NQB-100NWA-DBNH-000-ESA [CUI]
FULLY REGULATED ADVANCED BUS CONVERTERS; 全面监管的先进的总线转换器![NQB-100NWA-DBNH-000-ESA](http://pdffile.icpdf.com/pdf1/p00187/img/icpdf/NQB-10_1056836_icpdf.jpg)
型号: | NQB-100NWA-DBNH-000-ESA |
厂家: | ![]() |
描述: | FULLY REGULATED ADVANCED BUS CONVERTERS |
文件: | 总30页 (文件大小:1740K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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date 02/20/2013
page 1 of 30
SERIES: NQB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
FEATURES
• industry standard quarter-brick
GENERAL CHARACTERISTICS
• industry standard footprint
• isolated topology
57.9 x 36.8 x 11.3 mm
(2.28 x 1.45 x 0.445 in)
• high power density
• industry-leading power density for
telecom and datacom 127~141W / sq. in
• high efficiency, typ. 96.4% at half load,
12 Vout
• fast transient response
• high conversion efficiency
• wide range of input and output
characteristics available
• fully regulated advanced bus converter
from 36~75Vin
• 2,250 Vdc input to output isolation
• fast feed forward regulation to manage
line transients
• optional baseplate for high temperature
applications
• droop load sharing with 10% current
share accuracy
• 2.9 million hours MTBF
• ISO 9001/14001 certified supplier
input voltage
output voltage
output current
output wattage
MODEL
max
max
(Vdc)
(Vdc)
12
(A)
(W)
NQB-420NWA-AN
NQB-468NMA-AN
NQB-415NWB-AN
NQB-462NMB-AN
36~75
40~60
36~75
40~60
35
39
35
39
420
468
415
462
12
12.45
12.45
cui.com
CUI Inc │SERIES: NQB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 02/20/2013 │ page 2 of 30
PART NUMBER KEY
NQB- XXX N X X - X X X X - XXX -ES X
Base Number
Engineering Phase:
A~Z
Design Output Power:
1~999
Engineering Sample:
ES
No Digital Interface
Firmware Configuration:
000~ZZZ
Input Voltage Range:
W = wide (36~75 V)
M = medium (40~60 V)
Heatsink Option:
"blank" = open frame
H = heatsink flat
L = heatsink lateral fins
T = heatsink transverse fins
G = heatsink with GND pin
Nominal Output Voltage:
A = 12.0 V
B = 12.45 V
C = 9.6 V
D = 9.0 V
E = 5.0 V
Enable Logic Sense:
N = negative logic
P = positive logic
Load Sharing Function:
D = Vout droop
Pin Description:
A = 5.33 mm (0.210 in.)
B = 4.57 mm (0.180 in.)
C = 3.69 mm (0.145 in.)
D = 2.79 mm (0.110 in.)
S = SMT
Packaging:
Example part number: NQB-420NWA-AN-001
20 converters(through hole pin)/tray, PE foam dissipative
20 converters(surface mount pin)/tray, Antistatic PPE
420 W output power, no digital pins
wide input voltage range, 12.0 V output
5.33 mm pins, negative enable logic
firmware revision 001
CONTENTS
Part Number Key........................................................2 EMC Specification.........................................19
General Information...................................................3 Operating Information...................................19
Safety Specification....................................................3 Thermal Consideration..................................21
Absolute Maximum Ratings..........................................4 Connections............................................22
Mechanical Information.................................23
Electrical Specification:
Soldering Information...................................26
Delivery Package Information.........................27
Product Qualification Specification...................29
12V,35A, 420W,36~75Vin; NQB-420NWA-AN....................5
12V, 39A, 468W, 40~60Vin; NQB-468NMA-AN..................9
12.45 V, 35 A, 415 W, 36~75 Vin; NQB-415NWB-AN............13
12.45 V, 39 A, 462 W, 40~60 Vin; NQB-420NMB-AN............16
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CUI Inc │SERIES: NQB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 02/20/2013 │ page 3 of 30
General Information
Reliability
the requirements of all applicable safety standards and
regulations for the final product.
The failure rate (λ) and mean time between failures
(MTBF= 1/ λ) is calculated at max output power and
an operating ambient temperature (TA) of +40°C. CUI
Power Modules uses Telcordia SR-332 Issue 2 Method 1 to
calculate the mean steady-state failure rate and standard
deviation (σ).
Component power supplies for general use should comply
with the requirements in IEC/EN/UL 60950 1 Safety
of Information Technology Equipment. Product related
standards, e.g. IEEE 802.3af Power over Ethernet, and
ETS 300132 2 Power interface at the input to telecom
equipment, operated by direct current (dc) are based on
IEC/EN/UL 60950 1 with regards to safety.
Telcordia SR-332 Issue 2 also provides techniques to
estimate the upper confidence levels of failure rates based
on the mean and standard deviation.
CUI Power Modules DC/DC converters and DC/DC
regulators are UL 60950 1 recognized and certified in
accordance with EN 60950 1. The flammability rating for
all construction parts of the products meet requirements
for V 0 class material according to IEC 60695 11 10, Fire
hazard testing, test flames – 50 W horizontal and vertical
flame test methods.
Mean steady-state failure rate, λ Std. deviation, σ
421 n Failures/h
60.9 nFailures/h
MTBF (mean value) for the NQB series = 2.9 Mh.
MTBF at 90% confidence level = 2.4 Mh
Compatibility with RoHS requirements
Isolated DC/DC converters
The products are compatible with the relevant clauses
and requirements of the RoHS directive 2011/65/EU and
have a maximum concentration value of 0.1% by weight
in homogeneous materials for lead, mercury, hexavalent
chromium, PBB and PBDE and of 0.01% by weight in
homogeneous materials for cadmium.
Galvanic isolation between input and output is verified
in an electric strength test and the isolation voltage
(Viso) meets the voltage strength requirement for basic
insulation according to IEC/EN/UL 60950-1.
It is recommended to use a slow blow fuse at the input
of each DC/DC converter. If an input filter is used in the
circuit the fuse should be placed in front of the input filter.
In the rare event of a component problem that imposes a
short circuit on the input source, this fuse will provide the
following functions:
Exemptions in the RoHS directive utilized in CUI
Power Modules products are found in the Statement of
Compliance document.
Safety Specification
Reliability
•
Isolate the fault from the input power source so as
not to affect the operation of other parts of
the system
CUI Power Modules DC/DC converters and DC/DC
regulators are designed in accordance with the safety
standards IEC 60950 1, EN 60950 1 and UL 60950 1
Safety of Information Technology Equipment.
•
Protect the distribution wiring from excessive
current and power loss thus preventing hazardous
overheating
The DC/DC converter output is considered as safety extra
low voltage (SELV) if one of the following conditions is
met:
IEC/EN/UL 60950 1 contains requirements to prevent
injury or damage due to the following hazards:
•
•
•
•
•
•
Electrical shock
Energy hazards
Fire
Mechanical and heat hazards
Radiation hazards
Chemical hazards
•
The input source has double or reinforced
insulation from the AC mains according to IEC/EN/
UL 60950-1
•
The input source has basic or supplementary
insulation from the AC mains and the input
of the DC/DC converter is maximum 60
Vdc and connected to protective earth according to
IEC/EN/UL 60950-1
On-board DC/DC converters and DC/DC regulators are
defined as component power supplies. As components
they cannot fully comply with the provisions of any
safety requirements without “conditions of acceptability”.
