BCM20710A1KUFBXG_技术文档

PRELIMINARY

CYW20710

Single-Chip Bluetooth® Transceiver and

Baseband Processor

General Description

The Cypress CYW20710 is a monolithic, single-chip, Bluetooth 4.0 compliant, stand-alone baseband processor with an integrated

2.4 GHz transceiver. Manufactured using the industry's most advanced 65 nm CMOS low-power process, the CYW20710 employs

the highest level of integration, eliminating all critical external components, and thereby minimizing the device’s footprint and costs

associated with the implementation of Bluetooth solutions.

The CYW20710 is the optimal solution for voice and data applications that require a Bluetooth SIG standard Host Controller Interface

(HCI) via UART H4 or H5 and PCM audio interface support. The CYW20710 radio transceiver’s enhanced radio performance meets

the most stringent industrial temperature application requirements for compact integration into mobile handset and portable devices.

The CYW20710 is fully compatible with all standard TCXO frequencies and provides full radio compatibility, enabling it to operate

simultaneously with GPS and cellular radios.

Cypress Part Numbering Scheme

Cypress is converting the acquired IoT part numbers from Cypress to the Cypress part numbering scheme. Due to this conversion,

there is no change in form, fit, or function as a result of offering the device with Cypress part number marking. The table provides

Cypress ordering part number that matches an existing IoT part number.

Table 1. Mapping Table for Part Number between Broadcom and Cypress

Broadcom Part Number

Cypress Part Number

BCM20710

CYW20710

BCM20710A1KUFBXG

BCM20710A1KUBXG

CYW20710A1KUFBXG

CYW20710A1KUBXG

Features

■ Bluetooth 4.0 + EDR compliant

■ Class 1 capable with built-in PA

■ Automatic frequency detection for standard crystal and

TCXO values when an external 32.768 kHz reference

clock is provided.

■ Programmable output power control meets Class 1,

■ Ultra-low power consumption

■ Supports serial flash interfaces

Class 2, or Class 3 requirements

■ Use supply voltages up to 5.5V

■ Available in 42-bump WLBGA and 50-ball FPBGA

■ Supports Cypress SmartAudio™, wide-band speech,

packages.

SBC codec, and packet loss concealment.

■ ARM7TDMI-S™–based microprocessor with

■ Fractional-N synthesizer supports frequency refer-

integrated ROM and RAM

ences from 12 MHz to 52 MHz

■ Supports mobile without external memory

■ Automotive telematic systems

Applications

■ Mobile handsets and smart phones

■ Personal digital assistants

Cypress Semiconductor Corporation

Document No. 002-14804 Rev. *H

•

198 Champion Court

•

San Jose, CA 95134-1709

•

408-943-2600

Revised November 25, 2016

PRELIMINARY

CYW20710

Figure 1. Functional Block Diagram

CYW20710

PCM

UART

GPIO

High-Speed Peripheral

Transport Unit (PTU)

Radio Transceiver

Memory

SPI

I²S

Microprocessor and

Memory Unit (uPU)

Bluetooth Baseband

Core (BBC)

