C470XT290-S1800-D [CREE]
Visible LED;型号: | C470XT290-S1800-D |
厂家: | CREE, INC |
描述: | Visible LED |
文件: | 总6页 (文件大小:260K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
®
XThin LEDs
CxxxXT290-Sxx00-x
Cree’s XThin LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN materials
with Cree’s proprietary G•SiC® substrate to deliver superior price/performance for high-intensity LEDs. These LED
chips have a geometrically enhanced Epi-down design to maximize light extraction efficiency and require only a
single wire bond connection. These vertically structured LED chips are approximately 115 microns in height and
require a low forward voltage. Cree’s XT™ chips are tested for conformity to optical and electrical specifications
and the ability to withstand 1000V ESD. Applications for XThin include next-generation mobile appliances for use
in their LCD backlights and digital camera flash where brightness, sub-miniaturization, and low power consumption
are required.
FEATURES
APPLICATIONS
•
XThin LED Performance
•
•
•
•
SMT Packages
Cellular Phone LCD Backlighting
Digital Camera Flash
–
Blue
XT-12™ – 12.0 mW min.
XT-16™ – 16.0 mW min.
XT-18™ – 18.0 mW min.
XT-21™ – 21.0 mW min.
XT-24™ – 24.0 mW min.
Mobile Appliance Key Pads
–
–
White LEDs
Blue LEDs
•
LED Video Displays
–
Green – 7.0 mW min.
•
•
•
•
Low Forward Voltage – 3.2 V Typical at 20 mA
Class 2 ESD Rating
Sn Contact for Low-Temp. Die Attach Methods
Die Attach Options
–
–
Flux Eutectic; Flux & Temperature (-C)
Eutectic; Temperature & Pressure (-D)
CxxxXT290-Sxx00-x Chip Diagram
Top View
Bottom View
Die Cross Section
G•SiC LED Chip
300 x 300 μm
Backside
Contact
Metal
Gold Bond Pad
105 μm Diameter
Cathode (-)
Bottom View for -C
Bottom View for -D
SiC Substrate
t = 115 µm
Anode (+)
Subject to change without notice.
www.cree.com
ꢀ
Maximum Ratings at TA = 25°CNotes 2&4
DC Forward Current
CxxxXT290-Sxx00-x
30mA
Peak Forward Current (1/10 duty cycle @ 1kHz)
LED Junction Temperature
100mA
125°C
Reverse Voltage
5 V
Operating Temperature Range
Storage Temperature Range
-40°C to +100°C
-40°C to +100°C
1000V
Note 3
Electrostatic Discharge Threshold (HBM)
Note 3
Electrostatic Discharge Classification (MIL-STD-883E)
Class 2
Note 4
Typical Electrical/Optical Characteristics at T = 25°C, If = 20mA
Reverse Current
[I(Vr=5V), μA]
Full Width Half Max
Part Number
Forward Voltage (Vf, V)
(λD, nm)
Min.
Typ.
3.2
Max.
Max.
Typ.
21
C460XT290-Sxx00-x
C470XT290-Sxx00-x
C527XT290-S0100-A
2.7
2.7
2.7
3.7
3.7
3.7
2
2
2
3.2
22
3.2
35
Mechanical Specifications
Description
CxxxXT290-Sxx00-x
Dimension
Tolerance
± 25
P-N Junction Area (μm)
Top Area (μm)
250 x 250
200 x 200
300 x 300
115
± 25
Bottom Area (μm)
± 25
Chip Thickness (μm)
± 15
Au Bond Pad Diameter (μm)
Au Bond Pad Thickness (μm)
Back Contact Metal Area (μm)
105
-5, +15
± 0.5
± 25
1.2
210 x 210
2.0
Back Contact Metal Thickness (μm) -C (Sn Flux Eutectic)
Back Contact Metal Thickness (μm) -D (Sn Eutectic)
± 0.3
± 0.1
0.5
Notes:
1. This product is intended for use in a pre-molded surface mount package. It should be tested in the package and environment
consistent with the final use to validate applicability. CxxxXT290-Sxx00-C and –D are not intended for use where extended reliable
operation in high temperature and high humidity environments is required. For this condition or for use in a leaded radial lamp,
use CxxxXT290-Sxx00-A. See Cree XThin Applications Note for more information.
2. Maximum ratings are package dependent. The above ratings were determined using a T-1 3/4 package (with Hysol OS4000
epoxy) for characterization. Ratings for other packages may differ. The forward currents (DC and Peak) are not limited by the die
but by the effect of the LED junction temperature on the package. The junction temperature limit of 125°C is a limit of the T-1
3/4 package; junction temperature should be characterized in a specific package to determine limitations. Assembly processing
temperature must not exceed 325°C (< 5 seconds). See Cree XThin Applications Note for more assembly process information.
