BCM20704UA2KFFB1G

更新时间:2024-09-18 22:16:14
品牌:CYPRESS
描述:Single-Chip Bluetooth Transceiver and Baseband Processor

BCM20704UA2KFFB1G 概述

Single-Chip Bluetooth Transceiver and Baseband Processor

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CYW20704  
Single-Chip Bluetooth Transceiver  
and Baseband Processor  
The Cypress CYW20704 is a monolithic, single-chip, Bluetooth 4.1+ HS-compliant, stand-alone baseband processor with an  
integrated 2.4 GHz transceiver. Manufactured using the industry's most advanced 40 nm CMOS low-power process, the CYW20704  
employs the highest level of integration, eliminating all critical external components, and thereby minimizing the device’s footprint and  
costs associated with the implementation of Bluetooth solutions.  
The CYW20704 is the optimal solution for voice and data applications that require a Bluetooth SIG standard Host Controller Interface  
(HCI) via USB, UART H4, and PCM audio interface support.  
The CYW20704 transceiver’s enhanced radio performance meets the most stringent industrial temperature application requirements  
for compact integration into mobile handset and portable devices. The CYW20704 provides full radio compatibility, enabling it to  
operate simultaneously with GPS and cellular radios.  
Cypress Numbering Scheme  
Cypress is converting the acquired IoT part numbers from Broadcom to the Cypress part numbering scheme. Due to this conversion,  
there is no change in form, fit, or function as a result of offering the device with Cypress part number marking. The table provides  
Cypress ordering part number that matches an existing IoT part number.  
Table 1. Mapping Table for Part Number between Broadcom and Cypress  
Broadcom Part Number  
Cypress Part Number  
BCM20704  
CYW20704  
BCM20704UA2KFFB1G  
CYW20704UA2KFFB1G  
Features  
Complies with Bluetooth Core Specification Version 4.1+ HS  
Ultra-low power consumption  
with provisions for supporting future specifications  
Supports serial flash interfaces  
Bluetooth Class 1 or Class 2 transmitter operation  
Supports mobile and PC applications without external memory  
Available in a 49-ball FcBGA package  
Supports extended synchronous connections (eSCO), for  
enhanced voice quality by allowing for retransmission of  
dropped packets  
IoT Applications  
Adaptive frequency hopping (AFH) for reducing radio  
Remotes: TV/Entertainment  
USB dongles  
frequency interference  
Interface support, host controller interface (HCI) using a USB  
or high-speed UART interface and PCM for audio data  
Wearables  
USB2.0 full-speed with LPM support (12 Mbps)  
Smart metering  
Supports Cypress proprietary 2 Mbps low energy mode.  
Cypress Semiconductor Corporation  
Document Number: 002-14786 Rev. *E  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised Thursday, September 29, 2016  
CYW20704  
Figure 1. Functional Block Diagram  
CYW20704  
PCM/I2S  
USB  
UART  
High-Speed  
Peripheral Transport  
Unit (PTU)  
GPIO  
SPI Master  
BSC  
Radio Transceiver  
Microprocessor and  
Memory Unit (µPU)  
Bluetooth Baseband  
Core (BBC)  
IoT Resources  
Cypress provides a wealth of data at http://www.cypress.com/internet-things-iot to help you to select the right IoT device for your  
design, and quickly and effectively integrate the device into your design. Cypress provides customer access to a wide range of  
information, including technical documentation, schematic diagrams, product bill of materials, PCB layout information, and software  
updates. Customers can acquire technical documentation and software from the Cypress Support Community website (http://  
community.cypress.com/).  
Document Number: 002-14786 Rev. *E  
Page 2 of 49  
CYW20704  
Contents  
4.3 EEPROM ............................................................13  
4.4 External Reset ....................................................13  
4.5 One-Time Programmable Memory .....................14  
1. Overview............................................................ 4  
1.1 Overview ............................................................. 4  
1.2 Major Features .................................................... 4  
1.3 Block Diagram ..................................................... 5  
1.2 Usage Model ....................................................... 6  
5. Peripheral Transport Unit.............................. 15  
5.1 PCM Interface ....................................................15  
5.2 HCI Transport Detection Configuration ..............16  
5.3 USB Interface .....................................................17  
5.4 UART Interface ..................................................18  
5.5 Simultaneous UART Transport and Bridging .....18  
2. Integrated Radio Transceiver.......................... 7  
2.1 Transmit .............................................................. 7  
2.2 Receiver .............................................................. 7  
2.3 Local Oscillator Generation ................................. 7  
2.4 Calibration ........................................................... 7  
2.5 Internal LDO ........................................................ 8  
6. Frequency References................................... 19  
6.1 Crystal Interface and Clock Generation .............20  
6.2 Crystal Oscillator ................................................20  
6.3 Frequency Selection ..........................................20  
6.4 Frequency Trimming ..........................................20  
3. Bluetooth Baseband Core ............................... 9  
3.1 Bluetooth Low Energy ......................................... 9  
3.2 Bluetooth 4.1 Features ........................................ 9  
3.3 Bluetooth 4.0 Features ........................................ 9  
3.4 Link Control Layer ............................................. 10  
3.5 Test Mode Support ............................................ 10  
3.6 Power Management Unit ................................... 10  
3.7 Adaptive Frequency Hopping ............................ 11  
3.8 Collaborative Coexistence ................................ 12  
3.9 Global Coexistence Interface ............................ 12  
7. Pin-out and Signal Descriptions................... 21  
7.1 Pin Descriptions .................................................21  
8. Ball Grid Arrays.............................................. 23  
9. Electrical Characteristics .............................. 24  
9.1 RF Specifications ...............................................27  
9.2 Timing and AC Characteristics ...........................31  
9.3 I2S Interface .......................................................39  
3.10 Recommended BT Coexistence Interface  
Assignments ...................................................... 12  
10. Mechanical Information ................................. 45  
4. Microprocessor Unit....................................... 13  
4.1 Overview ........................................................... 13  
4.2 NVRAM Configuration Data and Storage .......... 13  
10.1 Tape, Reel, and Packing Specification ..............46  
11. Ordering Information ..................................... 47  
Document History........................................................... 48  
Document Number: 002-14786 Rev. *E  
Page 3 of 50  
CYW20704  
1. Overview  
1.1 Overview  
The Cypress CYW20704 complies with Bluetooth Core Specification, version 4.1+ HS and is designed for use in standard Host Con-  
troller Interface (HCI) UART and HCI USB applications. The combination of the Bluetooth Baseband Core (BBC), a Peripheral  
Transport Unit (PTU), and a Cortex-M3 based microprocessor with on-chip ROM provides a complete lower layer Bluetooth protocol  
stack, including the Link Controller (LC), Link Manager (LM), and HCI.  
1.2 Major Features  
Major features of the CYW20704 include:  
Bluetooth v4.1 + EDR with integrated Class 1 PA  
BT host digital interface (can be used concurrently with below interfaces):  
USB 2.0 full-speed with LPM support (up to 12 Mbps)  
UART (up to 4 Mbps)42  
Integrated RF section  
Single-ended, 50RF interface  
Built-in TX/RX switch functionality  
TX Class 1 output power capability  
RX sensitivity basic rate of –93.5 dBm  
RX sensitivity for Low Energy of –96 dBm  
GCI-enhanced coexistence support, ability to coordinate BT SCO transmissions around WLAN receives  
Supports maximum Bluetooth data rates over HCI and USB interfaces  
I2S/PCM for BT audio  
HCI high-speed UART (H4, H4+) transport support  
Wideband speech support (16 bits linear data, MSB first, left-justified at 4K samples/s for transparent air coding, both through I2S  
and PCM interface)  
Bluetooth SmartAudio® technology improves voice and music quality to headsets  
Bluetooth low-power inquiry and page scan  
Bluetooth low energy (BLE) support  
Supports Cypress proprietary 2 Mbps low energy mode  
Maximum of 127 LE Connections  
Supports TBFC (Triggered Cypress [Bluetooth] Fast Connect)  
Bluetooth packet loss concealment (PLC)  
Bluetooth wide band speech (WBS)  
High-speed HCI UART transport support  
H4 five-wire UART (four signal wires, one ground wire)  
Maximum UART baud rates of 4 Mbps  
Low-power out-of-band BT_WAKE and HOST_WAKE signaling  
VSC from host transport to UART  
Proprietary compression scheme (allows more than two simultaneous A2DP packets and up to five devices at a time)  
HCI USB transport support  
USB version 2.0 full-speed compliant interface with LPM support  
UHE (proprietary method for emulating a human interface device (HID) at system boot up)  
Standard Bluetooth test modes  
Extended radio and production test mode features  
Document Number: 002-14786 Rev. *E  
Page 4 of 49  
CYW20704  
Full support for power savings modes:  
Bluetooth standard sniff  
Deep sleep modes and regulator shutdown  
Built-in LPO clock  
Larger patch RAM space to support future enhancements  
Serial flash Interface with native support for devices from several manufacturers  
One-Time Programmable (OTP) memory  
1.3 Block Diagram  
Figure 2 shows the interconnect of the major CYW20704 physical blocks and associated external interfaces.  
Figure 2. Functional Block Diagram  
Document Number: 002-14786 Rev. *E  
Page 5 of 49  
CYW20704  
1.2 Usage Model  
This section contains information on the PC Product Usage Model.  
1.2.1 PC Product Usage Model  
The CYW20704 can be directly interfaced using the HCI USB interface, providing full support for embedded USB applications like  
laptop and PC motherboards. The CYW20704 also supports PC applications such as external USB dongle peripheral devices.  
Figure 3 shows an example of a typical PC product usage model.  
Figure 3. Typical PC Product Usage Model  
3.3V  
Host PC  
USB  
LINK_IND  
CYW20704  
20 MHz Crystal Oscillator  
Flash Memory  
Serial Interface  
BT_GCI_SECI_IN  
IEEE 802.11™  
WLAN  
BT_GCI_SECI_OUT  
Document Number: 002-14786 Rev. *E  
Page 6 of 49  
CYW20704  
2. Integrated Radio Transceiver  
The CYW20704 has an integrated radio transceiver that has been optimized for use in 2.4 GHz Bluetooth wireless systems. It has  
been designed to provide low-power, low-cost, robust communications for applications operating in the globally available 2.4 GHz  
unlicensed ISM band. The CYW20704 is fully compliant with the Bluetooth Radio Specification and enhanced data rate (EDR) spec-  
ification and meets or exceeds the requirements to provide the highest communication link quality of service.  
2.1 Transmit  
The CYW20704 features a fully integrated zero-IF transmitter. The baseband transmit data is GFSK-modulated in the modem block  
and upconverted to the 2.4 GHz ISM band in the transmitter path. The transmitter path consists of signal filtering, I/Q upconversion,  
output power amplifier, and RF filtering. The transmitter path also incorporates pi/4-DQPSK for 2 Mbps and 8-DPSK for 3 Mbps to  
support EDR. The transmitter section is compatible to the Bluetooth Low Energy specification. The transmitter PA bias can also be  
adjusted to provide Bluetooth class 1 or class 2 operation.  
