SDH2812-4R7-R [COOPER]

General Purpose Inductor, 4.2uH, 20%, 1 Element, Ferrite-Core, SMD, 2830-12M, CHIP, 2830-12M, HALOGEN FREE AND ROHS COMPLIANT;
SDH2812-4R7-R
型号: SDH2812-4R7-R
厂家: COOPER BUSSMANN, INC.    COOPER BUSSMANN, INC.
描述:

General Purpose Inductor, 4.2uH, 20%, 1 Element, Ferrite-Core, SMD, 2830-12M, CHIP, 2830-12M, HALOGEN FREE AND ROHS COMPLIANT

测试 功率感应器 电感器
文件: 总4页 (文件大小:466K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HALOGEN  
Low Profile, High Power, Shielded Drum Inductors  
HF  
Pb  
FREE  
SDH2812 Series  
Applications  
Buck or boost inductor  
Cellular phones/ PDAs  
LED Photo flash  
LCD Displays  
Handheld/Mobile devices  
GPS Systems  
Digital cameras  
• MP3 Players  
SMD Device  
Environmental Data  
• Storage temperature range: -40°C to +125°C  
Description  
• Halogen Free  
• Operating temperature range: -40°C to +125°C  
(ambient plus self-temperature rise)  
• 125°C maximum total temperature operation  
• 3.2 x 3.0 x 1.2mm maximum shielded drum core  
• Ferrite core material  
• Solder reflow temperature: J-STD-020D compliant  
Packaging  
• High power density, ultra-compact footprint  
• Inductance range from 1.02μH to 97.7μH  
• Current range from 0.217 to 1.95 Amps  
• Magnetically shielded, low EMI  
• RoHS compliant  
• Supplied in tape and reel packaging, 4,500 parts per reel  
13” diameter reel  
Product Specifications  
2
Part  
Number5  
OCL1  
Part Marking  
I
I
3 @ 25°C  
DCR (Ω) @ 20°C  
DCR (Ω) @ 20°C  
rms  
(Amps)  
1.45  
sat  
(Amps)  
1.95  
(μH)  
Designator  
(Typical)  
0.062  
0.082  
0.095  
0.138  
0.200  
0.270  
0.380  
0.389  
0.620  
0.870  
1.37  
(Maximum)  
0.083  
0.102  
0.114  
0.154  
0.224  
0.336  
0.417  
0.467  
0.721  
0.922  
1.43  
K-factor4  
1212  
1070  
866  
673  
587  
466  
404  
387  
308  
264  
209  
173  
148  
135  
122  
SDH2812-1R0-R  
SDH2812-1R5-R  
SDH2812-2R2-R  
SDH2812-3R3-R  
SDH2812-4R7-R  
SDH2812-6R8-R  
SDH2812-8R2-R  
SDH2812-100-R  
SDH2812-150-R  
SDH2812-220-R  
SDH2812-330-R  
SDH2812-470-R  
SDH2812-680-R  
SDH2812-820-R  
SDH2812-101-R  
1.02 30ꢀ  
1.50 30ꢀ  
2.20 20ꢀ  
3.20 20ꢀ  
4.20 20ꢀ  
6.60 20ꢀ  
8.17 20ꢀ  
9.67 20ꢀ  
14.7 20ꢀ  
21.6 20ꢀ  
33.2 20ꢀ  
46.7 20ꢀ  
68.0 20ꢀ  
82.2 20ꢀ  
97.7 20ꢀ  
O
A
B
C
D
E
F
G
H
I
J
K
L
M
N
1.33  
1.71  
1.26  
1.53  
1.08  
1.16  
0.900  
0.730  
0.660  
0.620  
0.500  
0.440  
0.350  
0.300  
0.270  
0.230  
0.217  
1.000  
0.830  
0.780  
0.710  
0.570  
0.460  
0.380  
0.320  
0.270  
0.240  
0.218  
1.72  
2.46  
3.15  
3.61  
1.99  
2.70  
3.47  
3.97  
1
2
Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10V , 0.0Adc  
4
5
K-factor: Used to determine B for core loss (see graph). B = K  
K: (K-factor from table), L: (inductance in μH), ΔI (peak-to-peak ripple current in amps).  
Part Number Definition: SDH2812-xxx-R  
L
ΔI. B (Gauss),  
*
*
rms  
p-p  
p-p  
p-p  
I
: DC current for an approximate temperature rise of 40°C without core loss. Derating is  
rms  
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of  
other heat generating components will affect the temperature rise. It is recommended the part  
temperature not exceed 125°C under worst case operating conditions verified in the end  
application.  
• SDH2812 = Product code and size  
• xxx= Inductance value in μH, R = decimal point,  
If no R is present then 3rd digit equals number of zeros.  
• “-R” suffix = RoHS compliant  
3
I
: Peak current for approximately 30% rolloff at +25°C.  
sat  
1209 BU-SB091134  
Page 1 of 4  
Data Sheet: 4354  
Dimensions - mm  
Schem atic  
Bottom View  
1.54  
Top View  
Side View  
Recom m ended Pad Layout  
1.6±  
1.2 M ax.  
Typ.  
1.54  
±±.2  
1
2
2.±  
(2Plcs)  
2.8  
±±.2  
1.54  
±±.2  
1.±  
(2plcs)  
±.73  
±±.2  
3.±  
±±.2  
Two-digit (2) Part Marking:  
1st Digit indicates inductance value per “Part Marking Designator” column in Product Specifications table  