TCXO

LPO

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PRELIMINARY

CYW20710

Contents

1. Overview............................................................ 4

1.1 Major Features .................................................... 4

1.2 Block Diagram ..................................................... 6

1.3 Mobile Phone Usage Model ................................ 7

5. Peripheral Transport Unit .............................. 17

5.1 PCM Interface ....................................................17

5.1.1 System Diagram .....................................17

5.1.2 Slot Mapping ...........................................17

5.1.3 Wideband Speech ..................................18

5.1.4 Frame Synchronization ...........................18

5.1.5 Data Formatting ......................................18

2. Integrated Radio Transceiver .......................... 8

2.1 Transmitter Path .................................................. 8

2.1.1 Digital Modulator ...................................... 8

2.1.2 Power Amplifier ....................................... 8

5.2 HCI Transport Detection Configuration ..............19

5.3 UART Interface ..................................................19

5.3.1 HCI 3-Wire Transport (UART H5) ...........19

2.2 Receiver Path ...................................................... 8

2.2.1 Digital Demodulator and Bit Synchronizer 8

2.2.2 Receiver Signal Strength Indicator .......... 8

5.4 SPI .....................................................................20

6. Frequency References ................................... 21

6.1 Crystal Interface and Clock Generation .............21

6.2 Crystal Oscillator ................................................22

2.3 Local Oscillator Generation ................................. 8

2.4 Calibration ........................................................... 9

2.5 Internal LDO Regulator ....................................... 9

6.3 External Frequency Reference ..........................22

6.3.1 TCXO Clock Request Support ................23

3. Bluetooth Baseband Core.............................. 10

3.1 Transmit and Receive Functions ....................... 10

3.2 Bluetooth 4.0 + EDR Features .......................... 10

3.3 Frequency Hopping Generator .......................... 11

3.4 Link Control Layer ............................................. 11

3.5 Test Mode Support ............................................ 11

6.4 Frequency Selection ..........................................24

6.5 Frequency Trimming ..........................................24

6.6 LPO Clock Interface ...........................................25

7. Pin-Out and Signal Descriptions................... 26

7.1 Pin Descriptions .................................................26

3.6 Power Management Unit ................................... 12

3.6.1 RF Power Management ......................... 12

3.6.2 Host Controller Power Management ..... 12

3.6.3 Bluetooth Baseband Core Power

8. Ball Grid Arrays .............................................. 28

9. Electrical Characteristics............................... 30

9.1 RF Specifications ...............................................35

Management .......................................... 13

9.2 Timing and AC Characteristics ...........................38

9.2.1 Startup Timing ........................................38

9.2.2 UART Timing ..........................................39

9.2.3 PCM Interface Timing .............................40

9.2.4 BSC Interface Timing .............................44

3.7 Adaptive Frequency Hopping ............................ 14

3.8 Collaborative Coexistence ................................ 14

3.9 Serial Enhanced Coexistence Interface ............ 14

3.9.1 SECI Advantages .................................. 14

3.9.2 SECI I/O ................................................ 14

10.Mechanical Information.................................. 45

4. Microprocessor Unit....................................... 15

10.1 Tape, Reel, and Packing Specification ..............47

4.1 NVRAM Configuration Data and Storage .......... 15

4.1.1 Serial Interface ...................................... 15

11.Ordering Information...................................... 48

4.2 EEPROM ........................................................... 15

4.3 External Reset ................................................... 15

12.Additional Information ................................... 48

12.1 Acronyms and Abbreviations .............................48

12.2 IoT Resources ....................................................48

Document History Page................................................. 49

Sales, Solutions, and Legal Information ...................... 50

4.4 One-Time Programmable Memory .................... 16

4.4.1 Contents ................................................ 16

4.4.2 Programming ......................................... 16

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PRELIMINARY

CYW20710

1. Overview

The Cypress CYW20710 complies with the Bluetooth Core Specification, version 4.0 and is designed for use with a standard Host

Controller Interface (HCI) UART. The combination of the Bluetooth Baseband Core (BBC), a Peripheral Transport Unit (PTU), and an

ARM^®-based microprocessor with on-chip ROM provides a complete lower layer Bluetooth protocol stack, including the Link Controller

(LC), Link Manager (LM), and HCI.

1.1 Major Features

Major features of the CYW20710 include:

■

Support for Bluetooth 4.0 + EDR, including the following options:

❐

A whitelist size of 25.

Enhanced Power Control

HCI Read Encryption Key Size command

■

Full support for Bluetooth 2.1 + EDR additional features:

❐

Secure Simple Pairing (SSP)

Encryption Pause Resume (EPR)

Enhance Inquiry Response (EIR)

Link Supervision Time Out (LSTO)

Sniff SubRating (SSR)

Erroneous Data (ED)

Packet Boundary Flag (PBF)

■

Built-in Low Drop-Out (LDO) regulators (2)

❐

1.63 to 5.5V input voltage range

1.8 to 3.3V intermediate programmable output voltage

Integrated RF section

❐

Single-ended, 50 ohm RF interface

Built-in TX/RX switch functionality

TX Class 1 output power capability

-88 dBm RX sensitivity basic rate

■

Supports maximum Bluetooth data rates over HCI UART and SPI interfaces

Multipoint operation, with up to 7 active slaves

❐

Maximum of 7 simultaneous active ACL links

Maximum of 3 simultaneous active SCO and eSCO links, with Scatternet support

■

Scatternet operation, with up to 4 active piconets (with background scan and support for ScatterMode)

High-speed HCI UART transport support

❐

H4 five-wire UART (four signal wires, one ground wire)

H5 three-wire UART (two signal wires, one ground wire)

Maximum UART baud rates of 4 Mbps

Low-power out-of-band BT_WAKE and HOST_WAKE signaling

VSC from host transport to UART

Proprietary compressing scheme (allows more than two simultaneous A2DP packets and up to five devices at a time)