Clearance between conductors and between conductive
parts of the component power supply and conductors on
the board in the final product must meet the applicable
safety requirements. Certain conditions of acceptability
apply for component power supplies with limited stand-off
(see Mechanical Information for further information). It is
the responsibility of the installer to ensure that the final
product housing these components complies with
•
The input source has basic or supplementary
insulation from the AC mains and the DC/DC
converter output is connected to protective earth
according to IEC/EN/UL 60950-1
Non - isolated DC/DC regulators
The DC/DC regulator output is SELV if the input source
meets the requirements for SELV circuits according to IEC/
EN/UL 60950-1.
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CUI Inc │SERIES: NQB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 02/20/2013 │ page 4 of 30
Absolute Maximum Ratings
parameter
conditions/description
min
-40
-55
typ
max
+125
+125
units
°C
operating temperature (TP1)
storage temperature (TS)
see thermal consideration section
°C
+80
+65*
input voltage (VI)
-0.5
V
Vdc
V
isolation voltage (Viso)
input voltage transient (Vtr)
input to output test voltage, see note 1
2250
according to ETSI EN 300 132-2 and Telcordia GR-
1089-CORE
+100
+80*
remote control pin voltage (VRC) see operating information section
-0.3
18
V
Stress in excess of Absolute Maximum Ratings may cause permanent damage. Absolute Maximum Ratings, sometimes referred to as no destruction limits, are normally tested with one
parameter at a time exceeding the limits of Output data or Electrical Characteristics. If exposed to stress above these limits, function and performance may degrade in an unspecified
manner.
Note
1: Isolation voltage (input/output to base-plate) max 750 Vdc.
* Applies for the narrow input version VI= 40-60 V
Fundamental Circuit Diagram
+IN
+OUT
-OUT
-IN
Auxillary
Supply
Driver
Control
RC
RC isolation
Functional Description
TP1, TP3 = -40 to +90ºC, VI = 36 to 75 V.
Typical values given at: TP1, TP3 = +25°C, VI= 53 V, max IO , unless otherwise specified under Conditions
Configuration File: 190 10-CDA 102 0314/001
parameter
conditions/description
min
typ
max
units
fault protection
characteristics
fault limit
33
V
%
V
input under voltage lockout
(UVLO)
setpoint accuracy
hysteresis
delay
-2
2
2
300
μs
output voltage - under voltage
protection
fault limit
fault response time
0
200
V
μs
output voltage - over voltage
protection
fault limit
fault response time
15.6
200
V
μs
setpoint accuracy (IO)
fault limit
fault response time
-6
6
%
A
μs
over current protection (OCP)
41
200
fault limit
hysteresis
fault response time
125
10
300
ºC
ºC
μs
over temperature protection
(OTP)
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CUI Inc │SERIES: NQB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 02/20/2013 │ page 5 of 30
Electrical Specification
12.0 V, 35 A, 420 W
TP1, TP3 = -40 to +90ºC, VI = 36 to 75 V.
Typical values given at: TP1, TP3 = +25°C, VI = 53 V, max IO, unless otherwise specified under Conditions.
Additional Cout = 3.5 mF, Configuration File: 19010-CDA 102 0314/001
parameter
conditions/description
min
36
typ
max
75
units
V
input voltage range (VI)
turn-off input voltage (VIoff
)
decreasing input voltage
increasing input voltage
32
33
35
18
34
V
turn-on input voltage (VIon)
internal input capacitance (CI)
output power (PO)
34
36
V
μF
W
0
420
50% of max IO
max IO
50% of max IO, VI = 48 V
max IO, VI = 48 V
96.2
95.5
96.4
95.5
%
%
%
%
efficiency (η)
power dissipation (Pd)
input idling power (Pli)
input standby power (PRC)
switching frequency (fs)
max IO
19.8
3.3
29.5
W
W
IO = 0 A, VI = 53 V
VI = 53 V (turned off with RC)
0-100% of max IO
0.4
W
140
kHz
output voltage setting and ac-
curacy (VOi)
TP1 = +25°C, VI = 53 V, IO = 35 A
0-100% of max IO
11.88
11.76
12.0
12.12
12.24
V
V
output voltage tolerance band
(VO)
line regulation (VO)
load regulation (VO)
max IO
21
6
55
40
mV
mV
VI = 53 V, 0-100% of max IO
load transient voltage deviation VI = 53 V, load step 25-75-25% of max IO, di/dt =
±0.4
150
8
V
(Vtr)
1 A/μs
load transient recovery time
(ttr)
VI = 53 V, load step 25-75-25% of max IO, di/dt =
1 A/μs
µs
ramp-up time (tr) - (from
10−90% of VOi)
10-100% of max IO, TP1, TP3 = 25ºC, VI = 53 V
10-100% of max IO, TP1, TP3 = 25ºC, VI = 53 V
ms
ms
start-up time (ts) - (from VI
connection to 90% of VOi)
24
VI shut-down fall time (tf) -
(from VI off to 10% of VO)
max IO
IO = 0 A, CO = 0 mF
3.6
7
ms
s
RC start-up time (tRC)
max IO
12
ms
RC shut-down fall time (tRC) -
(from RC off to 10% of VO)
max IO
IO = 0 A, CO = 0 mF
5.1
7
ms
s
output current (IO)
0
35
44
A
A
A
current limit threshold (Ilim)
short circuit current (Isc)
VO = 10.8 V, TP1, TP3 < max TP1, TP3
TP1, TP3 = 25ºC, see Note 1
37
41
12
recommended capacitive load
(Cout)
TP1, TP3 = 25ºC, see Note 2
0.1
3.5
6
mF
output ripple & noise (VOac
)
See ripple & noise section, max IO , see Note 3
TP1, TP3 = 25°C, VI = 53 V, 10-100% of max IO
60
150
mVp-p
V
over voltage protection (OVP)
15.6
sink current (note 4), see operating information
trigger level, decreasing RC-voltage
trigger level, increasing RC-voltage
0.7
mA
V
V
remote control (RC)
2.6
2.9
Note
1: OCP in hic-up mode
2: Low ESR-value
3: Cout = 100 µF, external capacitance
4: Sink current drawn by external device connected to the RC pin. Minimum sink current required guaranteeing activated RC function.
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CUI Inc │SERIES: NQB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 02/20/2013 │ page 6 of 30
Typical Characteristics
12.0 V, 35 A / 420 W
Efficiency
Power Dissipation
[%]
100
[W]
24
20
16
12
8
95
90
85
80
36 V
48 V
53 V
36 V
48 V
53 V
75 V
75 V
4
75
0
0
5
10
15
20
25
30
35 [A]
0
5
10
15
20
25
30
35 [A]
Dissipated power vs. load current and input voltage at
TP1, TP3 = +25°C
Efficiency vs. load current and input voltage at TP1, TP3 = +25 C
Output Characteristics
Current Limit Characteristics
[V]
[V]
13.0
12.2
11.0
9.0
7.0
5.0
3.0
12.1
36 V
48 V
53 V
75 V
36V
48V
53V
75V
12.0
11.9
11.8
0
5
10
15
20
25
30
35 [A]
35
37
39
41
43
45 [A]
Output voltage vs. load current at TP1, TP3 = +25°C
Output voltage vs. load current at IO > max IO , TP1, TP3 = +25°C
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CUI Inc │SERIES: NQB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 02/20/2013 │ page 7 of 30
Typical Characteristics
12.0 V, 35 A / 420 W
Start-up
Shut-down
Start-up enabled by connecting VI at:
TP1, TP3 = +25°C, VI = 53 V,
IO = 35 A resistive load.
Top trace: output voltage (5 V/div.).
Bottom trace: input voltage (50 V/div.).
Time scale: (10 ms/div.).
Shut-down enabled by disconnecting VI at: Top trace: output voltage (5 V/div.).
Bottom trace: input voltage (50 V/div.).
Time scale: (2 ms/div.).
TP1, TP3 = +25°C, VI = 53 V,
IO =35 A resistive load.
