NDM3Z-90V-A-000 [CUI]
AUTO COMPENSATED, DIGITAL DC-DC POL CONVERTER;
| 型号： | NDM3Z-90V-A-000 |
| 厂家： | 
CUI INC |
| 描述： | AUTO COMPENSATED, DIGITAL DC-DC POL CONVERTER |
| 文件： | 总33页 (文件大小：3160K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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date 12/23/2015
page 1 of 33
MODEL: NDM3Z-90 │ DESCRIPTION: AUTO COMPENSATED, DIGITAL DC-DC POL CONVERTER
GENERAL CHARACTERISTICS
• 7.5~14 V input range
FEATURES
• compact package
• 0.6~1.8 V programmable output
• high efficiency
vertical:
50.8 x 9.51 x 19.05 mm
(2.0 x 0.37 x 0.75 in)
horizontal:
• voltage tracking
• voltage margining
• active current sharing
50.8 x 19.05 x 10.0 mm
(2.0 x 0.75 x 0.39 in)
• 90 A output
• Snapshot™ parametric capture
• voltage/current/temperature monitoring
• synchronization and phase spreading
• remote differential voltage sense
• programmable soft start and soft stop
• fault management
• adaptive algorithms
• cycle-by-cycle charge management
• dual phase architecture
• SMBus interface
• PMBus™ compatible
TM
Architects of
Modern Power
input voltage
output voltage
output current
output wattage
MODEL
max
max
(Vdc)
(Vdc)
(A)
(W)
NDM3Z-90
7.5~14
0.6~1.8
90
162
PART NUMBER KEY
NDM3Z-90 X - X - XXX
Base Number
Module Orientation and Pin Style:
Firmware Configuration:
HT = horizontal, through hole mount
HS = horizontal, surface mount
V = vertical
000~ZZZ
Pin Configuration:
A = HT 3.56 mm pin length (HT)
V 4 mm pin length (V)
B = V 5.5 mm pin length (V)
Example part number: NDM3Z-90V-A-002
vertical module
4.0 mm pin length
firmware configuration 002
* HS and HT modules are delivered on tape and reel
* V modules are delivered in trays
CONTENTS
Pin Descriptions................................................2
Absolute Maximum Ratings.................................4
Product Electrical Specifications...........................4
Mechanical Drawings.....................................14~15
PMBus Interface.................................................17
Operating Information.........................................20
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date 12/23/2015 │ page 2 of 33
INTERNAL CIRCUIT DIAGRAM
POWER CONNECTIONS
symbol
pin
IO type
Power
Ground
Power
N/A
description
Input voltage
VIN
1A, 1B, 1C, 1D
2A, 2B, 2C, 2D
3A, 3B, 3C, 3D
11, 12
GND
Power ground
VOUT
N/C
Output voltage
No connect on module
COMMUNICATION CONNECTIONS
symbol
pin
4A
4B
5A
5B
6A
6B
7A
IO type
Analog
Analog
Digital
Analog
Digital
Digital
Digital
description
+S
Output voltage positive sense input, N/C if not used
Output voltage negative sense input, N/C if not used
Output voltage pin-strap
-S
VSET
VTRK
SLRT
SDA
SCL
Voltage tracking input, N/C if not used
SMBus alert, N/C if not used
SMBus data, pull-up resistor required even if not used
SMBus clock, pull-up resistor required even if not used
Module fault indicator, N/C if module is stand-alone,
tied together if modules are current share configured
FAULT
7B
Digital
SA
8A
8B
9A
9B
Digital
Digital
Digital
Digital
SMBus address pinstrap
SYNC
PG
Synchronization I/O, N/C if not used
Power good, pull-up resistor or configured as push-pull
Remote control or enable, N/C if not used, internal pull-up resistor
CTRL
Digital-DC Communications bus, pull-up resistor or
configured as push-pull (stand-alone only) required
DDC
10A
10B
Digital
PREF
Ground
Pin-strap ground
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date 12/23/2015 │ page 3 of 33
TYPICAL APPLICATION CIRCUIT
TYPICAL APPLICATION CIRCUIT - PARALLEL OPERATION
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date 12/23/2015 │ page 4 of 33
ABSOLUTE MAXIMUM RATINGS
parameter
conditions/description
min
typ
max
units
Vin
input voltage
-0.3
16
V
CTRL, DDC, SA, SLRT, SDA, SCL, SYNC, VSET, PG,
FAULT
digital pin voltage
-0.3
6.0
V
analog pin voltage
+S, VO, VTRK
GND, PREF, -S
TP1
-0.3
-0.3
-40
6.5
0.3
V
V
ground voltage differential
operating temperature
storage temperature
150
150
°C
°C
-40
Notes:
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated
in the Electrical Specification section of this specification is not implied.
Configuration File
The digital control circuit in this module uses a configuration file which determines the functionality and performance of the
product. The Standard configuration is designed to fit most application needs and the Electrical Specification table shows
parameter values of functionality and performance with the Standard configuration, unless otherwise specified. Changes
in Standard configuration might be required to optimize performance in specific applications. Changes to the Standard
configuration are required for current sharing operation.
PRODUCT ELECTRICAL SPECIFICATION
TP1 = -30 to +95 °C, VI = 7.5 to 14 V, unless otherwise specified under Conditions.
Typical values given at: T = +25 °C, VI = 12.0 V, max IO, unless otherwise specified under Conditions.
VO defined by pin strap. SPt1andard configuration.
External CIN = 1000 μF/12 mΩ + 24 x 10 μF, COUT = 10 x 470 μF/5 mΩ + 10 x 100 μF. See Operating Information section
for selection of capacitor types.
Sense pins are connected to load.
parameter
conditions/description
min
typ
max
14
units
V
input voltage (VI)
input voltage rise time (VI)
7.5
monotonic
6
V/ms
output voltage without
pin-strap (VO)
1.2
V
V
V
output voltage adjustment
range (VO)
0.60
0.54
1.8
output voltage adjustment in-
cluding PMBus margining (VO)
1.98
output voltage set-point
resolution (VO)
output voltage accuracy2 (VO)
0.025
47
%VO
%VO
Ω
including line, load, temp
-1
1
internal resistance +S/-S to
VOUT/GND (VO)
+S bias current (VO)
-S bias current (VO)
-100
20
20
100
μA
μA
VO = 0.6 V
VO = 1.0 V
VO = 1.8 V
2
2
2
mV
mV
mV
line regulation (VO)
IO = max IO
VO = 0.6 V
VO = 1.0 V
VO = 1.8 V
2
2
2
mV
mV
mV
load regulation (VO)
output ripple & noise (VO)
IO = 0~100%
(up to 20 MHz)
VO = 0.6 V
VO = 1.0 V
VO = 1.8 V
2.5
3.5
5.0
mVp-p
mVp-p
mVp-p
output current (IO)
0
90
A
A
current limit threshold (Ilim)
100
114
125
Notes:
2. For VO < 1.0 V accuracy is +/-10 mV. For further deviations see section Output Voltage Adjust using PMBus
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(
)
PRODUCT ELECTRICAL SPECIFICATION CONTINUED
parameter
conditions/description
min
typ
max
units
short circuit current (ISC)
RMS, hiccup mode, VO = 1.0 V, 1.5 mΩ short
12
A
VO = 0.6 V
VO = 1.0 V
VO = 1.8 V
87.6
91.4
94.3
%
%
%
50% of max IO
IO = max IO
efficiency (η)
VO = 0.6 V
VO = 1.0 V
VO = 1.8 V
83.7
88.7
92.5
%
%
%
VO = 0.6 V
VO = 1.0 V
VO = 1.8 V
10.5
11.5
13.1
W
W
W
power dissipation at max IO (d)
input idling power (PIi)
VO = 0.6 V
VO = 1.0 V
VO = 1.8 V
1.29
1.35
1.82
W
W
W
IO = 0
input standby power (PCTRL
)
turned off with CTRL-pin
0.44
W
switching frequency
(fSW = 1/TSW)
320
kHz
switching frequency range2
(fSW = 1/TSW)
PMBus configurable
FREQUENCY_SWITCH
200
-5
640
5
kHz
%
switching frequency set-point
accuracy (fSW = 1/TSW)
external sync pulse width
(fSW = 1/TSW)
150
-10
ns
input clock frequency drift tol-
erance (fSW = 1/TSW)
external sync
10
%
initialization time (TINIT
)
From VI > ~2.7 V to ready to be enabled
67
ms
output voltage
total on delay time (TONdel_tot
enabled by input voltage
enabled by CTRL pin
TINIT + TONdel
TONdel
)
turn on delay duration
range PMBus configurable TON_DELAY
accuracy (actual delay vs set value)
5
ms
ms
ms
output voltage on delay time
(TONdel
3
4
250
250
)
-0/+2
0
turn off delay duration
range PMBus configurable TOFF_DELAY
accuracy (actual delay vs set value)
ms
ms
ms
output voltage off delay time3
(TOFFdel
)
-0/+2
5
turn on ramp duration
ms
Disabled in standard configuration.