■

Channel Quality-Driven Data Rate (CQDDR) and packet type selection

Standard Bluetooth test modes

Extended radio and production test mode features

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PRELIMINARY

CYW20710

■

Full support for power savings modes:

❐

Bluetooth standard Hold and Sniff

Deep sleep modes and regulator shutdown

■

Supports Wide-Band Speech (WBS) over PCM and Packet Loss Concealment (PLC) for better audio quality

2-, 3-, and 4-wire coexistence

Power Amplifier (PA) shutdown for externally controlled coexistence, such as WIMAX

Built-in LPO clock or operation using an external LPO clock

TCXO input and auto-detection of all standard handset clock frequencies (supports low-power crystal, which can be used during

Power Saving mode with better timing accuracy)

■

OR gate for combining a host clock request with a Bluetooth clock request (operates even when the Bluetooth core logic is powered

off)

■

Larger patch RAM space to support future enhancements

Serial flash Interface with native support for devices from several manufacturers

One-Time Programmable (OTP) memory

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PRELIMINARY

CYW20710

1.3 Mobile Phone Usage Model

The CYW20710 is designed to provide a direct interface to new and existing handset designs, as shown in Figure 3. The device has

flexible PCM and UART interfaces, enabling it to transparently connect to existing circuits. In addition, the TCXO and external LPO

inputs allow the use of existing handset features, helping to minimize product size, power, and cost.

The device incorporates a number of unique features to accommodate integration into mobile phone platforms.

■

The PCM interface provides multiple modes of operation to support both master and slave, as well as hybrid interfacing to one or

more external codec devices.

The UART interface supports hardware flow control with tight integration to power control sideband signaling to support the lowest

power operation.

■

The TCXO interface accommodates the typical reference frequencies used by cell phones.

A programmable TCXO power-up or power-down signal (active-high or active-low) allows the device to indicate when the clock

supplied to the device can be disabled for added power saving during Sleep mode.

■

The TCXO and external LPO inputs are high-impedance with minimal loading on the driving source whether power is applied to

the device or has been removed.

The highly linear design of the radio transceiver ensures that the device has the lowest output spurious emissions, regardless of

the state of operation, and has been fully characterized in the global cellular bands.

The transceiver design has excellent blocking (eliminating desensitization of the Bluetooth receiver) and intermodulation perfor-

mance (distortion of the transmitted signal caused by mixing the cellular and Bluetooth transmissions) in the presence of a cellular

transmission (GSM, GPRS, CDMA, WCDMA, or iDEN). Minimal external filtering is required for integration within the handset.

■

Few external components are required for integration and very compact WLBGA packaging is available.

Figure 3. Mobile Phone Usage Model

Voice

PCM

Codec

UART/SPI

Handset

Baseband

BT_WAKE

CYW20710

1.63V to 5.5V Battery

HOST_WAKE

CLK_REQ

XTAL_IN

TCXO

BT_BUSY/TX_REQ

WIFI_BUSY/TX_CONFIRM

OPTIONAL/STATUS

802.11

WLAN

LPO_INPUT

(optional)

LPO Clock

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CYW20710

2. Integrated Radio Transceiver

The CYW20710 has an integrated radio transceiver that has been optimized for use in 2.4 GHz Bluetooth wireless systems. It has

been designed to provide low-power, low-cost, robust communications for applications operating in the globally available 2.4 GHz

unlicensed ISM band. The CYW20710 is fully compliant with the Bluetooth Radio Specification and enhanced data rate specification

and meets or exceeds the requirements to provide the highest communication link quality of service.

2.1 Transmitter Path

The CYW20710 features a fully integrated zero IF transmitter. The baseband transmitted data is digitally modulated in the modem

block and up-converted to the 2.4 GHz ISM band in the transmitter path. The transmitter path consists of signal filtering, I/Q up-

conversion, a high-output power amplifier (PA), and RF filtering.

The CYW20710 also incorporates modulation schemes to support enhanced data rates.

■

P/4-DQPSK for 2 Mbps

8-DPSK for 3 Mbps

2.1.1 Digital Modulator

The digital modulator performs the data modulation and filtering required for the GFSK, /4DQPSK, and 8-DPSK signals. The fully

digital modulator minimizes any frequency drift or anomalies in the modulation characteristics of the transmitted signal and is much

more stable than direct VCO modulation schemes.

2.1.2 Power Amplifier

The CYW20710 has an integrated PA that can be configured for Class 2 operation, transmitting up to +4 dBm. The PA can also be

configured for Class 1 operation, transmitting up +10 dBm at the chip in gFSK mode, when a minimum supply voltage of 2.5V is applied

to VDDTF.

