CPD80V-CMPD2003 [CENTRAL]
Rectifier Diode,;
| 型号： | CPD80V-CMPD2003 |
| 厂家： | 
CENTRAL SEMICONDUCTOR CORP |
| 描述： | Rectifier Diode, 二极管 |
| 文件： | 总5页 (文件大小：629K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CPD80V-CMPD2003
Switching Diode Die
0.2 Amp, 250 Volt
www.centralsemi.com
The CPD80V-CMPD2003 is a 0.2 Amp, 250 Volt silicon switching diode ideal for all types of
commercial, industrial, entertainment, and computer applications.
MECHANICAL SPECIFICATIONS:
Die Size
72.4 x 72.4 MILS
5.9 MILS
Die Thickness
Anode Bonding Pad Size
Top Side Metalization
Back Side Metalization
Scribe Alley Width
Wafer Diameter
64 x 64 MILS
Al – 30,000Å
Au – 9,000Å
2.36 MILS
ANODE
5 INCHES
3,137
Gross Die Per Wafer
BACKSIDE CATHODE
R0
MAXIMUM RATINGS: (T =25°C)
Continuous Reverse Voltage
SYMBOL
UNITS
V
A
V
200
250
R
Peak Repetitive Reverse Voltage
Average Forward Current
V
V
mA
mA
mA
A
RRM
I
200
O
Continuous Forward Current
I
250
F
Peak Repetitive Forward Current
Peak Forward Surge Current, tp=1.0μs
Peak Forward Surge Current, tp=1.0s
Operating and Storage Junction Temperature
I
625
FRM
I
4.0
FSM
FSM
I
1.0
A
T , T
-65 to +150
°C
J
stg
ELECTRICAL CHARACTERISTICS: (T =25°C unless otherwise noted)
A
SYMBOL
TEST CONDITIONS
V =200V
MIN
MAX
100
UNITS
nA
I
R
R
BV
I =100μA
250
V
V
R
R
V
V
I =100mA
1.0
1.25
5.0
50
F
F
F
I =200mA
V
F
C
V =0, f=1.0MHz
pF
ns
J
R
t
I =I =30mA, I =3.0mA, R =100Ω
rr
R
F
rr
L
R0 (15-September 2016)
CPD80V-CMPD2003
Typical Electrical Characteristics
www.centralsemi.com
R0 (15-September 2016)
CPD80V-CMPD2003
Typical Electrical Characteristics
www.centralsemi.com
R0 (15-September 2016)
BARE DIE PACKING OPTIONS
BARE DIE IN TRAY (WAFFLE) PACK
CT: Singulated die in tray (waffle) pack.
(example: CP211-PART NUMBER-CT)
CM: Singulated die in tray (waffle) pack 100% visually inspected as
per MIL-STD-750, (method 2072 transistors, method 2073 diodes).
(example: CP211-PART NUMBER-CM)
UNSAWN WAFER
WN: Full wafer, unsawn, 100% tested with reject die inked.
(example: CP211-PART NUMBER-WN)
SAWN WAFER ON PLASTIC RING
WR: Full wafer, sawn and mounted on plastic ring,
100% tested with reject die inked.
(example: CP211-PART NUMBER-WR)
SAWN WAFER ON METAL FRAME
WS: Full wafer, sawn and mounted on metal frame,
100% tested with reject die inked.
(example: CP211-PART NUMBER-WS)
R0 (7-December 2015)
www.centralsemi.com
OUTSTANDING SUPPORT AND SUPERIOR SERVICES
PRODUCT SUPPORT
Central’s operations team provides the highest level of support to insure product is delivered on-time.
• Supply management (Customer portals)
• Inventory bonding
• Custom bar coding for shipments
• Custom product packing
• Consolidated shipping options
DESIGNER SUPPORT/SERVICES
Central’s applications engineering team is ready to discuss your design challenges. Just ask.
• Free quick ship samples (2nd day air)
• Online technical data and parametric search
• SPICE models
• Special wafer diffusions
• PbSn plating options
• Package details
• Custom electrical curves
• Application notes
• Environmental regulation compliance
• Customer specific screening
• Up-screening capabilities
• Application and design sample kits
• Custom product and package development
CONTACT US
Corporate Headquarters & Customer Support Team
Central Semiconductor Corp.
145 Adams Avenue
Hauppauge, NY 11788 USA
Main Tel: (631) 435-1110
Main Fax: (631) 435-1824
Support Team Fax: (631) 435-3388
www.centralsemi.com
Worldwide Field Representatives:
www.centralsemi.com/wwreps
Worldwide Distributors:
www.centralsemi.com/wwdistributors
For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER,
which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms
(000)
www.centralsemi.com
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