Turn off immediately upon expiration
of turn off delay.
turn off ramp duration
output voltage on/off ramp up
time (0→100%,100→0% of VO)
ramp duration range PMBus configurable
TON_RISE/TOFF_FALL
(TONrise/TOFFfall
)
0
100
ms
ramp time accuracy for standalone operation (ac-
tual ramp time vs set value)
250
μs
rising
falling
90
85
%VO
%VO
power good threshold (PG)
PMBus configurable
POWER_GOOD_ON
VOUT_UV_FAULT_LIMIT
power good threshold range
(PG)
0
100
%VO
Notes:
1. Value refers to total (internal + external) effective output capacitance. Capacitance derating with VO typical for ceramic capacitors (bias characteristics) and
temperature variations must be considered for the external capacitor(s). See section External Output Capacitors.
2. There are configuration changes to consider when changing the switching frequency, see section Switching Frequency.
3. The specified accuracy applies for off delay times larger than 4 ms. A value of 0 ms can be set to guarantee a fast shut-off, but this will force the device to
Immediate Off behavior, even if soft-off, i.e. ramp-down, is configured. When setting 0 ms the actual delay will be 0 ms.
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PRODUCT ELECTRICAL SPECIFICATION CONTINUED
parameter
conditions/description
min
typ
max
units
power good delay (PG)
From VO reaching target to PG assertion
2
ms
PMBus configurable
POWER_GOOD_DELAY
power good delay range (PG)
0
5000
ms
V
input under voltage protection
threshold (IUVP)
6.4
6.4~14
0.5
input under voltage protection
threshold range (IUVP)
PMBus configurable
VIN_UV_FAULT_LIMIT
V
input under voltage protection
hysteresis (IUVP)
V
input under voltage protection
hysteresis range (IUVP)
PMBus configurable
VIN_UV_WARN_LIMIT
0~7.6
280
V
input under voltage protection
set point accuracy (IUVP)
mV
μs
input under voltage protection
response delay (IUVP)
100
input under voltage protection
fault response1 (IUVP)
shutdown, automatic restart
VIN_UV_FAULT_RESPONSE
280
ms
V
input over voltage protection
threshold (IOVP)
16
input over voltage protection
threshold range (IOVP)
PMBus configurable
VIN_OV_FAULT_LIMIT
6.9~16
1
V
input over voltage protection
hysteresis (IOVP)
V
input over voltage protection
hysteresis range (IOVP)
PMBus configurable
VIN_OV_WARN_LIMIT
0~9.1
280
V
input over voltage protection
set point accuracy (IOVP)
mV
μs
input over voltage protection
response delay (IOVP)
100
input over voltage protection
fault response1 (IOVP)
shutdown, automatic restart
VIN_OV_FAULT_RESPONSE
280
ms
%VO
%VO
%VO
%VO
output under voltage protection
threshold (UVP)
85
output under voltage protection PMBus configurable
threshold range (UVP)
0~100
115
VOUT_UV_FAULT_LIMIT
output over voltage protection
threshold (OVP)
output over voltage protection
threshold range (OVP)
PMBus configurable
VOUT_OV_FAULT_LIMIT
100~115
output over/under
voltage protection response
time (UVP/OVP)
10
μs
output over/under
shutdown, automatic restart
VOUT_UV_FAULT_RESPONSE
VOUT_OV_FAULT_RESPONSE
voltage protection fault
280
ms
response1 (UVP/OVP)
Notes:
1. Automatic restart ~280 ms after fault if the fault is no longer present. Continuous restart attempts if the fault reappear after restart. See Operating Information
for other fault response options.
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PRODUCT ELECTRICAL SPECIFICATION CONTINUED
parameter
conditions/description
min
typ
max
units
over current protection
threshold1 (OCP)
set value per phase
57
A
over current protection
threshold range1 (OCP)
PMBus configurable
IOUT_AVG_OC_FAULT_LIMIT
0~57
5
A
over current protection
protection delay1 (OCP)
TSW
ms
°C
over current protection
fault response1 (OCP)
shutdown, automatic restart2
MFR_IOUT_OC_FAULT_RESPONSE
280
125
over temperature protection
threshold3 (OTP)
position P3
position P3
PMBus configurable
OT_FAULT_LIMIT
over temperature protection
threshold range3 (OTP)
-40~125
15
°C
°C
ms
°C
°C
°C
ms
over temperature protection
hysteresis3 (OTP)
position P3
PMBus configurable
position P3
over temperature protection
fault response3 (OTP)
shutdown, automatic restart2
OT_FAULT_RESPONSE
280
over temperature protection
threshold3 (OTP)
position P1
150
position P1
PMBus configurable
MFR_VMON_OV_FAULT_LIMIT
over temperature protection
threshold range3 (OTP)
-40~150
25
over temperature protection
hysteresis3 (OTP)
position P1
PMBus configurable
position P1
over temperature protection
fault response3 (OTP)
shutdown, automatic restart2
VMON_OV_FAULT_RESPONSE
280
input voltage
READ_VIN
280
1
mV
output voltage
READ_VOUT
%VO
output current
READ_IOUT
TP1 = 25 °C, VO = 1.0 V
TP1 = 0-95 °C, VO = 1.0 V
1
3.5
A
A
monitoring accuracy
No tolerance, value is
that applied to PWM
controller
duty cycle
READ_DUTY_CYCLE
temperature
READ_TEMPERATURE_1
position P3
-10
-2
5
%
tracking input bias current4
tracking input voltage range
VTRK = 5 V
70
200
μA
VTRK pin
0~1.8
V
regulation 100% tracking
ramp accuracy, VO = 1.0 V, 5 ms ramp
tracking accuracy
2
mV
current difference between
products in a current sharing
group
Max 2 x READ_IOUT monitoring
accuracy
steady state operation
number of products in a current
sharing group
4
Notes:
1. The set OCP limit applies per phase. The total OCP limit will be twice the set value.
2. Automatic restart ~280 ms after fault if the fault is no longer present. Continuous restart attempts if the fault reappear after restart. See Operating Information
for other fault response options.
3. See section Over Temperature Protection (OTP).
4. The maximum tracking rise-time is 1 V/ms, see section Voltage Tracking.
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PRODUCT ELECTRICAL SPECIFICATION CONTINUED
parameter
conditions/description
min
typ
max
units
logical output low signal level
(VOL)
SCL, SDA, SYNC, DDC, SLRT, PG
sink/source current = 2 mA
0.5
V
logical output high signal level
(VOH)
SCL, SDA, SYNC, DDC, SLRT, PG
sink/source current = 2 mA
2.25
-2
V
logic output low sink current
(IOL)
mA
mA
logic output high source cur-
rent (IOH)
2
logic input low threshold (VIL)
SCL, SDA, CTRL, SYNC, DDC
0.8
V
V
logic input high threshold (VIH) SCL, SDA, CTRL, SYNC, DDC
2
logic leakage current (II_LEAK
)
SCL, SDA, SYNC, SLRT, PG
-100
100
μA
logic pin input capacitance
SCL, SDA, CTRL, SYNC, DDC
12
pF
(CI_PIN
)
logic pin internal pull-up resis- SCL, SDA, SLRT
no internal pull-up
tance (RI_PU
)
CTRL to +5V
DDC to +5V
10
47
kΩ
kΩ
SMBus operating frequency
(fSMB
100
1.3
400
kHz
μs
)
SMBus bus free time1 (TBUF
)
STOP bit to START bit
SMBus SDA setup time from
SCL1 (tset)
100
ns
SMBus SDA hold time from
300
600
ns
ns
SCL1 (thold
)
SMBus START/STOP condition
setup/hold time from SCL
SCL low period (Tlow
)
1.3
0.6
μs
μs
SCL high period (Thigh
)
Notes:
1. See SMBus - Timing section.
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TYPICAL OUTPUT CHARACTERISTICS, VO = 0.6 V
Conditions (Standard configuration unless otherwise stated): TP1 = 25°C
Efficiency
Power Dissipation
100
95
90
85
80
75
70
15
12
9
Vin
Vin
7.5 V
9.6 V
12 V
14 V
7.5 V
9.6 V
12 V
14 V
6
3
0
0
10
20
30
40
50
60
70
80
90
0
10
20
30
40
50
60
70
80
90
Load Current (A)
Load Current (A)
Output Current Derating for Vertical Version
Output Current Derating for Lay Down Version
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
Airflow
3.0 m/s
2.0 m/s
1.0 m/s
0.5 m/s
Nat. Conv.
3.0 m/s
2.0 m/s
1.0 m/s
0.5 m/s
Nat. Conv.
