IXD_604 [CLARE]
4-Ampere Dual Low-Side Ultrafast MOSFET Drivers; 4安培双低侧超快MOSFET驱动器
| 型号： | IXD_604 |
| 厂家： | 
CLARE |
| 描述： | 4-Ampere Dual Low-Side Ultrafast MOSFET Drivers |
| 文件： | 总13页 (文件大小：1595K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IXD_604
4-Ampere Dual Low-Side
Ultrafast MOSFET Drivers
Features
Description
• 4A Peak Source/Sink Drive Current
• Wide Operating Voltage Range: 4.5V to 35V
• -40°C to +125°C Extended Operating Temperature
Range
• Logic Input Withstands Negative Swing of up to 5V
• Matched Rise and Fall Times
The IXDD604/IXDF604/IXDI604/IXDN604 dual
high-speed gate drivers are especially well suited for
driving the latest IXYS MOSFETs and IGBTs. Each of
the two outputs can source and sink 4A of peak
current while producing voltage rise and fall times of
less than 10ns. The input of each driver is virtually
immune to latch up, and proprietary circuitry
• Low Propagation Delay Time
• Low, 10μA Supply Current
• Low Output Impedance
eliminates cross conduction and current
“shoot-through.” Low propagation delay and fast,
matched rise and fall times make the IXD_604 family
ideal for high-frequency and high-power applications.
Applications
• Efficient Power MOSFET and IGBT Switching
• Switch Mode Power Supplies
• Motor Controls
• DC to DC Converters
• Class-D Switching Amplifiers
• Pulse Transformer Driver
The IXDD604 is a dual non-inverting driver with an
enable. The IXDN604 is a dual non-inverting driver,
the IXDI604 is a dual inverting driver, and the IXDF604
has one inverting driver and one non-inverting driver.
The IXD_604 family is available in a standard 8-pin
DIP (PI), 8-pin SOIC (SIA), 8-pin Power SOIC with an
exposed metal back (SI), and an 8-pin DFN (D2)
package.
RoHS
2002/95/EC
Pb
e3
Ordering Information
Logic
Configuration
Packing
Method
Part Number
Package Type
Quantity
IXDD604D2TR
IXDD604PI
IXDD604SI
IXDD604SITR
IXDD604SIA
IXDD604SIATR
IXDF604PI
8-Pin DFN
Tape & Reel
Tube
Tube
Tape & Reel
Tube
2000
50
ENA
8-Pin DIP
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin SOIC
INA
ENB
INB
A
B
OUTA
OUTB
100
2000
100
2000
50
8-Pin SOIC
8-Pin DIP
Tape & Reel
Tube
INA
INB
OUTA
OUTB
IXDF604SI
A
B
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin SOIC
Tube
Tape & Reel
Tube
Tape & Reel
Tube
100
2000
100
2000
50
IXDF604SITR
IXDF604SIA
IXDF604SIATR
IXDI604PI
8-Pin SOIC
8-Pin DIP
INA
INB
A
B
OUTA
OUTB
IXDI604SI
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin SOIC
Tube
Tape & Reel
Tube
Tape & Reel
Tube
100
2000
100
2000
50
IXDI604SITR
IXDI604SIA
IXDI604SIATR
IXDN604PI
8-Pin SOIC
8-Pin DIP
INA
INB
OUTA
OUTB
A
B
IXDN604SI
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin SOIC
Tube
Tape & Reel
Tube
100
2000
100
2000
IXDN604SITR
IXDN604SIA
IXDN604SIATR
8-Pin SOIC
Tape & Reel
DS-IXD_604 - R02
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1
IXD_604
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.5 Electrical Characteristics: T = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
A
1.6 Electrical Characteristics: - 40°C ≤ T ≤ +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
A
1.7 Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. IXD_604 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.1 IXDD604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.2 IXDI604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.3 IXDF604. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.4 IXDN604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.4 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
