LA363B5CB [CTS]
METAL CASE, CASE-MOUNTED SEMICONDUCTORS; 金属外壳，机箱面板上半导体
| 型号： | LA363B5CB |
| 厂家： | 
CTS |
| 描述： | METAL CASE, CASE-MOUNTED SEMICONDUCTORS |
| 文件： | 总2页 (文件大小：155K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LA363B5
Technical
METAL CASE, CASE-MOUNTED
SEMICONDUCTORS
LA363B5
Natural Conv. (°C/W): 11.1
Forced Air (°C/W): 3.9
Mounting Envelope: 1.63" x 1.29" x 1.25"
DESCRIPTION OF CURVES
A.
B.
N.C. Horiz. Device Only
Mounted to G-10.
N.C Horiz. & Vert. With
Dissipator.
C.
D.
E.
200 FPM w/Diss.
500 FPM w/Diss.
1000 FPM w/Diss.
•
•
Thermal Resistance Case to Sink is 1.0-1.4 °C/W w/Joint Compound.
Derate 0.7 °C/watt for unplated part in natural convection only.
Ordering Information
CTS IERC PART NO.
Comm'l. Black
Semiconductor
Accommodated
Hole patt.
ref. no.
Max. Weight
(Grams)
Unplated
Mil. Black
Anodize
Anodize
LA363B5U
LA363B5CB
LA363B5B
Any TO-3 can
3
12.6
HOLE PATTERNS
3. Hole pattern no. 363 accommodates T0-3s or T0-3 ICs.
Available in LA-B series heat dissipators only.
CTS IERC, Heat Sinks and Thermal Management Solutions
413 North Moss Street, Burbank, California 91502 Tel: (818) 842-7277
Fax: (818) 848-8872
Rev. 03-04-03
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