2.1.1 Digital Modulator  
The digital modulator performs the data modulation and filtering required for the GFSK, pi/4 – DQPSK, and  
8 – DPSK signal. The fully digital modulator minimizes any frequency drift or anomalies in the modulation characteristics of the trans-  
mitted signal and is much more stable than direct VCO modulation schemes.  
2.1.2 Digital Demodulator and Bit Synchronizer  
The digital demodulator and bit synchronizer take the low-IF received signal and perform an optimal frequency tracking and bit-syn-  
chronization algorithm.  
2.1.3 Power Amplifier  
The fully integrated PA supports Class 1 or Class 2 output using a highly linearized, temperature-compensated design. This provides  
greater flexibility in front-end matching and filtering. Due to the linear nature of the PA combined with some integrated filtering, exter-  
nal filtering is required to meet the Bluetooth and regulatory harmonic and spurious requirements. The transmitter features a sophis-  
ticated on-chip transmit signal strength indicator (TSSI) block to keep the absolute output power variation within a tight range across  
process, voltage, and temperature.  
2.2 Receiver  
The receiver path uses a low-IF scheme to downconvert the received signal for demodulation in the digital demodulator and bit syn-  
chronizer. The receiver path provides a high degree of linearity, an extended dynamic range, and high-order on-chip channel filtering  
to ensure reliable operation in the noisy 2.4 GHz ISM band. The front-end topology with built-in out-of-band attenuation enables the  
CYW20704 to be used in most applications with minimal off-chip filtering. For integrated handset operation, in which the Bluetooth  
function is integrated close to the cellular transmitter, external filtering is required to eliminate the desensitization of the receiver by  
the cellular transmit signal.  
2.2.1 Digital Demodulator and Bit Synchronizer  
The digital demodulator and bit synchronizer take the low-IF received signal and perform an optimal frequency tracking and bit syn-  
chronization algorithm.  
2.2.2 Receiver Signal Strength Indicator  
The radio portion of the CYW20704 provides a Receiver Signal Strength Indicator (RSSI) signal to the baseband, so that the control-  
ler can take part in a Bluetooth power-controlled link by providing a metric of its own receiver signal strength to determine whether  
the transmitter should increase or decrease its output power.  
2.3 Local Oscillator Generation  
Local Oscillator (LO) generation provides fast frequency hopping (1600 hops/second) across the 79 maximum available channels.  
The LO generation subblock employs an architecture for high immunity to LO pulling during PA operation. The CYW20704 uses an  
internal RF and IF loop filter.  
2.4 Calibration  
The CYW20704 radio transceiver features an automated calibration scheme that is fully self contained in the radio. No user interac-  
tion is required during normal operation or during manufacturing to provide the optimal performance. Calibration optimizes the per-  
formance of all the major blocks within the radio to within 2% of optimal conditions, including gain and phase characteristics of filters,  
matching between key components, and key gain blocks. This takes into account process variation and temperature variation. Cali-  
bration occurs transparently during normal operation during the settling time of the hops and calibrates for temperature variations as  
the device cools and heats during normal operation in its environment.  
Document Number: 002-14786 Rev. *E  
Page 7 of 49  
CYW20704  
2.5 Internal LDO  
The CYW20704 uses two LDOs—one for 1.2V and the other for 2.5V. The 1.2V LDO is used to provide the power supply to the  
baseband and the radio while the 2.5V LDO is used for the PA power supply.  
Figure 4. LDO Functional Block  
CYW20704 PMU  
VDDC_IN  
1.2V LDO (VDDC_LDO)  
VDDC_OUT  
VDD2P5_IN  
2.5V LDO (BTLDO2P5)  
AVSS_GND  
VDD2P5_OUT  
Document Number: 002-14786 Rev. *E  
Page 8 of 49  
CYW20704  
3. Bluetooth Baseband Core  
The Bluetooth Baseband Core (BBC) implements all of the time critical functions required for high-performance Bluetooth operation.  
The BBC manages the buffering, segmentation, and routing of data for all connections. It also buffers data that passes through it,  
handles data flow control, schedules SCO/ACL TX/RX transactions, monitors Bluetooth slot usage, optimally segments and pack-  
ages data into baseband packets, manages connection status indicators, and composes and decodes HCI packets. In addition to  
these functions, it independently handles HCI event types and HCI command types.  
The following transmit and receive functions are also implemented in the BBC hardware to increase reliability and security of the TX/  
RX data before sending over the air:  
Symbol timing recovery, data deframing, forward error correction (FEC), header error control (HEC), cyclic redundancy check  
(CRC), data decryption, and data dewhitening in the receiver.  
Data framing, FEC generation, HEC generation, CRC generation, key generation, data encryption, and data whitening in the trans-  
mitter.  
3.1 Bluetooth Low Energy  
The CYW20704 supports dual-mode Bluetooth Low Energy (BT and BLE) operation.  
3.2 Bluetooth 4.1 Features  
The CYW20704 supports the new features expected in Bluetooth v4.1.  
Secure connections (LE/BR/EDR)  
Fast advertising interval  
Piconet clock adjust  
Clock nudging  
Connectionless Broadcast  
LE enhanced privacy  
Low duty cycle directed advertising  
LE dual mode topology  
3.3 Bluetooth 4.0 Features  
The CYW20704 supports all Bluetooth 4.0 features, with the following benefits:  
Extended Inquiry Response (EIR)  
Encryption Pause Resume (EPR)  
Sniff Subrating (SSR)  
Secure Simple Pairing (SSP)  
Link Supervision Time Out (LSTO)  
QoS enhancements  
Document Number: 002-14786 Rev. *E  
Page 9 of 49  
CYW20704  
3.4 Link Control Layer  
The link control layer is part of the Bluetooth link control functions that are implemented in dedicated logic in the link control unit  
(LCU). This layer consists of the command controller that takes commands from the software, and other controllers that are acti-  
vated or configured by the command controller, to perform the link control tasks. Each task performs a different state in the Bluetooth  
Link Controller.  
Major states:  
Standby  
Connection  
Substates:  
Page  
Page Scan  
Inquiry  
Inquiry Scan  
Sniff  
3.5 Test Mode Support  
The CYW20704 fully supports Bluetooth Test mode as described in Specification of the Bluetooth Core v4.1, which includes the  
transmitter tests, normal and delayed loopback tests, and reduced hopping sequence. In addition to the standard Bluetooth Test  
Mode, the CYW20704 also supports enhanced testing features to simplify RF debugging and qualification and type-approval testing,  
including:  
Fixed frequency carrier wave (unmodulated) transmission  
Simplifies some type-approval measurements (Japan)  
Aids in transmitter performance analysis  
Fixed frequency constant receiver mode  
Receiver output directed to I/O pin  
Allows for direct BER measurements using standard RF test equipment  
Facilitates spurious emissions testing for receive mode  
Fixed frequency constant transmission  
8-bit fixed pattern, PRBS-9, or PRBS-15  
Enables modulated signal measurements with standard RF test equipment  
3.6 Power Management Unit  
The Power Management Unit (PMU) provides power management features that can be invoked through power management regis-  
ters or packet handling in the baseband core. This section contains descriptions of the PMU features.  
3.6.1 RF Power Management  
The BBC generates power-down control signals for the transmit path, receive path, PLL, and power amplifier to the 2.4 GHz trans-  
ceiver. The transceiver then processes the power-down functions, accordingly.  
3.6.2 Host Controller Power Management  
The host can place the device in a sleep state, in which all nonessential blocks are powered off and all nonessential clocks are dis-  
abled. Power to the digital core is maintained so that the state of the registers and RAM is not lost. In addition, the CYW20704 inter-  
nal LPO clock is applied to the internal sleep controller so that the chip can wake automatically at a specified time or based on  
signaling from the host. The goal is to limit the current consumption to a minimum, while maintaining the ability to wake up and  
resume a connection with minimal latency.  
If a scan or sniff session is enabled while the device is in Sleep mode, the device automatically will wake up for the scan/sniff event,  
then go back to sleep when the event is done. In this case, the device uses its internal LPO-based timers to trigger the periodic wake  
up. While in Sleep mode, the transports are idle. However, the host can signal the device to wake up at any time. If signaled to wake  
up while a scan or sniff session is in progress, the session continues but the device will not sleep between scan/sniff events. Once  
Sleep mode is enabled, the wake signaling mechanism can also be thought of as a sleep signaling mechanism, since removing the  
wake status will often cause the device to sleep.  
In addition to a Bluetooth device wake signaling mechanism, there is a host wake signaling mechanism. This feature provides a way  
for the Bluetooth device to wake up a host that is in a reduced power state.  
Document Number: 002-14786 Rev. *E  
Page 10 of 49  
CYW20704  
There are two mechanisms for the device and the host to signal wake status to each other:  
USB  
When running in USB mode with LPM, the device supports the USB version 2.0  
full-speed specification, suspend/resume signaling, as well as remote wake-up  
signaling for power control.  
Bluetooth device WAKE (BT_DEV_WAKE) and The BT_DEV_WAKE signal allows the host to wake the BT device, and  
Host WAKE (and BT_HOST_WAKE) signaling  
BT_HOST_WAKE is an output that allows the BT device to wake the host.  
Table 2. Power Control Pin Summary  
Pin  
Direction  
Description  
BT_DEV_WAKE  
(BT_GPIO_0)  
Host output  
BT input  
Bluetooth device wake-up: Signal from the host to the Bluetooth device that the host  
requires attention.  
Asserted = Bluetooth device must wake up or remain awake.  
Deasserted = Bluetooth device may sleep when sleep criteria are met.  
The polarity of this signal is software configurable and can be asserted high or low. By  
default, BT_DEV_WAKE is active-low (if BT-WAKE is low it requires the device to wake up  
or remain awake).  
For USB applications, this pin can be used to disable the BT radio, which puts the device  
in Airport mode.  
BT_HOST_WAKE  
(BT_GPIO_1)  
BT output  
Host input  
Host wake-up. Signal from the Bluetooth device to the host indicating that Bluetooth device  
requires attention.  
Asserted = Host device must wake up or remain awake.  
Deasserted = Host device may sleep when sleep criteria are met.  
The polarity of this signal is software configurable and can be asserted high or low.  
BT_CLK_REQ  
RST_N  
BT output  
BT input  
Clock request  
Asserted = External clock reference required  
Deasserted = External clock reference may be powered down  
Used to place the chip in reset. RST_N is active-low.  
3.6.3 Bluetooth Baseband Core Power Management  
The following are low-power operations for the Bluetooth Baseband Core (BBC):  
Physical layer packet-handling turns the RF on and off dynamically within transmit/receive packets.  
Bluetooth-specified low-power connection modes: sniff, hold, and park. While in these modes, the CYW20704 runs on the low-power  
oscillator and wakes up after a predefined time period.  
3.7 Adaptive Frequency Hopping  
The CYW20704 supports host channel classification and dynamic channel classification Adaptive Frequency Hopping (AFH)  
schemes, as defined in the Bluetooth specification.  