R02
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2
IXD_604
1 Specifications
1.1 Pin Configurations
1.2 Pin Definitions
IXDD604PI/SI/SIA
IXDD604D2
Pin Name Description
ENA
INA
1
2
3
4
8
7
6
5
ENB
OUTA
VCC
ENA
INA
1
2
3
4
8
7
6
5
OUTA
GND
VCC
A
B
A
B
INA
INB
Channel A Logic Input
GND
INB
INB
Channel B Logic Input
OUTB
ENB
OUTB
Channel A Enable Input -
Drive pin low to disable Channel A and force
Channel A Output to a high impedance state
ENA
ENB
IXDI604PI/SI/SIA
IXDF604PI/SI/SIA
NC
INA
1
2
3
4
8
7
6
5
NC
NC
INA
1
2
3
4
8
7
6
5
NC
Channel B Enable Input -
Drive pin low to disable Channel A and force
Channel A Output to a high impedance state
A
B
OUTA
VCC
A
B
OUTA
VCC
GND
INB
GND
INB
OUTA
OUTA
Channel A Output - Sources or sinks current to
turn-on or turn-off a discrete MOSFET or IGBT
OUTB
OUTB
IXDN604PI/SI/SIA
OUTB
OUTB
Channel B Output - Sources or sinks current to
turn-on or turn-off a discrete MOSFET or IGBT
NC
INA
1
2
3
4
8
7
6
5
NC
V
A
B
OUTA
VCC
Supply Voltage - Provides power to the device
CC
GND
INB
Ground - Common ground reference for the
device
GND
OUTB
1.3 Absolute Maximum Ratings
Parameter
Symbol
Minimum
Maximum
Units
V
Supply Voltage
Input Voltage
-0.3
-5
40
V
V
CC
V
, V
INx ENx
VCC+0.3
I
Output Current
Junction Temperature
Storage Temperature
-
4
A
OUT
T
°C
-55
-65
+150
+150
J
T
°C
STG
Absolute maximum electrical ratings are at 25°C
Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device.
Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not
implied.
1.4 Recommended Operating Conditions
Parameter
Symbol
Minimum
Maximum
Units
V
Supply Voltage
4.5
-40
35
V
CC
T
Operating Temperature Range
+125
°C
A
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3
IXD_604
1.5 Electrical Characteristics: T = 25°C
A
Test Conditions: 4.5V < V < 35V, one channel (unless otherwise noted).
CC
Parameter
Conditions
Symbol
Minimum
Typical
Maximum
Units
4.5V < VCC < 18V
4.5V < VCC < 18V
Input Voltage, High
Input Voltage, Low
V
3.0
-
-
0.8
10
-
IH
V
V
-
-
-
IL
0V < VIN < V
Input Current
I
CC
-
μA
IN
High EN Input Voltage
Low EN Input Voltage
Output Voltage, High
Output Voltage, Low
Output Resistance, High State
Output Resistance, Low State
IXDD604 only
V
2/3V
-
-
ENH
CC
V
IXDD604 only
V
1/3V
-
ENL
CC
-
V
V
-0.025
-
-
0.025
2.5
2
OH
CC
V
-
V
-
-
-
-
OL
V
V
=18V, I =-10mA
OUT
R
CC
1.3
1.1
OH
Ω
=18V, I =10mA
OUT
R
CC
OL
Limited by package power
dissipation
Output Current, Continuous
I
-
-
1
A
DC
V
V
V
V
=18V, C
=18V, C
=18V, C
=18V, C
=1000pF
=1000pF
=1000pF
=1000pF
Rise Time
t
CC
CC
CC
CC
LOAD
LOAD
LOAD
LOAD
-
-
-
-
-
-
9
16
14
50
50
55
55
r
Fall Time
t
8
f
On-Time Propagation Delay
Off-Time Propagation Delay
Enable to Output-High Delay Time
Disable to High Impedance State Delay Time
Enable Pull-Up Resistor
t
29
35
35
40
ondly
ns
t
offdly
IXDD604 only, V =18V
CC
t
ENOH
IXDD604 only, V =18V
CC
t
DOLD
-
R
-
-
-
-
200
1
-
kΩ
mA
EN
V
=18V, V =3.5V
IN
3
CC
V
=18V, V =0V
IN
Power Supply Current
I
<1
<1
10
10
CC
CC
μA
V
=18V, V =V
CC
IN CC
1.6 Electrical Characteristics: - 40°C ≤ T ≤ +125°C
A
Test Conditions: 4.5V < V < 35V, one channel (unless otherwise noted).
