HCP0805-2R2-R [COOPER]
High Current, High Frequency, Power Inductors; 大电流，高频率，功率电感器
| 型号： | HCP0805-2R2-R |
| 厂家： | 
COOPER BUSSMANN, INC. |
| 描述： | High Current, High Frequency, Power Inductors |
| 文件： | 总4页 (文件大小：410K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
High Current, High Frequency, Power Inductors
HCP0805 Series
Applications:
• Voltage Regulator Module (VRM)
• Multi-phase regulators
• Desktop and servers
• Base station equipment
• Notebook regulators
• Data networking and storage systems
• Point-of-load modules
• Battery power systems
• DCR sensing
SMD Device
Environmental Data:
• Storage temperature range: -40°C to +125°C
• Operating temperature range: -40°C to +125°C
(Range is application specific)
Description:
• Halogen free
• Solder reflow temperature: J-STD-020D compliant
• 125°C maximum total temperature operation
• 7.6 x 7.9 x 5.0mm surface mount package
• Powder iron core material
Packaging:
• Supplied in tape-and-reel packaging, 700 parts per reel,
13” diameter reel
• Magnetically shielded, low EMI
• High current carrying capacity, Low core losses
• Controlled DCR tolerance for sensing circuits
• Inductance range from 0.40μH to 2.2μH
• Current range from 10.0 to 32 amps
• Frequency range up to 2MHz
• RoHS compliant
Product Specifications
Part Number6
OCL1 ꢀ20 ꢁμH)
FLLꢀ Min. ꢁμH)
I
3 ꢁAmps)
I
4 @ ꢀ5°C ꢁAmps)
DCR ꢁmΩ) @ ꢀ2°C
K-factor5
rms
sat
HCP0805-R40-R
HCP0805-R68-R
HCP0805-1R0-R
HCP0805-1R5-R
HCP0805-2R2-R
0.40
0.68
1.00
1.50
2.20
0.26
0.44
0.64
0.96
1.41
20
32
25
22
18
14
3.1 6.0%
4.5 6.0%
5.8 6.0%
6.8 6.0%
11.2 6.0%
376.0
292.0
239.0
202.0
175.0
17.5
14.5
13.3
10
1
2
3
Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10V , 0.0Adc
rms
4
5
I
: Peak current for approximately 20% rolloff at +25°C.
sat
K-factor: Used to determine B for core loss (see graph). B = K
Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1V , I
1
L
ΔI. B : (Gauss), K:
*
*
rms sat
p-p
p-p
p-p
I
: DC current for an approximate temperature rise of 40°C without core loss. Derating is
(K-factor from table), L: (inductance in μH), ΔI (peak-to-peak ripple current in amps).
Part Number Definition: HCP0805-xxx-R
• HCP0805 = Product code and size
• xxx= Inductance value in μH, R = decimal point. If no “R” is present, then
third character = # of zeros.
• “-R” suffix = RoHS compliant
rms
6
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of
other heat generating components will affect the temperature rise. It is recommended the part
temperature not exceed 125°C under worst case operating conditions verified in the end
application.
1108 BU-SB08798
Page 1 of 4
Data Sheet: 4349
Dimensions - mm
Part No.
Pin width
E (mm)
HCP0805-R40-R 1.3 0.2
HCP0805-R68-R 1.1 0.2
HCP0805-1R0-R 1.1 0.2
HCP0805-1R5-R 1.1 0.2
HCP0805-2R2-R 0.8 0.2
Recommended Pad Layout
Top View
Bottom View
Side View
Schematic
1.8
(2x)
7.40
0.20
E
5.0
max
(2x)
b
1
1
1
2
4.3 typ.
3.50
HCP0805
XXX
7.70
0.20
8.1
wwllyy
R
2
a
The nominal DCR is measured from point “a” to point”b.”
2
1.70
0.30
Part Marking: HCP0805
xxx = Inductance value in μH. (R = Decimal point). If no “R” is present, then last character is # 0f zeros
wwllyy = Date code
R = Revision level
Packaging Information - mm
1.5 Dia.
4.0
2.0
1.5 Dia
min.