Because of the linear nature of the PA, combined with integrated filtering, minimal external filtering is required to meet Bluetooth and

regulatory harmonic and spurious requirements.

Using a highly linearized, temperature compensated design, the PA can transmit +10 dBm for basic rate and +8 dBm for enhanced

data rates (2 to 3 Mbps). A flexible supply voltage range allows the PA to operate from 1.2V to 3.3V. A minimum supply voltage of

2.5V is required at VDDTF to achieve +10 dBm of transmit power.

2.2 Receiver Path

The receiver path uses a low IF scheme to downconvert the received signal for demodulation in the digital demodulator and bit

synchronizer. The receiver path provides a high degree of linearity, an extended dynamic range, and high order on-chip channel

filtering to ensure reliable operation in the noisy 2.4 GHz ISM band. The front-end topology, with built-in out-of-band attenuation,

enables the device to be used in most applications without off-chip filtering. For integrated handset operation where the Bluetooth

function is integrated close to the cellular transmitter, minimal external filtering is required to eliminate the desensitization of the

receiver by the cellular transmit signal.

2.2.1 Digital Demodulator and Bit Synchronizer

The digital demodulator and bit synchronizer uses the low IF received signal to perform an optimal frequency tracking and bit synchro-

nization algorithm.

2.2.2 Receiver Signal Strength Indicator

The CYW20710 radio provides a Receiver Signal Strength Indicator (RSSI) signal to the baseband so that the controller can take part

in a Bluetooth power-controlled link by providing a metric of its own receiver signal strength to determine whether the transmitter

should increase or decrease its output power.

2.3 Local Oscillator Generation

Local Oscillator (LO) generation provides fast frequency hopping (1600 hops/second) across the 79 maximum available channels.

The LO generation subblock employs an architecture for high immunity to LO pulling during PA operation. The device uses fully-

integrated PLL loop filters.

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PRELIMINARY

CYW20710

2.4 Calibration

The radio transceiver features an automated calibration scheme that is fully self-contained in the radio. User interaction is not required

during normal operation or during manufacturing to provide the optimal performance. Calibration optimizes the performance of all

major blocks in the radio, including gain and phase characteristics of filters, matching between key components, and key gain blocks.

Calibration, which takes process and temperature variations into account, occurs transparently during the settling time of the hops,

adjusting for temperature variations as the device cools and heats during normal operation.

2.5 Internal LDO Regulator

Two internal Low Drop-Out (LDO) voltage regulators eliminate the need for external voltage regulators and therefore reduce the BOM.

The first LDO is a preregulator (HV LDO). The second LDO (Main LDO) supplies the main power to the CYW20710 (see Figure 2).

The HV LDO has an input voltage range of 2.3V to 5.5V. The input VBAT is ideal for batteries. The VREGHV output is programmable

from 1.8V to 3.3V, in 100 mV steps. The dropout voltage is 200 mV. The HV LDO can supply up to 95 mA, which leaves spare power

for external circuitry such as an RF power amp for higher transmit power. If the HV LDO is not used, to turn off the HV LDO and

minimize current consumption, connect the VBAT input to the VREGHV output. Firmware can then disable the HV LDO, saving the

quiescent current.

The HV LDO default output voltage is 2.9V, allowing this regulator to be used to power external NV memory devices, as well as the

VDDO rail. The firmware can then adjust this output to as low as 1.8V, if desired, to power VDDTF.

The main LDO has a 1.22V output (VREG) and is used to supply main power to the CYW20710. The input of this LDO (VREGHV)

has an input voltage range of from 1.63V to 3.63V. The output of the HV LDO is internally connected to the input to the main LDO.

Power can be applied to VREGHV when the HV LDO is not used. The main LDO supplies power to the entire device for Class 2

operation. The main LDO can drive up to 60 mA, which leaves spare power for external circuitry. The main LDO is bypassed by not

connecting anything to its output (VREG) and driving 1.12V–1.32V directly to VDDC and VDDRF.

REG_EN provides a control signal for the host to control power to the CYW20710. When power is enabled, the CYW20710 will require

complete initialization.

