FP1007R1-R22-R [COOPER]
High Current, High Frequency, Power Inductors; 大电流，高频率，功率电感器
| 型号： | FP1007R1-R22-R |
| 厂家： | 
COOPER BUSSMANN, INC. |
| 描述： | High Current, High Frequency, Power Inductors |
| 文件： | 总4页 (文件大小：492K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
High Current, High Frequency, Power Inductors
FLAT-PAC™ FP1007 Series
• Frequency range up to 2MHz
• RoHS compliant
HALOGEN
Applications:
HF
• Multi-phase regulators
FREE
• Voltage Regulator Module (VRM)
• Desktop and server VRMs and EVRDs
• Notebook regulators
• Data networking and storage systems
• Graphics cards and battery power systems
• Point-of-load modules
• DCR sensing
SMD Device
Environmental Data:
• Storage temperature range: -40°C to +125°C
• Operating temperature range: -40°C to +125°C
(With derated current)
Description:
• Halogen free
• 125°C maximum total temperature operation
• 8.0 x 10.4 x 6.5, 7.0 or 7.5mm surface mount package
• Solder reflow temperature: J-STD-020D compliant
• Ferrite core material
Packaging:
• High current carrying capacity, low core losses
• Controlled DCR tolerance for sensing circuits
• Inductance range from 120nH to 300nH
• Current range from 32 to 94 Amps
• Supplied in tape and reel packaging on 13” diameter reel
• FP1007R1 700 parts per reel
• FP1007R2 750 parts per reel
• FP1007R3 650 parts per reel
Product Specifications
Part Number7
R1 Version
OCL1 1ꢀ0 ꢁ(nH FLL2 Mi(. ꢁ(nH
I
3 ꢁAmpsH I 14 @ 25°C ꢁAmpsH I 25 @ 125°C ꢁAmpsH DCR ꢁmΩH @ 2ꢀ°C K-factor6
rms sat sat
FP1007R1-R12-R
FP1007R1-R14-R
FP1007R1-R17-R
FP1007R1-R22-R
FP1007R1-R30-R
R2 Version
FP1007R2-R12-R
FP1007R2-R14-R
FP1007R2-R17-R
FP1007R2-R22-R
FP1007R2-R30-R
R3 Version
120
140
170
215
300
86
100
122
155
216
81
72
58
50
32
65
56
46
36
26
371
371
371
371
371
60
51
0.29 10ꢀ
120
140
170
215
300
86
100
122
155
216
81
72
58
50
32
65
56
46
36
26
368
368
368
368
368
0.48 8ꢀ
FP1007R3-R12-R
FP1007R3-R15-R
FP1007R3-R17-R
FP1007R3-R22-R
FP1007R3-R23-R
FP1007R3-R27-R
FP1007R3-R30-R
120
150
170
215
230
270
300
86
108
122
155
165
194
216
94
76
66
50
48
40
35
86
70
60
43
40
34
30
354
354
354
354
354
354
354
61
0.29 8ꢀ
1
2
3
Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10V , 0.0Adc
4
5
I
I
1: Peak current for approximately 20ꢀ rolloff at +25°C.
2: Peak current for approximately 20ꢀ rolloff at +125°C.
rms
sat
Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1V , I
rms sat
1
sat
I
: DC current for an approximate temperature rise of 40°C without core loss. Derating is
-3
K-factor: Used to determine B for core loss (see graph). B = K L ΔI 10 , B : (Gauss),
* *
p-p p-p
K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps).
rms
6
*
p-p
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of
other heat generating components will affect the temperature rise. It is recommended the part
temperature not exceed 125°C under worst case operating conditions verified in the end
application.
7
Part Number Definition: FP1007Rx-Rxx-R
• FP1007 = Product code and size
• Rxx= Inductance value in μH, R = decimal point • “-R” suffix = RoHS compliant
• Rx is the DCR indicator
0209 BU-SB09133
Page 1 of 4
Data Sheet: 4341
Dimensions - mm
Side View
Top View
7.8 +0.2/-0.3
Bottom View
1
Recom m ended Pad Layout
Schem atic
2.24 0.15
a
2.5
3.0
1
1
2
The nominal DCR is
measured from point
“a” to point”b.”
2.54 0.20
10.2 0.2
4.7
1007Rx
Rxx
wwllyy R
2
2
b
FP1007R1-R = 6.80 0.2
FP1007R2-R = 6.30 0.2
FP1007R3-R = 7.30 0.2
Part Marking: Coiltronics Logo
1007Rx (Rx = DCR Indicator)
Rxx = Inductance value in μH. (R = Decimal point)
wwllyy = Date code
R = Revision level
Packaging Information - mm
1.5 dia.
