XHGAWT-00-0000-00000UVE7 [CREE]

XLamp XH-G LED;
XHGAWT-00-0000-00000UVE7
型号: XHGAWT-00-0000-00000UVE7
厂家: CREE, INC    CREE, INC
描述:

XLamp XH-G LED

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中文:  中文翻译
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Product family data sheet  
Cree® XLamp® XH-G LED  
PRODUCT DESCRIPTION  
FEATURES  
TAbLE OF CONTENTS  
Unlikꢀ common plastic packagꢀs,  
XLamp XH LeDs usꢀ a cꢀramic packagꢀ  
to dꢀliꢁꢀr thꢀ uniquꢀ combination of high  
pꢀrformancꢀ and rꢀliability not aꢁailablꢀ  
ꢀlsꢀwhꢀrꢀ in mid-powꢀr LeDs. Thꢀ  
cꢀramic-basꢀd XH LeDs arꢀ dꢀsignꢀd to  
dꢀliꢁꢀr thꢀ long L70 lifꢀtimꢀs of Crꢀꢀ’s  
othꢀr high-powꢀr LeDs, such as XP or  
XT LeDs, as wꢀll as industry-lꢀading LeD  
efficacy levels.  
Package size: 3.0 X 3.0 mm  
Available in white (2200 K and  
2600 K - 8300 K), 70-minimum CRI  
cool white, 80-minimum CRI white  
and 85- and 90-minimum CRI warm  
whitꢀ  
Charactꢀristics.......................................2  
Flux Charactꢀristics ...............................3  
Rꢀlatiꢁꢀ Spꢀctral Powꢀr Distribution ....4  
Relative Flux vs. Junction  
Tꢀmpꢀratur...........................................4  
elꢀctrical Charactꢀristics.......................5  
Rꢀlatiꢁꢀ Flux ꢁs. Currꢀnt ........................5  
Typical Spatial Distribution....................6  
Thꢀrmal Dꢀsign......................................6  
Reflow Soldering Characteristics..........7  
Notꢀs ......................................................8  
Mꢀchanical Dimꢀnsions ......................10  
Tapꢀ and Rꢀꢀl.......................................11  
Packaging.............................................12  
350 mA maximum drive current  
viꢀwing anglꢀ: 130°  
Reflow solderable - JEDEC  
J-STD-020C compatible  
Unlimited floor life at  
Optimized for fluorescent replacement  
lighting applications, such as troffꢀrs  
and panel lights, where high efficacy,  
long lifꢀtimꢀ and smooth appꢀarancꢀ  
arꢀ critical, thꢀ XH LeDs allow lighting  
manufacturꢀrs to offꢀr products that  
mꢀꢀt thꢀ lifꢀtimꢀ ꢀxpꢀctations of LeD  
tꢀchnology.  
≤ 30 °C/85% RH  
RoHS and ReACh compliant  
UL® rꢀcognizꢀd componꢀnt  
(E349212)  
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are  
registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.  
Cree, Inc.  
4600 Silicon Drive  
Durham, NC 27703  
USA Tel: +1.919.313.5300  
XLamp® XH-G LED  
CHARACTERISTICS  
Characteristics  
Unit  
Minimum  
Typical  
Maximum  
Thꢀrmal rꢀsistancꢀ, junction to soldꢀr point  
Viewing angle (FWHM)  
°C/W  
20  
dꢀgrꢀꢀs  
130  
-1.2  
Temperature coefficient of voltage  
ESD withstand voltage (HBM per Mil-Std-883D)  
DC forward currꢀnt  
mV/°C  
v
mA  
v
8000  
350  
-5  
Rꢀꢁꢀrsꢀ ꢁoltagꢀ  
Forward voltage (@ 65 mA, 25 °C)  
LeD junction tꢀmpꢀraturꢀ  
v
2.9  
3.4  
°C  
150  
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of  
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.  
2
XLamp® XH-G LED  
FLUX CHARACTERISTICS (TJ = 25 °C)  
The following table provides several base order codes for XLamp XH-G LEDs. It is important to note that the base order codes listed here  
arꢀ a subsꢀt of thꢀ total aꢁailablꢀ ordꢀr codꢀs for thꢀ product family. For morꢀ ordꢀr codꢀs, as wꢀll as a complꢀtꢀ dꢀscription of thꢀ ordꢀr-  
codꢀ nomꢀnclaturꢀ, plꢀasꢀ consult thꢀ XLamp XH Family LeD Binning and Labꢀling documꢀnt.  