Host channel classification enables the host to set a predefined hopping map for the device to follow.  
If dynamic channel classification is enabled, the device gathers link quality statistics on a channel-by-channel basis to facilitate chan-  
nel assessment and channel map selection. To provide a more accurate frequency hop map, link quality is determined using both RF  
and baseband signal processing.  
Document Number: 002-14786 Rev. *E  
Page 11 of 49  
CYW20704  
3.8 Collaborative Coexistence  
The CYW20704 provides extensions and collaborative coexistence to the standard Bluetooth AFH for direct communication with  
WLAN devices. Collaborative coexistence enables WLAN and Bluetooth to operate simultaneously in a single device. The device  
supports industry-standard coexistence signaling, including 802.15.2, and supports Cypress and third-party WLAN solutions.  
3.9 Global Coexistence Interface  
The CYW20704 supports the proprietary Cypress Global Coexistence Interface (GCI) which is a 2-wire interface.  
The following key features are associated with the interface:  
Enhanced coexistence data can be exchanged over GCI_SECI_IN and GCI_SECI_OUT a two-wire interface, one serial input  
(GCI_SECI_IN), and one serial output (GCI_SECI_OUT). The pad configuration registers must be programmed to choose the digital  
I/O pins that serve the GCI_SECI_IN and GCI_SECI_OUT function.  
It supports generic UART communication between WLAN and Bluetooth devices.  
To conserve power, it is disabled when inactive.  
It supports automatic resynchronizaton upon waking from sleep mode.  
It supports a baud rate of up to 4 Mbps.  
3.9.1 SECI I/O  
The CYW20704 devices have dedicated GCI_SECI_IN and GCI_SECI_OUT pins. The two pin functions can be mapped to any of  
the Cypress Global Co-existence Interface (GCI) GPIO. Pin function mapping is controlled by the configuration file that is stored in  
either NVRAM or downloaded directly into on-chip RAM from the host.  
3.10 Recommended BT Coexistence Interface Assignments  
The following tables show the recommended BT coexistence interface assignments.  
Table 3. BT GCI Two-Wire Coexistence  
Coexistence Signal Name  
BT_SECI_IN  
BT_SECI_OUT  
Signal Assignment  
Signal Assignment  
Pin Number  
Pin Number  
GPIO_6  
GPIO_7  
B6  
C6  
Table 4. BT GCI Three-Wire Coexistence  
Coexistence Signal Name  
BTCX_WL_ACTIVE  
BTCX_BT_ACTIVE  
BTCX_PRI_STATUS  
PCM_IN  
C7  
C8  
B7  
PCM_SYNC  
PCM_CLK  
Table 5. BT GCI Four-Wire Coexistence  
Coexistence Signal Name  
Signal Assignment  
Pin Number  
BTCX_WL_ACTIVE  
BTCX_BT_ACTIVE  
BTCX_PRI_STATUS  
BTCX_STATUS2  
PCM_IN  
C7  
C8  
B7  
A8  
PCM_SYNC  
PCM_CLK  
PCM_OUT  
Document Number: 002-14786 Rev. *E  
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CYW20704  
4. Microprocessor Unit  
4.1 Overview  
The CYW20704 microprocessor unit runs software from the Link Control (LC) layer up to the Host Controller Interface (HCI). The  
microprocessor is based on the Cortex-M3 32-bit RISC processor with embedded ICE-RT debug and JTAG interface units. The  
microprocessor also includes 848 KB of ROM memory for program storage and boot ROM, 352 KB of RAM for data scratch-pad,  
and patch RAM code.  
The internal boot ROM provides flexibility during power-on reset to enable the same device to be used in various configurations,  
including automatic host transport selection from UART and USB transports with or without external NVRAM. At power-up, the lower  
layer protocol stack is executed from the internal ROM.  
External patches can be applied to the ROM-based firmware to provide flexibility for bug fixes and features additions. These patches  
can be downloaded from the host to the device through the SPI interface or UART and USB transports, or using external NVRAM.  
The device can also support the integration of user applications and profiles using an external serial flash memory.  
4.2 NVRAM Configuration Data and Storage  
4.2.1 Serial Interface  
The CYW20704 includes an SPI master controller that can be used to access serial flash memory. The SPI master contains an AHB  
slave interface, transmit and receive FIFOs, and the SPI core PHY logic. Data is transferred to and from the module by the system  
CPU. DMA operation is not supported.  
4.3 EEPROM  
The CYW20704 includes a Cypress Serial Control (BSC) master interface. The BSC interface supports low-speed and fast mode  
devices and is compatible with I2C slave devices. Multiple I2C master devices and flexible wait state insertion by the master interface  
or slave devices are not supported. The CYW20704 provides 400 kHz, full speed clock support.  
The BSC interface is programmed by the CPU to generate the following BSC transfer types on the bus:  
Read-only  
Write-only  
Combined read/write  
Combined write-read  
NVRAM may contain configuration information about the customer application, including the following:  
Fractional-N information  
BD_ADDR  
UART baud rate  
USB enumeration information  
SDP service record  
File system information used for code, code patches, or data  
4.4 External Reset  
The CYW20704 has an integrated power-on reset circuit which completely resets all circuits to a known power on state. This action  
can also be driven by an external reset signal, which can be used to externally control the device, forcing it into a power-on reset  
state. The RST_N signal is an active-low signal, which is an input to the CYW20704 chip. The CYW20704 does not require an exter-  
nal pull-up resistor on the RST_N input.  
Document Number: 002-14786 Rev. *E  
Page 13 of 49  
CYW20704  
4.5 One-Time Programmable Memory  
The CYW20704 includes a One-Time Programmable (OTP) memory, allowing manufacturing customization and avoiding the need  
for an on-board NVRAM.If customization is not required, then the OTP does not need to be programmed. Whether the OTP is pro-  
grammed or not, it is disabled after the boot process completes to save power.  
The OTP size is 2048 bytes.  
The OTP is designed to store a minimal amount of information. Aside from OTP data, most user configuration information will be  
downloaded into RAM after the CYW20704 boots up and is ready for host transport communication. The OTP contents are limited  
to:  
Parameters required prior to downloading user configuration to RAM.  
Parameters unique to each part and each customer (i.e., the BD_ADDR, software license key, and USB PID/VID).  
The OTP memory is particularly useful in a PC design with USB transport capability because:  
Some customer-specific information must be configured before enumerating the part on the USB transport.  
Partorcustomeruniqueinformation(BD_ADDR, softwarelicensekey, andUSBPID/VID)donotneed tobestoredonthehostsystem.  
4.5.1 Contents  
The following are typical parameters programmed into the OTP memory:  
BD_ADDR  
Software license key  
USB PID/VID  
USB bus/self-powered status  
Output power calibration  
Frequency trimming  
Initial status LED drive configuration  
The OTP contents also include a static error correction table to improve yield during the programming process as well as forward  
error correction codes to eliminate any long-term reliability problems. The OTP contents associated with error correction are not vis-  
ible by customers.  
4.5.2 Programming  
OTP memory programming takes place through a combination of Cypress software integrated with the manufacturing test software  
and code embedded in CYW20704 firmware.  
Document Number: 002-14786 Rev. *E  
Page 14 of 49  
CYW20704  
5. Peripheral Transport Unit  
This section discusses the PCM, USB, UART, I2S, and SPI peripheral interfaces. The CYW20704 has a 1040-byte transmit and  
receive FIFO, which is large enough to hold the entire payload of the largest EDR BT packet (3-DH5).  
5.1 PCM Interface  
The CYW20704 supports two independent PCM interfaces that share the pins with the I2S interfaces. The PCM Interface on the  
CYW20704 can connect to linear PCM Codec devices in master or slave mode. In master mode, the CYW20704 generates the  
PCM_CLK and PCM_SYNC signals, and in slave mode, these signals are provided by another master on the PCM interface and are  
inputs to the CYW20704.  
The configuration of the PCM interface may be adjusted by the host through the use of vendor-specific HCI commands.  
5.1.1 Slot Mapping  
The CYW20704 supports up to three simultaneous full-duplex SCO or eSCO channels through the PCM interface. These three  
channels are time-multiplexed onto the single PCM interface by using a time-slotting scheme where the 8 kHz or 16 kHz audio sam-  
ple interval is divided into as many as 16 slots. The number of slots is dependent on the selected interface rate of 128 kHz, 512 kHz,  
or 1024 kHz. The corresponding number of slots for these interface rate is 1, 2, 4, 8, and 16, respectively. Transmit and receive PCM  
data from an SCO channel is always mapped to the same slot. The PCM data output driver tristates its output on unused slots to  
allow other devices to share the same PCM interface signals. The data output driver tristates its output after the falling edge of the  
PCM clock during the last bit of the slot.  
5.1.2 Frame Synchronization  
The CYW20704 supports both short- and long-frame synchronization in both master and slave modes. In short-frame synchroniza-  
tion mode, the frame synchronization signal is an active-high pulse at the audio frame rate that is a single-bit period in width and is  
synchronized to the rising edge of the bit clock. The PCM slave looks for a high on the falling edge of the bit clock and expects the  
first bit of the first slot to start at the next rising edge of the clock. In long-frame synchronization mode, the frame synchronization sig-  
nal is again an active-high pulse at the audio frame rate; however, the duration is three bit periods and the pulse starts coincident  
with the first bit of the first slot.  
5.1.3 Data Formatting  
The CYW20704 may be configured to generate and accept several different data formats. For conventional narrowband speech  
mode, the CYW20704 uses 13 of the 16 bits in each PCM frame. The location and order of these 13 bits can be configured to sup-  
port various data formats on the PCM interface. The remaining three bits are ignored on the input and may be filled with 0s, 1s, a  
sign bit, or a programmed value on the output. The default format is 13-bit 2’s complement data, left justified, and clocked MSB first.  
5.1.4 Wideband Speech Support  
When the host encodes Wideband Speech (WBS) packets in transparent mode, the encoded packets are transferred over the PCM  
bus for an eSCO voice connection. In this mode, the PCM bus is typically configured in master mode for a 4 kHz sync rate with 16-  
bit samples, resulting in a 64 Kbps bit rate. The CYW20704 also supports slave transparent mode using a proprietary rate-matching  
scheme. In SBC-code mode, linear 16-bit data at 16 kHz (256 Kbps rate) is transferred over the PCM bus.  
Document Number: 002-14786 Rev. *E  
Page 15 of 49  
CYW20704  
5.1.5 Multiplexed Bluetooth Over PCM  
Bluetooth supports multiple audio streams within the Bluetooth channel and both 16 kHz and 8 kHz streams can be multiplexed. This  
mode of operation is only supported when the Bluetooth host is the master. Figure 5 shows the operation of the multiplexed trans-  
port with three simultaneous SCO connections. To accommodate additional SCO channels, the transport clock speed is increased.  
To change between modes of operation, the transport must be halted and restarted in the new configuration.  