+0.1/-0.0
1.75
A
Section A-A
1
7.5
16.0
0.3
HCP0805
XXX
8.1
wwllyy
R
2
A
User direction of feed
5.2
7.8
16.0
Supplied in tape-and-reel packaging, 700 parts per reel, 13” diameter reel.
Temperature Rise vs.Total Loss
60
50
40
30
20
10
0
0
0.2
0.4
0.6
0.8
1
1.2
Tota l Los s (W)
1108 BU-SB08798
Page 2 of 4
Data Sheet: 4349
Core Loss
Core Loss vs. B
p-p
100
10
1 MHz
5 0 0 kHz
3 0 0 kHz
2 0 0 kHz
1
1 0 0 kHz
0.1
0.01
0.001
100
1000
10000
B
p-p
(Guass)
Inductance Characteristics
% of OCL vs. % of I
sat
110%
100%
90%
80%
70%
60%
50%
40%
30%
20%
10%
0%
0%
20%
40%
60%
80%
100%
120%
140%
160%
180%
200%
% of I
sat
1108 BU-SB08798
Page 3 of 4
Data Sheet: 4349
Solder Reflow Profile
TP
TTaabbllee 1 - SSttaannddaardd SnPPbb SSoolldeerr ((TT ))
cc
TC -5°C
tP
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Volume
Volume
Package
Thickness
<2.5mm
mm3
mm3
_
<352
235°C
220°C
>352
TL
220°C
220°C
Preheat
t
_
>2.5mm
Tsmax
TTaabbllee 22 - LLeeaadd ((PPbb)) FFrreeee SSoolldeerr ((TT ))
cc
Volume
Volume
Volume
mm3
>ꢀ222
260°C
245°C
245°C
Tsmin
mm3
mm3
ts
Package
Thickness
<1.6mm
<352
260°C
1.6 – 2.5mm 260°C
>2.5mm 250°C
352 - ꢀ222
260°C
250°C
245°C
25°C
Time 25°C to Peak
Time
Reference JDEC J-STD-020D
Profile Feature
Standard SnPb Solder Lead ꢁPb) Free Solder
100°C
Preheat and Soak
• Temperature min. (T
)
150°C
smin
• Temperature max. (T
)
150°C
200°C
smax
) (t )
• Time (T
smin
to T
60-120 Seconds
3°C/ Second Max.
60-120 Seconds
3°C/ Second Max.
smax s
Average ramp up rate T
to T
smax
p
Liquidous temperature (T
Time at liquidous (t )
L
)
183°C
60-150 Seconds
217°C
60-150 Seconds
L
Peak package body temperature (T )*
Table 1
Table 2
P
Time (t )** within 5 °C of the specified classification temperature (T )
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
p
Average ramp-down rate (T to T
c
)
p
Time 25°C to Peak Temperature
smax
* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.
p
** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.
p
North America
Europe
Asia Pacific
Cooper Electronic Technologies
1225 Broken Sound Parkway NW
Suite F
Cooper Bussmann
Cooper Electronic Technologies
Cooper (UK) Limited
Cooper Electronic Technologies
1 Jalan Kilang Timor
#06-01 Pacific Tech Centre
Singapore 159303
Cooper Electronic Technologies
Avda. Santa Eulalia, 290
08223
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-636-527-1607
Burton-on-the-Wolds
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
Leicestershire • LE12 5TH UK
Tel: +44 (0) 1509 882 737
Fax: +44 (0) 1509 882 786
Terrassa, (Barcelona), Spain
Tel: +34 937 362 812
+34 937 362 813
Tel: +65 278 6151
Fax: +65 270 4160
Fax: 1-561-241-6640
Toll Free: 1-888-414-2645
Fax: +34 937 362 719
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncon-
trolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann
reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to
change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the
Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the label-
ing, can be reasonably expected to result in significant injury to the user.
© 2008 Cooper Bussmann
St. Louis, MO 63178
www.cooperbussmann.com
1108 BU-SB08798
Page 4 of 4
Data Sheet: 4349
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