Output Ripple & Noise
Output Load Transient Response
Output voltage ripple at:
TP1, TP3 = +25°C, VI = 53 V,
IO = 35 A resistive load.
Trace: output voltage (50 mV/div.).
Time scale: (2 µs/div.).
Output voltage response to load current
step-change (8.75-26.25-8.75 A) at:
TP1, TP3 =+25°C, VI = 53 V, CO = 3.5 mF.
Top trace: output voltage (0.5 V/div.).
Bottom trace: output current (20 A/div.).
Time scale: (0.5 ms/div.).
Input Voltage Transient Response
Output voltage response to input voltage
transient at: TP1, TP3 = +25°C, VI = 36-75 V,
IO = 17 A resistive load, CO = 3.5 mF
Top trace: output voltage (2 V/div.).
Bottom trace: input voltage (20 V/div.).
Time scale: (0.5 ms/div.).
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CUI Inc │SERIES: NQB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 02/20/2013 │ page 8 of 30
Typical Characteristics
12.0 V, 35 A / 420 W
Output Current Derating – Open frame
[A]
35
3.0 m/s
2.0 m/s
30
25
20
15
10
1.5 m/s
1.0 m/s
0.5 m/s
Nat. Conv.
5
0
0
20
40
60
80
100 [°C]
Available load current vs. ambient air temperature and airflow at
VI = 53 V. See Thermal Consideration section.
Output Current Derating – Base plate
Thermal Resistance – Base plate
[A]
35
[°C/W]
6
3.0 m/s
30
25
20
15
10
5
5
2.0 m/s
1.5 m/s
4
3
1.0 m/s
0.5 m/s
2
1
Nat. Con v.
0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0[m/s]
0
20
40
60
80
100 [° C]
Available load current vs. ambient air temperature and airflow at
VI = 53 V. See Thermal Consideration section.
Thermal resistance vs. airspeed measured at the converter. Tested in
wind tunnel with airflow and test conditions as per the Thermal
consideration section. VI = 53 V.
Output Current Derating – Base plate + Heat sink
Output Current Derating – Cold wall sealed box
[A]
35
A
40
35
30
25
20
15
10
5
3.0 m/s
30
25
20
15
10
5
2.0 m/s
1.5 m/s
1.0 m/s
Ta mb
85 °C
0.5 m/s
Nat. Conv.
0
0
0
20
40
60
80
100 [°C]
0
20
40
60
80
100 [°C]
Available load current vs. ambient air temperature and airflow at
VI = 53 V. See Thermal Consideration section. Tested with Plate Fin
Transverse heatsink, height 0.23 In, P0114 Thermal Pad.
Available load current vs. base plate temperature at 85ºC ambient.
VI = 53 V. See Thermal Consideration section.
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CUI Inc │SERIES: NQB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 02/20/2013 │ page 9 of 30
Electrical Specification
12.0 V, 39 A / 468 W
TP1, TP3 = -40 to +90ºC, VI = 40 to 60 V.
Typical values given at: TP1, TP3 = +25°C, VI = 53 V, max IO, unless otherwise specified under Conditions.
Additional Cout = 3.9 mF, Configuration File: 19010-CDA 102 0314/002
parameter
conditions/description
min
40
typ
max
60
units
V
input voltage range (VI)
turn-off input voltage (VIoff
)
decreasing input voltage
increasing input voltage
36
37
39
18
38
V
turn-on input voltage (VIon)
internal input capacitance (CI)
output power (PO)
38
40
V
μF
W
0
468
50% of max IO
max IO
50% of max IO, VI = 48 V
max IO, VI = 48 V
96.7
95.7
96.8
95.6
%
%
%
%
efficiency (η)
power dissipation (Pd)
input idling power (Pli)
input standby power (PRC)
switching frequency (fs)
max IO
21.2
2.8
30.5
W
W
IO = 0 A, VI = 53 V
VI = 53 V (turned off with RC)
0-100% of max IO
0.4
W
140
kHz
output voltage setting and ac-
curacy (VOi)
TP1 = +25°C, VI = 53 V, IO = 39 A
0-100% of max IO
11.88
11.76
12.0
12.12
12.24
V
V
output voltage tolerance band
(VO)
line regulation (VO)
load regulation (VO)
max IO
31
5
60
25
mV
mV
VI = 53 V, 1-100% of max IO
load transient voltage deviation VI = 53 V, load step 25-75-25% of max IO, di/dt =
±0.4
150
8
V
(Vtr)
1 A/μs
load transient recovery time
(ttr)
VI = 53 V, load step 25-75-25% of max IO, di/dt =
1 A/μs
µs
ramp-up time (tr) - (from
10−90% of VOi)
10-100% of max IO, TP1 = 25ºC, VI = 53 V
10-100% of max IO, TP1 = 25ºC, VI = 53 V
ms
ms
start-up time (ts) - (from VI
connection to 90% of VOi)
24
VI shut-down fall time (tf) -
(from VI off to 10% of VO)
max IO
IO = 0 A, CO = 0 mF
3
7
ms
s
RC start-up time (tRC)
max IO
12
ms
RC shut-down fall time (tRC) -
(from RC off to 10% of VO)
max IO
IO = 0 A, CO = 0 mF
4.5
7
ms
s
output current (IO)
0
39
47
A
A
A
current limit threshold (Ilim)
short circuit current (Isc)
VO = 10.8 V, TP1, TP3 < max TP1, TP3
TP1 = 25ºC, see Note 1
41
44
14
recommended capacitive load
(Cout)
TP1 = 25ºC, see Note 2
0.1
3.9
6
mF
output ripple & noise (VOac
)
See ripple & noise section, max IO , see Note 3
TP1, TP3 = 25°C, VI = 53 V, 10-100% of max IO
50
110
mVp-p
V
over voltage protection (OVP)
15.6
sink current (note 4), see operating information
trigger level, decreasing RC-voltage
trigger level, increasing RC-voltage
0.7
mA
V
V
remote control (RC)
2.6
2.9
Note
1: OCP in hic-up mode
2: Low ESR-value
3: Cout = 100 µF, external capacitance
4: Sink current drawn by external device connected to the RC pin. Minimum sink current required guaranteeing activated RC function.
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CUI Inc │SERIES: NQB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 02/20/2013 │ page 10 of 30
Typical Characteristics
12.0 V, 39 A / 468 W
Efficiency
Power Dissipation
[%]
100
[W]
25
20
15
10
5
95
90
85
80
40 V
48 V
53 V
60 V
40 V
48 V
53 V
60 V
0
75
0
5
10
15
20
25
30
35
40 [A]
0
5
10
15
20
25
30
35
40 [A]
Dissipated power vs. load current and input voltage at
TP1, TP3 = +25°C
Efficiency vs. load current and input voltage at TP1, TP3 = +25 C
Output Characteristics
Current Limit Characteristics
[V]
[V]
13.0
12.2
11.0
9.0
7.0
5.0
3.0
12.1
12.0
11.9
11.8
40 V
48 V
53 V
60 V
40V
48V
53V
60V
0
5
10 15
20 25 30
35 40 [A]
39
41
43
45
47 [A]
Output voltage vs. load current at TP1, TP3 = +25°C
Output voltage vs. load current at IO > max IO , TP1, TP3 = +25°C
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CUI Inc │SERIES: NQB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 02/20/2013 │ page 11 of 30
Typical Characteristics
12.0 V, 39 A / 468 W
Start-up
Shut-down
Start-up enabled by connecting VI at:
TP1, TP3 = +25°C, VI = 53 V,
IO = 39 A resistive load.
Top trace: output voltage (5 V/div.).
Bottom trace: input voltage (50 V/div.).
Time scale: (10 ms/div.).