30 40 50 60 70 80 90 100 110 120
30
40
50
60
70
80
90
100
110
120
Ambient Air Temperature (°C)
Ambient Air Temperature (°C)
Output Ripple and Noise
Transient Response
Vin = 12 V, Iout = Imax
Vin = 12 V, Iout = 25% Imax 75% Imax 25% Imax
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TYPICAL OUTPUT CHARACTERISTICS, VO = 1.0 V
Conditions (Standard configuration unless otherwise stated): TP1 = 25°C
Efficiency
Power Dissipation
100
95
90
85
80
75
70
15
12
9
Vin
Vin
7.5 V
9.6 V
12 V
14 V
7.5 V
9.6 V
12 V
14 V
6
3
0
0
10
20
30
40
50
60
70
80
90
0
10
20
30
40
50
60
70
80
90
Load Current (A)
Load Current (A)
Output Current Derating for Vertical Version
Output Current Derating for Lay Down Version
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
Airflow
3.0 m/s
2.0 m/s
1.0 m/s
0.5 m/s
Nat. Conv.
3.0 m/s
2.0 m/s
1.0 m/s
0.5 m/s
Nat. Conv.
30 40 50 60 70 80 90 100 110 120
30
40
50
60
70
80
90
100
110
120
Ambient Air Temperature (°C)
Ambient Air Temperature (°C)
Output Ripple and Noise
Transient Response
Vin = 12 V, Iout = Imax
Vin = 12 V, Iout = 25% Imax 75% Imax 25% Imax
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TYPICAL OUTPUT CHARACTERISTICS, VO = 1.8 V
Conditions (Standard configuration unless otherwise stated): TP1 = 25°C
Efficiency
Power Dissipation
100
95
90
85
80
75
70
15
12
9
Vin
7.5 V
Vin
7.5 V
9.6 V
12 V
14 V
9.6 V
12 V
14 V
6
3
0
0
10
20
30
40
50
60
70
80
90
0
10
20
30
40
50
60
70
80
90
Load Current (A)
Load Current (A)
Output Current Derating for Vertical Version
Output Current Derating for Lay Down Version
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
Airflow
3.0 m/s
3.0 m/s
2.0 m/s
1.0 m/s
0.5 m/s
Nat. Conv.
2.0 m/s
1.0 m/s
0.5 m/s
Nat. Conv.
30 40 50 60 70 80 90 100 110 120
30
40
50
60
70
80
90
100
110
120
Ambient Air Temperature (°C)
Ambient Air Temperature (°C)
Output Ripple and Noise
Transient Response
Vin = 12 V, Iout = Imax
Vin = 12 V, Iout = 25% Imax 75% Imax 25% Imax
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TYPICAL ON/OFF CHARACTERISTICS
Conditions (Standard configuration unless otherwise stated): TP1 = 25°C, VO = 1.0 V
Enable by input voltage
Disable by input voltage
Enable by CTRL pin
Disable by CTRL pin
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TYPICAL CHARACTERISTICS
Conditions (Standard configuration unless otherwise stated): TP1 = 25°C
Power Dissipation vs. Output Current and
Switching Frequency
Efficiency vs. Output Current and Switching Frequency
95
93
91
89
87
14.0
12.0
10.0
8.0
200 kHz
640 kHz
480 kHz
320 kHz
200 kHz
85
83
81
79
77
75
320 kHz
480 kHz
640 kHz
6.0
4.0
2.0
0.0
0
10
20
30
40
50
60
70
80
90
0
10
20
30
40
50
60
70
80
90
Load Current (A)
Load Current (A)
Load Transient vs. ASCR Gain and External
Output Capacitance
Output Ripple vs. Switching Frequency
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
100.0
90.0
80.0
70.0
60.0
50.0
40.0
30.0
20.0
10.0
0.0
1.8 V
1.0 V
0.6 V
4 x 470 μF + 10 x 100 μF
10 x 470 μF + 10 x 100 μF
150
200
250
300
350
400
450
500
200
250
300
350
400
450
500
550
600
ASCR
Fsw (kHz)
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MECHANICAL DRAWING (HORIZONTAL, THROUGH-HOLE MOUNT)
units: mm [inches]
tolerance unless specified:
X.X ±0.50 [0.02]
X.XX ±0.25 [0.01]
(not applied on footprint or typical values)
D
19.05 0.75
50.80 2.00
Top View
Side View
9.67 0.381
1.02 0.040
(14 PLCS)
0.50 0.020
(14 PLCS)
Front View
PIN
NUMBER
PIN
NAME
MATERIAL PLATING
1A, 1B,
1C, 1D
51.80 2.039
Recommended keep out
area for user components
VIN
2.40 0.094
2.25 0.089
2.40 0.094
2A, 2B,
2C, 2D
GND
12
11
2.25 0.089
3A, 3B,
3C, 3D
VOUT
4A
4B
5A
5B
6A
6B
7A
7B
8A
8B
9A
9B
10A
10B
11
+S
-S
0.80 0.031
(14 PLCS)
20.05 0.789
4.20 0.165
VSET
VTRK
SLRT
SDA
SCL
2.40 0.094
2.25 0.089
4B
5B 6B 7B 8B 9B
10B
1A
1B
2A
2B
3A
3B
3C
3D
2C
2D
1C 1D
Min
0.1 μm Au
over
1~3 μm Ni
4A 5A
6A 7A 8A 9A 10A
Copper Alloy
2.80 0.110
(11 PLCS)
2.00 0.079
(6 PLCS)
1.20 0.047
(14 PLCS)
2.00 0.079
Recommended Footprint
Top View
FAULT
SA
SYNC
PG
CTRL
DDC
PREF
N/C
12
N/C
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MECHANICAL DRAWING (VERTICAL)
units: mm [inches]
tolerance unless specified:
X.X ±0.50 [0.02]
X.XX ±0.25 [0.01]
(not applied on footprint or typical values)
H
19.05 0.75
0.50 0.02
1.00 0.039
50.80 2.00
Front View
Side View
9.47 0.373
PIN
NUMBER
PIN
NAME
MATERIAL PLATING
Bottom View
5.07 0.200
0.80 0.031
(14 PLCS)
1.20 0.047
(12 PLCS)
1A, 1B,
1C, 1D
VIN
4.20 0.165
2D 1C
2A, 2B,
2C, 2D
GND
10.5 0.413
1A
1B
2A
2B
3A
3B
3C
3D
2C
1D
4A
5A 6A 7A 8A 9A 10A
2.00 0.079
3A, 3B,
3C, 3D
VOUT
2.80 0.110
(11 PLCS)
4B 5B
6B 7B 8B 9B 10B
2.00 0.079
(6 PLCS)
4A
4B
5A
5B
6A
6B
7A
7B
8A
8B
9A
9B
10A
10B
+S
-S
51.80 2.04
Recommended Footprint
Recommended keep out
area for user components
Top View
VSET
VTRK
SLRT
SDA
SCL
Min
0.1 μm Au
Copper Alloy
over
1~3 μm Ni
FAULT
SA
SYNC
PG
CTRL
DDC
PREF
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Output Ripple and Noise
EMC SPECIFICATION
The circuit shown below is used to measure output ripple
and noise. A damped filter is created by the 50 mm
conductor and the two capacitors.
Conducted EMI is measured according to the test set-up
below. The typical fundamental switching frequency is 320
kHz.
50 mm conductor
Vout
Tantalum
Capacitor
10 µF
Ceramic
Capacitor
0.1 µF
Conducted EMI
Input terminal value (typical for standard configuration).
VI = 12 V, VO = 1.0 V, IO = IMAX
+S
−S
co
GND
50 mm conductor
BNC-contact to
oscilloscope
Output ripple and noise test set-up.
The following is an example of the low frequency output
ripple and noise as measured with the above circuit.
EMI without filter.
To spectrum
analyzer
RF Current probe
1kHz – 50MHz
Resistive
load
Battery
supply
VI=12 V, VO=1.0 V, IO=90 A, COUT = 10 x 470 μF/5 mΩ + 10 x 100 μF, 5 mV/div,
50 ꢀs/div
DUT
Example of low frequency ripple at the output.
C1
50mm
C1 = 10uF / 600VDC
Feed- Thru RF capacitor
200mm
Test set-up conducted emission, power lead.
800mm
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PMBus Addressing
PMBUS INTERFACE
The PMBus address is configured with a resistor connected
between the SA pin and the PREF pin, as shown in the
Typical Application Circuit. Recommended resistor values
are shown in the table below. 1% tolerance resistors are
required.
Power Conversion Overview
The NDM3Z-90 module has several features to enable
high power conversion efficiency. Adaptive algorithms and
cycle-by-cycle charge management improves the response
time and reduces the output deviation as a result of load
transients. The incorporation of DFM enhances the CUI
modules for improved performance.