Figure 5. Functional Multiplex Data Diagram  
1 frame  
BT SCO 1 Rx  
BT SCO 1 Tx  
BT SCO 2 Rx  
BT SCO 2 Tx  
BT SCO 3 Rx  
BT SCO 3 Tx  
PCM_OUT  
PCM_IN  
PCM_SYNC  
PCM_CLK  
CLK  
16 bits per SCO frame  
Each SCO channel duplicates the data 6 times. Each  
WBS frame duplicates the data 3 times per frame  
5.1.6 Burst PCM Mode  
In this mode of operation, the PCM bus runs at a significantly higher rate of operation to allow the host to duty cycle its operation and  
save current. In this mode of operation, the PCM bus can operate at a rate of up to 24 MHz. This mode of operation is initiated with  
an HCI command from the host.  
5.2 HCI Transport Detection Configuration  
The CYW20704 supports the following interface types for the HCI transport from the host:  
UART (H4)  
USB  
Only one host interface can be active at a time. The firmware performs a transport detect function at boot-time to determine which  
host is the active transport. It can auto-detect UART and USB interfaces, but the SPI interface must be selected by strapping the  
SCL pin to 0.  
The complete algorithm is summarized as follows:  
1. Determine if any local NVRAM contains a valid configuration file. If it does and a transport configuration entry is present, select  
the active transport according to entry, and then exit the transport detection routine.  
2. Look for start-of-frame (SOF) on the USB interface. If it is present, select USB.  
3. Look for CTS_N = 0 on the UART interface. If it is present, select UART.  
4. Repeat Step 2 and Step 3 until transport is determined.  
Document Number: 002-14786 Rev. *E  
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CYW20704  
5.3 USB Interface  
5.3.1 Features  
The following USB interface features are supported:  
USB Protocol, Revision 2.0, full-speed compliant with LPM support (up to 12 Mbps)  
Global and selective suspend and resume with remote wake-up  
Bluetooth HCI  
HID, DFU, UHE (proprietary method to emulate an HID device at system boot)  
Integrated detach resistor  
Note: If the USB transport is not used, tie the CYW20704 USB pins and VDD_USB to ground.  
5.3.2 Operation  
The CYW20704 can be configured to boot up as a single USB peripheral, and the host detects a single USB Bluetooth device.  
The CYW20704 can boot up showing the independent interfaces connected to logical USB devices internal to the CYW20704—a  
generic Bluetooth device, a mouse, and a keyboard. In this mode, the mouse and keyboard are emulated devices, since they con-  
nect to real HID devices via a Bluetooth link. The Bluetooth link to these HID devices is hidden from the USB host. To the host, the  
mouse and/or keyboard appear to be directly connected to the USB port. This Cypress proprietary architecture is called USB HID  
Emulation (UHE).  
The USB device, configuration, and string descriptors are fully programmable, allowing manufacturers to customize the descriptors,  
including vendor and product IDs, the CYW20704 uses to identify itself on the USB port. To make custom USB descriptor informa-  
tion available at boot time, stored it in external NVRAM.  
In the single USB peripheral operating mode, the Bluetooth device is configured to include the following interfaces:  
Interface 0  
Contains a Control endpoint (Endpoint 0x00) for HCI commands, a Bulk In Endpoint (Endpoint 0x82) for receiving  
ACL data, a Bulk Out Endpoint (Endpoint 0x02) for transmitting ACL data, and an Interrupt Endpoint (Endpoint  
0x81) for HCI events.  
Interface 1  
Interface 2  
Contains Isochronous In and Out endpoints (Endpoints 0x83 and 0x03) for SCO traffic. Several alternate Interface  
1 settings are available for reserving the proper bandwidth of isochronous data (depending on the application).  
Contains Bulk In and Bulk Out endpoints (Endpoints 0x84 and 0x04) used for proprietary testing and debugging  
purposes. These endpoints can be ignored during normal operation.  
5.3.3 UHE Support  
The CYW20704 supports the USB device model (USB 2.0-compatible, full-speed compliant with LPM support). Optional mouse and  
keyboard interfaces utilize Cypress’s proprietary USB HID Emulation (UHE) architecture, which allows these Bluetooth devices  
appear as standalone HID devices even though connected through a Bluetooth link.  
The presence of UHE devices requires the CYW20704 to be configured as a composite device (Composite mode). In this mode, the  
Bluetooth mouse and keyboard interfaces are independently controlled and appear as standalone logical devices.  
Cypress’s standard composite configuration uses the following layout:  
Interface 0—Keyboard  
Interface 1—Mouse  
Interface 2/3/4—Bluetooth (as described above)  
When operating in Composite mode, every interface does not have to be enabled—each can be optionally enabled. The configura-  
tion record in NVRAM determines which devices are present.  
Document Number: 002-14786 Rev. *E  
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CYW20704  
5.4 UART Interface  
The CYW20704 shares a single UART for Bluetooth. The UART is a standard 4-wire interface (RX, TX, RTS, and CTS) with adjust-  
able baud rates from 38400 bps to 4.0 Mbps. The interface features an automatic baud rate detection capability that returns a baud  
rate selection. Alternatively, the baud rate may be selected through a vendor-specific UART HCI command.  
UART has a 1040-byte receive FIFO and a 1040-byte transmit FIFO to support EDR. Access to the FIFOs is conducted through the  
AHB interface through either DMA or the CPU. The UART supports the Bluetooth 4.1 UART HCI specification: H4, and a custom  
Extended H4. The default baud rate is 115.2 Kbaud.  
The CYW20704 UART can perform XON/XOFF flow control and includes hardware support for the Serial Line Input Protocol (SLIP).  
It can also perform wake-on activity. For example, activity on the RX or CTS inputs can wake the chip from a sleep state.  
Normally, the UART baud rate is set by a configuration record downloaded after device reset, or by automatic baud rate detection,  
and the host does not need to adjust the baud rate. Support for changing the baud rate during normal HCI UART operation is  
included through a vendor-specific command that allows the host to adjust the contents of the baud rate registers. The CYW20704  
UARTs operate correctly with the host UART as long as the combined baud rate error of the two devices is within ±2%.  
Table 6. Example of Common Baud Rates  
Desired Rate  
Actual Rate  
Error (%)  
4000000  
3000000  
2000000  
1500000  
921600  
460800  
230400  
115200  
57600  
4000000  
3000000  
2000000  
1500000  
923077  
461538  
230796  
115385  
57692  
0.00  
0.00  
0.00  
0.00  
0.16  
0.16  
0.17  
0.16  
0.16  
0.00  
38400  
38400  
5.5 Simultaneous UART Transport and Bridging  
Note: Simultaneous UART transport and bridging is only valid for the HCI operating mode.  
The CYW20704 supports UART or USB interfaces that can function as the host controller interface (HCI). Typically, a customer  
application would choose one of the two interfaces and the other would be idle. The CYW20704 allows the UART transport to oper-  
ate simultaneously with the USB. To operate this way, the assumption is that the USB would function as the primary host transport,  
while the UART would function as a secondary communication channel that can operate at the same time. This can enable the fol-  
lowing applications:  
Bridging primary HCI transport traffic to another device via the UART  
Generic communication to an external device for a vendor-supported application via the UART  
Document Number: 002-14786 Rev. *E  
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CYW20704  
6. Frequency References  
The CYW20704 uses an external crystal for generating all radio frequencies and normal operation clocking. As an alternative, an  
external frequency reference can be used.  
6.1 Crystal Interface and Clock Generation  
The CYW20704 uses a fractional-N synthesizer to generate the radio frequencies, clocks, and data/packet timing, enabling it to  
operate from any of a multitude of frequency sources. The source can be external, such as a crystal interfaced directly to the device  
or an external frequency reference can be used.  
Typical crystal frequencies of 20 MHz and 40 MHz are supported using the XTAL_STRAP_1 pin on the CYW20704. The signal char-  
acteristics for the crystal interface are listed in Table 7 on page 19.  
Table 7. Crystal Interface Signal Characteristics  
Parameter  
Acceptable frequencies  
Crystal load capacitance  
ESR  
Crystal  
19.2–52 MHz in 2 ppma steps  
12 (typical)  
External Frequency Reference  
12–52 MHz in 2 ppma steps  
Units  
N/A  
pF  
60 (max)  
Power dissipation  
Input signal amplitude  
200 (max)  
μW  
mVp-p  
N/A  
400 to 1200  
2000 to 3300 (requires a 10 pF DC blocking  
capacitor to attenuate the signal)  
Signal type  
N/A  
N/A  
Square-wave or sine-wave  
Input impedance  
1  
2  
MΩ  
pF  
Phase noise  
@ 1 kHz  
@ 10 kHz  
@ 100 kHz  
@ 1 MHz  
N/A  
N/A  
N/A  
N/A  
N/A  
< –120  
< –130  
< –135  
< –136  
dBc/Hz  
dBc/Hz  
dBc/Hz  
dBc/Hz  
Tolerance without frequency  
trimmingb  
±20  
±20  
ppm  
Initial frequency tolerance trimming ±50  
range  
±50  
ppm  
a. The frequency step size is approximately 80 Hz resolution.  
b. AT-Cut crystal or TXCO recommended.  
Document Number: 002-14786 Rev. *E  
Page 19 of 49  
CYW20704  
6.2 Crystal Oscillator  
The CYW20704 can use an external crystal to provide a frequency reference. The recommended configuration for the crystal oscil-  
lator, including all external components, is shown in Figure 6.  
Figure 6. Recommended Oscillator Configuration  
XOIN  
0 ~18 pF*  
Crystal  
Oscillator  
XOOUT  
0 ~18 pF*  
*Capacitor value range depends on  
the manufacturer of the XTAL as well  
as board layout.  
6.3 Frequency Selection  
Any frequency within the range specified for the crystal and frequency reference can be used. Since bit timing is derived from the ref-  
erence frequency, the CYW20704 must have the reference frequency set correctly in order for any of the USB, UART, and PCM  
interfaces to function properly.  
The CYW20704 reference frequency can be selected by using BT_XTAL_STRAP_1. The typical crystal frequencies of 20 MHz and  
40 MHz are supported.  
The GPIO_2 pin needs to be tied to ground when a dedicated Bluetooth crystal is used.  
Clock (MHz):XTAL_Strap_1 (Pin-F2)  
40: Low  
20: High  
If the application requires a frequencies other than these, the value can be stored in an external NVRAM. Programming the refer-  
ence frequency in NVRAM provides the maximum flexibility in the selection of the reference frequency, since any frequency within  
the specified range for crystal and external frequency reference can be used. During power-on reset (POR), the device downloads  
the parameter settings stored in NVRAM, which can be programmed to include the reference frequency and frequency trim values.  
Typically, this is how a PC Bluetooth application is configured.  
6.4 Frequency Trimming  
The CYW20704 uses a fractional-N synthesizer to digitally fine-tune the frequency reference input to within ±2 ppm tuning accuracy.  
This trimming function can be applied to either the crystal or an reference frequency source. Unlike the typical crystal-trimming meth-  
ods used, the CYW20704 changes the frequency using a fully digital implementation and is much more stable and unaffected by  
crystal characteristics or temperature. Input impedance and loading characteristics remain unchanged on the crystal during the trim-  
ming process and are unaffected by process and temperature variations.  