3. Product resistance to electrostatic discharge (ESD) according to the HBM is measured by simulating ESD using a rapid avalanche
energy test (RAET). The RAET procedures are designed to approximate the maximum ESD ratings shown. The RAET procedure is
performed on each die. The ESD classification of Class 2 is based on sample testing according to MIL-STD-883E.
4. All products conform to the listed minimum and maximum specifications for electrical and optical characteristics when assembled
and operated at 20 mA within the maximum ratings shown above. Efficiency decreases at higher currents. Typical values given
are within the range of average values expected by manufacturer in large quantities and are provided for information only. All
measurements were made using lamps in T-1 3/4 packages (with Hysol OS4000 epoxy). Optical characteristics measured in an
integrating sphere using Illuminance E.
5. Caution: To avoid leakage currents and achieve maximum output efficiency, die attach material must not contact the side of the
chip. See Cree XThin Applications Note for more information.
6. Specifications are subject to change without notice.
7. XThin chips are shipped with the junction side down, not requiring a die transfer prior to die attach.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
Copyright © 2004-2006 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree,
the Cree logo, G•SiC and XThin are registered trademarks, and XT, XT-12, XT-16, XT-18, XT-21, XT-21 and XT-24 are trademarks
of Cree, Inc.
USA Tel: +1.919.313.5300
www.cree.com
2
CPR3CE Rev. E
Standard Bins for XT290
LED chips are sorted to the radiant flux and dominant wavelength bins shown. A sorted die sheet contains die
from only one bin. Sorted die kit (CxxxXT290-Sxx00-x) orders may be filled with any or all bins (CxxxXB290-01xx-x)
contained in the kit. All radiant flux and all dominant wavelength values shown and specified are at If = 20 mA.
XT-24
XT-2ꢀ
C460XT290-S2400-x
C460XT290-0117-x
C460XT290-0118-x
C460XT290-0119-x
C460XT290-0120-x
24.0 mW
455 nm
457.5 nm
460 nm
462.5 nm
465 nm
Dominant Wavelength
C460XT290-S2ꢀ00-x
C460XT290-0117-x
C460XT290-0113-x
C460XT290-0118-x
C460XT290-0119-x
C460XT290-0115-x
C460XT290-0120-x
C460XT290-0116-x
24.0 mW
21.0 mW
C460XT290-0114-x
455 nm
457.5 nm
460 nm
462.5 nm
465 nm
Dominant Wavelength
XT-ꢀ8
C460XT290-Sꢀ800-x
C460XT290-0117-x
C460XT290-0113-x
C460XT290-0109-x
C460XT290-0118-x
C460XT290-0119-x
C460XT290-0115-x
C460XT290-0111-x
C460XT290-0120-x
C460XT290-0116-x
C460XT290-0112-x
24.0 mW
21.0 mW
18.0 mW
C460XT290-0114-x
C460XT290-0110-x
455 nm
457.5 nm
460 nm
462.5 nm
465 nm
Dominant Wavelength
XT-ꢀ6
C460XT290-Sꢀ600-x
C460XT290-0117-x
C460XT290-0113-x
C460XT290-0109-x
C460XT290-0105-x
C460XT290-0118-x
C460XT290-0119-x
C460XT290-0115-x
C460XT290-0111-x
C460XT290-0107-x
C460XT290-0120-x
C460XT290-0116-x
C460XT290-0112-x
C460XT290-0108-x
24.0 mW
21.0 mW
18.0 mW
16.0 mW
C460XT290-0114-x
C460XT290-0110-x
C460XT290-0106-x
455 nm
457.5 nm
460 nm
Dominant Wavelength
462.5 nm
465 nm
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
Copyright © 2004-2006 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree,
the Cree logo, G•SiC and XThin are registered trademarks, and XT, XT-12, XT-16, XT-18, XT-21, XT-21 and XT-24 are trademarks
of Cree, Inc.