Shut-down enabled by disconnecting VI at: Top trace: output voltage (5 V/div.).
Bottom trace: input voltage (50 V/div.).
Time scale: (2 ms/div.).
TP1, TP3 = +25°C, VI = 53 V,
IO =39 A resistive load.
Output Ripple & Noise
Output Load Transient Response
Output voltage ripple at:
TP1, TP3 = +25°C, VI = 53 V,
IO = 39 A resistive load.
Trace: output voltage (50 mV/div.).
Time scale: (2 µs/div.).
Output voltage response to load current
step-change (9.75-29.25-9.75 A) at:
TP1, TP3 =+25°C, VI = 53 V, CO = 3.9 mF.
Top trace: output voltage (0.5 V/div.).
Bottom trace: output current (20 A/div.).
Time scale: (0.5 ms/div.).
Input Voltage Transient Response
Output voltage response to input voltage
transient at: TP1, TP3 = +25°C, VI = 40-60 V,
IO = 19,5 A resistive load, CO = 3.9 mF
Top trace: output voltage (2 V/div.).
Bottom trace: input voltage (20 V/div.).
Time scale: (0.5 ms/div.).
cui.com
CUI Inc │SERIES: NQB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 02/20/2013 │ page 12 of 30
Typical Characteristics
12.0 V, 39 A / 468 W
Output Current Derating – Open frame
[A]
40
3.0 m/s
35
30
25
20
15
10
5
2.0 m/s
1.5 m/s
1.0 m/s
0.5 m/s
Nat. Conv.
0
0
20
40
60
80
100 [°C]
Available load current vs. ambient air temperature and airflow at
VI = 53 V. See Thermal Consideration section.
Output Current Derating – Base plate
Thermal Resistance – Base plate
[A]
40
[°C/W]
6
3.0 m/s
35
30
25
20
15
10
5
5
2.0 m/s
1.5 m/s
4
3
1.0 m/s
0.5 m/s
2
1
Nat. Conv.
0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0[m/s]
0
20
40
60
80
100 [° C]
Available load current vs. ambient air temperature and airflow at
VI = 53 V. See Thermal Consideration section.
Thermal resistance vs. airspeed measured at the converter. Tested
in wind tunnel with airflow and test conditions as per the Thermal
consideration section. VI = 53 V.
Output Current Derating – Base Plate + Heat sink
Output Current Derating – Cold wall sealed box
[A]
40
A
40
35
30
3.0 m/s
35
30
25
20
15
10
5
2.0 m/s
1.5 m/s
25
20
15
10
5
Ta mb
85 °C
1.0 m/s
0.5 m/s
Nat. Conv.
0
0
0
20
40
60
80
100 [° C]
0
20
40
60
80
100 [°C]
Available load current vs. ambient air temperature and airflow at
VI = 53 V. See Thermal Consideration section. Tested with Plate Fin
Transverse heatsink, height 0.23 In, P0114 Thermal Pad.
Available load current vs. base plate temperature at 85ºC ambient.
VI = 53 V. See Thermal Consideration section.
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CUI Inc │SERIES: NQB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 02/20/2013 │ page 13 of 30
Electrical Specification
12.45 V, 35 A / 415 W
TP1, TP3 = -40 to +90ºC, VI = 36 to 75 V.
Typical values given at: TP1, TP3 = +25°C, VI = 53 V, max IO, unless otherwise specified under Conditions.
Additional Cout = 3.9 mF, Configuration File: 19010-CDA 102 0314/014
parameter
conditions/description
min
36
typ
max
75
units
V
input voltage range (VI)
turn-off input voltage (VIoff
)
decreasing input voltage
increasing input voltage
32
33
35
18
34
V
turn-on input voltage (VIon)
internal input capacitance (CI)
output power (PO)
34
36
V
μF
W
0
415
50% of max IO
max IO
50% of max IO, VI = 48 V
max IO, VI = 48 V
96.2
95.5
96.4
95.5
%
%
%
%
efficiency (η)
power dissipation (Pd)
input idling power (Pli)
input standby power (PRC)
switching frequency (fs)
max IO
19.5
3.2
29.5
W
W
IO = 0 A, VI = 53 V
VI = 53 V (turned off with RC)
0-100% of max IO
0.4
W
140
kHz
output voltage setting and ac-
curacy (VOi)
TP1 = 25°C, VI = 53 V, IO = 0 A
0-100% of max IO
12.415
11.5
12.45
12.485
12.7
V
V
output voltage tolerance band
(VO)
line regulation (VO)
load regulation (VO)
max IO
20
55
mV
mV
VI = 53 V, 0-100% of max IO
500
600
700
load transient voltage deviation VI = 53 V, load step 25-75-25% of max IO, di/dt =
±0.4
150
23
V
(Vtr)
1 A/μs
load transient recovery time
(ttr)
VI = 53 V, load step 25-75-25% of max IO, di/dt =
1 A/μs
µs
ramp-up time (tr) - (from
10−90% of VOi)
10-100% of max IO, TP1, TP3 = 25ºC, VI = 53 V
10-100% of max IO, TP1, TP3 = 25ºC, VI = 53 V
ms
ms
start-up time (ts) - (from VI
connection to 90% of VOi)
39
VI shut-down fall time (tf) -
(from VI off to 10% of VO)
max IO
IO = 0 A, CO = 0 mF
3.6
7
ms
s
RC start-up time (tRC)
max IO
27
ms
RC shut-down fall time (tRC) -
(from RC off to 10% of VO)
max IO
IO = 0 A, CO = 0 mF
5.1
7
ms
s
output current (IO)
0
35
44
A
A
A
current limit threshold (Ilim)
short circuit current (Isc)
VO = 10.8 V, TP1, TP3 < max TP1, TP3
TP1, TP3 = 25ºC, see Note 1
37
41
12
recommended capacitive load
(Cout)
TP1, TP3 = 25ºC, see Note 2
0.1
3.5
6
mF
output ripple & noise (VOac
)
See ripple & noise section, max IO , see Note 3
TP1, TP3 = 25°C, VI = 53 V, 10-100% of max IO
60
150
mVp-p
V
over voltage protection (OVP)
15.6
sink current (note 4), see operating information
trigger level, decreasing RC-voltage
trigger level, increasing RC-voltage
0.7
mA
V
V
remote control (RC)
2.6
2.9
Note
1: OCP in hic-up mode
2: Low ESR-value
3: Cout = 100 µF, external capacitance
4: Sink current drawn by external device connected to the RC pin. Minimum sink current required guaranteeing activated RC function.
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CUI Inc │SERIES: NQB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 02/20/2013 │ page 14 of 30
Typical Characteristics
12.45 V, 63 A / 747 W, two products in parallel
Efficiency
Power Dissipation
[%]
100
[W]
45
40
35
30
25
20
15
10
5
95
90
85
80
36 V
48 V
53 V
36 V
48 V
53 V
75 V
75 V
75
0
0
0
10
20
30
40
50
60
[A]
10
20
30
40
50
60
[A]
Dissipated power vs. load current and input voltage at
TP1, TP3 = +25°C
Efficiency vs. load current and input voltage at TP1, TP3 = +25 C
Output Characteristics
Current Limit Characteristics
[V]
[V]
13.0
12 .5
12 .4
12 .3
12 .2
12 .1
12 .0
11.9
11.0
9.0
36 V
48 V
53 V
75 V
36 V
48 V
53 V
75 V
7.0
5.0
3.0
63 65 67 69 71 73 75 77 79 81 83 [A]
11.8
0
10
20
30
40
50
60
[A]
Output voltage vs. load current at TP1, TP3 = +25°C
Output voltage vs. load current at IO > max IO , TP1, TP3 = +25°C
Start-up
Output Load Transient Response
Start-up enabled by connecting VI at:
Top trace: output voltage (5 V/div.).