The option to use or not use frequency trimming is based on the system designer’s cost trade-off between bill-of-materials (BOM)  
cost of the crystal and the added manufacturing cost associated with frequency trimming. The frequency trimming value can either  
be stored in the host and written to the CYW20704 as a vendor-specific HCI command or stored in NVRAM and subsequently  
recalled during POR.  
Frequency trimming is not a substitute for the poor use of tuning capacitors at an crystal oscillator (XTAL). Occasionally, trimming  
can help alleviate hardware changes.  
Document Number: 002-14786 Rev. *E  
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CYW20704  
7. Pin-out and Signal Descriptions  
7.1 Pin Descriptions  
Table 8. CYW20704 FcBGA Signal Descriptions  
FcBGA Pin  
(49-Ball)  
Signal  
I/O  
Power Domain  
Description  
Radio  
VDD_RF  
VDD_RF  
VDD_RF  
Voltage Regulators  
N/A  
RFOP  
A2  
A4  
A5  
I/O  
RF I/O antenna port  
XO_IN  
XO_OUT  
I
Crystal or reference input  
Crystal oscillator output  
O
VBAT  
D1  
E1  
E2  
F1  
I
VBAT input pin  
2.5V LDO input  
2.5V LDO output  
1.2V LDO output  
VDD2P5_IN  
VDD2P5_OUT  
VDDC_OUT  
I
N/A  
O
O
N/A  
N/A  
Straps  
BT_XTAL_STRAP_1  
F2  
I
VDDO  
This pin is used as strap for choosing the XTAL  
frequencies.  
RST_N  
A6  
G7  
I
I
VDDO  
Active-low reset input  
BT_TM1  
VDDO  
Reserved: connect to ground.  
Digital I/O  
VDDO  
BT_GPIO_0  
BT_GPIO_1  
BT_GPIO_2  
F8  
F7  
E4  
I
BT_GPIO_0/BT_DEV_WAKE  
Asignal from the host to the CYW20704 device that the  
host requires attention.  
O
I
VDDO  
VDDO  
BT_GPIO_1/BT_HOST_WAKE  
A signal from the CYW20704 device to the host  
indicating that the Bluetooth device requires attention.  
When high, this signal extends the XTAL warm-up time  
for external CLK requests. Otherwise, it is typically  
connected to ground when a dedicated BT crystal is  
used.  
BT_GPIO_3  
BT_GPIO_4  
C5  
D6  
I/O  
I/O  
VDDO  
VDDO  
General-purpose I/O.  
General-purpose I/O. It can also be configured as a GCI  
pin.  
BT_GPIO_5  
BT_GPIO_6  
BT_GPIO_7  
B5  
B6  
C6  
I/O  
I/O  
I/O  
VDDO  
VDDO  
VDDO  
General-purpose I/O. It can also be configured as a GCI  
pin.  
General-purpose I/O. It can also be configured as a GCI  
pin.  
General-purpose I/O. It can also be configured as a GCI  
pin.  
BT_UART_RXD  
BT_UART_TXD  
BT_UART_RTS_N  
BT_UART_CTS_N  
BT_CLK_REQ  
F5  
F4  
F3  
G4  
G8  
D8  
E8  
E7  
D7  
I/O  
I/O  
I/O  
I/O  
O
VDDO  
VDDO  
VDDO  
VDDO  
VDDO  
VDDO  
VDDO  
VDDO  
VDDO  
UART receive data  
UART transmit data  
UART request to send output  
UART clear to send input  
This pin is used for shared-clock application.  
BSC clock  
SPI2_MISO_I2S_SCL  
SPI2_MOSI_I2S_SDA  
SPI2_CLK  
I/O  
I/O  
I/O  
I/O  
BSC data  
Serial flash SPI clock  
SPI2_CSN  
Serial flash active-low chip select  
Document Number: 002-14786 Rev. *E  
Page 21 of 49  
CYW20704  
Table 8. CYW20704 FcBGA Signal Descriptions (Cont.)  
FcBGA Pin  
Signal  
I/O  
Power Domain  
Description  
(49-Ball)  
I2S_DI/PCM_IN  
C7  
A8  
B7  
C8  
I/O  
VDDO  
VDDO  
VDDO  
VDDO  
USB  
PCM/I2S data input  
PCM/I2S data output  
PCM/I2S clock  
I2S_DO/PCM_OUT  
I2S_CLK/PCM_CLK  
I2S_WS/PCM_SYNC  
I/O  
I/O  
I/O  
PCM sync/I2S word select  
BT_HUSB_DP  
BT_HUSB_DN  
G2  
G3  
I/O  
I/O  
VDD_USB  
VDD_USB  
JTAG  
USB D+ signal. If not used, connect to GND.  
USB D- signal. If not used, connect to GND.  
JTAG_SEL  
D5  
G1  
I/O  
I
VDDO  
Supplies  
N/A  
Used for debugging  
BT_VDD_USB  
3.3V USB transceiver supply voltage. If the USB  
transport is not needed, connect this pin to GND.  
BT_IFVDD1P2  
BT_PAVDD2P5  
BT_LNAVDD1P2  
BT_VCOVDD1P2  
BT_PLLVDD1P2  
VDDC  
B4  
A1  
B1  
C1  
A3  
I
I
I
I
I
I
I
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
Radio IF PLL supply  
Radio PA supply  
Radio LNA supply  
Radio VCO supply  
Radio RF PLL supply  
Core logic supply  
Digital I/O supply voltage  
Ground  
B8, G6  
G5  
VDDO  
VSS  
A7, B2, B3, C2, D2, –  
F6  
Document Number: 002-14786 Rev. *E  
Page 22 of 49  
CYW20704  
8. Ball Grid Arrays  
Figure 7 shows the top view of the 49-ball 4.5 mm x 4 mm x 0.8 mm (FcBGA).  
Figure 7. 4.5 mm x 4 mm x 0.8 mm (FcBGA) Array  
Figure 8. Ball-Out for the 49-Ball FcBGA  
1
2
3
4
5
6
7
8
BT_  
PAVDD2P5  
BT_  
PLLVDD1P2  
I2S_DO/  
PCM_OUT  
RFOP  
XO_IN  
XO_OUT  
RST_N  
VSSC  
A
B
C
D
E
F
BT_LNAVDD1  
P2  
BT_  
IFVDD1P2  
I2S_CLK/  
PCM_CLK  
VSS  
VSS  
VSS  
VSS  
BT_GPIO_5 BT_GPIO_6  
BT_GPIO_3 BT_GPIO_7  
VDDC  
BT_  
VCOVDD1P2  
I2S_DI/  
PCM_IN  
I2S_WS/  
PCM_SYNC  
SPI2_MISO_  
I2C_SCL  
VBAT  
JTAG_SEL  
BT_GPIO_4  
SPI2_CSN  
SPI2_CLK  
VDD2P5_  
OUT  
SPI2_MOSI_  
I2C_SDA  
VDD2P5_IN  
VDDC_OUT  
BT_GPIO_2  
BT_GPIO_1/ BT_GPIO_0/  
BT_XTAL  
_STRAP_1  
BT_UART  
_RST_N  
BT_UART  
_TXD  
BT_UART  
_RXD  
VSS  
BT_HOST_  
WAKE  
BT_DEV  
_WAKE  
BT_VDD  
_USB  
BT_HUSB  
_DP  
BT_HUSB  
_DN  
BT_UART  
_CTS_N  
BT_CLK  
_REQ  
VDDO  
VDDC  
BT_TM1  
G
Document Number: 002-14786 Rev. *E  
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CYW20704  
9. Electrical Characteristics  
Note: All voltages listed in Table 9 are referenced to VDD  
.
Table 9. Absolute Maximum Voltages  
Requirement Parameter  
Specification  
Nominal  
Units  
Minimum  
Maximum  
Ambient Temperature of Operation  
Storage temperature  
ESD Tolerance HBM  
ESD Tolerance MM  
ESD Tolerance CDM  
Latch-up  
–30  
–40  
25  
85  
°C  
°C  
V
150  
–2000  
–100  
–500  
–200  
1.14  
3
2000  
100  
500  
200  
1.26  
3.6  
V
V
mA  
V
VDD Core  
1.2  
3.3  
1.2  
2.5  
VDD IO  
V
VDD RF (excluding class 1 PA)  
VDD PA (class 1 mode)  
1.14  
2.25  
1.26  
2.75  
V
V
Table 10. Power Supply Specifications  
Parameter  
Conditions  
Min.  
Typ.  
Max.  
Max.  
Units  
VBAT input  
3.0  
3.0  
3.3  
3.3  
3.6  
3.6  
V
V
2.5V LDO input  
Table 11. VDDC LDO Electrical Specifications  
Parameter  
Conditions  
Min.  
Typ.  
Units  
Input Voltage  
3.0  
3.3  
3.6  
V
V
Nominal Output  
Voltage  
1.2  
DC Accuracy  
–5  
5
%
Load Current  
40  
200  
0.2  
mA  
mV  
%Vo/V  
μA  
Dropout Voltage  
Line Regulation  
I
load = 40 mA  
Vin from 1.62V to 3.6V, Iload = 40 mA  
Power Down Current Vin = 3.3V @25C  
0.2  
Over Current Limit  
100  
0.8  
mA  
μF  
External Output  
Capacitor  
Ceramic cap with ESR 0.5Ω  
1
4.7  
External Input  
Capacitor  
Ceramic, X5R, 0402, ±20%, 10V.  
1
μF  
Document Number: 002-14786 Rev. *E  
Page 24 of 49  
CYW20704  
Table 12. BTLDO_2P5 Electrical Specifications  
Parameters  
Conditions  
Min = Vo + 0.2V = 2.7V  
(for Vo = 2.5V)  
Dropout voltage requirement must be met  
under maximum load for performance  
specs.  
Min  
Typ  
Max  
Units  
Input supply voltage,  
Vin  
3.0  
3.3  
3.6  
V
Nominal output  
voltage, Vo  
Default = 2.5V  
2.5  
V
Output voltage  
programmability  
Range  
2.2  
2.8  
5
V
%
Accuracy at any step (including line/load –5  
regulation), load >0.1 mA  
Dropout voltage  
Output current  
At max load  
200  
70  
mV  
mA  
μA  
Quiescent current  
No load; Vin = Vo + 0.2V  
8
16  
Max load @ 70 mA; Vin = Vo + 0.2V  
660  
700  
Leakage current  
Power-down mode. At junction  
temperature 85°C.  