2nd Digit indicates bi-weekly production date code  
Packaging Information - mm  
1.5 dia.  
2.0  
4.0  
A
5.5  
1
12.0 0.ꢀ0  
10.2  
X
X
2
ꢀ.ꢀ0  
1.ꢀ0  
A-A View  
A
B
B
8.0  
Direction of feed  
1.2 dia.  
ꢀ.10  
B-B View  
Supplied in tape-and-reel packaging, 4,500 parts per reel, 13” diameter reel.  
Temperature Rise vs. Total Loss  
50  
40  
ꢀ0  
20  
10  
0
0.00  
0.05  
0.10  
0.15  
0.20  
0.25  
0.ꢀ0  
0.ꢀ5  
0.40  
Total Loss (W)  
1209 BU-SB091134  
Page 2 of 4  
Data Sheet: 4354  
Core Loss  
Core Loss Vs. B  
p-p  
10  
1
1M Hz  
500k Hz  
ꢀ00k Hz  
200k Hz  
100k Hz  
0.1  
0.01  
0.001  
0.0001  
0.00001  
100  
1000  
10000  
B
(Guass)  
p-p  
Inductance Characteristics  
% of OCL vs. % of Isat  
100%  
80%  
60%  
40%  
20%  
0%  
-40°C  
+25°C  
+85°C  
0%  
20%  
40%  
60%  
80%  
100%  
120%  
140%  
160%  
% of Isat  
1209 BU-SB091134  
Page 3 of 4  
Data Sheet: 4354  
Solder Reflow Profile  
TP  
TTaabbllee 1 - SSttaannddaardd SnPPbb SSoolldeerr ((TT ))  
cc  
TC -5°C  
tP  
Max. Ramp Up Rate = ꢀ°C/s  
Max. Ramp Down Rate = 6°C/s  
Volume  
Volume  
Package  
Thickness  
<2.5mm  
mm3  
mm3  
_
<350  
235°C  
220°C  
>350  
TL  
220°C  
220°C  
Preheat  
t
_
>2.5mm  
Tsmax  
TTaabbllee 22 - LLeeaadd ((PPbb)) FFrreee SSoolldeerr ((TT ))  
cc  
Volume  
Volume  
Volume  
mm3  
>2000  
260°C  
245°C  
245°C  
Tsmin  
mm3  
mm3  
ts  
Package  
Thickness  
<1.6mm  
<350  
260°C  
1.6 – 2.5mm 260°C  
>2.5mm 250°C  
350 - 2000  
260°C  
250°C  
245°C  
25°C  
Time 25°C to Peak  
Time  
Reference JDEC J-STD-020D  
Profile Feature  
Standard SnPb Solder Lead (Pb) Free Solder  
100°C  
Preheat and Soak  
• Temperature min. (T  
)
150°C  
smin  
• Temperature max. (T  
)
150°C  
200°C  
smax  
) (t )  
• Time (T  
smin  
to T  
60-120 Seconds  
C/ Second Max.  
60-120 Seconds  
C/ Second Max.  
smax  
s
Average ramp up rate T  
to T  
smax  
p
Liquidous temperature (T  
Time at liquidous (t )  
L
)
183°C  
60-150 Seconds  
217°C  
60-150 Seconds  
L
Peak package body temperature (T )*  
Table 1  
Table 2  
P
Time (t )** within 5 °C of the specified classification temperature (T )  
20 Seconds**  
C/ Second Max.  
6 Minutes Max.  
30 Seconds**  
C/ Second Max.  
8 Minutes Max.  
p
Average ramp-down rate (T to T  
c
)
p
Time 25°C to Peak Temperature  
smax  
* Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum.  
p
** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.  
p
North America  
Europe  
Asia Pacific  
Cooper Electronic Technologies  
1225 Broken Sound Parkway NW  
Suite F  
Cooper Bussmann  
Cooper Electronic Technologies  
Cooper (UK) Limited  
Cooper Electronic Technologies  
1 Jalan Kilang Timor  
#06-01 Pacific Tech Centre  
Singapore 159303  
Cooper Electronic Technologies  
Avda. Santa Eulalia, 290  
08223  
P.O. Box 14460  
St. Louis, MO 63178-4460  
Tel: 1-636-394-2877  
Fax: 1-636-527-1607  
Burton-on-the-Wolds  
Boca Raton, FL 33487-3533  
Tel: 1-561-998-4100  
Fax: 1-561-241-6640  
Toll Free: 1-888-414-2645  
Leicestershire • LE12 5TH UK  
Tel: +44 (0) 1509 882 737  
Fax: +44 (0) 1509 882 786  
Terrassa, (Barcelona), Spain  
Tel: +34 937 362 812  
+34 937 362 813  
Tel: +65 278 6151  
Fax: +65 270 4160  
Fax: +34 937 362 719  
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This  
bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, with-  
out notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any  
technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.  
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company.  
Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably  
expected to result in significant injury to the user.  
© 2009 Cooper Bussmann  
St. Louis, MO 63178  
www.cooperbussmann.com  
1209 BU-SB091134  
Page 4 of 4  
Data Sheet: 4354  

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