Figure 4. LDO Functional Block Diagram

CYW20710

HV LDO

Main LDO

VBAT

VREGHV

VREG

REG_EN

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PRELIMINARY

CYW20710

3. Bluetooth Baseband Core

The Bluetooth Baseband Core (BBC) implements the time critical functions required for high-performance Bluetooth operation. The

BBC manages buffering, segmentation, and data routing for all connections. It also buffers data that passes through it, handles data

flow control, schedules SCO/ACL Tx/Rx transactions, monitors Bluetooth slot usage, optimally segments and packages data into

baseband packets, manages connection status indicators, and composes and decodes HCI packets. In addition to these functions, it

independently handles HCI event types and HCI command types.

3.1 Transmit and Receive Functions

The following transmit and receive functions are implemented in the BBC hardware to increase the reliability and security of the Tx/

Rx data before sending the data over the air:

In the transmitter:

■

Data framing

Forward Error Correction (FEC) generation

Header Error Control (HEC) generation

Cyclic Redundancy Check (CRC) generation

Key generation

Data encryption

Data whitening

In the receiver:

■

Symbol timing recovery

Data deframing

FEC

HEC

CRC

Data decryption

Data dewhitening

3.2 Bluetooth 4.0 + EDR Features

The CYW20710 supports Bluetooth 4.0 + EDR, including the following options:

■

A whitelist size of 25

Enhanced Power Control

HCI Read Encryption Key Size command

The CYW20710 provides full support for Bluetooth 2.1 + EDR additional features:

■

Secure Simple Pairing (SSP)

Encryption Pause Resume (EPR)

Enhance Inquiry Response (EIR)

Link Supervision Time Out (LSTO)

Sniff SubRating (SSR)

Erroneous Data (ED)

Packet Boundary Flag (PBF)

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CYW20710

3.3 Frequency Hopping Generator

The frequency hopping sequence generator selects the correct hopping channel number, based on the link controller state, Bluetooth

clock, and device address.

3.4 Link Control Layer

The Link Control layer is part of the Bluetooth link control functions implemented in dedicated logic in the Link Control Unit (LCU).

This layer consists of the Command Controller that takes commands from the software and other controllers that are activated or

configured by the Command Controller to perform the link control tasks.

There are two major states–Standby and Connection. Each task establishes a different state in the Bluetooth Link Controller. In

addition, there are eight substates—Page, Page Scan, Inquiry, Inquiry Scan, Park, Sniff Subrate, and Hold.

3.5 Test Mode Support

The CYW20710 fully supports Bluetooth Test Mode, including the transmitter tests, normal and delayed Loopback tests, and the

reduced hopping sequence.

In addition to the standard Bluetooth Test mode, the device supports enhanced testing features to simplify RF debugging and quali-

fication and type approval testing.

These test features include:

■

Fixed frequency carrier wave (unmodulated) transmission

❐

Simplifies some type approval measurements (Japan)

Aids in transmitter performance analysis

■

Fixed frequency constant receiver mode

❐

Directs receiver output to I/O pin

Allows for direct BER measurements using standard RF test equipment

Facilitates spurious emissions testing for receive mode

■

Fixed frequency constant bit stream transmission

❐

Unmodulated, 8-bit fixed pattern, PRBS-9, or PRBS-15

Enables modulated signal measurements with standard RF test equipment

Packetized connectionless transmitter test

❐

Hopping or fixed frequency

Multiple packet types supported

Multiple data patterns supported

■

Packetized connectionless receiver test

❐

Fixed frequency

Multiple packet types supported

Multiple data patterns supported

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CYW20710

3.6 Power Management Unit

The Power Management Unit (PMU) provides power management features that can be invoked through power management registers

or packet handling in the baseband core. This section contains descriptions of the PMU features.

3.6.1 RF Power Management

The BBC generates power-down control signals for the transmit path, receive path, PLL, and power amplifier to the 2.4 GHz trans-

ceiver. The transceiver then processes the power-down functions, accordingly.

3.6.2 Host Controller Power Management

The host can place the device in a sleep state, in which all nonessential blocks are powered off and all nonessential clocks are

disabled. Power to the digital core is maintained so that the state of the registers and RAM is not lost. In addition, the LPO clock is

applied to the internal sleep controller so that the chip can wake automatically at a specified time or based on signaling from the host.

The goal is to limit the current consumption to a minimum, while maintaining the ability to wake up and resume a connection with

minimal latency.

If a scan or sniff session is enabled while the device is in Sleep mode, the device automatically will wake up for the scan/sniff event,

then go back to sleep when the event is done. In this case, the device uses its internal LPO-based timers to trigger the periodic wake

up. While in Sleep mode, the transports are idle. However, the host can signal the device to wake up at any time. If signaled to wake

up while a scan or sniff session is in progress, the session continues but the device will not sleep between scan/sniff events. Once

Sleep mode is enabled, the wake signaling mechanism can also be thought of as a sleep signaling mechanism, since removing the

wake status will often cause the device to sleep.