1.5  
2.2  
1
5
μA  
μF  
μF  
External output  
capacitor, Co  
Ceramic, X5R, 0402, (ESR: 5m-240 m), 0.7  
±20%, 6.3V  
2.64  
External input  
capacitor  
Ceramic, X5R, 0402, ±20%, 10V  
Table 13. Digital I/O Characteristics  
Characteristics  
Input low voltage (VDDO = 3.3V)  
Input high voltage (VDDO = 3.3V)  
Output low voltage  
Symbol  
VIL  
Minimum  
Typical  
Maximum  
Unit  
0.8  
V
VIH  
VOL  
VOH  
IIL  
2.0  
V
0.4  
V
Output high voltage  
VDDO – 0.4V  
V
Input low current  
1.0  
1.0  
2.0  
2.0  
0.4  
μA  
μA  
mA  
mA  
pF  
Input high current  
IIH  
Output low current (VDDO = 3.3V, VOL = 0.4V)  
Output high current (VDDO = 3.3V, VOH = 2.9V)  
Input capacitance  
IOL  
IOH  
CIN  
Document Number: 002-14786 Rev. *E  
Page 25 of 49  
CYW20704  
Table 14. USB/UART Interface Level  
Parameter  
I/O supply voltage  
Symbol  
Minimum  
3.0  
Typical  
Maximum  
Unit  
VDD_USB/VDDO  
3.6  
500  
V
Supply current  
Icchpf  
Vih  
mA  
V
Input high voltage (driven)  
Input high voltage (floating)  
Input low voltage  
Differential input sensitivitya  
Differential common-mode rangea  
Output low voltage  
2.0  
2.7  
Vihz  
Vil  
3.6  
0.8  
V
V
Vdi  
0.2  
0.8  
0.0  
2.8  
1.3  
V
Vcm  
Vol  
2.5  
0.3  
3.6  
2.0  
V
V
Output high voltage (driven)  
Output signal crossover voltagea  
Voh  
Vcrs  
V
V
a. Applies to USB only.  
Table 15. Bluetooth and BLE Current Consumption  
Operating Mode  
VBAT (VBAT=3.6V) Typical  
Units  
Sleep  
114  
μA  
Standard 1.28s Inquiry Scan  
500 ms Sniff Master (–4 Att)  
DM1/DH1 Master  
DM3/DH3 Master  
DM5/DH5 Master  
3DH5/3DH1 Master  
SCO HV3 Master  
BLE SCANa  
334  
μA  
900  
μA  
32.15  
38.14  
38.46  
25.94  
14.64  
355  
mA  
mA  
mA  
mA  
mA  
μA  
BLE ADV: Unconnectable 1.00 sec  
BLE Connected 1 sec  
176  
835  
μA  
μA  
Note: Current measurements were done with 12 dBm TX power for GFSK and 9 dBm TX power for EDR and BLE.  
a. No devices present. A 1.28 second interval with a scan window of 11.25 ms.  
Document Number: 002-14786 Rev. *E  
Page 26 of 49  
CYW20704  
9.1 RF Specifications  
Table 16. Receiver RF Specificationsa, b  
Parameter  
General  
Conditions  
Minimum  
Typical c  
Maximum  
Unit  
MHz  
Frequency range  
RX sensitivity d  
2402  
2480  
GFSK, 0.1% BER, 1 Mbps  
/4-DQPSK, 0.01% BER, 2 Mbps  
8-DPSK, 0.01% BER, 3 Mbps  
GFSK, 1 Mbps  
–93.5  
–95.5  
–89.5  
dBm  
dBm  
dBm  
dBm  
dBm  
Maximum input  
–20  
–20  
Maximum input  
/4-DQPSK, 8-DPSK, 2/3 Mbps  
Interference Performance  
GFSK Modulatione  
C/I cochannel  
GFSK, 0.1% BER  
GFSK, 0.1% BER  
GFSK, 0.1% BER  
GFSK, 0.1% BER  
GFSK, 0.1% BER  
9.5  
–5  
11  
dB  
dB  
dB  
dB  
dB  
dB  
C/I 1 MHz adjacent channel  
C/I 2 MHz adjacent channel  
C/I > 3 MHz adjacent channel  
C/I image channel  
0
–40  
–49  
–27  
–37  
–30.0  
–40.0  
–9.0  
–20.0  
C/I 1 MHz adjacent to image channel GFSK, 0.1% BER  
QPSK Modulationf  
C/I cochannel  
/4-DQPSK, 0.1% BER  
11  
13  
dB  
dB  
dB  
dB  
dB  
dB  
C/I 1 MHz adjacent channel  
C/I 2 MHz adjacent channel  
C/I > 3 MHz adjacent channel  
C/I image channel  
/4-DQPSK, 0.1% BER  
/4-DQPSK, 0.1% BER  
8-DPSK, 0.1% BER  
–8  
0
–40  
–50  
–27  
–40  
–30.0  
–40.0  
–7.0  
–20.0  
/4-DQPSK, 0.1% BER  
C/I 1 MHz adjacent to image channel /4-DQPSK, 0.1% BER  
8PSK Modulationg  
C/I cochannel  
8-DPSK, 0.1% BER  
8-DPSK, 0.1% BER  
8-DPSK, 0.1% BER  
8-DPSK, 0.1% BER  
8-DPSK, 0.1% BER  
17  
21  
dB  
dB  
dB  
dB  
dB  
dB  
C/I 1 MHz adjacent channel  
C/I 2 MHz adjacent channel  
C/I > 3 MHz adjacent channel  
C/I Image channel  
–5  
5
–40  
–47  
–20  
–35  
–25.0  
–33.0  
0
C/I 1 MHz adjacent to image channel 8-DPSK, 0.1% BER  
–13.0  
Out-of-Band Blocking Performance (CW) h  
30 MHz–2000 MHz  
2000–2399 MHz  
0.1% BER  
0.1% BER  
0.1% BER  
0.1% BER  
–10.0  
–27  
dBm  
dBm  
dBm  
dBm  
2498–3000 MHz  
–27  
3000 MHz–12.75 GHz  
–10.0  
Document Number: 002-14786 Rev. *E  
Page 27 of 49  
CYW20704  
Table 16. Receiver RF Specificationsa, b (Cont.)  
Parameter  
Conditions  
Minimum  
Typical c  
–10 i  
Maximum  
Unit  
dBm  
Out-of-Band Blocking Performance, Modulated Interferer  
776–764 MHz  
824–849 MHz  
1850–1910 MHz  
824–849 MHz  
880–915 MHz  
1710–1785 MHz  
1850–1910 MHz  
1850–1910 MHz  
1920–1980 MHz  
CDMA  
CDMA  
–10 i  
–23 i  
–10 i  
–10 i  
–23 i  
–23 i  
–23 i  
–23 i  
dBm  
dBm  
dBm  
dBm  
dBm  
dBm  
dBm  
dBm  
CDMA  
EDGE/GSM  
EDGE/GSM  
EDGE/GSM  
EDGE/GSM  
WCDMA  
WCDMA  
Intermodulation Performance j  
BT, Df = 4 MHz  
–39.0  
dBm  
Spurious Emissions k  
30 MHz to 1 GHz  
1–12.75 GHz  
–62  
–47  
dBm  
dBm  
65–108 MHz  
FM RX  
CDMA  
CDMA  
EDGE/GSM  
EDGE/GSM  
PCS  
–147  
–147  
–147  
–147  
–147  
–147  
–147  
dBm/Hz  
dBm/Hz  
dBm/Hz  
dBm/Hz  
dBm/Hz  
dBm/Hz  
dBm/Hz  
746–764 MHz  
851–894 MHz  
925–960 MHz  
1805–1880 MHz  
1930–1990 MHz  
2110–2170 MHz  
WCDMA  
a. All specifications are single ended. Unused inputs are left open.  
b. All specifications, except typical, are for industrial temperatures.  
c. Typical operating conditions are 3.3V VBAT and 25°C ambient temperature. The final TX power depends on the insertion loss due to the  
connector and the antenna. Typically, less than 2 dB. However, the actual value depends on the connector and antenna and must be  
measured. The stated number is for chip output power.  
d. The receiver sensitivity is measured at BER of 0.1% on the device interface.  
e. Typical GFSK CI numbers at –7 MHz, –5 MHz, and –3 MHz are –45 dB, –42 dB, and –41 dB, respectively.  
f.  
Typical QPSK CI numbers at –7 MHz, –5 MHz, and –3 MHz are –46 dB, –43 dB, and –42 dB, respectively.  
g. Typical 8PSK CI numbers at –7 MHz, –5 MHz, and –3 MHz are –50 dB, –45 dB, and –45 dB, respectively.  
h. Meets this specification using front-end band pass filter.  
i.  
j.  
Numbers are referred to the pin output with an external BPF filter.  
f0 = -64 dBm Bluetooth-modulated signal, f1 = –39 dBm sine wave, f2 = –39 dBm Bluetooth-modulated signal, f0 = 2f1 – f2, and |f2 –  
f1| = n*1 MHz, where n is 3, 4, or 5. For the typical case, n = 4.  
k. Includes baseband radiated emissions.  
Document Number: 002-14786 Rev. *E  
Page 28 of 49  
CYW20704  
Table 17. Transmitter RF Specifications a b  
Parameter  
General  
Conditions  
Minimum  
Typical  
Maximum  
Unit  
MHz  
Frequency range  
2402  
2480  
Class1: GFSK TX power c  
Class1: EDR TX power d  
Class 2: GFSK TX power  
Power control step  
2
12  
9
8
dBm  
dBm  
dBm  
dB  
2
4
Modulation Accuracy  
/4-DQPSK Frequency Stability  
/4-DQPSK RMS DEVM  
/4-QPSK Peak DEVM  
/4-DQPSK 99% DEVM  
8-DPSK frequency stability  
8-DPSK RMS DEVM  
8-DPSK Peak DEVM  
8-DPSK 99% DEVM  
–10  
10  
20  
35  
30  
10  
13  
25  
20  
kHz  
%
%
%
–10  
kHz  
%
%
%
In-Band Spurious Emissions  
1.0 MHz < |M – N| < 1.5 MHz  
1.5 MHz < |M – N| < 2.5 MHz  
|M – N| > 2.5 MHz  
–26  
–20  
–40  
dBc  
dBm  
dBm  
Out-of-Band Spurious Emissions  
30 MHz to 1 GHz  
–36.0 e  
–30.0 e, f  
–47.0  
dBm  
dBm  
dBm  
dBm  
1–12.75 GHz  
1.8–1.9 GHz  
5.15–5.3 GHz  
–47.0  
GPS Band Noise Emission (without a front-end band pass filter)  
1572.92 MHz to 1577.92 MHz  
Out-of-Band Noise Emissions (without a front-end band pass filter)  
–150  
–127  
dBm/Hz  
65–108 MHz  
FM RX  
–145  
–145  
–145  
–145  
–145  
–145  
–140  
dBm/Hz  
dBm/Hz  
dBm/Hz  
dBm/Hz  
dBm/Hz  
dBm/Hz  
dBm/Hz  
746–764 MHz  
869–960 MHz  
925–960 MHz  
1805–1880 MHz  
1930–1990 MHz  
2110–2170 MHz  
CDMA  
CDMA  
EDGE/GSM  
EDGE/GSM  
PCS  
WCDMA  
a. All specifications are for industrial temperatures.  
b. All specifications are single-ended. Unused input are left open.  
c. +12 dBm output for GFSK measured with PA VDD = 2.5V.  
d. +9 dBm output for EDR measured with PA VDD = 2.5V.  
e. Maximum value is the value required for Bluetooth qualification.  
f.  