RSA (kΩ)
0 (short)
10
Address
0x26
0x19
0x1A
0x1B
0x1C
0x1D
0x1E
0x1F
0x20
0x21
0x22
0x23
0x24
0x25
0x26
0x27
RSA (kΩ)
42.2
Address
0x28
0x29
0x2A
0x2B
0x2C
0x2D
0x2E
0x2F
0x30
0x31
0x32
0x33
0x34
0x35
0x36
0x37
0x28
46.4
11
51.1
Power Management Overview
12.1
13.3
14.7
16.2
17.8
19.6
21.5
23.7
26.1
28.7
31.6
34.8
38.3
56.2
This product incorporates a wide range of configurable
power management features that are simple to implement
with a minimum of external components. Additionally,
the product includes protection features that continuously
safeguard the load from damage due to unexpected system
faults.
The product’s standard configuration is suitable for a wide
range of operation in terms of input voltage, output
voltage, and load. The configuration is stored in an internal
Non-Volatile Memory (NVM). All power management
functions can be reconfigured using the PMBus interface.
Throughout this document, different PMBus commands
are referenced. A detailed description of each command is
provided in the appendix at the end of this specification.
The ability of CUI modules to digitally control, configure and
monitor OS features provides significant benefits during
development, production and the product life.
61.9
68.1
75
82.5
90.9
100
110
121
133
147
162
178
infinite (open)
Reserved Addresses
Addresses listed in the table below are reserved or assigned
according to the SMBus specification and may not be
usable. Refer to the SMBus specification for further
information.
SMBus Interface
The product can be used with any standard two-wire I2C or
SMBus host device. See Electrical Specification for allowed
clock frequency range. In addition, the product is
compatible with PMBus version 1.2 and includes an SLRT
line to help mitigate limitations related to continuous
fault monitoring. The PMBus signals SCL, SDA and SLRT
require passive pull-up resistors as stated in the SMBus
Specification. Pull-up resistors are required to guarantee the
rise time as follows:
Address
0x00
Comment
general call address / START byte
CBUS address
0x01
0x02
address reserved for different bus format
reserved for future use
0x03 ~ 0x07
0x08
SMBus host
0x09 ~0x0B
0x0C
assigned for smart battery
SMBus alert response address
reserved for ACCESS.bus host
T = RPCP ≤ 1μs
0x28
Where RP is the pull-up resistor value and CP is the bus
loading. The maximum allowed bus load is 400 pF. The
pull-up resistor should be tied to an external supply voltage
in range from 2.5 to 5.5 V, which should be present prior
to or during power-up. If the proper power supply is not
available, voltage dividers may be applied. Note that in
this case, the resistance in the equation above corresponds
to parallel connection of the resistors forming the voltage
divider.
0x2C ~ 0x2D
reserved for previous versions of the SMBus
specification
0x37
reserved for ACCESS.bus default address
0x40 ~ 0x44
reserved by previous versions of the SMBus
specification
0x48 ~ 0x4B
0x61
unrestricted addresses
SMBus device default address
10-bit slave addressing
reserved for future use
0x78 ~ 0x7B
0x7C ~ 0x7F
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Monitoring via PMBus
It is possible to continuously monitor a wide variety of
parameters through the PMBus interface. These include, but
are not limited to, the parameters listed in the table below.
●
●
●
●
●
Output current
Controller temperature
Switching frequency
Duty cycle
Status and fault information
Parameter
input voltage
PMBus Command
READ_VIN
When a fault occurs the Snapshot functionality will
automatically store this parametric data to NVM. The data
can then later be read back to provide valueable information
for analysis. It is possible to select which faults will trigger a
store to NVM by the PMBus command
output voltage
total output current
READ_VOUT
READ_IOUT
READ_IOUT0
READ_IOUT1
output current of each phase
controller temperature
switching frequency
duty cycle
READ_TEMPERATURE_1
READ_FREQUENCY
SNAPSHOT_FAULT_MASK.
PMBus/I2C Timing
READ_DUTY_CYCLE
highest temperature of power
switches*
READ_VMON
* Reports a voltage level corresponding to the temperature.
See command details in the end of this specification.
Monitoring Faults
Fault conditions can be monitored using the SLRT pin,
which will be asserted low when any number of
pre-configured fault or warning conditions occur. The SLRT
pin will be held low until faults and/or warnings are cleared
by the CLEAR_FAULTS command, or until the output voltage
has been re-enabled. It is possible to mask which fault
conditions should not assert the SLRT pin by the command
MFR_SMBALERT_MASK.
Setup and hold times timing diagram.
The setup time, tset, is the time data, SDA, must be stable
before the rising edge of the clock signal, SCL. The hold
time thold, is the time data, SDA, must be stable after the
falling edge of the clock signal, SCL. If these times are
violated incorrect data may be captured or meta-stability
may occur and the bus communication may fail. All
standard SMBus protocols must be followed, including clock
stretching. Refer to the SMBus specification for SMBus
electrical and timing requirements.
In response to the SLRT signal, the user may read a number
of status commands to find out what fault or warning
condition occurred, see table below.
Fault & Warning Status
PMBus Command
This product supports the BUSY flag in the status commands
to indicate product being too busy for SMBus response. A
busfree time delay according to this specification must occur
between every SMBus transmission (between every stop
& start condition). The product supports PEC (Packet Error
Checking) according to the SMBus specification.
STATUS_WORD
STATUS_BYTE
overview, power good
output voltage level
output current level
input voltage level
temperature level
PMBus communication
miscellaneous
STATUS_VOUT
STATUS_IOUT
STATUS_INPUT
STATUS_TEMPERATURE
STATUS_CML
When sending subsequent commands to the same unit it is
recommended to insert additional delays after write
transactions according to the table below. After read
transactions a delay of 2 ms should be inserted before
STATUS_MFR_SPECIFIC
Snapshot Parameter Capture
This product offers a special feature that enables the user to accessing the unit again.
capture parametric data during normal operation by a single
PMBus command SNAPSHOT. The following parameters are
stored:
●
Input voltage
●
Output voltage
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Delay after write before
additional command
PMBus Command
Initialization Procedure
The product follows an internal initialization procedure after
power is applied to the VIN pin:
STORE_USER_ALL
STORE_DEFAULT_ALL
RESTORE_USER_ALL
RESTORE_DEFAULT_ALL
any other command
100 ms
100 ms
100 ms
1. Self test and memory check.
100 ms
10 ms
2. The address pin-strap resistors are measured and the
associated PMBus address is defined.
Non-Volatile Memory (NVM)
3. The output voltage pin-strap resistor is measured and the
associated output voltage level will be loaded to
The product incorporates two Non-Volatile Memory areas for
storage of the PMBus command values; the Default NVM
and the User NVM. The Default NVM is pre-loaded with CUI
factory default values. The Default NVM is write-protected
and can be used to restore the CUI factory default values
through the command RESTORE_DEFAULT_ALL. The User
NVM is pre-loaded with CUI factory default values. The User
NVM is writable and open for customization. The values in
NVM are loaded during initialization according to section
Initialization Procedure, whereafter commands can be
changed through the PMBus Interface. The STORE_USER_
ALL command will store the changed parameters to the
User NVM.
operational RAM of PMBus command VOUT_COMMAND.
4. CUI factory default values stored in default NVM
memory are loaded to operational RAM. This overwrites
any previously loaded values.
5. Values stored in the User NVM are loaded into operational
RAM memory. This overwrites any previously loaded
values (e.g. VOUT_COMMAND by pin-strap).
6. Check for external clock signal at the SYNC pin and lock
internal clock to the external clock if used.
Once this procedure is completed and the Initialization Time
has passed (see Electrical Specification), the output voltage
is ready to be enabled using the CTRL pin. The product is
also ready to accept commands via the PMBus interface,
which in case of writes will overwrite any values loaded
during the initialization procedure.
INITIALIZATION
Pin-strap resistors
INITIALIZATION
Default NVM
CUI factory default
RESTORE_DEFAULT_ALL
Write-protected
RAM
VIN
INITIALIZATION
User NVM
CUI factory default
Customizable
STORE_USER_ALL
Ready for output
enable and soft-start
TINIT
RESTORE_USER_ALL
WRITE
READ
VOUT
PMBus interface
Illustration Initialization time.
Illustration of memory areas of the product.
Command Protection
The user may write-protect specific PMBus commands in the
User NVM by using the command UNPROTECT.
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OPERATING INFORMATION
External Input Capacitors
The product is a two-phase converter which gives
lower input ripple than a single phase design. Thus,
ripple-current-rating requirements for the input capacitors
are lower.
Input Voltage
The input voltage range 7.5-14V makes the product
easy to use in intermediate bus applications when powered
by a non-regulated bus converter or a regulated bus
converter.
Input Under Voltage Protection (IUVP)
For most applications non-tantalum capacitors are preferred
due to the robustness of such capacitors to accommodate
high inrush currents of systems being powered from
very low impedance sources. It is recommended to use a
combination of ceramic capacitors and low-ESR electrolytic/
polymer bulk capacitors. The low ESR of ceramic capacitors
effectively limits the input ripple voltage level, while the
bulk capacitance minimizes deviations in the input voltage
at large load transients.