Bottom trace: input voltage (50 V/div.).
Time scale: (10 ms/div.).
Output voltage response to load current Top trace: output voltage (0.5 V/div.).
step-change (15.8-47.3-15.8 A) at:
Bottom trace: output current (20 A/div.).
Time scale: (0.5 ms/div.).
TP1, TP3 = +25°C, VI = 53 V,
TP1, TP3 =+25°C, VI = 53 V, CO = 3.5 mF.
IO = 63 A resistive load.
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CUI Inc │SERIES: NQB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 02/20/2013 │ page 15 of 30
Typical Characteristics
12.45 V, 35 A / 415 W
Output Current Derating – Open frame
[A]
35
3.0 m/s
2.0 m/s
30
25
20
15
10
1.5 m/s
1.0 m/s
0.5 m/s
Nat. Conv.
5
0
0
20
40
60
80
100 [°C]
Available load current vs. ambient air temperature and airflow at
VI = 53 V. See Thermal Consideration section.
Output Current Derating – Base plate
Thermal Resistance – Base plate
[A]
35
[°C/W]
6
3.0 m/s
30
25
20
15
10
5
5
2.0 m/s
1.5 m/s
4
3
1.0 m/s
0.5 m/s
2
1
Nat. Conv.
0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0[m/s]
0
20
40
60
80
100 [° C]
Available load current vs. ambient air temperature and airflow at
VI = 53 V. See Thermal Consideration section.
Thermal resistance vs. airspeed measured at the converter. Tested in
wind tunnel with airflow and test conditions as per the Thermal
consideration section. VI = 53 V.
Output Current Derating – Base plate + Heat sink
Output Current Derating – Cold wall sealed box
[A]
35
A
40
35
30
25
20
15
10
5
3.0 m/s
30
25
20
15
10
5
2.0 m/s
1.5 m/s
1.0 m/s
Ta mb
85 °C
0.5 m/s
Nat. Conv.
0
0
0
20
40
60
80
100 [°C]
0
20
40
60
80
100 [°C]
Available load current vs. ambient air temperature and airflow at
VI = 53 V. See Thermal Consideration section. Tested with Plate Fin
Transverse heatsink, height 0.23 In, P0114 Thermal Pad.
Available load current vs. base plate temperature at 85ºC ambient.
VI = 53 V. See Thermal Consideration section.
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CUI Inc │SERIES: NQB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 02/20/2013 │ page 16 of 30
Electrical Specification
12.45 V, 39 A / 462 W
TP1, TP3 = -40 to +90ºC, VI = 40 to 60 V.
Typical values given at: TP1, TP3 = +25°C, VI = 53 V, max IO, unless otherwise specified under Conditions.
Additional Cout = 3.9 mF, Configuration File: 19010-CDA 102 0314/017
parameter
conditions/description
min
40
typ
max
60
units
V
input voltage range (VI)
turn-off input voltage (VIoff
)
decreasing input voltage
increasing input voltage
36
37
39
18
38
V
turn-on input voltage (VIon)
internal input capacitance (CI)
output power (PO)
38
40
V
μF
W
0
462
50% of max IO
max IO
50% of max IO, VI = 48 V
max IO, VI = 48 V
96.7
95.7
96.8
95.6
%
%
%
%
efficiency (η)
power dissipation (Pd)
input idling power (Pli)
input standby power (PRC)
switching frequency (fs)
max IO
21.0
2.8
30.5
W
W
IO = 0 A, VI = 53 V
VI = 53 V (turned off with RC)
0-100% of max IO
0.4
W
140
kHz
output voltage setting and ac-
curacy (VOi)
TP1 = 25°C, VI = 53 V, IO = 0 A
0-100% of max IO
12.415
11.5
12.45
12.485
12.7
V
V
output voltage tolerance band
(VO)
line regulation (VO)
load regulation (VO)
max IO
31
60
mV
mV
VI = 53 V, 0-100% of max IO
500
600
700
load transient voltage deviation VI = 53 V, load step 25-75-25% of max IO, di/dt =
±0.4
150
23
V
(Vtr)
1 A/μs
load transient recovery time
(ttr)
VI = 53 V, load step 25-75-25% of max IO, di/dt =
1 A/μs
µs
ramp-up time (tr) - (from
10−90% of VOi)
10-100% of max IO, TP1 = 25ºC, VI = 53 V
10-100% of max IO, TP1 = 25ºC, VI = 53 V
ms
ms
start-up time (ts) - (from VI
connection to 90% of VOi)
39
VI shut-down fall time (tf) -
(from VI off to 10% of VO)
max IO
IO = 0 A, CO = 0 mF
3
7
ms
s
RC start-up time (tRC)
max IO
27
ms
RC shut-down fall time (tRC) -
(from RC off to 10% of VO)
max IO
IO = 0 A, CO = 0 mF
4.5
7
ms
s
output current (IO)
0
39
47
A
A
A
current limit threshold (Ilim)
short circuit current (Isc)
VO = 10.8 V, TP1, TP3 < max TP1, TP3
TP1 = 25ºC, see Note 1
41
44
14
recommended capacitive load
(Cout)
TP1 = 25ºC, see Note 2
0.1
3.9
6
mF
output ripple & noise (VOac
)
See ripple & noise section, max IO , see Note 3
TP1, TP3 = 25°C, VI = 53 V, 10-100% of max IO
50
110
mVp-p
V
over voltage protection (OVP)
15.6
sink current (note 4), see operating information
trigger level, decreasing RC-voltage
trigger level, increasing RC-voltage
0.7
mA
V
V
remote control (RC)
2.6
2.9
Note
1: OCP in hic-up mode
2: Low ESR-value
3: Cout = 100 µF, external capacitance
4: Sink current drawn by external device connected to the RC pin. Minimum sink current required guaranteeing activated RC function.
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CUI Inc │SERIES: NQB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 02/20/2013 │ page 17 of 30
Typical Characteristics
12.45 V, 70 A / 830 W, two products in parallel
Efficiency
Power Dissipation
[%]
100
[W]
45
40
35
30
25
20
15
10
5
95
90
85
80
40 V
48 V
53 V
60 V
40 V
48 V
53 V
60 V
75
0
0
[A]
70
10
20
30
40
50
60
70 [A]
0
10
20
30
40
50
60
Dissipated power vs. load current and input voltage at
TP1, TP3 = +25°C
Efficiency vs. load current and input voltage at TP1, TP3 = +25 C
Output Characteristics
Current Limit Characteristics
[V]
[V]
13.0
12.5
12.4
12.3
12.2
12.1
12.0
11.0
9.0
7.0
5.0
3.0
40 V
48 V
53 V
60 V
40 V
48 V
53 V
60 V
11.9
11.8
70
75
80
85
90 [A]
0
10
20
30
40
50
60
70 [A]
Output voltage vs. load current at TP1, TP3 = +25°C
Output voltage vs. load current at IO > max IO , TP1, TP3 = +25°C
Start-up
Output Load Transient Response
Start-up enabled by connecting VI at:
TP1, TP3 = +25°C, VI = 53 V,
IO = 70 A resistive load.
Top trace: output voltage (5 V/div.).
Bottom trace: input voltage (50 V/div.).
Time scale: (10 ms/div.).
Output voltage response to load current Top trace: output voltage (0.5 V/div.).
step-change (17.5-52.5-17.5 A) at:
Bottom trace: output current (20 A/div.).
Time scale: (0.5 ms/div.).
