MX-6S [CREE]
XLamp MX-6S LEDs;
| 型号： | MX-6S |
| 厂家： | 
CREE, INC |
| 描述： | XLamp MX-6S LEDs |
| 文件： | 总12页 (文件大小：1251K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Product family data sheet
Cree® XLamp® MX-6S LEDs
PꢀoDuCt DESCꢀiPtion
FEAtuꢀES
tAbLE oF ContEntS
Thꢀ Crꢀꢀ XLamp® MX-6s LeD proꢁidꢀꢂ
thꢀ proꢁꢀn lighting-claꢂꢂ pꢀrformancꢀ
and rꢀliability of Crꢀꢀ XLamp LeDꢂ in
a high‑voltage, PLCC configuration. All
mꢀmbꢀrꢂ of thꢀ MX family of LeDꢂ haꢁꢀ
wide viewing angle, uniform light output
without secondary optics, unlimited floor
life, and electrically neutral thermal path.
•
Available in white (2600 K to 8300 K
CCT)
Charactꢀriꢂticꢂ....................................... 2
Flux Characteristics ............................... 3
Relative Spectral Power Distribution .... 4
Relative Flux vs. Junction
•
•
Wide viewing angle: 120°
20 VDC nominal with voltage binning
aꢁailablꢀ
Temperature........................................... 4
elꢀctrical Charactꢀriꢂticꢂ....................... 5
Relative Flux vs. Current ........................ 5
Typical Spatial Distribution.................... 6
Thꢀrmal Dꢀꢂign...................................... 6
Reflow Soldering Characteristics.......... 7
Notꢀꢂ ...................................................... 8
Mꢀchanical Dimꢀnꢂionꢂ ...................... 10
Tapꢀ and Rꢀꢀl....................................... 11
Packaging............................................. 12
•
•
Electrically neutral thermal path
Qualification at maximum drive
current
•
•
RoHS and REACh compliant
UL® rꢀcognizꢀd componꢀnt
(E349212)
Thꢀ XLamp MX-6s LeD bringꢂ high
performance and quality of light to a
range of lighting applications that require
near‑line‑voltage configuration, including
LED light bulbs, fluorescent retrofits and
retail‑display lighting.
Copyright © 2010-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are
registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
XLamp® mX-6S LED
ChAꢀACtEꢀiStiCS
Cꢁaracꢂerꢃsꢂꢃcs
uꢄꢃꢂ
Mꢃꢄꢃmꢅm
typꢃcal
Maxꢃmꢅm
Thermal resistance, junction to solder point
Viewing angle (FWHM)
°C/W
dꢀgrꢀꢀꢂ
mV/°C
v
5
120
‑20
Temperature coefficient of voltage
ESD withstand voltage (HBM per Mil‑Std‑883D)
DC forward current
8000
mA
175
Forward voltage (@ 60 mA)
LED junction temperature
v
20.0
22.0
150
°C
Copyright © 2010-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
2
XLamp® mX-6S LED
FLuX ChAꢀACtEꢀiStiCS (tJ = 25 °C)
The following table provides several base order codes for XLamp MX‑6S LEDs. It is important to note that the base order codes listed
here are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the
order‑code nomenclature, please consult the XLamp MX LED Family Binning and Labeling document.
Mꢃꢄꢃmꢅm Lꢅmꢃꢄꢆꢅs Flꢅx
CCt ꢀaꢄge
(lm) @ 60 mA
Cꢆlꢆr
order Cꢆde
Mꢃꢄꢃmꢅm
Maxꢃmꢅm
Grꢆꢅp
R4
R3
R3
R2
R3
R2
R3
R2
R2
Q5
Q5
Q4
R2
Q5
Q5
Q4
Flux (lm)
130
122
122
114
122
114
122
114
114
107
107
100
114
107
107
100
MX6SWT‑A1‑0000‑000G51
MX6SWT‑A1‑0000‑000F51
MX6SWT‑A1‑0000‑000FE3
MX6SWT‑A1‑0000‑000EE3
MX6SWT‑H1‑0000‑000F51
MX6SWT‑H1‑0000‑000E51
MX6SWT‑H1‑0000‑000FE3
MX6SWT‑H1‑0000‑000EE3
MX6SWT‑H1‑0000‑000EE5
MX6SWT‑H1‑0000‑000DE5
MX6SWT‑H1‑0000‑000DE7
MX6SWT‑H1‑0000‑000CE7
MX6SWT‑A1‑0000‑000EE5
MX6SWT‑A1‑0000‑000DE5
MX6SWT‑A1‑0000‑000DE7
MX6SWT‑A1‑0000‑000CE7
Cool Whitꢀ
5000 K
8300 K
5000 K
2600 K
8300 K
4300 K
80‑CRI White
3700 K
2600 K
4300 K
3700 K
Warm Whitꢀ
Notꢀꢂ:
•
Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements and ±2 on
CRI measurements. See the Measurements section (page 8).
•
•
•
Typical CRI for Cool White (4300 K – 8300 K CCT) is 75.
