HTEP20120H-1R0MSR [CYNTEC]

Power Choke Coil HTEP20120H MSR type;
HTEP20120H-1R0MSR
型号: HTEP20120H-1R0MSR
厂家: Cyntec    Cyntec
描述:

Power Choke Coil HTEP20120H MSR type

文件: 总3页 (文件大小:191K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DOCUMENT : HTEP20120H-000  
CYNTEC CO., LTD.  
乾坤科技股份有限公司  
REVISION  
PAGE  
: A0  
: 1 OF 3  
Power Choke Coil HTEP20120H MSR type  
Features  
High performance (Isat) realized by metal dust core.  
Low profile2.0mm x 1.2mm x 0.8mm  
Low loss realized with low DCR  
100% lead (Pb) free meet RoHS standard  
Application  
DC/DC converter for CPU in Notebook PC  
Cellular phones, LCD displays, HDDs, DVCs, DSCs, PDAs etc..  
Thin type on-board power supply module for exchanger  
VRM for server  
Outline Dimensions  
L
Code  
Dimensions (mm)  
W
L
2.0 0.2  
1.2 0.2  
0.8 Max.  
0.6 Typ.  
W
G
T
G
T
Recommend Land Pattern Dimensions  
The customer shall determine the land dimensions shown below after confirming and safety.  
B
A
B
C
1.3  
0.5  
2.1  
A
C
Unit : mm  
Oct., 2019  
DOCUMENT : HTEP20120H-000  
CYNTEC CO., LTD.  
乾坤科技股份有限公司  
REVISION  
PAGE  
: A0  
: 2 OF 3  
Marking  
The point on the top surface represents winding direction of choke.  
Upside of Chip  
PIN 1  
PIN 2  
Coil clockwise around  
Specifications  
L0  
Inductance  
( H )  
Heat Rating Current  
DC Amps. Idc ( A )  
Saturation Current  
DC Amps. Isat ( A )  
Rdc ( m)  
Typical  
Part Number  
Maximum Typical  
Maximum  
Typical  
Maximum  
@ (0A)  
HTEP20120H-R47MSR  
HTEP20120H-1R0MSR  
0.47  
1.0  
25  
42  
29  
50  
3.9  
3.5  
3.7  
3.1  
4.8  
3.8  
4.3  
3.3  
* If you require another part number please contact with us.  
**Inductance Tolerance 20%  
Note 1.All test data is referenced to 25℃ ambient.  
Note 2.Test Condition:1MHz, 1.0Vrms  
Note 3.Idc : DC current (A) that will cause an approximate T of 40℃  
Note 4.Isat : DC current (A) that will cause L0 to drop approximately 30%  
Note 5.Operating Temperature Range -55℃ to + 125℃  
Note 6.The part temperature (ambient + temp rise) should not exceed 125℃ under the worst case operating  
conditions. Circuit design, component placement, PCB trace size and thickness, airflow and other cooling  
provision all affect the part temperature. Part temperature should be verified in the end application.  
Note 7.The rated current as listed is either the saturation current or the heating current depending on which value  
is lower.  
Oct., 2019  
DOCUMENT : HTEP20120H-000  
CYNTEC CO., LTD.  
乾坤科技股份有限公司  
REVISION  
PAGE  
: A0  
: 3 OF 3  
Current Characteristic  
HTEP20120H-R47MSR  
1.20  
1.00  
0.80  
0.60  
0.40  
0.20  
0.00  
100  
80  
60  
40  
20  
0
0.60  
0.50  
0.40  
0.30  
0.20  
0.10  
0.00  
100  
80  
60  
40  
20  
0
HTEP20120H-1R0MSR  
INDUCTANCE(μH)  
TEMP. RISE(℃)  
INDUCTANCE(μH)  
TEMP. RISE(℃)  
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0  
DC BIAS(Amps)  
0.0 0.6 1.2 1.8 2.4 3.0 3.6 4.2 4.8 5.4 6.0  
DC BIAS(Amps)  
Oct., 2019  

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