CC
Parameter
Conditions
Symbol
Minimum
Maximum
Units
4.5V < VCC < 18V
4.5V < VCC < 18V
Input Voltage, High
Input Voltage, Low
V
3.1
-
-
0.65
10
IH
V
V
IL
0V < VIN < V
Input Current
I
CC
-10
μA
IN
Output Voltage, High
Output Voltage, Low
Output Resistance, High State
Output Resistance, Low State
-
V
V
-0.025
-
OH
CC
V
-
V
-
-
-
0.025
3
OL
V
V
=18V, I =-10mA
OUT
R
CC
OH
Ω
=18V, I =10mA
OUT
R
CC
2.5
OL
Limited by package power
dissipation
Output Current, Continuous
I
-
1
A
DC
V
V
V
V
=18V, C
=18V, C
=18V, C
=18V, C
=1000pF
=1000pF
=1000pF
=1000pF
Rise Time
t
CC
CC
CC
CC
LOAD
LOAD
LOAD
LOAD
-
-
-
-
-
16
14
65
65
65
r
Fall Time
t
f
On-Time Propagation Delay
Off-Time Propagation Delay
Enable to Output-High Delay Time
Disable to High Impedance State Delay Time
t
ondly
ns
t
offdly
IXDD604 only, V =18V
CC
t
ENOH
IXDD604 only, V =18V
CC
t
-
-
-
-
65
3.5
DOLD
V
=18V, V =3.5V
IN
mA
CC
V
=18V, V =0V
IN
Power Supply Current
I
150
150
CC
CC
μA
V
=18V, V =V
CC
IN CC
4
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R02
IXD_604
1.7 Thermal Characteristics
Package
Parameter
Symbol
Rating
Units
D2 (8-Pin DFN)
35
125
85
PI (8-Pin DIP)
θ
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
°C/W
°C/W
JA
SI (8-Pin Power SOIC)
SIA (8-Pin SOIC)
SI (8-Pin Power SOIC)
120
10
θ
JC
2 IXD_604 Performance
2.1 Timing Diagrams
VIH
VIH
VIL
INx
INx
VIL
t
t
ondly
offdly
t
t
ondly
offdly
90%
10%
90%
10%
OUTx
OUTx
t
t
t
t
f
r
r
f
2.2 Characteristics Test Diagram
ENA
ENB
+
INA
OUTA
VCC
0.1μF 10μF
-
VCC
Tektronix
Current Probe
GND
INB
CLOAD
6302
VIN
OUTB
Tektronix
Current Probe
6302
CLOAD
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5
IXD_604
3 Block Diagrams & Truth Tables
3.1 IXDD604
3.3 IXDF604
IXDD604
IXDF604
VCC
VCC
200kΩ
OUTA
INA
VCC
ENA
INA
GND
OUTA
VCC
VCC
200kΩ
OUTB
INB
VCC
ENB
INB
OUTB
GND
INA
OUTA
0
1
1
0
IN
EN
OUT
X
X
X
INB
0
OUTB
0
1
0
1
1 or open
0
1
Z
Z
0
1
1 or open
1
0
0
3.4 IXDN604
3.2 IXDI604
IXDI604
IXDN604
VCC
VCC
OUTA
INA
OUTA
INA
GND
GND
VCC
VCC
OUTB
OUTB
INB
INB
IN
OUT
IN
OUT
X
X
X
X
0
1
0
1
0
1
1
0
6
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R02
IXD_604
4 Typical Performance Characteristics
A&B Rise and Fall Times
vs.Temperature
(Input=0-5V, VCC=18V, CL=1nF)
A&B Rise Times vs. Supply Voltage
(Input=0-5V, f=10kHz,TA=25ºC)
A&B Fall Times vs. Supply Voltage
(Input=0-5V, f=10kHz,TA=25ºC)
120
100
80
60
40
20
0
120
100
80
60
40
20
0
10
9
t
r
8
CL=10nF
CL=1nF
CL=470pF
CL=10nF
CL=1nF
CL=470pF
t
f
7
6
5
4
0
5
10
15
20
25
30
35
40
0
5
10
15
20
25
30
35
40
-40 -20
0
20 40 60 80 100 120 140
Supply Voltage (V)
Supply Voltage (V)
Temperature (ºC)
A&B Fall Time vs. Load Capacitance
at Various VCC Levels
A&B Rise Time vs. Load Capacitance
at Various VCC Levels
120
100
80
60
40
20
0
120
100
80
60
40
