data and parametric search

• SPICE models

• Special wafer diffusions

• PbSn plating options

• Package details

• Custom electrical curves

• Application notes

• Environmental regulation compliance

• Customer specific screening

• Up-screening capabilities

• Application and design sample kits

• Custom product and package development

REQUESTING PRODUCT PLATING

1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when

ordering (example: 2N2222A TIN/LEAD).

2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number

when ordering (example: 2N2222A PBFREE).

Corporate Headquarters & Customer Support Team

Central Semiconductor Corp.

145 Adams Avenue

Worldwide Field Representatives:

www.centralsemi.com/wwreps

Hauppauge, NY 11788 USA

Main Tel: (631) 435-1110

Main Fax: (631) 435-1824

Support Team Fax: (631) 435-3388

www.centralsemi.com

Worldwide Distributors:

www.centralsemi.com/wwdistributors

For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER,

which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms

(001)

www.centralsemi.com

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