Typical CRI for Warm White (2600 K – 4000 K CCT) is 80.
Minimum CRI for 80‑CRI White is 80.
Copyright © 2010-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
3
XLamp® mX-6S LED
ꢀELAtivE SPECtꢀAL PowEꢀ DiStꢀibution
100
90
80
70
60
50
40
30
20
10
0
5000 K - 8300 K CCT
3500 K - 5000 K CCT
2600 K - 3500 K CCT
380
430
480
530
580
630
680
730
780
Wavelength (nm)
ꢀELAtivE FLuX vS. JunCtion tEMPEꢀAtuꢀE (iF = 60 mA)
100%
90%
80%
70%
60%
50%
40%
30%
20%
10%
0%
25
50
75
100
125
150
Junction Temperature (ºC)
Copyright © 2010-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
4
XLamp® mX-6S LED
ELECtꢀiCAL ChAꢀACtEꢀiStiCS (tJ = 25 °C)
175
150
125
100
75
50
25
0
15.00
16.00
17.00
18.00
19.00
20.00
21.00
22.00
23.00
24.00
Forward Voltage (V)
ꢀELAtivE FLuX vS. CuꢀꢀEnt (tJ = 25 °C)
250
200
150
100
50
0
0
25
50
75
100
125
150
175
Forward Current (mA)
Copyright © 2010-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
5
XLamp® mX-6S LED
tꢇPiCAL SPAtiAL DiStꢀibution
100
80
60
40
20
0
-90
-70
-50
-30
-10
10
30
50
70
90
Angle (º)
thEꢀMAL DESiGn
The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end
product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life
and optical characteristics.
200
180
160
140
120
100
80
Rj-a = 10° C/W
60
Rj-a = 15° C/W
40
Rj-a = 20° C/W
Rj-a = 25° C/W
20
0
0
20
40
60
80
100
120
140
160
Ambient Temperature (ºC)
Copyright © 2010-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
6
XLamp® mX-6S LED
ꢀEFLow SoLDEꢀinG ChAꢀACtEꢀiStiCS
In testing, Cree has found XLamp MX‑6S LEDs to be compatible with JEDEC J‑STD‑020C, using the parameters listed below. As a general
guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used.
Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.
tP
Critical Zone
TL to TP
TP
Ramp-up
TL
tS
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
t 25˚C to Peak
Time
Prꢆfꢃle Feaꢂꢅre
Lead-Free Sꢆlder
1.2 °C/second
120 °C
Average Ramp‑Up Rate (Tsmax to Tp)
Preheat: Temperature Min (Tsmin
Preheat: Temperature Max (Tsmax
Preheat: Time (tsmin to tꢂmax
)
)
170 °C
)
65‑150 seconds
217 °C
Time Maintained Above: Temperature (TL)
Time Maintained Above: Time (tL)
Peak/Classification Temperature (Tp)
Time Within 5 °C of Actual Peak Temperature (tp)
Ramp-Down Ratꢀ
45‑90 seconds
235 ‑ 245 °C
20‑40 seconds
1 ‑ 6 °C/second
4 minutes max.
Time 25 °C to Peak Temperature
Note: All temperatures refer to the topside of the package, measured on the package body surface.
Copyright © 2010-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
7
XLamp® mX-6S LED
notES
Measꢅremeꢄꢂs
The luminous flux, radiant power, chromaticity and CRI measurements in this document are binning specifications only and solely
represent product measurements as of the date of shipment. These measurements will change over time based on a number of factors
that are not within Cree’s control and are not intended or provided as operational specifications for the products. Calculated values are
provided for informational purposes only and are not intended as specifications.
Pre‑Release Qualification Testing
Plꢀaꢂꢀ rꢀad thꢀ LeD Rꢀliability Oꢁꢀrꢁiꢀw for details of the qualification process Cree applies to ensure long‑term reliability for XLamp
LEDs and details of Cree’s pre‑release qualification testing for XLamp LEDs.
Lꢅmeꢄ Maꢃꢄꢂeꢄaꢄce
Cree now uses standardized IES LM‑80‑08 and TM‑21‑11 methods for collecting long‑term data and extrapolating LED lumen maintenance.
For information on the specific LM‑80 data sets available for this LED, refer to the public LM‑80 results document.
Plꢀaꢂꢀ rꢀad thꢀ Long‑Term Lumen Maintenance application note for more details on Cree’s lumen maintenance testing and forecasting.
Plꢀaꢂꢀ rꢀad thꢀ Thꢀrmal Managꢀmꢀnt application notꢀ for details on how thermal design, ambient temperature and drive current affect
the LED junction temperature.
Mꢆꢃsꢂꢅre Seꢄsꢃꢂꢃꢈꢃꢂy
Cree recommends keeping XLamp MX‑6S LEDs in the provided, resealable moisture‑barrier packaging (MBP) until immediately prior to
soldering. Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity.