20
0
VCC=4.5V
VCC=8V
VCC=4.5V
VCC=8V
VCC=12V
VCC=18V
VCC=24V
VCC=35V
VCC=12V
VCC=18V
VCC=24V
VCC=35V
0
2000
4000
6000
8000
10000
0
2000
4000
6000
8000
10000
Load Capacitance (pF)
Load Capacitance (pF)
Propagation Delay vs. Supply Voltage
Propagation Delay vs. Input Voltage
(VIN=0-5V, CL=1nF, f=1kHz)
(VCC=15V, CL=1nF)
Propagation Delay vs.Temperature
160
140
120
100
80
70
60
50
40
30
20
50
45
40
35
30
25
20
t
offdly
t
t
t
offdly
ondly
offdly
60
40
t
t
ondly
ondly
20
0
5
10
15
20
25
30
35
2
4
6
8
10
12
-40 -20
0
20 40 60 80 100 120 140
Supply Voltage (V)
Input Voltage (V)
Temperature (ºC)
Input Threshold Voltage
vs.Temperature
(VCC=18V, CL=1nF)
Input Threshold vs. Supply Voltage
Enable Threshold vs. Supply Voltage
2.9
2.7
2.5
2.3
2.1
1.9
1.7
3.2
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
22
20
18
16
14
12
10
8
6
4
2
0
VENH
VENL
Min VIH
Max VIL
VIH
VIL
-40 -20
0
20 40 60 80 100 120 140
0
5
10
15
20
25
30
35
0
5
10
15
20
25
30
35
Temperature (ºC)
Supply Voltage (V)
Supply Voltage (V)
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7
IXD_604
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=12V)
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=18V)
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=35V)
400
350
300
250
200
150
100
50
400
350
300
250
200
150
100
50
1000
100
10
f=2MHz
f=1MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
f=500kHz
f=100kHz
f=50kHz
f=2MHz
0
0
1
100
1000
10000
100
1000
10000
100
1000
10000
Load Capacitance (pF)
Load Capacitance (pF)
Load Capacitance (pF)
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=8V)
Supply Current vs. Frequency
Both Outputs Active
(VCC=35V)
Supply Current vs. Frequency
Both Outputs Active
(VCC=18V)
350
300
250
200
150
100
50
1000
100
10
1000
100
10
CL=10nF
CL=1nF
CL=470pF
f=2MHz
f=1MHz
CL=10nF
CL=1nF
CL=470pF
f=500kHz
f=100kHz
f=50kHz
1
0
1
0.1
100
1000
10000
1
10
100
1000
10000
1
10
100
1000
10000
Load Capacitance (pF)
Frequency (kHz)
Frequency (kHz)
Quiesent Supply Current
vs.Temperature
(VCC=18V)
Supply Current vs. Frequency
Both Outputs Active
(VCC=12V)
Supply Current vs. Frequency
Both Outputs Active
(VCC=8V)
1000
100
10
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1000
100
10
CL=10nF
CL=1nF
CL=470pF
CL=10nF
CL=1nF
CL=470pF
VIN=3.5V
VIN=5V
VIN=10V
1
1
0.1
0.01
0.1
0.01
VIN=0V & 18V
-40 -20
0
20 40 60 80 100 120 140
1
10
100
1000
1
10
100
1000
10000
Temperature (ºC)
Frequency (kHz)
Frequency (kHz)
Dynamic Supply Current
vs.Temperature
(VCC=18V, VIN=5V, f=1khz, CL=1nF)
Output Sink Current
vs. Supply Voltage
(CL=10nF)
Output Source Current
vs. Supply Voltage
(CL=10nF)
-10
-8
-6
-4
-2
0
10
8
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
6
4
2
0
-40 -20
0
20 40 60 80 100 120 140
0
5
10
15
20