Meets this spec using a front-end bandpass filter.  
Document Number: 002-14786 Rev. *E  
Page 29 of 49  
CYW20704  
Table 18. BLE RF Specifications  
Parameter  
Frequency Range  
RX Sensea  
Conditions  
Minimum  
Typical  
Maximum  
Unit  
MHz  
n/a  
2402  
2480  
GFSK, 0.1% BER, 1 Mbps  
–96  
9
dBm  
dBm  
kHz  
%
TX Powerb  
n/a  
n/a  
n/a  
n/a  
Mod Char: Delta F1 average  
Mod Char: Delta F2 maxc  
Mod Char: Ratio  
225  
99.9  
0.8  
255  
275  
0.95  
%
a. Dirty TX is Off.  
b. The BLE TX power can be increased to compensate for front-end losses such as BPF, diplexer, switch, etc. The output is capped at 12 dBm  
out. The BLE TX power at the antenna port cannot exceed the 10 dBm EIRP specification limit.  
c. At least 99.9% of all delta F2 max frequency values recorded over 10 packets must be greater than 185 kHz.  
Document Number: 002-14786 Rev. *E  
Page 30 of 49  
CYW20704  
9.2 Timing and AC Characteristics  
In this section, use the numbers listed in the reference column to interpret the timing diagrams.  
9.2.1 Startup Timing  
The global reset signal in the CYW20704 is a logical OR (actually a wired AND, since the signals are active low) of the RST_N input  
and the internal POR signals. The last signal to be released determines the time at which the chip is released from reset. The POR  
is typically asserted for 2.4 ms after the POR threshold is crossed.  
The following two figures illustrate two startup timing scenarios.  
Figure 9. Startup Timing  
3.96 ms  
VDDO  
~ 2.4 ms  
VDDO POR  
0.5 ms  
VDDC  
7.5 ms  
VDDC Reset  
VDDC Reset/Share XTAL  
9.2.2 USB Full-Speed Timing  
Table 19 through Table 10 shows timing specifications for VDD_USB = 3.3V, V = 0V, and T = 0°C to 85°C operating  
SS  
A
temperature range.  
Table 19. USB Full-Speed Timing Specifications  
Reference  
Characteristics  
Minimum  
Maximum  
20  
Unit  
1
2
3
4
Transition rise time  
Transition fall time  
4
4
ns  
ns  
%
20  
Rise/fall timing matching  
Full-speed data rate  
90  
12 – 0.25%  
111  
12 + 0.25%  
Mb/s  
Figure 10. USB Full-Speed Timing  
2
1
D+  
90%  
90%  
VCRS  
10%  
10%  
D-  
Document Number: 002-14786 Rev. *E  
Page 31 of 49  
CYW20704  
9.2.3 UART Timing  
Table 20. UART Timing Specifications  
Ref No.  
Characteristics  
Minimum  
Typical  
Maximum  
Unit  
1
2
3
Delay time  
UART_CTS_N low to UART TXD valid.  
1.50  
0.67  
1.33  
Bit periods  
Setup time  
Bit periods  
Bit periods  
UART_CTS_N high before midpoint of stop bit.  
Delay time  
Midpoint of stop bit to UART_RTS_N high.  
Figure 11. UART Timing  
UART_CTS_N  
1
2
UART_TXD  
Midpoint of STOP bit  
Midpoint of STOP bit  
UART_RXD  
3
UART_RTS_N  
Document Number: 002-14786 Rev. *E  
Page 32 of 49  
CYW20704  
9.2.4 PCM Interface Timing  
Short Frame Sync, Master Mode  
Figure 12. PCM Timing Diagram (Short Frame Sync, Master Mode)  
1
2
3
PCM_BCLK  
4
PCM_SYNC  
8
PCM_OUT  
5
HIGH IMPEDANCE  
7
6
PCM_IN  
Table 21. PCM Interface Timing Specifications (Short Frame Sync, Master Mode)  
Ref No. Characteristics Minimum  
Typical  
Maximum  
12  
Unit  
MHz  
1
2
3
4
5
6
7
8
PCM bit clock frequency  
PCM bit clock LOW  
PCM bit clock HIGH  
PCM_SYNC delay  
PCM_OUT delay  
PCM_IN setup  
41  
41  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
25  
25  
0
8
PCM_IN hold  
8
Delay from rising edge of PCM_BCLK during last bit period to  
PCM_OUT becoming high impedance  
0
25  
Document Number: 002-14786 Rev. *E  
Page 33 of 49  
CYW20704  
Short Frame Sync, Slave Mode  
Figure 13. PCM Timing Diagram (Short Frame Sync, Slave Mode)  
1
2
3
PCM_BCLK  
4
5
PCM_SYNC  
PCM_OUT  
9
HIGH IMPEDANCE  
8
6
7
PCM_IN  
Table 9-14. PCM Interface Timing Specifications (Short Frame Sync, Slave Mode)  
Ref No. Characteristics Minimum  
Typical  
Maximum  
Unit  
MHz  
1
2
3
4
5
6
7
8
9
PCM bit clock frequency  
PCM bit clock LOW  
PCM bit clock HIGH  
PCM_SYNC setup  
PCM_SYNC hold  
PCM_OUT delay  
PCM_IN setup  
12  
41  
41  
8
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
8
0
25  
8
PCM_IN hold  
8
Delay from rising edge of PCM_BCLK during last bit period to  
PCM_OUT becoming high impedance  
0
25  
Document Number: 002-14786 Rev. *E  
Page 34 of 49  
CYW20704  
Long Frame Sync, Master Mode  
Figure 14. PCM Timing Diagram (Long Frame Sync, Master Mode)  
1
2
3
PCM_BCLK  
4
PCM_SYNC  
PCM_OUT  
8
HIGH IMPEDANCE  
Bit 0  
Bit 0  
Bit 1  
Bit 1  
5
7
6
PCM_IN  
Table 22. PCM Interface Timing Specifications (Long Frame Sync, Master Mode)  
Ref No. Characteristics Minimum  
Typical  
Maximum  
12  
Unit  
MHz  
1
2
3
4
5
6
7
8
PCM bit clock frequency  
PCM bit clock LOW  
PCM bit clock HIGH  
PCM_SYNC delay  
PCM_OUT delay  
PCM_IN setup  
41  
41  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
25  
25  
0
8
PCM_IN hold  
8
Delay from rising edge of PCM_BCLK during last bit period to  
PCM_OUT becoming high impedance  
0
25  
Document Number: 002-14786 Rev. *E  
Page 35 of 49  
CYW20704  
Long Frame Sync, Slave Mode  
Figure 15. PCM Timing Diagram (Long Frame Sync, Slave Mode  
1
2
3
PCM_BCLK  
4
5
PCM_SYNC  
9
PCM_OUT  
PCM_IN  
Bit 0  
Bit 0  
HIGH IMPEDANCE  
8
Bit 1  
Bit 1  
6
7
Table 23. PCM Interface Timing Specifications (Long Frame Sync, Slave Mode)  
Ref No. Characteristics Minimum  
Typical  
Maximum  
Unit  
MHz  
1
2
3
4
5
6
7
8
9
PCM bit clock frequency  
PCM bit clock LOW  
PCM bit clock HIGH  
PCM_SYNC setup  
PCM_SYNC hold  
PCM_OUT delay  
PCM_IN setup  
12  
41  
41  
8
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
8
0
25  
8
PCM_IN hold  
8
Delay from rising edge of PCM_BCLK during last bit period to  
PCM_OUT becoming high impedance  
0
25  
Document Number: 002-14786 Rev. *E  
Page 36 of 49  
CYW20704  
Short Frame Sync, Burst Mode  
Figure 16. PCM Burst Mode Timing (Receive Only, Short Frame Sync)  
1
2
3
PCM_BCLK  
PCM_SYNC  
4
5
7
6
PCM_IN  
Table 24. PCM Burst Mode (Receive Only, Short Frame Sync)  
Ref No. Characteristics  
Minimum  
Typical  
Maximum  
Unit  
MHz  
1
2
3
4
5
6
7
PCM bit clock frequency  
PCM bit clock LOW  
PCM bit clock HIGH  
PCM_SYNC setup  
PCM_SYNC hold  
PCM_IN setup  
24  
20.8  
20.8  
8
ns  
ns  
ns  
ns  
ns  
ns  
8
8
PCM_IN hold  
8
Document Number: 002-14786 Rev. *E  
Page 37 of 49  
CYW20704  
Long Frame Sync, Burst Mode  
Figure 17. PCM Burst Mode Timing (Receive Only, Long Frame Sync)  
1
2
3
PCM_BCLK  
PCM_SYNC  
4
5
7
6
Bit 0  
PCM_IN  
Bit 1  
Table 25. PCM Burst Mode (Receive Only, Long Frame Sync)  
Ref No. Characteristics  
Minimum  
Typical  
Maximum  
Unit  
MHz  
1
2
3
4
5
6
7
PCM bit clock frequency  
PCM bit clock LOW  
PCM bit clock HIGH  
PCM_SYNC setup  
PCM_SYNC hold  
PCM_IN setup  
24  
20.8  
20.8  
8
ns  
ns  
ns  
ns  
ns  
ns  
8
8
PCM_IN hold  
8
Document Number: 002-14786 Rev. *E  
Page 38 of 49  
CYW20704  
2
9.3 I S Interface  
The CYW20704 supports two independent I2S digital audio ports. The I2S interface supports both master and slave modes. The I2S  
signals are:  
I2S clock: I2S SCK  
I2S Word Select: I2S WS  
I2S Data Out: I2S SDO  
I2S Data In: I2S SDI  
I2S SCK and I2S WS become outputs in master mode and inputs in slave mode, while I2S SDO always stays as an output. The  
channel word length is 16 bits and the data is justified so that the MSB of the left-channel data is aligned with the MSB of the I2S bus,  
per the I2S specification. The MSB of each data word is transmitted one bit clock cycle after the I2S WS transition, synchronous with  
the falling edge of bit clock. Left-channel data is transmitted when I2S WS is low, and right-channel data is transmitted when I2S WS  
is high. Data bits sent by the CYW20704 are synchronized with the falling edge of I2S_SCK and should be sampled by the receiver  
on the rising edge of I2S_SSCK.  
The clock rate in master mode is either of the following:  
48 kHz x 32 bits per frame = 1.536 MHz  
48 kHz x 50 bits per frame = 2.400 MHz  
The master clock is generated from the input reference clock using a N/M clock divider.  
In the slave mode, any clock rate is supported to a maximum of 3.072 MHz.  
Document Number: 002-14786 Rev. *E  
Page 39 of 49  
CYW20704  
9.3.1 I2S Timing  
Note: Timing values specified in Table 26 are relative to high and low threshold levels.  