In addition to a Bluetooth device wake signaling mechanism, there is a host wake signaling mechanism. This feature provides a way

for the Bluetooth device to wake up a host that is in a reduced power state.

There are two mechanisms for the device and the host to signal wake status to each other:

Bluetooth WAKE (BT_WAKE) and Host WAKE (and

HOST_WAKE) signaling

The BT_WAKE pin (GPIO_0) allows the host to wake the BT device, and

HOST_WAKE (GPIO_1) is an output that allows the BT device to wake the

host.

In-band UART signaling

The CTS and RTS signals of the UART interface are used for BT wake

(CTS) and Host wake (RTS) functions in addition to their normal function on

the UART interface. Note that this applies for both H4 and H5 protocols.

When running in SPI mode, the CYW20710 has a mode where it enters Sleep mode when there is no activity on the SPI interface for

a specified (programmable) amount of time. Idle mode is detected when the SPI_CSN is left deasserted. Whether to sleep on an idle

interface and the amount of time to wait before entering Sleep mode can be programed by the host. Once the CYW20710 enters

sleep, the host can wake it by asserting SPI_CSN. If the host decides to sleep, the CYW20710 will wake up the host by asserting

SPI_INT when it has data for it.

Note: Successful operation of the power management handshaking signals requires coordinated support between the device

firmware and the host software.

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CYW20710

Table 2. Power Control Pin Summary

Direction

Description

BT_WAKE (GPIO_0)

Host output

BT input

Bluetooth device wake-up: Signal from the host to the Bluetooth device that the host

requires attention.

•

Asserted = Bluetooth device must wake up or remain awake.

•

Deasserted = Bluetooth device may sleep when sleep criteria are met.

The polarity of this signal is software configurable and can be asserted high or low. By

default, BT_WAKE is active-low (if BT-WAKE is low it requires the device to wake up or

remain awake).

HOST_WAKE (GPIO_1) BT output

Host input

Host wake-up. Signal from the Bluetooth device to the host indicating that Bluetooth

device requires attention.

•

Asserted = Host device must wake up or remain awake.

•

Deasserted = Host device may sleep when sleep criteria are met.

The polarity of this signal is software configurable and can be asserted high or low.

CLK_REQ (GPIO_5)

REG_EN

BT output

BT input

Clock request

•

Asserted = External clock reference required

Deasserted = External clock reference may be powered down

The polarity of CLK_REQ is software configurable and can be set to active high (TM0

= 1) or active low (TM0 = 0).

Enables the internal preregulator and main regulator outputs. REG_EN is active-high.

•

1 = Enabled

0 = Disabled

3.6.3 Bluetooth Baseband Core Power Management

The device provides the following low-power operations for the Bluetooth Baseband Core (BBC):

■

Physical layer packet handling turns RF on and off dynamically within packet TX and RX.

Bluetooth specified low-power connection modes—Sniff, Hold, and Park. While in these low-power connection modes, the device

runs on the Low Power Oscillator and wakes up after a predefined time period.

Backdrive Protection

The CYW20710 provides a backdrive protection feature that allows the device to be turned off while the host and other devices in the

system remain operational. When the device is not needed in the system, VDD_RF and VDDC are shut down and VDDO remains

powered. This allows the device to be effectively off, while keeping the I/O pins powered so that they do not draw extra current from

other devices connected to the I/O.

Note: VDD_RF collectively refers to the VDDTF, VDDIF, VDDLNA, VDDPX, and VDDRF RF power supplies.

Note: Never apply voltage to I/O pins if VDDO is not applied.

During the low power shutdown state and as long as VDDO remains applied to the device, all outputs are tristated and all digital and

analog clocks are disabled. Input voltages must remain within the limits defined for normal operation. This is done to either prevent

current draw and back loading on digital signals in the system. It also enables the device to be fully integrated in an embedded device

and take full advantage of the lowest power savings modes. If VDDC is powered up externally (not connected to VREG), VDDC

requires 750K ohms to ground during low-power shutdown. If VDDC is powered up by VREG, VDDC does not require 750K ohms to

ground because the internal main LDO has about 750 K ohms to ground when turned off.