The product monitors the input voltage and will turn-on and
turn-off at configured thresholds (see Electrical
Specification). The turn-on input voltage threshold is set
higher than the corresponding turn-off threshold. Hence,
there is a hysteresis between turn-on and turn-off input
voltage levels. Once the input voltage falls below the
turn-off threshold, the device can respond in several ways
as follows:
1.
Immediate and definite shutdown of output voltage
until the fault is cleared by PMBus command
CLEAR_FAULTS or the output voltage is re-enabled.
If several products are connected in a phase spreading
setup the amount of input ripple current, and capacitance
per product, can be reduced.
2.
Immediate shutdown of output voltage while the
input voltage is below the turn-on threshold.
Operation resumes automatically and the output is
enabled when the input voltage has risen above the
turn-on threshold.
Input capacitors must be placed closely and with low
impedance connections to the VIN and GND pins in order to
be effective.
External Output Capacitors
The default response is option 2. The IUVP function can be
reconfigured using the PMBus commands
VIN_UV_FAULT_LIMIT (turn-off threshold),
VIN_UV_WARN_LIMIT (turn-on threshold) and
VIN_UV_FAULT_RESPONSE.
The output capacitor requirement depends on two
considerations; output ripple voltage and load transient
response. To achieve low ripple voltage, the output
capacitor bank must have a low ESR value, which is
achieved with ceramic output capacitors. A low ESR value
is critical also for a small output voltage deviation during
load transients. Designs with smaller load transients can
use fewer capacitors and designs with more dynamic load
content will require more load capacitors to achieve a small
output deviation. Improved transient response can also
be achieved by adjusting the settings of the control loop
of the product. Adding output capacitance decreases loop
band-width.
Input Over Voltage Protection (IOVP)
The product monitors the input voltage continously and will
respond as configured when the input voltage rises above
the configured threshold level (see Electrical Specification).
Refer to section “Input Under Voltage Protection” for
functionality, response configuration options and default
setting. The IOVP function can be reconfigured using
the PMBus commands VIN_OV_FAULT_LIMIT (turn-off
threshold), VIN_OV_WARN_LIMIT (turn-on threshold) and
VIN_OV_FAULT_RESPONSE.
It is recommended to locate low ESR ceramic and low ESR
electrolytic/polymer capacitors as close to the load as
possible, using several capacitors in parallel to lower the
effective ESR. It is important to use low resistance and low
inductance PCB layouts and cabling in order for capacitance
to be effective.
Input and Output Impedence
The impedance of both the input source and the load will
interact with the impedance of the product. It is important
that the input source has low characteristic impedance. If
the input voltage source contains significant inductance,
the addition of a capacitor with low ESR at the input of the
product will ensure stable operation.
Dynamic Loop Compensation (DLC)
The typical design of regulated power converters includes a
control function with a feedback loop that can be closed
using either analog or digital circuits. The feedback loop
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is required to provide a stable output voltage, but should
be optimized for the output filter to maintain output voltage
regulation during transient conditions such as sudden
changes in output current and/or input voltage. Digitally
controlled converters allow one to optimize loop parameters
100.0
without the need to change components on the board,
90.0
however, optimization can still be challenging because
80.0
the key parameters of the output filter include parasitic
impedances in the PCB and the often distributed filter
70.0
components themselves.
60.0
50.0
4 x 470 μF + 10 x 100 μF
10 x 470 μF + 10 x 100 μF
Dynamic Loop Compensation has been developed to solve
40.0
the problem of compensation for a converter with a difficult
30.0
to define output filter. This task is achieved by utilization of
algorithms that can identify an arbitrary output filter
based on accurate measurements of the output voltage in
response to a very small excitation signal initiated by the
20.0
10.0
0.0
150
200
250
300
350
400
450
500
ASCR
algorithm, or occurring due to the changes in operating
conditions, and automatically adjust feedback loop
parameters to match the output filter.
V =12 V, V =1 V, load step 25%-75%-25% , 2A/μs, fsw=320 kHz, Residual factor=90
I
O
Voltage deviation vs. control loop gain setting and output capacitance
Details of the algorithm that is used to characterize an
output filter and the different operational modes can be
found in the following sections.
The user may also adjust the residual factor, set by the
ASCR_CONFIG command, to improve the recovery time
after a load transient.
Control Loop
The products use a fully digital control loop that achieves
precise control of the entire power conversion process,
resulting in a very flexible device that is also very easy
to use. A non-linear charge-mode control algorithm is
implemented that responds to output current changes
within a single PWM switching cycle, achieving a smaller
total output voltage variation with less output capacitance
than traditional PWM controllers, thus saving cost and board
space. The algorithm is inherently stable at all conditions
due to a residual scheme.
130
110
90
10 x 470 μF + 10 x 100 μF
70
50
30
4 x 470 μF + 10 x 100 μF
Control may be set more or less aggressive by adjusting a
gain factor, set by the PMBus command ASCR_CONFIG.
Increasing the gain, i.e the control effort, will reduce the
voltage deviation at load transients, at the expense of
somewhat increased ripple on the output. Below graph
exemplifies the impact on load transient performance when
adjusting the gain factor.
50
60
70
80
90
100
110
Residual
V =12 V, V =1 V, load step 25%-75%-25% , 2A/μs, fsw=320 kHz, gain factor=300
I
O
Recovery time vs. control loop residual setting and output capacitance.
By default the product is configured with a moderate gain
setting to provide a trade-off between load transient
performance and output ripple for a wide range of operating
conditions. For a specific application the gain factor can be
increased with an improved load transient response.
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Remote Sense
Output Voltage Adjust using Pin-Strap Resistor
The product has remote sense to compensate the voltage
drops between the output and the point of load. The sense
traces should be located close to each other and to the PCB
ground layer to reduce noise susceptibility.
Using an external Pin-strap resistor, RSET, the output voltage
can be set to several predefined levels shown in the table
below. The resistor should be applied between the VSET pin
and the PREF pin as shown in the Typical Application Circuit.
Maximum 1% tolerance resistors are required.
In cases where the external output filter includes an
inductor (forming a pi filter) according to the picture below,
the LEXT/CEXT resonant frequency places an upper limit on the
controller loop bandwidth. If the resonant frequency is high
the sense lines can be connected after the filter (as shown
in the picture) – if the resonant frequency is low and the DC
drop from LEXT is acceptable, sensing before the filter may
be better.
RSET (kΩ)
0 (short)
10
Vout [V]
1.00
0.60
0.65
0.70
0.75
0.80
0.85
0.90
0.95
1.00
1.05
RSET (kΩ)
26.1
Vout [V]
1.10
1.15
1.20
1.25
1.30
1.40
1.50
1.60
1.70
1.80
1.20
28.7
11
31.6
12.1
34.8
13.3
38.3
14.7
42.2
16.2
46.4
Vout
17.8
51.1
LEXT
CO
CEXT
19.6
56.2
21.5
61.9
GND
23.7
infinite (open)
-S
+S
RSET also sets the maximum output voltage; see section
Output Voltage Range Limitation. The resistor is sensed
only during the initialization procedure after application of
input voltage. Changing the resistor value during normal
operation will not change the output voltage.
External output filter with inductor (pi filter).
Output Voltage Control
To control the output voltage the following options are
available:
Output Voltage Adjust using PMBus
1.
2.
Output voltage is controlled through the CTRL pin.
The output voltage set by pin-strap can be overridden
up to a certain level (see section Output Voltage Range
Limitation) by using the PMBus command VOUT_COMMAND.
See Electrical Specification for adjustment range.
Output voltage is controlled using the PMBus
command OPERATION.
The CTRL pin has an internal 10 kΩ pull-up resistor to 5 V.
The external device must provide a minimum required sink
current to guarantee a voltage not higher than the logic low
threshold level (see Electrical Characteristics). When the
CTRL pin is left open, the voltage generated on the CTRL pin
is 5 V.
Voltage Margining Up/Down
Using the PMBus interface it is possible to adjust the output
voltage to one of two predefined levels above or below the
nominal voltage setting in order to determine whether
the load device is capable of operating over its specified
supply voltage range. This provides a convenient method
for dynamically testing the operation of the load circuit over
its supply margin or range. It can also be used to verify the
function of supply voltage supervisors. Margin limits of the
nominal output voltage ±5% are default, but the margin
limits can be reconfigured using the PMBus commands
VOUT_MARGIN_LOW and VOUT_MARGIN_HIGH. Margining
is activated by the command OPERATION and can be used
regardless of the output voltage being enabled by the CTRL
pin or by the PMBus.
If the device is to be synchronized to an external clock
source, the clock frequency must be stable prior to enabling
the output voltage.
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Output Voltage Trim
Power Good
The actual output voltage can be trimmed to optimize
performance of a specific load by setting a non-zero value
for PMBus command VOUT_TRIM. The value of VOUT_TRIM
is summed with the nominal output voltage set by
VOUT_COMMAND, allowing for multiple products to be
commanded to a common nominal value, but with slight
adjustments per load.