Table 26. Timing for I2S Transmitters and Receivers  
Transmitter  
Receiver  
Lower Limit Upper Limit  
Min Max  
Lower LImit  
Min Max  
Upper Limit  
Min Max  
Notes  
Min  
Max  
a
Clock Period T  
T
T
tr  
r
Master Mode: Clock generated by transmitter or receiver  
b
b
HIGH tHC  
LOWtLC  
0.35T  
0.35T  
0.35T  
0.35T  
tr  
tr  
tr  
tr  
Slave Mode: Clock accepted by transmitter or receiver  
c
c
d
HIGH tHC  
0.35T  
0.35T  
0.35T  
0.35T  
tr  
tr  
tr  
tr  
LOW tLC  
Rise time tRC  
0.15T  
tr  
Transmitter  
e
d
Delay tdtr  
0
0.8T  
Hold time thtr  
Receiver  
f
f
Setup time tsr  
Hold time thr  
0.2T  
0
r
a. The system clock period T must be greater than Ttr and Tr because both the transmitter and receiver have to be able to handle the data  
transfer rate.  
b. At all data rates in master mode, the transmitter or receiver generates a clock signal with a fixed mark/space ratio. For this reason, tHC and  
tLC are specified with respect to T.  
c. In slave mode, the transmitter and receiver need a clock signal with minimum HIGH and LOW periods so that they can detect the signal.  
So long as the minimum periods are greater than 0.35Tr, any clock that meets the requirements can be used.  
d. Because the delay (tdtr) and the maximum transmitter speed (defined by Ttr) are related, a fast transmitter driven by a slow clock edge can  
result in tdtr not exceeding tRC which means thtr becomes zero or negative. Therefore, the transmitter has to guarantee that thtr is greater  
than or equal to zero, so long as the clock rise-time tRC is not more than tRCmax, where tRCmax is not less than 0.15Ttr.  
e. To allow data to be clocked out on a falling edge, the delay is specified with respect to the rising edge of the clock signal and T, always giving  
the receiver sufficient setup time.  
f.  
The data setup and hold time must not be less than the specified receiver setup and hold time.  
Note: The time periods specified in Figure 18 and Figure 19 are defined by the transmitter speed. The receiver specifications must  
match transmitter performance.  
Document Number: 002-14786 Rev. *E  
Page 40 of 49  
CYW20704  
Figure 18. I2S Transmitter Timing  
T
tRC*  
tLC > 0.35T  
tHC > 0.35T  
VH = 2.0V  
VL = 0.8V  
SCK  
thtr > 0  
totr < 0.8T  
SD and WS  
T = Clock period  
Ttr = Minimum allowed clock period for transmitter  
T = Ttr  
* tRC is only relevant for transmitters in slave mode.  
Figure 19. I2S Receiver Timing  
T
tLC > 0.35T  
tHC > 0.35  
VH = 2.0V  
VL = 0.8V  
SCK  
tsr > 0.2T  
thr > 0  
SD and WS  
T = Clock period  
Tr = Minimum allowed clock period for transmitter  
T > Tr  
Document Number: 002-14786 Rev. *E  
Page 41 of 49  
CYW20704  
9.3.2 BSC Interface Timing  
Figure 20 and Table 27 define the timing requirements for the BSC interface.  
Figure 20. BSC Interface Timing Diagram  
1
5
SCL  
2
4
7
8
6
3
SDA  
IN  
10  
9
SDA  
OUT  
Table 27. BSC Interface Timing Specifications  
Reference Characteristics  
Minimum  
Maximum  
100  
Unit  
kHz  
1
Clock frequency  
400  
800  
1000  
2
3
4
5
6
7
8
9
START condition setup time  
START condition hold time  
Clock low time  
650  
280  
650  
280  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Clock high time  
Data input hold timea  
Data input setup time  
STOP condition setup time  
Output valid from clock  
Bus free timeb  
100  
280  
400  
10  
650  
a. As a transmitter, 300 ns of delay is provided to bridge the undefined region of the falling edge of SCL to avoid unintended generation of START or STOP conditions  
b. Time that the cbus must be free before a new transaction can start.  
Document Number: 002-14786 Rev. *E  
Page 42 of 49  
CYW20704  
9.3.3 SPI Timing  
The SPI interface can be clocked up to 12 MHz.  
Figure 21 and Table 28 define the timing requirements when operating in SPI Mode 0 and 2.  
Figure 21. SPI Timing, Mode 0 and 2  
5
SPI_CSN  
SPI_INT  
(DirectWrite)  
SPI_INT  
(DirectRead)  
1
SPI_CLK  
(Mode 0)  
SPI_CLK  
(Mode 2)  
2
First Bit  
Second Bit  
Second Bit  
Last bit  
Last bit  
SPI_MOSI  
SPI_MISO  
First Bit  
Not Driven  
Not Driven  
Table 28. SPI Mode 0 and 2  
Reference  
Characteristics  
Minimum  
Maximum  
Unit  
ns  
1
2
3
4
5
Time from master assert SPI_CSN to first clock edge  
Hold time for MOSI data lines  
45  
12  
½ SCK  
100  
ns  
ns  
ns  
ns  
Time from last sample on MOSI/MISO to slave deassert SPI_INT  
Time from slave deassert SPI_INT to master deassert SPI_CSN  
Idle time between subsequent SPI transactions  
0
0
1 SCK  
Document Number: 002-14786 Rev. *E  
Page 43 of 49  
CYW20704  
Figure 22 and Table 29 define the timing requirements when operating in SPI Mode 1 and 3.  
Figure 22. SPI Timing, Mode 1 and 3  
SPI_CSN  
5
SPI_INT  
(DirectWrite)  
3
4
SPI_INT  
(DirectRead)  
SPI_CLK  
1
(Mode 1)  
SPI_CLK  
(Mode 3)  
2
Invalid bit  
Invalid bit  
First bit  
First bit  
Last bit  
Last bit  
SPI_MOSI  
SPI_MISO  
Not Driven  
Not Driven  
Table 29. SPI Mode 1 and 3  
Reference  
Characteristics  
Minimum  
Maximum  
Unit  
ns  
1
2
3
Time from master assert SPI_CSN to first clock edge  
Hold time for MOSI data lines  
45  
12  
0
½ SCK  
100  
ns  
ns  
Time from last sample on MOSI/MISO to slave  
deassert SPI_INT  
4
5
Time from slave deassert SPI_INT to master  
deassert SPI_CSN  
0
ns  
ns  
Idle time between subsequent SPI transactions  
1 SCK  
Document Number: 002-14786 Rev. *E  
Page 44 of 49  
CYW20704  
10. Mechanical Information  
Figure 23. 49-Ball FcBGA Mechanical Drawing  
Document Number: 002-14786 Rev. *E  
Page 45 of 49  
CYW20704  
10.1 Tape, Reel, and Packing Specification  
Figure 24. Reel, Labeling, and Packing Specification  
Device Orientation/Mix Lot Number  
Each reel may contain up to three lot numbers, independent of the date code.  
Individual lots must be labeled on the box, moisture barrier bag, and the reel.  
Pin 1  
Topright corner toward sprocket holes.  
?
?
?
?
Moisture Barrier Bag Contents/Label  
Desiccant pouch (minimum 1)  
Humidity indicator (minimum 1)  
Reel (maximum 1)  
Document Number: 002-14786 Rev. *E  
Page 46 of 49  
CYW20704  
11. Ordering Information  
Table 30 provides the available part number and its ordering information. This package is rated from –30°C to +85°C.  
Table 30. Ordering Information  
Part Number  
Package Description  
CYW20704UA2KFFB1G  
Commercial 49-ball FcBGA, 4.5 mm x 4.0 mm x 0.8 mm, RoHS-compliant, halogen-free  
Document Number: 002-14786 Rev. *E  
Page 47 of 49  
CYW20704  
Document History  
Document Title: CYW20704 Single-Chip Bluetooth Transceiver and Baseband Processor  
Document Number: 002-14786  
Orig. of Submission  
Revision  
ECN  
Description of Change  
Change  
Date  
**  
04/22/2015  
20704-DS100-R  
Initial release  
20704-DS101-R  
Updated:  
*A  
*B  
*C  
*D  
*E  
11/06/2015  
02/18/2016  
02/29/2016  
03/18/2016  
09/29/2016  
Table 6-1: “Crystal Interface Signal Characteristics,” on page 20  
20704-DS102-R  
Updated:  
Table 11-1: “Ordering Information,” on page 48  
20704-DS103-R  
Added:  
“Recommended BT Coexistence Interface Assignments” on page 13  
UTSV  
UTSV  
20704-DS104-R  
Updated:  
Table 9-8: “Receiver RF Specifications” on page 28  
5445323  
Updated to Cypress Template  
Document Number: 002-14786 Rev. *E  
Page 48 of 49  
CYW20704  
Sales, Solutions, and Legal Information  
Worldwide Sales and Design Support  
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office  
closest to you, visit us at Cypress Locations.  
®
Products  
PSoC Solutions  
ARM® Cortex® Microcontrollers  
cypress.com/arm  
cypress.com/automotive  
cypress.com/clocks  
cypress.com/interface  
cypress.com/iot  
PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP  
Automotive  
Cypress Developer Community  
Clocks & Buffers  
Interface  
Forums | Projects | Video | Blogs | Training | Components  
Technical Support  
Internet of Things  
Lighting & Power Control  
Memory  
cypress.com/support  
cypress.com/powerpsoc  
cypress.com/memory  
cypress.com/psoc  
PSoC  
Touch Sensing  
USB Controllers  
Wireless/RF  
cypress.com/touch  
cypress.com/usb  
cypress.com/wireless  
49  
© Cypress Semiconductor Corporation, 2015-2016. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC (“Cypress”). This document,  
including any software or firmware included or referenced in this document (“Software”), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries  
worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or other  
intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software, then Cypress  
hereby grants you a personal, non-exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the Software (a) for Software provided in source code form, to  
modify and reproduce the Software solely for use with Cypress hardware products, only internally within your organization, and (b) to distribute the Software in binary code form externally to end users  
(either directly or indirectly through resellers and distributors), solely for use on Cypress hardware product units, and (2) under those claims of Cypress's patents that are infringed by the Software (as  
provided by Cypress, unmodified) to make, use, distribute, and import the Software solely for use with Cypress hardware products. Any other use, reproduction, modification, translation, or compilation  
of the Software is prohibited.  
TO THE EXTENT PERMITTED BY APPLICABLE LAW, CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE  
OR ACCOMPANYING HARDWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. To the extent  
permitted by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any liability arising out of the application or use of any  
product or circuit described in this document. Any information provided in this document, including any sample design information or programming code, is provided only for reference purposes. It is  
the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this information and any resulting product. Cypress products  
are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons systems, nuclear installations, life-support devices or  
systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances management, or other uses where the failure of the  
device or system could cause personal injury, death, or property damage (“Unintended Uses”). A critical component is any component of a device or system whose failure to perform can be reasonably  
expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim,  
damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from and against all claims, costs, damages, and other  
liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products.  
Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in  
the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners.  
Document Number: 002-14786 Rev. *E  
Revised September 29, 2016  
Page 49 of 49  

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