TP1, TP3 =+25°C, VI = 53 V, CO = 3.9 mF
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CUI Inc │SERIES: NQB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 02/20/2013 │ page 18 of 30
Typical Characteristics
12.45 V, 39 A / 462 W
Output Current Derating – Open frame
[A]
40
3.0 m/s
35
30
25
20
15
10
5
2.0 m/s
1.5 m/s
1.0 m/s
0.5 m/s
Nat. Conv.
0
0
20
40
60
80
100 [°C]
Available load current vs. ambient air temperature and airflow at
VI = 53 V. See Thermal Consideration section.
Output Current Derating – Base plate
Thermal Resistance – Base plate
[A]
40
[°C/W]
6
3.0 m/s
35
30
25
20
15
10
5
5
2.0 m/s
1.5 m/s
4
3
1.0 m/s
0.5 m/s
2
1
Nat. Conv.
0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0[m/s]
0
20
40
60
80
100 [° C]
Available load current vs. ambient air temperature and airflow at
VI = 53 V. See Thermal Consideration section.
Thermal resistance vs. airspeed measured at the converter. Tested
in wind tunnel with airflow and test conditions as per the Thermal
consideration section. VI = 53 V.
Output Current Derating – Base Plate + Heat sink
Output Current Derating – Cold wall sealed box
[A]
40
A
40
35
30
25
20
15
10
5
3.0 m/s
35
30
25
20
15
10
5
2.0 m/s
1.5 m/s
Ta mb
85 °C
1.0 m/s
0.5 m/s
Nat. Conv.
0
0
0
20
40
60
80
100 [° C]
0
20
40
60
80
100 [°C]
Available load current vs. ambient air temperature and airflow at
VI = 53 V. See Thermal Consideration section. Tested with Plate Fin
Transverse heatsink, height 0.23 In, P0114 Thermal Pad.
Available load current vs. base plate temperature at 85ºC ambient.
VI = 53 V. See Thermal Consideration section.
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CUI Inc │SERIES: NQB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 02/20/2013 │ page 19 of 30
EMC Specification
Conducted EMI measured according to EN55022, CISPR
22 and FCC part 15J (see test set-up). The fundamental
switching frequency is 140 kHz for NQB at VI = 53 V, max
IO.
Conducted EMI Input terminal value (typ)
Test set-up
Layout recommendations
The radiated EMI performance of the product will
depend on the PWB layout and ground layer design.
It is also important to consider the stand-off of
the product. If a ground layer is used, it should
be connected to the output of the product and the
equipment ground or chassis.
A ground layer will increase the stray capacitance
in the PWB and improve the high frequency EMC
performance.
EMI without filter
Output ripple and noise
Output ripple and noise measured according to figure
below.
Optional external filter for class B
Suggested external input filter in order to meet class B in
EN 55022, CISPR 22 and FCC part 15J.
Filter components:
C1 = 1 μF
C2 = 1 μF+220 μF
0
C3 = 1 μF+220 μF
C4
L1
L2
C4,C5 = 2.2 nF
L1 = 810 μH
L2 = 810 μH
+
+
C1
C2
C3
R
Module
-
-
C5
0
Output ripple and noise test setup
Operating information
Power Management Overview
This product includes protection features that
continuously safeguard the load from damage due to
unexpected system faults.
Input Voltage
The NQB consists of two different product families
designed for two different input voltage ranges, 36 to
75 Vdc and 40 to 60 Vdc, see ordering information.
The input voltage range 36 to 75 Vdc meets the
requirements of the European Telecom Standard ETS
300 132-2 for normal input voltage range in –48 and
EMI with filter
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CUI Inc │SERIES: NQB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
date 02/20/2013 │ page 20 of 30
capacitors are used to handle low frequency dynamic load
changes. Ceramic capacitors will also reduce any high
frequency noise at the load. It is equally important to
use low resistance and low inductance PWB layouts and
cabling. External decoupling capacitors will become part
of the product’s control loop. The control loop is optimized
for a wide range of external capacitance and the maximum
recommended value that could be used without any
additional analysis is found in the electrical specification.
The ESR of the capacitors is a very important parameter.
Stable operation is guaranteed with a verified ESR value
of >10 mΩ across the output connections. For further
information please contact your local CUI Power Modules
representative.
–60 Vdc systems, -40.5 to -57.0 V and –50.0 to -72 V
respectively.
At input voltages exceeding 75 V, the power loss will
be higher than at normal input voltage and TP1 must be
limited to absolute max +125°C. The absolute maximum
continuous input voltage is 80 Vdc.
The input voltage range 40 to 60 Vdc meets the
requirements for normal input voltage range in -48 V
systems, -40.5 to -57.0 V. At input voltages exceeding
60 V, the power loss will be higher than at normal input
voltage and TP1 must be limited to absolute max +125°C.
The absolute maximum continuous input voltage is 65 Vdc.
Turn-off Input Voltage
Parallel Operation (Droop Load Share, DLS)
The NQB, DLS products are variants that can be connected
in parallel. The products have a pre-configured voltage
droop: The stated output voltage set point is at no load.
The output voltage will decrease when the load current is
increased. The voltage will droop 0.6 V while load reaches
max load. This feature allows the products to be connected
in parallel and share the current with 10% accuracy. Up
to 90% of max output current can be used from each
product.
The product monitors the input voltage and will turn
on and turn off at predetermined levels. The minimum
hysteresis between turn on and turn off input voltage is 2
V.
Remote Control (RC)
The products are fitted with a remote control function.
The remote control is referenced to the primary negative
input connection (-In). The RC function allows the
converter to be turned on/off by an external device like a
semiconductor or mechanical switch. The RC pin has an
internal pull up resistor. The device should be capable of
sinking 0.7 mA. When the RC pin is left open, the voltage
generated on the RC pin is max
Voltage regulation DLS products
12.8
Module 1
6 V. The product is provided with
“negative logic” remote control
and will be off until the RC pin is
Module 2
12.6
Module 1+2
12.4
connected to the -In. To turn on
the product the voltage between
RC pin and -In should be less
than 1 V. To turn off the product
the RC pin should be left open for
a minimum of time 150 µs, the
12.2
12.0
11.8
11.6
0
10
20
30
40
50
60
70
same time requirement applies
when the product shall turn on. In
Output Current [A]
situations where it is desired to have the product to power
up automatically without the need for control signals or a
switch, the RC pin can be wired directly to –In
Feed Forward Capability
The NQB products have a feed forward function
implemented that can handle sudden input voltage
changes. The output voltage will be regulated during an
input transient and will typically stay within 10% when an
input transient is applied.
Input and Output Impedance
The impedance of both the input source and the load will
interact with the impedance of the product. It is important
that the input source has low characteristic impedance.
Minimum recommended external input capacitance is 100
µF. The performance in some applications can be enhanced
by addition of external capacitance as described under
External Decoupling Capacitors.
Soft-start Power Up
The rise time of the ramp up is 10 ms. When starting by
applying input voltage the control circuit boot-up time
adds an additional 15 ms delay. The DLS variants have a
pre-configured ramp up time of
External Decoupling Capacitors
25 ms.
When powering loads with significant dynamic current
requirements, the voltage regulation at the point of load
can be improved by addition of decoupling capacitors at
the load. The most effective technique is to locate low ESR
ceramic and electrolytic capacitors as close to the load
as possible, using several parallel capacitors to lower the
effective ESR. The ceramic capacitors will handle high-
frequency dynamic load changes while the electrolytic
Temperature Protection (OTP, UTP)
The products are protected from thermal overload by an
internal temperature shutdown protection. When TP1 as
defined in thermal consideration section is exceeded the
product will shut down. The product will make continuous
attempts to start up and resume normal operation
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automatically when the temperature has dropped below
Thermal Consideration
the temperature threshold; the hysteresis is defined in
general electrical specification. The product has also an
under temperature protection.