The power good pin (PG) indicates when the product is
ready to provide regulated output voltage to the load.
During ramp-up and during a fault condition, PG is held
low. By default, PG is asserted high after the output has
ramped to a voltage above 90% of the nominal voltage,
and deasserted if the output voltage falls below 85% of the
nominal voltage. These thresholds may be changed using
the PMBus commands POWER_GOOD_ON and
Output Voltage Range Limitation
VOUT_UV_FAULT_LIMIT.
The output voltage range that is possible to set by
configuration or by the PMBus interface is hardware limited
by the pin-strap resistor RSET. The maximum output voltage
is set to 115% of the output value defined by RSET. This
protects the application circuit from an over voltage due to
an accidental PMBus command.
The time between when the POWER_GOOD_ON threshold is
reached and when the PG pin is actually asserted is set by
the PMBus command POWER_GOOD_DELAY. See Electrical
Specification for default value and range.
By default the PG pin is configured as an open drain output
but it is also possible to set the output in push-pull mode by
the command USER_CONFIG. The PG output is not defined
during ramp up of the input voltage due to the initialization
of the product.
The limitation applies to the actual regulated output voltage
rather than to the configured value. Thus, it is possible to
write and read back a VOUT_COMMAND value higher than
the limit, but the actual output voltage will be limited. The
output voltage limit can be reconfigured to a lower value by
writing the PMBus command VOUT_MAX.
Over Current Protection (OCP)
The product includes robust current limiting circuitry for
protection at continuous overload. After ramp-up is
complete the product can detect an output overload/short
condition. The following OCP response options are available:
Output Over Voltage Protection (OVP)
The product includes over voltage limiting circuitry for
protection of the load. The default OVP limit is 15% above
the nominal output voltage. The product can be configured
to respond in different ways to the output voltage exceeding
the OVP limit:
1.
Immediate and definite shutdown of output voltage
until the fault is cleared by PMBus command
CLEAR_FAULTS or the output voltage is re-enabled.
1.
Immediate and definite shutdown of output voltage
until the fault is cleared by PMBus command
CLEAR_FAULTS or the output voltage is re-enabled.
2.
Immediate shutdown of output voltage followed by
continous restart attempts of the output voltage
with a preset interval (“hiccup” mode).
2.
Immediate shutdown of output voltage followed by
continous restart attempts of the output voltage
with a preset interval (“hiccup” mode).
The default response from an over current fault is option 2.
Note that delayed shutdown is not supported. The load
distribution should be designed for the maximum output
short circuit current specified. The OCP limit and response
can be reconfigured using the PMBus commands
IOUT_AVG_OC_FAULT_LIMIT and
The default response is option 2. The OVP limit and fault
response can be reconfigured using the PMBus commands
VOUT_OV_FAULT_LIMIT, VOUT_OV_FAULT_RESPONSE
and OVUV_CONFIG.
MFR_IOUT_OC_FAULT_RESPONSE.
Output Under Voltage Protection (UVP)
Under Current Protection (UCP)
The product includes output under voltage limiting circuitry
for protection of the load. The default UVP limit is 15%
below the nominal output voltage. Refer to section Output
Over Voltage Protection for response configuration options
and default setting. The UVP limit and fault response can be
reconfigured using the PMBus commands
The product includes robust current limiting circuitry for
protection at continuous reversed current, due to a
synchronous rectifier ability to sink current. Refer to section
Over Current Protection for response configuration options
and default setting. The UCP limit and response can be
reconfigured using the PMBus commands
VOUT_UV_FAULT_LIMIT and VOUT_UV_FAULT_RESPONSE.
IOUT_AVG_UC_FAULT_LIMIT and
MFR_IOUT_UC_FAULT_RESPONSE.
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Switching Frequency
The default switching frequency is chosen as the best
tradeoff between efficiency and thermal performance,
SYNC
clock
output ripple and load transient performance. The switching
frequency can be reconfigured in a certain range using the
PMBus command FREQUENCY_SWITCH. Refer to Electrical
Phase
offset = 60°
Specification for default switching frequency and range.
Changing the switching frequency will affect efficiency and
power dissipation, load transient response (control loop
characteristics) and output ripple.
PWM pulse
(VO/VI = 0.165)
Illustration of phase offset.
Note that since the product has two phases the effective
switching frequency will be twice the configured value.
The phase offset is configured using the PMBus command
INTERLEAVE and is defined as:
Synchronization
Two or more products may be synchronized with an external
clock to eliminate beat frequencies reflected back to the
input supply rail. Eliminating the slow beat frequencies
(usually <10 kHz) eases the filtering requirements.
Synchronization can also be utilized for phase spreading,
described in section Phase Spreading.
Interleave_order is in the range 0-15. Number_in_group
is in the range 0-15 where a value of 0 means 16. The set
resolution for the phase offset is 360° / 16 = 22.5°.
By default Number_in_group = 0 and Interleave_order
The products can be synchronized with an external oscillator = Four LSB’s of set PMBus address (see section PMBus
or one product can be configured with the SYNC pin as a
SYNC output, working as a source of synchronization signal
for other products connected to the same synchronization
line. The SYNC pin of products being synchronized must be
configured as SYNC Input. Default configuration is using the
internal clock, independently of signal at the SYNC pin.
Synchronization is configured using PMBus command
MFR_USER_CONFIG.
Addressing).
Soft-start and Soft-stop
The soft-start and soft-stop control functionality allows the
output voltage to ramp-up and ramp-down with defined
timing with respect to the control of the output. This can
be used to control inrush current and manage supply
sequencing of multiple controllers.
The rise time is the time taken for the output to ramp to its
target voltage, while the fall time is the time taken for the
output to ramp down from its regulation voltage to 0 V. The
on delay time sets a delay from when the output is enabled
until the output voltage starts to ramp up. The off delay
time sets a delay from when the output is disabled until the
output voltage starts to ramp down.
Phase Spreading
When multiple products share a common DC input supply,
spreading of the switching clock phase between the
products can be utilized. This dramatically reduces input
capacitance requirements and efficiency losses, since the
peak current drawn from the input supply is effectively
spread out over the whole switch period. This requires that
the products are synchronized using the SYNC pin.
Output
control
The phase offset is measured from the rising edge of the
applied external clock to the rising edge of the PWM pulse
as illustrated below.
On
Delay
Time
On
Ramp
time
Off
Delay
Time
Off
Ramp
Time
VOUT
Illustration of Soft-Start and Soft-Stop.
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By default soft-stop is disabled and the regulation of output
voltage stops immediately when the output is disabled.
Soft-stop can be enabled through the PMBus command
VOUT
Soft-start
ramp time
ON_OFF_CONFIG. The delay and ramp times can be
reconfigured using the PMBus commands TON_DELAY,
TON_RISE, TOFF_DELAY and TOFF_FALL.
Output Voltage Sequencing
A group of products may be configured to power up in a
predetermined sequence. This feature is especially useful
when powering advanced processors, FPGAs, and ASICs
that require one supply to reach its operating voltage prior
Time
Illustration of Pre-Bias Startup.
to another.
Voltage Tracking
VOUT
The product integrates a lossless tracking scheme that
allows its output to track a voltage that is applied to the
VTRK pin with no external components required. During
ramp-up, the output voltage follows the VTRK voltage until
the preset output voltage level is met. The product offers
two modes of tracking as follows:
V
V
OUT1
OUT2
1.
Coincident. This mode configures the product to
ramp its output voltage at the same rate as the
voltage applied to the VTRK pin.
Time
Illustration of Output Voltage Sequencing.
Different types of multi-product sequencing are supported:
1.
Time based sequencing. Configuring the start delay
and rise time of each module through the PMBus
interface and by connecting the CTRL pin of each
product to a common enable signal.
2.
3.
Event based sequencing. Routing the PG pin signal
of one module to the CTRL pin of the next module in
the sequence.
Illustration of Coincident Voltage Tracking.
DDC based sequencing. Power Good triggered
sequencing with the same flexibility as time based
sequencing. Configured through the PMBus interface
and uses the DDC bus, see section Digital-DC bus.
2.
Ratiometric. This mode configures the product to
ramp its output voltage at a rate that is a
percentage of the voltage applied to the VTRK pin.
The default setting is 50%, but a different tracking
ratio may be set by an external resistive voltage
divider.
Pre-Bias Startup Capability
Pre-bias startup often occurs in complex digital systems
when current from another power source is fed back
through a dual supply logic component, such as FPGAs or
ASICs. There could also be still charged output capacitors
when starting up shortly after turn-off.
The product incorporates synchronous rectifiers, but will not
sink current during startup, or turn off, or whenever a fault
shuts down the product in a pre-bias condition.
Illustration of Ratiometric Voltage Tracking.
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The master device in a tracking group is defined as the
device that has the highest target output voltage within
the group. This master device will control the ramp rate
of all tracking devices and is not configured for tracking
mode. Any device configured in tracking mode will ignore
its soft-start/stop settings and take on the turn-on/turn-off
characteristics of the voltage present at the VTRK pin.