Calculated  
Minimum Luminous Flux  
Minimum  
Luminous Flux  
(lm)*  
CCT Range  
@ 65 mA  
Color  
Order Code  
Min.  
Max.  
Group  
J3  
Flux (lm)  
26.8  
26.8  
26.8  
23.5  
26.8  
26.8  
26.8  
26.8  
26.8  
26.8  
23.5  
18.1  
18.1  
300 mA  
101  
Cool White  
5000 K  
3700 K  
2600 K  
2000 K  
5000 K  
3700 K  
2600 K  
5000 K  
3700 K  
2600 K  
2000 K  
2600 K  
2600 K  
8300 K  
5000 K  
3700 K  
2400 K  
8300 K  
5000 K  
3700 K  
8300 K  
5000 K  
3700 K  
2400 K  
3200 K  
3200 K  
XHGAWT-00-0000-00000LX51  
XHGAWT-00-0000-00000LXE5  
XHGAWT-00-0000-00000LXE7  
XHGAWT-00-0000-00000LWEA  
XHGAWT-00-0000-00000BX51  
XHGAWT-00-0000-00000BXE5  
XHGAWT-00-0000-00000BXE7  
XHGAWT-00-0000-00000HX51  
XHGAWT-00-0000-00000HXE5  
XHGAWT-00-0000-00000HXE7  
XHGAWT-00-0000-00000HWEA  
XHGAWT-00-0000-00000PVE7  
XHGAWT-00-0000-00000UVE7  
Neutral White  
J3  
101  
J3  
101  
Warm White  
J2  
88.6  
101  
J3  
70-CRI White  
J3  
101  
J3  
101  
J3  
101  
J3  
101  
80-CRI White  
J3  
101  
J2  
88.6  
68.2  
68.2  
85-CRI White  
90-CRI White  
H0  
H0  
Notꢀs:  
Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements and ±2 on CRI  
measurements. See the Measurements section (page 8).  
Typical CRI for Neutral White, 3700 K - 5000 K CCT is 75.  
Typical CRI for Warm White, 2000 K - 3700 K CCT is 80.  
*
Minimum CRI for 70-CRI Minimum Cool White is 70.  
Minimum CRI for 80-CRI Minimum White is 80.  
Minimum CRI for 85-CRI Minimum White is 85.  
Minimum CRI for 90-CRI Minimum White is 90.  
Calculated flux values at 300 mA are for reference only.  
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of  
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.  
3
XLamp® XH-G LED  
RELATIvE SPECTRAL POwER DISTRIbUTION  
100  
80  
60  
40  
20  
0
Cool White  
Warm White  
380  
430  
480  
530  
580  
630  
680  
730  
780  
Wavelength (nm)  
RELATIvE FLUX vS. JUNCTION TEMPERATURE (IF = 65 mA)  
100  
80  
60  
40  
20  
0
25  
50  
75  
100  
125  
150  
Junction Temperature (ºC)  
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of  
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.  
4
XLamp® XH-G LED  
ELECTRICAL CHARACTERISTICS (TJ = 25 °C)  
350  
325  
300  
275  
250  
225  
200  
175  
150  
125  
100  
75  
50  
25  
2.7  
2.8  
2.9  
3.0  
3.1  
3.2  
3.3  
3.4  
3.5  
3.6  
3.7  
3.8  
Forward Voltage (V)  
RELATIvE FLUX vS. CURRENT (TJ = 25 °C)  
450  
400  
350  
300  
250  
200  
150  
100  
50  
0
25  
50  
75  
100  
125  
150  
175  
200  
225  
250  
275  
300  
325  
350  
Forward Current (mA)  
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of  
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.  
5
XLamp® XH-G LED  
TꢀPICAL SPATIAL DISTRIbUTION  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
-90  
-70  
-50  
-30  
-10  
Angle (º)  
10  
30  
50  
70  
90  
THERMAL DESIGN  
The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end  
product to bꢀ dꢀsignꢀd in a mannꢀr that minimizꢀs thꢀ thꢀrmal rꢀsistancꢀ from thꢀ soldꢀr point to ambiꢀnt in ordꢀr to optimizꢀ lamp lifꢀ  
and optical charactꢀristics.  