25
30
35
0
5
10
15
20
25
30
35
Temperature (ºC)
Supply Voltage (V)
Supply Voltage (V)
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R02
IXD_604
Output Source Current
vs.Temperature
Output Sink Current
vs.Temperature
(VCC=18V, CL=10nF)
(VCC=18V, CL=10nF)
6
5
4
3
2
6.0
5.0
4.0
3.0
2.0
-40 -20
0
20 40 60 80 100 120 140
-40 -20
0
20 40 60 80 100 120 140
Temperature (ºC)
Temperature (ºC)
High State Output Resistance
vs. Supply Voltage
Low State Output Resistance
vs. Supply Voltage
(IOUT= -10mA)
(IOUT= +10mA)
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
5
10
15
20
25
30
35
0
5
10
15
20
25
30
35
Supply Voltage (V)
Supply Voltage (V)
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9
IXD_604
5 Manufacturing Information
5.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified
all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint
industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our
products to the maximum conditions set forth in the standard, and guarantee proper operation of our
devices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
IXD_604SI / IXD_604SIA / IXD_604PI
IXD_604D2
MSL 1
MSL 3
5.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
5.3 Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
IXD_604SI / IXD_604SIA / IXD_604D2
IXD_604PI
260°C for 30 seconds
250°C for 30 seconds
RoHS
2002/95/EC
Pb
e3
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5.4 Mechanical Dimensions
5.4.1 SIA (8-Pin SOIC)
0.10 / 0.25
(0.004 / 0.010)
1.27
(0.050)
0.40 / 1.27
(0.016 / 0.050)
3.80 / 4.00
(0.150 / 0.157)
5.40
(0.213)
5.80 / 6.20
(0.228 / 0.244)
1.55
(0.061)
PIN 1
0.25 / 0.50 x45º
(0.010 / 0.020 x45º)
0.60
0.31 / 0.51
(0.012 / 0.020)
1.27 BSC
(0.05 BSC)
(0.024)
0º / 8º
Recommended PCB Land Pattern
4.80 / 5.00
(0.190 / 0.197)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
0.10 / 0.25
(0.004 / 0.010)
1.30 / 1.75
(0.051 / 0.069)
NOTE: Molded package conforms to JEDEC standard configuration
MS-012 variation AA.
5.4.2 SI (8-Pin Power SOIC with Exposed Metal Back)
3.80
(0.150)
0.10 / 0.25
(0.004 / 0.010)
1.55
(0.061)
0.40 / 1.27
(0.016 / 0.050)
3.80 / 4.00
(0.150 / 0.157)
5.40
(0.209) (0.108)
2.75
5.80 / 6.20
(0.228 / 0.244)
PIN 1
0.25 / 0.50 x45º
(0.010 / 0.020 x45º)
0.60
(0.024)
1.27
(0.050)
0.31 / 0.51
(0.012 / 0.020)
1.27 BSC
(0.05 BSC)
0º / 8º
4.80 / 5.00
(0.190 / 0.197)
Recommended PCB Land Pattern
0.03 / 0.10
(0.001 / 0.004)
1.30 / 1.75
(0.051 / 0.069)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
NOTES:
2.29 / 2.79
1. Molded package conforms to JEDEC standard configuration
MS-012 variation BA.
(0.090 / 0.110)
2. The exposed metal pad on the back of the SI package may be
left floating or connected to GND. It is not suitable for carrying
current.