All of the CTRL pins in the tracking group must be
Broadcast Control
The product can be configured to broadcast output voltage
enable or setting of output voltage level over the DDC bus
to other devices in the group. If configured to do so, a
device receiving a PMBus OPERATION command or
VOUT_COMMAND command will broadcast the same
command over the DDC bus, and other devices on the DDC
bus will respond to the same commands. Broadcast control
is configured using the PMBus command DDC_GROUP.
connected and driven by a single logic source. Tracking is
configured using the PMBus command TRACK_CONFIG.
Fault Spreading
Digital-DC Bus
The product can be configured to broadcast a fault event
over the DDC bus to the other devices in the group.
When a nondestructive fault occurs and the device is
configured to shut down on a fault, the device will shut
down and broadcast the fault event over the DDC bus. The
other devices on the DDC bus will shut down together if
configured to do so, and will attempt to re-start in their
The Digital-DC Bus, DDC, is used to communicate between
products. This dedicated single wire bus provides the
communication channel between devices for features such
as sequencing, fault spreading and current sharing. The
DDC solves the PMBus data rate limitation. The DDC pin on
all devices in an application should be connected together.
A pullup resistor is required on the common DDC in order to prescribed order if configured to do so. Fault spreading is
guarantee the rise time as follows:
configured using the PMBus command DDC_GROUP and
LEGACY_FAULT_GROUP.
T = RDDCCDDC≤1μs
Where RDDC is the pull up resistor value and CDDC is the bus
loading. The pull-up resistor should be tied to an external
supply voltage in range from 2.5 to 5.5 V, which should be
present prior to or during power-up.
The DDC is an internal bus, such that it is only connected
across the modules and not the PMBus system host. DDC
addresses are assigned on a rail level, i.e. modules within
the same current sharing group share the same DDC
address. Addressing rails across the DDC is done with a 5
bit DDC ID, yielding a theoretical total of 32 rails that can
be shared with a single DDC bus.
By default the DDC ID is set to the five LSB’s of set PMBus
address (see section PMBus Addressing).
Parallel Operation (Current Sharing)
Paralleling multiple products can be used to increase
the output current capability of a single power rail. By
connecting the DDC and SYNC pins of each device and
configuring the devices as a current sharing rail, the
units will share the current equally, enabling up to 100%
utilization of the current capability for each device in the
current sharing rail. The product uses a low bandwidth,
first-order digital current sharing by aligning the output
voltage of the slave devices to deliver the same current as
the master device. Artificial droop resistance is added to
the output voltage path to control the slope of the load line
curve, calibrating out the physical parasitic mismatches due
to power train components and PWB layout. Up to 4 devices
can be configured in a given current sharing group.
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THERMAL CONSIDERATION
NDM3Z-90V
General
The product is designed to operate in different thermal
AIR FLOW
environments and sufficient cooling must be provided
to ensure reliable operation. Cooling is achieved mainly
by conduction, from the pins to the host board, and
convection, which is dependent on the airflow across the
product. Increased airflow enhances the cooling of the
product. The Output Current Derating graph found in the
Output section for each model provides the available output
current vs. ambient air temperature and air velocity at
specified VI. The product is tested on a 254 x 254 mm, 35
μm (1 oz), test board mounted vertically in a wind tunnel
with a cross-section of 608 x 203 mm. The test board has
16 layers.
P3
P2
P1
Temperature positions and air flow direction.
Note that the same PCB is used for both the NDM3Z-90HT
and the NDM3Z-90V. Thus, the positions indicated in the
pictures apply to both versions.
Definition of Product Operating Temperature
The temperature at positions P1, P2, P3, P4 and P5 should
not exceed the maximum temperatures in the table below.
The number of measurement points may vary with different
thermal designs and topologies. Temperatures above
specified maximum measured at the specified positions are
not allowed and may cause permanent damage.
Definition of Reference Temperature TP1
The temperature at position P1 has been used as a
reference temperature for the Electrical Specification data
provided.
Note that the max values are the absolute maximum
rating (non destruction) and that the provided Electrical
Specification data is guaranteed up to TP1 = +95°C.
Over Temperature Protection (OTP)
The products are protected from thermal overload by dual
internal over temperature shutdown functions:
1.
2.
Temperature in VR controller, located in position P3.
Position
Description
power switch
power switch
VR controller
power inductor
power inductor
Max. Temperature
130°C
The highest temperature of power switches,
located in positions P1 and P2.
P1
P2
P3
P4
P5
130°C
These temperatures are continously monitored and when a
temperature rises above the configured fault threshold level
the product will respond as configured. The product can
respond in several ways as follows:
125°C
125°C
125°C
1.
Immediate and definite shutdown of output voltage
until the fault is cleared by PMBus command
NDM3Z-90HT
CLEAR_FAULTS or the output voltage is re-enabled.
2.
Immediate shutdown of output voltage while the
temperature is above the warning threshold.
Operation resumes automatically and the output is
enabled when the temperature has fallen below the
warning threshold, i.e. there is a hysteresis defined
by the difference between the fault threshold and
the warning threshold.
AIR FLOW
P4
P5
Default response is option 2. The default OTP thresholds
and hysteresis are specified in Electrical Characteristics.
The OTP limit, hysteresis and response for temperature in
position P3 is configured using the PMBus commands
OT_FAULT_LIMIT, OT_WARN_LIMIT and
Temperature positions and air flow direction (top view).
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OT_FAULT_RESPONSE. The OTP limit, hysteresis and
response for highest temperature of positions P1 and P2 are
configured using the PMBus commands MFR_VMON_OV_
FAULT_LIMIT and VMON_OV_FAULT_RESPONSE.
PCB Layout Considerations
The radiated EMI performance of the product will depend on
the PCB layout and ground layer design. If a ground layer is
used, it should be connected to the output of the product
and the equipment ground or chassis.
A ground layer will increase the stray capacitance in the PCB
and improve the high frequency EMC performance.
Further layout recommendations are listed below.
•
The pin strap resistors, RSET, and RSA should be
placed as close to the product as possible to
minimize loops that may pick up noise.
Avoid current carrying planes under the pin strap
resistors and the PMBus signals.
The capacitors CIN should be placed as close to the
input pins as possible.
The capacitors COUT should be placed close to the
load.
•
•
•
•
•
The point of output voltage sense should be “down
stream” of COUT.
Care should be taken in the routing of the
connections from the sensed output voltage to the
+S and –S terminals. These sensing connections
should be routed as a differential pair, preferably
between ground planes which are not carrying high
currents. The routing should avoid areas of high
electric or magnetic fields.
•
If possible use planes on several layers to carry
VIN, VOUT and GND. There should be a large
number of vias close to the VIN, VOUT and GND
pads in order to lower input and output impedances
and improve heat spreading between the product
and the host board.
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board, up to a recommended maximum temperature of
245°C could be used, if the products are kept in a controlled
environment (dry pack handling and storage) prior to
assembly.
SOLDERING INFORMATION - Surface Mounting
and Through-Hole Mount Pin in Paste Assembly
The surface mount product is intended for forced convection
or vapor phase reflow soldering in SnPb or Pb-free
processes. The reflow profile should be optimised to avoid
excessive heating of the product. It is recommended
to have a sufficiently extended preheat time to ensure
an even temperature across the host PWB and it is also
recommended to minimize the time in reflow.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board, since cleaning residues may
affect long term reliability and isolation voltage.
Lead-free (Pb-free) solder processes
For Pb-free solder processes, a pin temperature (TPIN) in
excess of the solder melting temperature (TL, 217 to
221°C for SnAgCu solder alloys) for more than 60 seconds
and a peak temperature of 245°C on all solder joints is
recommended to ensure a reliable solder joint.
Maximum Product Temperature Requirements
Top of the product PWB near pin 10A is chosen as reference
location for the maximum (peak) allowed product
temperature (TPRODUCT) since this will likely be the warmest
part of the product during the reflow process.
General reflow process
SnPb eutectic
3°C/s max
183°C
Pb-free
3°C/s max
221°C
specifications
average ramp up (TPRODUCT
Typical solder melting
)
SnPb solder processes
(liquidus) temperature (TL)
For SnPb solder processes, the product is qualified for MSL
1 according to IPC/JEDEC standard J-STD-020C. During
reflow TPRODUCT must not exceed 225 °C at any time.
Minimum reflow time above TL
60s
60s
Minimum pin temperature (TPIN
)
210°C
235°C
Peak product temperature (TPRODUCT
)
225°C
260°C
Dry Pack Information
Average ramp-down (TPRODUCT
)
6°C/s max
6 minutes
6°C/s max
8 minutes
Products intended for Pb-free reflow soldering processes are
delivered in standard moisture barrier bags according to
IPC/JEDEC standard J-STD-033 (Handling, packing, shipping
and use of moisture/reflow sensitivity surface mount
devices). Using products in high temperature Pb-free
soldering processes requires dry pack storage and handling.
