CPD24 [CENTRAL]
Fast Recovery Rectifier 1.0 Amp Glass Passivated Rectifier Chip; 快恢复整流1.0安培玻璃钝化整流芯片
| 型号： | CPD24 |
| 厂家： | 
CENTRAL SEMICONDUCTOR CORP |
| 描述： | Fast Recovery Rectifier 1.0 Amp Glass Passivated Rectifier Chip |
| 文件： | 总1页 (文件大小：62K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TM
PROCESS CPD24
Fast Recovery Rectifier
1.0 Amp Glass Passivated Rectifier Chip
Central
Semiconductor Corp.
PROCESS DETAILS
Process
GLASS PASSIVATED MESA
Die Size
Die Thickness
50 x 50 MILS
10.6 MILS
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
34 x 34 MILS
Au - 5,000Å
Au - 2,000Å
GEOMETRY
GROSS DIE PER 4 INCH WAFER
4,520
PRINCIPAL DEVICE TYPES
1N4933 thru 1N4937
1N4942 thru 1N4948
1N5615 thru 1N5623
CMR1F-02M Series
The Typical Electrical Characteristics data for
this chip is currently being revised.
For the latest updated data
for this Chip Process,
BACKSIDE CATHODE
please visit our website at:
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: (631) 435-1110
www.centralsemi.com/chip
Fax: (631) 435-1824
www.centralsemi.com
R1 (1-August 2002)
相关型号：
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