General
The product is designed to operate in different thermal
environments and sufficient cooling must be provided
to ensure reliable operation. For products mounted on
a PWB without a heat sink attached, cooling is achieved
mainly by conduction, from the pins to the host board,
and convection, which is dependant on the airflow across
the product. Increased airflow enhances the cooling of
the product. The Output Current Derating graph found in
the output section for each model provides the available
output current vs. ambient air temperature and air velocity
at VI =53 V.
Over Voltage Protection (OVP)
The product includes over voltage limiting circuitry for
protection of the load. The OVP limit is 30% above the
nominal output voltage. The response from an over
voltage fault is to immediately shut down. The device will
continuously check for the presence of the fault condition,
and when the fault condition no longer exists the device
will be re-enabled.
Over Current Protection (OCP)
The product includes current limiting circuitry for
protection at continuous overload. The setting for the
product is hic-up mode if the maximum output current is
exceeded and the output voltage is below 0.3×Vout. Above
the trip voltage the product will continue operate while
maintaining the output current at the maximum output
current. The load distribution should be designed for the
maximum output short circuit current specified.
The product is tested on a 254 x 254 mm, 35 µm (1 oz),
16-layer test board mounted vertically in a wind tunnel
with a cross-section of 608 x 203 mm.
Droop Load Share variants (DLS) will enter hic-up mode,
with a trip voltage, 0.04×Vout. Above the trip voltage the
product will continue to operate while maintaining the
output current at the maximum output current
Input Over/Under voltage protection
The input of the product is protected from high input
voltage and low input voltage.
Pre-bias Start-up Capability
The product has a Pre-bias start up functionality and will
not sink current during start up if a Pre-bias source is
present at the output terminals. If the Pre-bias voltage
is lower than the target value, the product will ramp up
to the target value. If the Pre-bias voltage is higher than
the target value, the product will ramp down to the target
value and in this case sink current for a limited time.
For products with base plate used in a sealed box/cold
wall application, cooling is achieved mainly by conduction
through the cold wall. The Output Current Derating graphs
are found in the output section for each model. The
product is tested in a sealed box test set up with ambient
temperatures 85, 55 and 25°C.
Output Voltage Regulation
The NQB products are designed to be fully regulated
within the plotted area. Operating outside this area is not
recommended.
13.4
13.2
13.0
12.8
12.6
12.4
12.2
12.0
13.4
13.2
13.0
12.8
12.6
12.4
12.2
12.0
35 45 55 65 75
Vin [V]
35 40 45 50 55 60 65
Vin [V]
Vin range: 36-75Vdc
Vin range:40-60Vdc
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Definition of product operating temperature
Resistance graph found in the Output section for
each model. Note that the thermal resistance can be
significantly reduced if a heat sink is mounted on the top
The product operating temperature is used to monitor the
temperature of the product, and proper thermal conditions
can be verified by measuring the temperature at positions
P1, P2, P3 and P4. The temperature at these positions (TP1,
of the base plate.
TP2, TP3, TP4) should not exceed the maximum temperatures Calculate the temperature increase (ΔT).
in the table below. The number of measurement points
may vary with different thermal design and topology.
Temperatures above maximum TP1, measured at the
ΔT = Rth x Pd
3. Max allowed ambient temperature is:
Max TP1 - ΔT.
reference point P1 (TP3
/
for base plate versions) are not
P3
allowed and may cause permanent damage.
E.g. NQB-468 at 2m/s:
Position
Description
PWB (reference point, open
frame)
Max temperature
TP1=125º C
1. ((1/0.95) - 1) × 468 W = 24.6 W
2. 19.5 W × 2.8°C/W = 69.0°C}
P1
P2
P3
P4
Opto-coupler
TP2=105º C
PWB (reference point for
base-plate version)
TP3=125º C
3. 125 °C - 69.0°C = max ambient temperature is 56°C
The actual temperature will be dependent on several
factors such as the PWB size, number of layers and
direction of airflow.
Primary MOSFET
TP4=125º C
Connections (Top view)
Top view
Pin
1
Designation
+In
Function
Positive Input
2
3
4
5
RC
Case
-In
-Out
+Out
Remote Control
Case to GND (optional)
Negative Input
Negative Output
Positive Output
16
Bottom view
(Best air flow direction is from positive to negative pins.)
Ambient Temperature Calculation
For products with base plate the maximum allowed
ambient temperature can be calculated by using the
thermal resistance.
1. The power loss is calculated by using the formula
((1/η) - 1) × output power = power losses (Pd).
η = efficiency of product. E.g. 95 % = 0.95
2. Find the thermal resistance (Rth) in the Thermal
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Mechanical Information - Hole Mount, Open Frame Version
Top View
Pin Positions According To Recommended Footprint
Table ꢀ.
Xꢀ = Ordering information
PIN SPECIFICATIONS
Pin ꢀ, 2, 4, 5 & ꢀ6 Material: Copper alloy
Plating: Min Au 0.ꢀ µm over ꢀ-3 µm Ni.
Pin position 3 is only used for base plate
GND connection which is not available on
this module.
Recommended Footprint - Top View
Weight: Typical 48 g
All dimensions: mm [inch]
Tolerances:
x.x 0.50 [0.02]
x.xx 0.25 [0.0ꢀ]
(not applied on footprint or typical values)
Recommended keep away area for user components.
The stand-off in combination with insulating material ensures that requirements
as per IEC/EN/UL60950 are met and 2250 V isolation maintained even if open
vias or traces are present under the DC/DC converter.
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Mechanical Information - Hole Mount, Base Plate Version
Top View
Pin Positions According To Recommended Footprint
Table ꢀ.
Xꢀ = Ordering information
CASE
Material: Aluminum
For screw attachment apply mounting
torque of max 0.44 Nm [3.9 lbf in]. M3
screws must not protrude more than
2.7mm [0.ꢀ06] into the base plate.
PIN SPECIFICATIONS
Pin ꢀ, 2, 3, 4, 5 & ꢀ6 Material: Copper alloy
Plating: Min Au 0.ꢀ µm over ꢀ-3 µm Ni.
Recommended Footprint - Top View
Pin position 3 is only used for base plate
GND connection.
Weight: Typical 68 g
All dimensions: mm [inch]
Tolerances:
x.x 0.50 [0.02]
x.xx 0.25 [0.0ꢀ]
(not applied on footprint or typical values)
Recommended keep away area for user components.
The stand-off in combination with insulating material ensures that requirements
as per IEC/EN/UL60950 are met and 2250 V isolation maintained even if open
vias or traces are present under the DC/DC converter.
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Mechanical Information - Surface Mount Version
Top View
Pin Positions According To Recommended Footprint
Recommended Footprint - Top View
PIN SPECIFICATIONS
Pin ꢀ, 2, 4, 5 & ꢀ6 Material: Copper alloy
Plating: Min Au 0.ꢀ µm over ꢀ-3 µm Ni.
Weight: Typical 46 g
All dimensions: mm [inch]
Tolerances:
x.x 0.50 [0.02]
x.xx 0.25 [0.0ꢀ]
(not applied on footprint or typical values)
Recommended keep away area for user components.
The stand-off in combination with insulating material ensures that requirements
as per IEC/EN/UL60950 are met and 2250 V isolation maintained even if open
vias or traces are present under the DC/DC converter.
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Lead-free (Pb-free) solder processes
Soldering Information - Surface Mounting
For Pb-free solder processes, a pin temperature (TPIN
)
in excess of the solder melting temperature (TL, 217 to
221°C for SnAgCu solder alloys) for more than 60 seconds
and a peak temperature of 245°C on all solder joints is
recommended to ensure a reliable solder joint.