3.30 / 3.81
(0.130 / 0.150)
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11
IXD_604
5.4.3 Tape & Reel Information for SI and SIA Packages
∅1.55 0.05
330.2 DIA.
(13.00 DIA.)
4.00 0.10 See Note #2
1.75 0.10
2.00 0.10
0.30 0.05
B
R0.50 TYP
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
5.50 0.10
(3.40)
B0=5.20 0.10
12.00 0.30
A
A
Embossed Carrier
1.80 0.10
∅1.50 (MIN)
B
8.00 0.10
K0=2.30 0.10
SECTION B-B
A0=6.40 0.10
Embossment
(4.70)
(1.20)
(70º)
NOTES:
1. A0 & B0 measured at 0.3mm above base of pocket.
2. 10 pitches cumulative tol. 0.2mm
3. ( ) Reference dimensions only.
SECTION A-A
4. Unless otherwise specified, all dimensions in millimeters.
5.4.4 PI (8-Pin DIP)
8-0.900 DIA.
(8-0.035 DIA.)
2.540
(0.100)
9.02 / 10.16
(0.355 / 0.400)
0.20 / 0.38
(0.008 / 0.015)
7.50
(0.295)
1.40
(0.055)
6.10 / 6.86
(0.240 / 0.270)
7.62 BSC
(0.300 BSC)
2.540 BSC
(0.100 BSC)
7.37 / 8.26
(0.290 / 0.325)
7.62 / 10.92
(0.300 / 0.430)
PC Board Pattern
3.05 / 3.81
(0.120 / 0.150)
3.43 / 4.70
(0.135 / 0.185)
0.38 / 1.02
(0.015 / 0.040)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
1.14 / 1.65
3.18 / 3.81
(0.125 / 0.150)
(0.045 / 0.065)
0.38 / 0.58
(0.015 / 0.023)
NOTE: Molded package conforms to JEDEC standard configuration
MS-001 variation BA.
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IXD_604
5.4.5 D2 (8-Pin DFN)
5.00 BSC
(0.197 BSC)
0.35 x 45º
(0.014 x 45º)
0.80 / 1.00
(0.031 / 0.039)
0.20 REF
(0.008 REF)
0.95
(0.037)
4.50
(0.177)
Pin 1
4.00 BSC
(0.158 BSC)
3.05
(0.120)
0.45
(0.018)
0.00 / 0.05
(0.000 / 0.002)
2.55
(0.100)
1.20
(0.047)
0.76 / 0.81
(0.030 / 0.032)
Recommended PCB Land Pattern
3.04 / 3.09
(0.120 / 0.122)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
0.30 / 0.45
(0.012 / 0.018)
0.95 BSC
(0.037 BSC)
Pin 1
Pin 8
2.54 / 2.59
(0.100 / 0.102)
NOTE:
0.35 / 0.45 x 45º
(0.014 / 0.018 x 45º)
The exposed metal pad on the back of the D2 package may be
left floating or connected to ground. It is not suitable for carrying current.
5.4.6 Tape & Reel Information for D2 Package
∅1.55 0.05
330.2 DIA.
(13.00 DIA.)
4.00 0.10 See Note #2
1.75 0.10
R0.75 TYP
2.00 0.05
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
(0.05)
5º MAX
5.50 0.05
(0.05)
B0=5.40 0.10
12.00 0.30
Embossed Carrier
K0=1.90 0.10
∅1.50 (MIN)
8.00 0.10
NOTES:
5º MAX
1. A0 & B0 measured at 0.3mm above base of pocket.
2. 10 pitches cumulative tol. 0.2mm
3. ( ) Reference dimensions only.
A0=4.25 0.10
Embossment
4. Unless otherwise specified, all dimensions in millimeters.
0.30 0.05
For additional information please visit our website at: www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and
product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale,
Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for
a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental
damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-IXD_604-R02
©Copyright 2010, Clare, Inc.
All rights reserved. Printed in USA.
12/3/2010
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