4.0
2.0
1.75
11.5
1
24 0.ꢀ
1007Rx
Rxx
wwllyy R
10.5
2
Section A-A
1.5 dia.
12.0
FP1007R1 = 7.1
FP1007R2 = 6.6
FP1007Rꢀ = 7.6
User direction of feed
Section B-B
8.1
Supplied in tape-and-reel packaging, on 13” diameter reel; FP1007R1 700 parts, FP1007R2 750 parts, FP1007R3 650 parts
Temperature Rise vs.Total Loss
60
50
FP1007Rꢀ-R
FP1007R1-R
40
ꢀ0
20
10
0
FP1007R2-R
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
Total Loss (W )
0209 BU-SB09133
Page 2 of 4
Data Sheet: 4341
Core Loss
Core Loss vs. Bp-p
1M Hz
500kHz
300kHz
200kHz
100kHz
10
1
0.1
0.01
0.001
0.0001
0.00001
100
1000
10000
B
(G auss)
p-p
Inductance Characteristics
% of OCL vs. Isat
1
100
90
80
70
60
50
40
ꢀ0
20
10
0
-40°C
+25°C
+125°C
0
10 20
ꢀ0
40 50
60
70 80
90 100 110 120 1ꢀ0 140 150
% of Isat
1
0209 BU-SB09133
Page 3 of 4
Data Sheet: 4341
Solder Reflow Profile
TP
TTaabbllee 1 - SSttaannddaardd SnPPbb SSoolldeerr ((TT ))
cc
TC -5°C
tP
Max. Ramp Up Rate = ꢀ°C/s
Max. Ramp Down Rate = 6°C/s
Volume
Volume
Package
Thick(ess
<2.5mm
mm3
mm3
_
<35ꢀ
235°C
220°C
>35ꢀ
TL
220°C
220°C
Preheat
t
_
>2.5mm
Tsmax
TTaabbllee 22 - LLeeaadd ((PPbb)) FFrreeee SSoolldeerr ((TT ))
cc
Volume
Volume
Volume
mm3
>2ꢀꢀꢀ
260°C
245°C
245°C
Tsmin
mm3
mm3
ts
Package
Thick(ess
<1.6mm
<35ꢀ
260°C
1.6 – 2.5mm 260°C
>2.5mm 250°C
35ꢀ - 2ꢀꢀꢀ
260°C
250°C
245°C
25°C
Time 25°C to Peak
Time
Reference JDEC J-STD-020D
Profile Feature
Sta(dard S(Pb Solder Lead ꢁPbH Free Solder
100°C
Preheat and Soak
• Temperature min. (T
)
150°C
smin
• Temperature max. (T
)
150°C
200°C
smax
) (t )
• Time (T
smin
to T
60-120 Seconds
3°C/ Second Max.
60-120 Seconds
3°C/ Second Max.
smax s
Average ramp up rate T
to T
smax
p
Liquidous temperature (T
Time at liquidous (t )
L
)
183°C
60-150 Seconds
217°C
60-150 Seconds
L
Peak package body temperature (T )*
Table 1
Table 2
P
Time (t )** within 5 °C of the specified classification temperature (T )
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
p
Average ramp-down rate (T to T
c
)
p
Time 25°C to Peak Temperature
smax
* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.
p
** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.
p
North America
Europe
Asia Pacific
Cooper Electronic Technologies
1225 Broken Sound Parkway NW
Suite F
Cooper Bussmann
Cooper Electronic Technologies
Cooper (UK) Limited
Cooper Electronic Technologies
1 Jalan Kilang Timor
#06-01 Pacific Tech Centre
Singapore 159303
Cooper Electronic Technologies
Avda. Santa Eulalia, 290
08223
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-636-527-1607
Burton-on-the-Wolds
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
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Tel: +44 (0) 1509 882 737
Fax: +44 (0) 1509 882 786
Terrassa, (Barcelona), Spain
Tel: +34 937 362 812
+34 937 362 813
Tel: +65 278 6151
Fax: +65 270 4160
Fax: 1-561-241-6640
Toll Free: 1-888-414-2645
Fax: +34 937 362 719
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncon-
trolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann
reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to
change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the
Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the label-
ing, can be reasonably expected to result in significant injury to the user.
© 2009 Cooper Bussmann
St. Louis, MO 63178
www.cooperbussmann.com
0209 BU-SB09133
Page 4 of 4
Data Sheet: 4341
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