The surface mount product is intended for forced
convection or vapor phase reflow soldering in SnPb and
Pb-free processes.
The reflow profile should be optimised to avoid excessive
heating of the product. It is recommended to have
a sufficiently extended preheat time to ensure an
even temperature across the host PWB and it is also
recommended to minimize the time in reflow.
Maximum Product Temperature Requirements
Top of the product PWB near pin 2 is chosen as reference
location for the maximum (peak) allowed product
temperature (TPRODUCT) since this will likely be the warmest
part of the product during the reflow process.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between
the product and the host board, since cleaning residues
may affect long time reliability and isolation voltage.
SnPb solder processes
For SnPb solder processes, the product is qualified for MSL
1 according to IPC/JEDEC standard J STD 020C.
During reflow TPRODUCT must not exceed 225 °C at any time.
Pb-free
General reflow process specifications SnPb eutectic
Average ramp-up (TPRODUCT
)
3°C/s max
183°C
3°C/s max
Pb-free solder processes
Typical solder melting (liquidus)
temperature
TL
221°C
For Pb-free solder processes, the product is qualified for
MSL 3 according to IPC/JEDEC standard J-STD-020C.
Minimum reflow time above TL
Minimum pin temperature
Peak product temperature
60 s
60 s
TPIN
210°C
235°C
TPRODUCT
225°C
260°C
During reflow TPRODUCT must not exceed 260 °C at any time.
Average ramp-down (TPRODUCT
Maximum time 25°C to peak
)
6°C/s max
6 minutes
6°C/s max
8 minutes
Dry Pack Information
Products intended for Pb-free reflow soldering processes
are delivered in standard moisture barrier bags according
to IPC/JEDEC standard J STD 033 (Handling, packing,
shipping and use of moisture/reflow sensitivity surface
mount devices).
Temperature
TPRODUCT maximum
TPIN minimum
Pin
profile
TL
Product
profile
Using products in high temperature Pb-free soldering
processes requires dry pack storage and handling. In
case the products have been stored in an uncontrolled
environment and no longer can be considered dry, the
modules must be baked according to J STD 033.
Time in
reflow
Time in preheat
/ soak zone
Time 25°C to peak
Time
Thermocoupler Attachment
Minimum Pin Temperature Recommendations
Top of PWB near pin 2 for measurement of maximum
product temperature, TPRODUCT
Pin number 5 chosen as reference location for the
minimum pin temperature recommendation since this will
likely be the coolest solder joint during the reflow process.
SnPb solder processes
For SnPb solder processes, a pin temperature (TPIN) in
excess of the solder melting temperature, (TL, 183°C
for Sn63Pb37) for more than 60 seconds and a peak
temperature of 220°C is recommended to ensure a reliable
solder joint.
For dry packed products only: depending on the type of
solder paste and flux system used on the host board, up to
a recommended maximum temperature of 245°C could be
used, if the products are kept in a controlled environment
(dry pack handling and storage) prior to assembly.
Pin 5 for measurement of minimum pin (solder joint )
temperature, TPIN
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Soldering Information - Hole Mounting
The hole mounted product is intended for plated through
hole mounting by wave or manual soldering. The pin
temperature is specified to maximum to 270°C for
maximum 10 seconds.
A maximum preheat rate of 4°C/s and maximum preheat
temperature of 150°C is suggested. When soldering by
hand, care should be taken to avoid direct contact between
the hot soldering iron tip and the pins for more than a few
seconds in order to prevent overheating.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between
the product and the host board. The cleaning residues may
affect long time reliability and isolation voltage.
Delivery Package Information
The products are delivered in antistatic injection molded
trays (Jedec design guide 4.10D standard) and in antistatic
trays.
Tray Specifications – SMD
Material
Surface resistance
Antistatic PPE
105 < Ohm/square < 1012
The trays can be baked at maximum
125°C for 48 hours
Bakability
Tray thickness
Box capacity
Tray weight
14.50 mm 0.571 [ inch]
20 products (2 full trays/box)
125 g empty, 574 g full tray
JEDEC standard tray for 2x5 = 10 products.
All dimensions in mm [inch]
Tolerances: X.x ±0.26 [0.01], X.xx ±0.13 [0.005]
Note: pick up positions refer to center of pocket.
See mechanical drawing for exact location on product.
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Tray Specifications - TH
Material
PE Foam
Surface
105 < Ohm/square < 1012
resistance
Bakability
Tray capacity
Box capacity
The trays are not bakeable
20 converters/tray
20 products (1 full tray/box)
Product – Open frame
1100 g full tray, 140g empty tray
Product – Base plate option
1480 g full tray, 140 g empty tray
Weight
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Product Qualification Specification
Characteristics
External visual inspection
IPC-A-610
Temperature range
Number of cycles
Dwell/transfer time
-40 to 100°C
500
15 min/0-1 min
Change of temperature
(Temperature cycling)
IEC 60068-2-14 Na
Temperature TA
Duration
Temperature
Humidity
Duration
-45°C
72 h
85°C
85 % RH
1000 hours
125°C
1000 h
Cold (in operation)
Damp heat
IEC 60068-2-1 Ad
IEC 60068-2-67 Cy
IEC 60068-2-2 Bd
Temperature
Duration
Dry heat
Electrostatic discharge
susceptibility
IEC 61340-3-1, JESD 22-A114
IEC 61340-3-2, JESD 22-A115
Human body model (HBM)
Machine Model (MM)
Class 2, 2000 V
Class 3, 200 V
Water
Glycol ether
Isopropyl alcohol
55°C
35°C
35°C
Immersion in cleaning solvents
IEC 60068-2-45 XA, method 2
Peak acceleration
Duration
100 g
6 ms
Mechanical shock
IEC 60068-2-27 Ea
Level 1 (SnPb-eutectic)
Level 3 (Pb Free)
225°C
260°C
Moisture reflow sensitivity 1
J-STD-020C
Operational life test
MIL-STD-202G, method 108A
IEC 60068-2-20 Tb, method 1A
Duration
1000 h
Solder temperature
Duration
270°C
10-13 s
Resistance to soldering heat 2
IEC 60068-2-21 Test Ua1
IEC 60068-2-21 Test Ue1
Through hole mount products
Surface mount products
All leads
All leads
Robustness of terminations
Preconditioning
150°C dry bake 16 h
215°C
Temperature, SnPb Eutectic
Temperature, Pb-free
IEC 60068-2-58 test Td 1
IEC 60068-2-20 test Ta 2
235°C
Solderability
Preconditioning
Temperature, SnPb Eutectic
Temperature, Pb-free
Steam ageing
235°C
245°C
Frequency
Spectral density
Duration
10 to 500 Hz
Vibration, broad band random
IEC 60068-2-64 Fh, method 1
0.07 g2/Hz
10 min in each direction
Notes:
1. Only for products intended for reflow soldering (surface mount products)
2. Only for products intended for wave soldering (plated through hole products)
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REVISION HISTORY
rev.
description
date
1.0
initial release
02/20/2013
The revision history provided is for informational purposes only and is believed to be accurate.
Headquarters
20050 SW 112th Ave.
Tualatin, OR 97062
800.275.4899
Fax 503.612.2383
cui.com
techsupport@cui.com
Novum is a trademark of CUI.
All other trademarks are the property of their respective owners.
CUI offers a two (2) year limited warranty. Complete warranty information is listed on our website.
CUI reserves the right to make changes to the product at any time without notice. Information provided by CUI is believed to be accurate and reliable. However, no responsibility is
assumed by CUI for its use, nor for any infringements of patents or other rights of third parties which may result from its use.
CUI products are not authorized or warranted for use as critical components in equipment that requires an extremely high level of reliability. A critical
component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to
affect its safety or effectiveness.
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