CEFB202 [COMCHIP]

SMD Efficient Fast Recovery Rectifier; SMD高效快速恢复整流器
CEFB202
型号: CEFB202
厂家: COMCHIP TECHNOLOGY    COMCHIP TECHNOLOGY
描述:

SMD Efficient Fast Recovery Rectifier
SMD高效快速恢复整流器

文件: 总2页 (文件大小:71K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SSMMDD EEffffiicciieenntt FFaasstt RReeccoovveerryy RReeccttiiffiieerr  
CCOOMMCCHHIIPP  
www.comchip.com.tw  
CEFB201 Thru CEFB205  
Reverse Voltage: 50 - 600 Volts  
Forward Current: 2.0 Amp  
Features  
Ideal for surface mount applications  
Easy pick and place  
SMB/DO-214AA  
Plastic package has Underwriters Lab.  
flammability classification 94V-0  
0.083(2.11)  
0.075(1.91)  
0.155(3.94)  
0.130(3.30)  
Super fast recovery time for high efficient  
Built-in strain relief  
Low forward voltage drop  
0.185(4.70)  
0.160(4.06)  
0.012(0.31)  
0.006(0.15)  
Mechanical Data  
0.096(2.44)  
0.083(2.13)  
Case: JEDEC DO-214AA molded plastic  
0.008(0.20)  
0.203(0.10)  
0.050(1.27)  
0.030(0.76)  
Terminals: solderable per MIL-STD-750,  
method 2026  
0.220(5.59)  
0.200(5.08)  
Polarity: Color band denotes cathode  
end  
Dimensions in inches and (millimeter)  
Mounting position: Any  
Approx. Weight:0.093 gram  
Maximum Ratings and Electrical Characterics  
CEFB  
201  
CEFB  
202  
CEFB  
203  
CEFB  
204  
CEFB  
205  
Unit  
Symbol  
VRRM  
VDC  
Parameter  
600  
600  
420  
50  
50  
35  
200  
200  
140  
400  
400  
280  
100  
100  
70  
Max. Repetitive PeakReverse Voltage  
Max. DC BlockingVoltage  
Max. RMS Voltage  
V
V
V
VRMS  
Peak Surge ForwardCurrent  
8.3ms single halfsine-wave  
superimposed on rateload  
( JEDEC method)  
IFSM  
A
35  
40  
I o  
2.0  
Max. Average Forward Current  
A
Max. Instantaneous ForwardCurrent  
at 2.0 A  
0.875  
1.1  
1.25  
V F  
V
Trr  
Reverse recovery time  
25  
35  
50  
nS  
Max. DC ReverseCurrent at RatedDC  
I R  
5.0  
Blocking Voltage  
Ta=25 C  
Ta=100C  
uA  
250  
15  
R
JL  
Max. Thermal Resistance(Note 1)  
Operating Junction Temperature  
Storage Temperature  
C/W  
- 5 5 t o + 1 5 0  
T j  
C
- 5 5 t o + 1 5 0  
TSTG  
C
Note 1: Thermal resistance from junction to lead P.C.B. Mounted on 8.0x8.0 mm copper pad areas.  
Page 1  
MDS0210023A  
SSMMDD EEffffiicciieenntt FFaasstt RReeccoovveerryy RReeccttiiffiieerr  
CCOOMMCCHHIIPP  
www.comchip.com.tw  
Rating and Characteristic Curves (CEFB201 Thru CEFB205)  
Fig. 1 - Reverse Characteristics  
Fig.2 - Forward Characteristics  
100  
10  
CEFB201-203  
10  
1.0  
Tj=125 C  
CEFB204  
CEFB205  
1.0  
Tj=75 C  
0.1  
0.01  
0.1  
Tj=25 C  
Tj=25 C  
Pulse width 300uS  
4% duty cycle  
0. 01  
0
0.001  
20  
40  
60  
80 100 120 140  
0
0.2  
0.4  
0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0  
Forward Voltage (V)  
Percent of RatedPeak Reverse Voltage (%)  
Fig. 3 - Junction Capacitance  
Fig. 4 - Non Repetitive Forward  
Surge Current  
200  
50  
8.3mS Single HalfSine  
Wave JEDEC methode  
100  
40  
30  
Tj=25 C  
Tj=25 C  
20  
10  
10  
0
2
0.1  
1.0  
10  
100  
1
5
10  
50  
1 00  
Reverse Voltage (V)  
Number of Cyclesat 60Hz  
Fig. 5 - Test Circuit Dai gram and Reverse Recovery Time Characteristics  
Fig. 6 - Current Derating Curve  
2.8  
trr  
50  
W
10W  
NONINDUCTIVE  
2.4  
2.0  
1.6  
1.2  
NONINDUCTIVE  
|
|
|
|
|
|
|
|
+0.5A  
(
)
(+)  
0
D.U.T.  
25Vdc  
PULSE  
GENERATOR  
(NOTE 2)  
(approx.)  
-0.25A  
(
)
(+)  
Single Phase  
0.8  
1W  
OSCILLISCOPE  
(NOTE 1)  
NON-  
Half Wave 60Hz  
INDUCTIVE  
0.4  
NOTES: 1. Rise Time= 7ns max., Input Impedance= 1 megohm.22pF.  
2. Rise Time= 10ns max., Source Impedance= 50 ohms.  
-1.0A  
0
0
25  
50  
75  
100 125 150 175  
1cm  
Ambient Temperature ( C)  
SET TIME BASE FOR  
50 / 10ns / cm  
Page 2  
MDS0210023A  

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