400  
350  
300  
250  
200  
150  
Rj-a = 25°C/W  
100  
Rj-a = 30°C/W  
Rj-a = 35°C/W  
50  
Rj-a = 40°C/W  
0
0
20  
40  
60  
80  
100  
120  
140  
160  
Ambient Temperature (ºC)  
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of  
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.  
6
XLamp® XH-G LED  
REFLOw SOLDERING CHARACTERISTICS  
In testing, Cree has found XLamp XH-G LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general  
guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used.  
Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.  
tP  
Critical Zone  
TL to TP  
TP  
Ramp-up  
TL  
tS  
Tsmax  
Tsmin  
Ramp-down  
ts  
Preheat  
25  
t 25˚C to Peak  
IPC/JEDEC J-STD-020C  
Time  
Profile Feature  
Lead-Free Solder  
Aꢁꢀragꢀ Ramp-Up Ratꢀ (Tsmax to Tp)  
1.2 °C/second  
Prꢀhꢀat: Tꢀmpꢀraturꢀ Min (Tsmin  
Prꢀhꢀat: Tꢀmpꢀraturꢀ Max (Tsmax  
Prꢀhꢀat: Timꢀ (tsmin to tsmax  
)
120 °C  
)
170 °C  
65-150 seconds  
217 °C  
)
Timꢀ Maintainꢀd Aboꢁꢀ: Tꢀmpꢀraturꢀ (TL)  
Timꢀ Maintainꢀd Aboꢁꢀ: Timꢀ (tL)  
45-90 seconds  
Peak/Classification Temperature (Tp)  
235 - 245 °C  
Time Within 5 °C of Actual Peak Temperature (tp)  
Ramp-Down Ratꢀ  
20-40 sꢀconds  
1 - 6 °C/second  
4 minutꢀs max.  
Time 25 °C to Peak Temperature  
Notꢀ: All tꢀmpꢀraturꢀs rꢀfꢀr to topsidꢀ of thꢀ packagꢀ, mꢀasurꢀd on thꢀ packagꢀ body surfacꢀ.  
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of  
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.  
7
XLamp® XH-G LED  
NOTES  
Measurements  
The luminous flux, radiant power, chromaticity and CRI measurements in this document are binning specifications only and solely  
rꢀprꢀsꢀnt product mꢀasurꢀmꢀnts as of thꢀ datꢀ of shipmꢀnt. Thꢀsꢀ mꢀasurꢀmꢀnts will changꢀ oꢁꢀr timꢀ basꢀd on a numbꢀr of factors  
that are not within Cree’s control and are not intended or provided as operational specifications for the products. Calculated values are  
provided for informational purposes only and are not intended as specifications.  
Pre‑Release Qualification Testing  
Plꢀasꢀ rꢀad thꢀ LeD Rꢀliability Oꢁꢀrꢁiꢀw for details of the qualification process Cree applies to ensure long-term reliability for XLamp  
LEDs and details of Cree’s pre-release qualification testing for XLamp LEDs.  
Lumen Maintenance  
Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance.  
For information on the specific LM-80 data sets available for this LED, refer to the public LM-80 results document.  
Plꢀasꢀ rꢀad thꢀ Long-Tꢀrm Lumꢀn Maintꢀnancꢀ application notꢀ for morꢀ dꢀtails on Crꢀꢀ’s lumꢀn maintꢀnancꢀ tꢀsting and forꢀcasting.  
Plꢀasꢀ rꢀad thꢀ Thꢀrmal Managꢀmꢀnt application notꢀ for dꢀtails on how thꢀrmal dꢀsign, ambiꢀnt tꢀmpꢀraturꢀ, and driꢁꢀ currꢀnt affꢀct  
thꢀ LeD junction tꢀmpꢀraturꢀ.  
Moisture Sensitiꢁity  
Cree recommends keeping XLamp LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to soldering.  
Unopꢀnꢀd MBPs that contain XLamp LeDs do not nꢀꢀd spꢀcial storagꢀ for moisturꢀ sꢀnsitiꢁity.  