USA Tel: +1.919.313.5300
www.cree.com
3
CPR3CE Rev. E
Standard Bins for XT290 (continued)
XT-ꢀ2
C460XT290-Sꢀ200-x
C460XT290-0117-x
C460XT290-0113-x
C460XT290-0109-x
C460XT290-0105-x
C460XT290-0101-x
C460XT290-0118-x
C460XT290-0114-x
C460XT290-0110-x
C460XT290-0106-x
C460XT290-0102-x
C460XT290-0119-x
C460XT290-0115-x
C460XT290-0111-x
C460XT290-0107-x
C460XT290-0103-x
C460XT290-0120-x
C460XT290-0116-x
C460XT290-0112-x
C460XT290-0108-x
C460XT290-0104-x
24.0 mW
21.0 mW
18.0 mW
16.0 mW
12.0 mW
455 nm
457.5 nm
460 nm
462.5 nm
465 nm
Dominant Wavelength
XT-2ꢀ
C470XT290-S2ꢀ00-x
C470XT290-0113-x
C470XT290-0114-x
C470XT290-0115-x
C470XT290-0116-x
21.0 mW
465 nm
467.5 nm
470 nm
472.5 nm
475 nm
Dominant Wavelength
XT-ꢀ8
C470XT290-Sꢀ800-x
C470XT290-0113-x
C470XT290-0109-x
C470XT290-0114-x
C470XT290-0115-x
C470XT290-0111-x
C470XT290-0116-x
C470XT290-0112-x
21.0 mW
18.0 mW
C470XT290-0110-x
465 nm
467.5 nm
470 nm
472.5 nm
475 nm
Dominant Wavelength
XT-ꢀ6
C470XT290-Sꢀ600-x
C470XT290-0113-x
C470XT290-0109-x
C470XT290-0114-x
C470XT290-0115-x
C470XT290-0111-x
C470XT290-0116-x
C470XT290-0112-x
21.0 mW
18.0 mW
16.0 mW
C470XT290-0110-x
465 nm
467.5 nm
470 nm
Dominant Wavelength
472.5 nm
475 nm
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
Copyright © 2004-2006 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree,
the Cree logo, G•SiC and XThin are registered trademarks, and XT, XT-12, XT-16, XT-18, XT-21, XT-21 and XT-24 are trademarks
of Cree, Inc.
USA Tel: +1.919.313.5300
www.cree.com
4
CPR3CE Rev. E
Standard Bins for XT290 (continued)
XT-ꢀ2
C470XT290-Sꢀ200-x
C470XT290-0113-x
C470XT290-0109-x
C470XT290-0105-x
C470XT290-0101-x
C470XT290-0114-x
C470XT290-0115-x
C470XT290-0111-x
C470XT290-0107-x
C470XT290-0103-x
C470XT290-0116-x
C470XT290-0112-x
C470XT290-0108-x
C470XT290-0104-x
21.0 mW
18.0 mW
16.0 mW
12.0 mW
C470XT290-0110-x
C470XT290-0106-x
C470XT290-0102-x
465 nm
467.5 nm
470 nm
472.5 nm
475 nm
Dominant Wavelength
C527XT290-S0ꢀ00-x
XT-ꢀ2
C527XT290-0110-x
C527XT290-0107-x
C527XT290-0104-x
C527XT290-0101-x
C527XT290-0111-x
C527XT290-0112-x
C527XT290-0109-x
C527XT290-0106-x
C527XT290-0103-x
10.0 mW
9.0 mW
8.0 mW
7.0 mW
C527XT290-0108-x
C527XT290-0105-x
C527XT290-0102-x
520 nm
525 nm
530 nm
535 nm
Dominant Wavelength
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
Copyright © 2004-2006 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree,
the Cree logo, G•SiC and XThin are registered trademarks, and XT, XT-12, XT-16, XT-18, XT-21, XT-21 and XT-24 are trademarks
of Cree, Inc.
USA Tel: +1.919.313.5300
www.cree.com
5
CPR3CE Rev. E
Characteristic Curves
These are representative measurements for the XThin product. Actual curves will vary slightly for the various radiant
flux and dominant wavelength bins.
Wavelength Shift vs Forward Current
Forward Current vs. Forward Voltage
16.0
14.0
12.0
10.0
8.0
30
25
20
15
10
5
6.0
4.0
2.0
0.0
527nm
470 nm
-2.0
-4.0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0
5
10
15
20
25
30
Vf (V)
If(mA)
Relative Intensity vs Forward Current
Relative Intensity vs Peak Wavelength
100
80
140
120
100
80
60
40
60
40
20
20
0
0
5
10
15
20
25
30
500
400
600
Wavelength (nm)
If(mA)
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
Copyright © 2004-2006 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree,
the Cree logo, G•SiC and XThin are registered trademarks, and XT, XT-12, XT-16, XT-18, XT-21, XT-21 and XT-24 are trademarks
of Cree, Inc.
USA Tel: +1.919.313.5300
www.cree.com
6
CPR3CE Rev. E
相关型号:
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