In case the products have been stored in an uncontrolled
environment and no longer can be considered dry, the
modules must be baked according to J-STD-033.
Maximum time 25°C to peak
Temperature
TPRODUCT maximum
TPIN minimum
Pin
profile
TL
Product
profile
Time in
reflow
Thermocoupler Attachment
Time in preheat
/ soak zone
Time 25°C to peak
Time
Minimum Pin Temperature Recommendations
Pin number 3C is chosen as reference location for the
minimum pin temperature recommendation since this will
likely be the coolest solder joint during the reflow process.
SnPb solder processes
Pin 3C for measurement of minimum
Pin (solder joint) temperature, TPIN
For SnPb solder processes, a pin temperature (TPIN) in
excess of the solder melting temperature, (TL, 183°C
for Sn63Pb37) for more than 60 seconds and a peak
temperature of 220°C is recommended to ensure a reliable
solder joint. For dry packed products only: depending on
the type of solder paste and flux system used on the host
Top of PWB near
Pin 10A for measurement
of maximum product temperature,
TPRODUCT
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SOLDERING INFORMATION - Hole Mounting
Tray Specifications
material
antistatic PS
101 < Ohm/square < 106
the trays are not bakeable
18 mm [0.724 inch]
90 products (5 full trays/box)
TBD
The hole mounted product is intended for plated through
surface resistance
hole mounting by wave or manual soldering. The pin
temperature is specified to maximum to 270°C for
maximum 10 seconds. A maximum preheat rate of 4°C/s
and maximum preheat temperature of 150°C is suggested.
bakeability
tray thickness
box capacity
tray weight
When soldering by hand, care should be taken to avoid
direct contact between the hot soldering iron tip and the
pins for more than a few seconds in order to prevent
overheating.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board. The cleaning residues may
affect long time reliability and isolation voltage.
Delivery Package Information
The products are delivered in antistatic trays and in
antistatic carrier tape (EIA 481 standard).
Carrier Tape Specifications
material
surface resistance
bakeability
antistatic PS
105 < Ohm/square < 1010
the tape is not bakeable
72 mm [2.83 inch]
32 mm [1.26 inch]
14.6 mm [0.575 inch]
330 mm [13 inch]
130 products/reel
TBD
tape width, W
pocket pitch, P1
pocket depth, K0
reel diameter
reel capacity
reel weight
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PRODUCT QUALIFICATION SPECIFICATIONS
Characteristics
External visual inspection
IPC-A-610
Temperature range
Number of cycles
Dwell/transfer time
-40 to 100°C
1000
15 min/0-1 min
Change of temperature
(Temperature cycling)
IEC 60068-2-14 Na
Temperature TA
Duration
-45°C
72 h
Cold (in operation)
Damp heat
IEC 60068-2-1 Ad
IEC 60068-2-67 Cy
IEC 60068-2-2 Bd
Temperature
Humidity
Duration
85°C
85 % RH
1000 hours
Temperature
Duration
125°C
1000 h
Dry heat
Electrostatic discharge
susceptibility
IEC 61340-3-1, JESD 22-A114
IEC 61340-3-2, JESD 22-A115
Human body model (HBM)
Machine Model (MM)
Class 2, 2000 V
Class 3, 200 V
Water
Glycol ether
Isopropyl alcohol
55°C
35°C
35°C
Immersion in cleaning solvents
Mechanical shock
IEC 60068-2-45 XA, method 2
IEC 60068-2-27 Ea
Peak acceleration
Duration
100 g
6 ms
Level 1 (SnPb-eutectic)
Level 3 (Pb Free)
225°C
260°C
Moisture reflow sensitivity1
Operational life test
J-STD-020C
MIL-STD-202G, method 108A
IEC 60068-2-20 Tb, method 1A
Duration
1000 h
Solder temperature
Duration
270°C
10-13 s
Resistance to soldering heat2
IEC 60068-2-21 Test Ua1
IEC 60068-2-21 Test Ue1
Through hole mount products
Surface mount products
All leads
All leads
Robustness of terminations
Solderability
Preconditioning
Temperature, SnPb Eutectic
Temperature, Pb-free
150°C dry bake 16 h
215°C
235°C
IEC 60068-2-58 test Td 1
Preconditioning
Temperature, SnPb Eutectic
Temperature, Pb-free
Steam ageing
235°C
245°C
IEC 60068-2-20 test Ta 2
Frequency
Spectral density
Duration
10 to 500 Hz
0.07 g2/Hz
10 min in each direction
Vibration, broad band random
IEC 60068-2-64 Fh, method 1
Notes:
1. Only for products intended for reflow soldering (surface mount products).
2. Only for products intended for wave soldering (plated through hole products)
General Information
The calculations for CUI module failure rate (λ) and mean time between failures (MTBF) are calculated at maximum output
power and operating ambient temperature (TA) of + 40ºC. The Telcordia SR-332 Issue 2 Method 1 (parts count method) is
used to calculate the mean steady-state failure rate and standard deviation (σ). The MTBF is defined as 1/ λ.
For the NDM3Z-90:
λ
36 nFailures/h
7 nFailures/h
27 Mh
σ
MTBF
MTBF at 90% confidence level
22 Mh
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Compatibility with RoHS Requirements
CUI NDM modules are compatible with the relevant clauses and requirements of RoHS directive 2011/65/EU. They have a
maximum concentration of 0.01% by weight of cadmium and 0.1% by weight in homogeneous materials for lead, mercury,
hexavalent chromium, PBB and PBDE.
The Statement of Compliance document notes exemptions to the RoHS directive present in CUI Novum modules.
CUI Novum modules meet and will continue to meet the obligations under regulation (EC) No 1907/2006 addressing the
registration, evaluation, authorization and restriction of chemicals (REACH) as they become applicable. CUI will utilize the
product materials declarations to communicate information on substances in the products.
Quality Statement
High quality of CUI products are achieved through conservative design rules, numerous design reviews and product
qualifications. Products are designed and manufactured with a philosophy where quality systems and methods such as ISO
9000, Six Sigma and SPC are employed to ensure continuous improvements. Modules with early failures are screened out
and parts are subjected to ATE-based final testing.
Safety
CUI NDM modules are designed in accordance with safety standards IEC/EN/UL 60950-1 Safety of Information Technology
Equipment.
On-board DC/DC converters and DC/DC regulators are defined as component power supplies and thus cannot fully comply
with the provisions of any safety requirements without “conditions of acceptability”. Clearance between conductors and
between conductive parts of the component power supply and conductors on the board in the final product must meet
the applicable safety requirements. Certain conditions of acceptability apply for component power supplies with limited
stand-off (see Mechanical Information and Safety Certificate for further information). It is the responsibility of the
installer to ensure that the final product housing these components complies with the requirements of all applicable safety
standards and regulations for the final product.
CUI NDM modules are certified in accordance with EN 60950-1 and UL 60950-1 recognized. All parts of the CUI NDM
modules meet the flammability rating requirements for V-0 class material according to IEC 60695-11-10, Fire hazard
testing, test flames – 50 W horizontal and vertical flame test methods.
A slow blow fuse is recommended to be placed at the input of each DC/DC converter. The fuse should be placed in front
of the input filter if such a filter is used. The fuse will provide the following functions in the rare event of a component
problem that imposes a short circuit on the input source:
• Isolate the fault from the input power source so as to isolate the fault from the other parts of the system
• Protect the distribution wiring from excessive current thus preventing hazardous overheating
The DC/DC regulator output is SELV if the input source meets the requirements for SELV circuits according to
IEC/EN/UL 60950-1.
cui.com
For more information, please visit the product page.
CUI Inc │ MODEL: NDM3Z-90 │ DESCRIPTION: AUTO COMPENSATED, DIGITAL DC-DC POL CONVERTER
date 12/23/2015 │ page 33 of 33
REVISION HISTORY
rev.
date
1.02
1.03
09/03/2015
12/21/2015
The revision history provided is for informational purposes only and is believed to be accurate.
Headquarters
20050 SW 112th Ave.
Tualatin, OR 97062
800.275.4899
Fax 503.612.2383
cui.com
techsupport@cui.com
Architects of Modern Power and AMP Group are trademarks of CUI.
Novum is a trademark of CUI.
PMBus is a trademark of SMIF, Inc.
Digital-DC is a trademark of Intersil Corporation.
CUI Novum products use patented technology licensed from Power-One.
All other trademarks are the property of their respective owners.
CUI offers a two (2) year limited warranty. Complete warranty information is listed on our website.
CUI reserves the right to make changes to the product at any time without notice. Information provided by CUI is believed to be accurate and reliable. However, no responsibility is
assumed by CUI for its use, nor for any infringements of patents or other rights of third parties which may result from its use.
CUI products are not authorized or warranted for use as critical components in equipment that requires an extremely high level of reliability. A critical component is any component of a
life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
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