Once the MBP is opened, XLamp XH-G LEDs may be stored as MSL 1 per JEDEC J-STD-033, meaning they have unlimited floor life in  
conditions of ≤ 30 ºC/85% relative humidity (RH). Regardless of storage condition, Cree recommends sealing any unsoldered LEDs in the  
original MBP.  
RoHS Compliance  
Thꢀ lꢀꢁꢀls of RoHS rꢀstrictꢀd matꢀrials in this product arꢀ bꢀlow thꢀ maximum concꢀntration ꢁaluꢀs (also rꢀfꢀrrꢀd to as thꢀ thrꢀshold  
limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/EC (RoHS2), as  
implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or from the Product  
Documꢀntation sꢀctions of www.crꢀꢀ.com.  
REACh Compliance  
REACh substances of very high concern (SVHCs) information is available for this product. Since the European Chemical Agency (ECHA)  
has publishꢀd noticꢀ of thꢀir intꢀnt to frꢀquꢀntly rꢀꢁisꢀ thꢀ SvHC listing for thꢀ forꢀsꢀꢀablꢀ futurꢀ, plꢀasꢀ contact a Crꢀꢀ rꢀprꢀsꢀntatiꢁꢀ to  
insure you get the most up-to-date REACh SVHC Declaration. REACh banned substance information (REACh Article 67) is also available  
upon rꢀquꢀst.  
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of  
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.  
8
XLamp® XH-G LED  
NOTES - CONTINUED  
UL® Recognized Component  
Level 4 enclosure consideration. The LED package or a portion thereof has been investigated as a fire and electrical enclosure per ANSI/  
UL 8750.  
vision Adꢁisory  
WARNING: Do not look at exposed lamp in operation. Eye injury can result. For more information about LEDs and eye safety, please refer  
to thꢀ LeD eyꢀ Safꢀty application notꢀ.  
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of  
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.  
9
XLamp® XH-G LED  
MECHANICAL DIMENSIONS  
All dimensions are ±.13 mm unless otherwise indicated.  
NOTCH IS ON  
CATHODE (-)  
SIDE  
.635  
3.00  
.10  
1.60  
.70  
3.00  
.50  
.10  
.7 .ꢀ ꢁꢁ  
2.80  
Top vieꢂ  
Side vieꢂ  
bottom vieꢂ  
.50  
.50  
1.70  
1.35  
.80  
.70  
1.20  
2.70  
3.00  
.33  
.30  
1.34  
.25  
Recommended PC board Solder Pad  
Recommended Metal Stencil Mask  
(Hatched Area is Open)  
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of  
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.  
10  
XLamp® XH-G LED  
TAPE AND REEL  
All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard.  
All dimensions are ±.13 mm unless otherwise indicated.  
CATHODE SIDE  
ANODE SIDE  
User Feed Direction  
END  
START  
Loaded Pockets  
(1,000 Lamps)  
Trailer  
Leader  
160mm (min) of  
empty pockets  
sealed with tape  
(20 pockets min.)  
400mm (min) of  
empty pockets with  
at least 100mm  
sealed by tape  
(50 empty pockets min.)  
16.40  
User Feed Direction  
Cover Tape  
Pocket Tape  
13mm  
62  
+
0
0.20  
12.40  
MEASURED AT HUB  
7"  
+
0
3.20  
12.40  
MEASURED AT INSIDE EDGE  
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of  
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.  
11  
XLamp® XH-G LED  
PACꢃAGING  
Thꢀ diagrams bꢀlow show thꢀ packaging and labꢀls Crꢀꢀ usꢀs to ship XLamp XH-G LeDs. XLamp XH-G LeDs arꢀ shippꢀd in tapꢀ loadꢀd  
on a rꢀꢀl. each box contains only onꢀ rꢀꢀl in a moisturꢀ barriꢀr bag.  
Unpackaged Reel  
Label with Cree Bin Code,  
Quantity, Reel ID  
Packaged Reel  
Label with Cree Order Code,  
Quantity, Reel ID, PO #  
Label with Cree Bin Code,  
Quantity, Reel ID  
Boxed Reel  
Label with Cree Order Code,  
Quantity, Reel ID, PO #  
Label with Cree Bin Code,  
Quantity, Reel ID  
Patent Label  
(on bottom of box)  
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of  
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.  
12  

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