Once the MBP is opened, XLamp MX‑6S LEDs should be handled and stored as MSL 2a per JEDEC J‑STD‑033, meaning they have limited
exposure time before damage to the LED may occur during the soldering
operation. The table on the right specifies the maximum exposure time
in days depending on temperature and humidity conditions. LEDs with
exposure time longer than the specified maximums must be baked
according to the baking conditions listed below.
Maxꢃmꢅm Perceꢄꢂ ꢀelaꢂꢃꢈe hꢅmꢃdꢃꢂy
temp.
30%
40%
50%
60%
17
28
-
70%
1
80%
.5
1
90%
.5
1
35 ºC
30 ºC
25 ºC
20 ºC
-
-
-
-
-
-
-
-
-
-
-
-
1
2
1
1
-
2
1
1
bakꢃꢄg Cꢆꢄdꢃꢂꢃꢆꢄs
It is not necessary to bake all XLamp MX‑6S LEDs. Only the LEDs that meet all of the following criteria must be baked:
1. LEDs that have been removed from the original MBP.
2. LEDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above.
3. LEDs that have not been soldered.
LEDs should be baked at 70 ºC for 24 hours. LEDs may be baked on the original reels. Remove LEDs from the MBP before baking. Do
not bake parts at temperatures higher than 70 ºC. This baking operation resets the exposure time as defined in the Moisture Sensitivity
section above.
Copyright © 2010-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
8
XLamp® mX-6S LED
notES - ContinuED
Sꢂꢆrage Cꢆꢄdꢃꢂꢃꢆꢄs
XLamp MX‑6S LEDs that have been removed from the original MBP but not soldered should be stored in one of the following ways:
•
•
•
Store the parts in a rigid metal container with a tight‑fitting lid. Verify that the storage temperature is <30 °C, and place fresh desiccant
and an RH indicator in the container to verify that the RH is no greater than 60%.
Store the parts in a dry, nitrogen‑purged cabinet or container that actively maintains the temperature at <30° and the RH at no greater
than 60%.
For short‑term store only: LEDs can be resealed in the original MBP soon after opening. Fresh desiccant may be needed. Use the
included humidity indicator card to verify <60% RH.
If an environment of <60% RH is not available for storage, XLamp MX‑6S LEDs should be baked (described above) before reflow soldering.
ꢀꢆhS Cꢆmplꢃaꢄce
The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold
limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/EC (RoHS2),
as implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or from the
Documentation sections of www.cree.com.
ꢀEACꢁ Cꢆmplꢃaꢄce
REACh substances of very high concern (SVHCs) information is available for this product. Since the European Chemical Agency (ECHA)
has published notice of their intent to frequently revise the SVHC listing for the foreseeable future, please contact a Cree representative to
insure you get the most up‑to‑date REACh SVHC Declaration. REACh banned substance information (REACh Article 67) is also available
upon request.
uL® ꢀecꢆgꢄꢃzed Cꢆmpꢆꢄeꢄꢂ
Level 4 enclosure consideration. The LED package or a portion thereof has been investigated as a fire and electrical enclosure per ANSI/
UL 8750.
vꢃsꢃꢆꢄ Adꢈꢃsꢆry
WARNING: Do not look at an exposed lamp in operation. Eye injury can result. See LED For more information about LEDs and eye safety,
plꢀaꢂꢀ rꢀfꢀr to thꢀ LeD eyꢀ safꢀty application notꢀ.
Copyright © 2010-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
9
XLamp® mX-6S LED
MEChAniCAL DiMEnSionS
All measurements are ±.13 mm unless otherwise indicated.
tꢆp vꢃeꢉ
tꢆp vꢃeꢉ
bꢆꢂꢂꢆm vꢃeꢉ
Sꢃde vꢃeꢉ
ꢀecꢆmmeꢄded Fꢀ4 Sꢆlder Pad
Alꢂerꢄaꢂꢃꢈe Sꢆlder Pad
ꢀecꢆmmeꢄded MCPCb Sꢆlder Pad
Copyright © 2010-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
10
XLamp® mX-6S LED
tAPE AnD ꢀEEL
All Cree carrier tapes conform to EIA‑481D, Automated Component Handling Systems Standard.
Except as noted, all dimensions in mm.
Cathode Mark
(4 )
(8 )
(
1.5 )
(1.75 )
CATHODE SIDE
(1.55 )
(12 )
ANODE SIDE
Trailer
Loaded Pockets
(1,400 pcs /Reel
Leader
160mm (min) of
empty pockets
400mm (min) of
empty pockets with
User Feed Direction
Cover Tape
Pocket Tape
13mm
7"
Copyright © 2010-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
11
XLamp® mX-6S LED
PACꢊAGinG
Unpackaged Reel
Label with Cree Bin Code,
Quantity, Reel ID
Packaged Reel
Dessicant
(inside bag)
Label with Cree Order Code,
Quantity, Reel ID, PO #
Humidity Indicator Card
(inside bag)
Label with Cree Bin
Code, Quantity, Reel ID
Boxed Reel
Label with Cree Order Code,
Quantity, Reel ID, PO #
Label with Cree Bin Code,
Quantity, Reel ID
Patent Label
(on bottom of box)
Copyright © 2010-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
12
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