Several signals, including the frequency reference input (XTAL_IN) and external LPO input (LPO_IN), are designed to be high-

impedance inputs that will not load down the driving signal, even if VDDO power is not applied to the chip. The other signals with back

drive prevention are RST_N, COEX_OUT0, COEX_OUT1, COEX_IN, PCM_SYNC, PCM_CLK, PCM_OUT, PCM_IN, UART_RTS_N,

UART_CTS_N, UART_RXD, UART_TXD, GPIO_0, GPIO_1, GPIO_2, GPIO_4, GPIO_7, CFG_SEL, and OTP_DIS.

All other IO signals must remain at VSS until VDDO is applied. Failing to do this can result in unreliable startup behavior.

When powered on, using REG_EN is the same as applying power to the CYW20710. The device does not have information about

its state before being powered-down.

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3.7 Adaptive Frequency Hopping

The CYW20710 supports host channel classification and dynamic channel classification Adaptive Frequency Hopping (AFH)

schemes, as defined in the Bluetooth specification.

Host channel classification enables the host to set a predefined hopping map for the device to follow.

If dynamic channel classification is enabled, the device gathers link quality statistics on a channel-by-channel basis to facilitate channel

assessment and channel map selection. To provide a more accurate frequency hop map, link quality is determined using both RF and

baseband signal processing.

3.8 Collaborative Coexistence

The CYW20710 provides extensions and collaborative coexistence to the standard Bluetooth AFH for direct communication with

WLAN devices. Collaborative coexistence enables WLAN and Bluetooth to operate simultaneously in a single device. The device

supports industry-standard coexistence signaling, including 802.15.2, and supports Cypress and third-party WLAN solutions.

Using a multitiered prioritization approach, relative priorities between data types and applications can be set. This approach maximizes

the performance-WLAN data throughput vs. voice quality vs. link performance.

A PA shutdown pin is available to allow full external control of the RF output for other types of coexistence, such as WIMAX.

3.9 Serial Enhanced Coexistence Interface

The Serial Enhanced Coexistence Interface (Serial ECI or SECI) is a proprietary Cypress interface between Cypress WLAN devices

and Bluetooth devices. It is an optional replacement to the legacy 3- or 4-wire coexistence feature, which is also available.

The following key features are associated with the interface:

■

Enhanced coexistence data can be exchanged over SECI_IN and SECI_OUT.

It supports generic UART communication between WLAN and Bluetooth devices.

To conserve power, it is disabled when inactive.

It supports automatic resynchronizaton upon waking from sleep mode.

It supports a baud rate of up to 4 Mbps.

3.9.1 SECI Advantages

The advantages of the SECI over the legacy 3-wire coexistence interface are:

■

Only two wires are required: SECI_IN and SECI_OUT.

Up to 48-bits of coexistence data can be exchanged.

Previous Cypress stand-alone Bluetooth devices such as the CYW2070 supported only a 3-wire or 4-wire coexistence interface.

Previous Cypress WLAN and Bluetooth combination devices such as the CYW4325, CYW4329, and CYW4330 support an internal

parallel enhanced coexistence interface for more efficient WLAN and Bluetooth information exchange. The SECI allows enhanced

coexistence information to be passed to a companion Cypress WLAN chip through a serial interface using fewer I/O than the 3-wire

coexistence scheme.

The 48-bits of the SECI significantly enhance WLAN and Bluetooth coexistence by sharing such information as frequencies used and

radio usage times. The exact contents of the SECI are Cypress confidential.

3.9.2 SECI I/O

The CYW20710 does not have dedicated SECI_IN or SECI_OUT pins, but the two pin functions can be mapped to the following digital

I/O: the UART, GPIO, SPIM (or BSC), PCM, and COEX pins. Pin function mapping is controlled by the config file that is either stored

in NVRAM or downloaded directly into on-chip RAM from the host.

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4. Microprocessor Unit

The CYW20710 microprocessor unit runs software from the Link Control (LC) layer up to the Host Controller Interface (HCI). The

microprocessor is based on the ARM7TDMIS 32-bit RISC processor with embedded ICE-RT debug and JTAG interface units. The

microprocessor also includes 384 KB of ROM memory for program storage and boot ROM, 112 KB of RAM for data scratch-pad, and

patch RAM code.

The internal boot ROM provides flexibility during power-on reset to enable the same device to be used in various configurations,

including automatic host transport selection from SPI or UART, with or without external NVRAM. At power-up, the lower layer protocol

stack is executed from the internal ROM.

External patches can be applied to the ROM-based firmware to provide flexibility for bug fixes and features additions. These patches

can be downloaded from the host to the device through the SPI or UART transports, or using external NVRAM. The device can also

support the integration of user applications and profiles using an external serial flash memory.

