CPD06-CMR3-06-WN [CENTRAL]
Rectifier Diode,;
| 型号： | CPD06-CMR3-06-WN |
| 厂家： | 
CENTRAL SEMICONDUCTOR CORP |
| 描述： | Rectifier Diode, |
| 文件： | 总4页 (文件大小：510K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CPD06-CMR3-06
General Purpose Rectifier Die
3.0 Amp, 600 Volt
www.centralsemi.com
The CPD06-CMR3-06 is a silicon 3.0 Amp, 600 Volt general purpose rectifier ideal for all types of
commercial, industrial, entertainment, and computer applications.
MECHANICAL SPECIFICATIONS:
Die Size
87 x 87 MILS
9.8 MILS
Die Thickness
Anode Bonding Pad Size
Top Side Metalization
Back Side Metalization
Scribe Alley Width
Wafer Diameter
64 x 64 MILS
Ni/Au – 5,000Å/1,350Å
Ni/Au – 5,000Å/1,350Å
2.75 MILS
4 INCHES
Gross Die Per Wafer
1,367
MAXIMUM RATINGS: (T =25°C)
Peak Repetitive Reverse Voltage
SYMBOL
UNITS
V
A
V
600
600
RRM
DC Blocking Voltage
V
V
V
R
RMS Reverse Voltage
V
420
R(RMS)
Average Forward Current (T =75°C)
A
I
3.0
A
O
Peak Forward Surge Current, tp=8.3ms
I
200
A
FSM
T , T
Operating and Storage Junction Temperature
-65 to +150
°C
J
stg
ELECTRICAL CHARACTERISTICS: (T =25°C unless otherwise)
A
SYMBOL
TEST CONDITIONS
V =600V
MIN
MAX
5.0
UNITS
µA
I
R
R
V
I =3.0A
1.2
V
F
F
C
V =0, f=1.0MHz
120
pF
J
R
R1 (7-March 2019)
CPD06-CMR3-06
Typical Electrical Characteristics
www.centralsemi.com
R1 (7-March 2019)
BARE DIE PACKING OPTIONS
BARE DIE IN TRAY (WAFFLE) PACK
CT: Singulated die in tray (waffle) pack.
(example: CP211-PART NUMBER-CT)
CM: Singulated die in tray (waffle) pack 100% visually inspected as
per MIL-STD-750, (method 2072 transistors, method 2073 diodes).
(example: CP211-PART NUMBER-CM)
UNSAWN WAFER
WN: Full wafer, unsawn, 100% tested with reject die inked.
(example: CP211-PART NUMBER-WN)
SAWN WAFER ON PLASTIC RING
WR: Full wafer, sawn and mounted on plastic ring,
100% tested with reject die inked.
(example: CP211-PART NUMBER-WR)
Please note: Sawn Wafer on Metal Frame (WS)
is possible as a special order. Please contact your
Central Sales Representative at 631-435-1110.
Visit the Central website for a complete listing of specifications:
www.centralsemi.com/bdspecs
R2 (3-April 2017)
www.centralsemi.com
OUTSTANDING SUPPORT AND SUPERIOR SERVICES
PRODUCT SUPPORT
Central’s operations team provides the highest level of support to insure product is delivered on-time.
• Supply management (Customer portals)
• Inventory bonding
• Custom bar coding for shipments
• Custom product packing
• Consolidated shipping options
DESIGNER SUPPORT/SERVICES
Central’s applications engineering team is ready to discuss your design challenges. Just ask.
• Free quick ship samples (2nd day air)
• Online technical data and parametric search
• SPICE models
• Special wafer diffusions
• PbSn plating options
• Package details
• Custom electrical curves
• Application notes
• Environmental regulation compliance
• Customer specific screening
• Up-screening capabilities
• Application and design sample kits
• Custom product and package development
REQUESTING PRODUCT PLATING
1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when
ordering (example: 2N2222A TIN/LEAD).
2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number
when ordering (example: 2N2222A PBFREE).
CONTACT US
Corporate Headquarters & Customer Support Team
Central Semiconductor Corp.
145 Adams Avenue
Worldwide Field Representatives:
www.centralsemi.com/wwreps
Hauppauge, NY 11788 USA
Main Tel: (631) 435-1110
Main Fax: (631) 435-1824
Support Team Fax: (631) 435-3388
www.centralsemi.com
Worldwide Distributors:
www.centralsemi.com/wwdistributors
For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER,
which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms
(001)
www.centralsemi.com
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CENTRAL
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