4.1 NVRAM Configuration Data and Storage

4.1.1 Serial Interface

The CYW20710 includes an SPI master controller that can be used to access serial flash memory. The SPI master contains an AHB

slave interface, transmit and receive FIFOs, and the SPI core PHY logic. Data is transferred to and from the module by the system

CPU. DMA operation is not supported.

The CYW20710 supports serial flash vendors Atmel, MXIC, and Numonyx. The most commonly used parts from two of these vendors

are:

■

AT25BCM512B, manufactured by Atmel

MX25V512ZUI-20G, manufactured by MXIC

4.2 EEPROM

The CYW20710 includes a Broadcom® Serial Control (BSC) master interface. The BSC interface supports low-speed and fast mode

devices and is compatible with I²C slave devices. Multiple I²C master devices and flexible wait state insertion by the master interface

or slave devices are not supported. The CYW20710 provides 400 kHz, full speed clock support.

The BSC interface is programmed by the CPU to generate the following BSC transfer types on the bus:

■

Read-only

Write-only

Combined read/write

Combined write-read

NVRAM may contain configuration information about the customer application, including the following:

■

Fractional-N information

BD_ADDR

UART baud rate

SDP service record

File system information used for code, code patches, or data

4.3 External Reset

The CYW20710 has an integrated power-on reset circuit which completely resets all circuits to a known power on state. This action

can also be driven by an external reset signal, which can be used to externally control the device, forcing it into a power-on reset state.

The RST_N signal input is an active-low signal for all versions of the CYW20710. The CYW20710 requires an external pull-up resistor

on the RST_N input. Alternatively, the RST_N input can be connected to REG_EN or driven directly by a host GPIO.

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4.4 One-Time Programmable Memory

The CYW20710 includes a One-Time Programmable (OTP) memory, allowing manufacturing customization and avoiding the need

for an on-board NVRAM.If customization is not required, then the OTP does not need to be programmed. Whether the OTP is

programmed or not, it is disabled after the boot process completes to save power.

The OTP size is 128 bytes.

The OTP is designed to store a minimal amount of information. Aside from OTP data, most user configuration information will be

downloaded into RAM after the CYW20710 boots up and is ready for host transport communication. The OTP contents are limited to:

■

Parameters required prior to downloading user configuration to RAM.

Parameters unique to a customer design.

4.4.1 Contents

The following are typical parameters programmed into the OTP memory:

■

BD_ADDR

Software license key

Output power calibration

Frequency trimming

Initial status LED drive configuration

The OTP contents also include a static error correction table to improve yield during the programming process as well as forward error

correction codes to eliminate any long-term reliability problems. The OTP contents associated with error correction are not visible by

customers.

4.4.2 Programming

OTP memory programming takes place through a combination of Cypress software integrated with the manufacturing test software

and code embedded in CYW20710 firmware.

Programming the OTP requires a 3.3V supply. The OTP programming supply comes from the VDDO pin. The OTP power supply can

be as low as 1.8V in order to read the OTP contents. OTP_DIS is brought out to a pin on the WLBGA package but not on the FPBGA

package, and is internally pulled low. If the OTP_DIS pin is left floating or externally pulled low, then the OTP will be enabled. if the

OTP_DIS pins is externally pulled high, then the OTP will be disabled.

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5. Peripheral Transport Unit

This section discusses the PCM, UART, and SPI peripheral interfaces. The CYW20710 has a 1040 byte transmit and receive fifo,

which is large enough to hold the entire payload of the largest EDR BT packet (3-DH5).

5.1 PCM Interface

The CYW20710 PCM interface can connect to linear PCM codec devices in master or slave mode. In master mode, the device

generates the PCM_BCLK and PCM_SYNC signals. In slave mode, these signals are provided by another master on the PCM

interface as inputs to the device.

The device supports up to three SCO or eSCO channels through the PCM interface and each channel can be independently mapped

to any available slot in a frame.

The host can adjust the PCM interface configuration using vendor-specific HCI commands or it can be setup in the configuration file.

5.1.1 System Diagram

Figure 5 shows options for connecting the device to a PCM codec device as a master or a slave.

Figure 5. PCM Interface with Linear PCM Codec

PCM_IN

PCM_OUT

PCM_BCLK

PCM_SYNC

PCM Codec

(Master)

CYW20710

(Slave)

PCM Interface Slave Mode

PCM_IN

PCM_OUT

PCM_BCLK

PCM_SYNC

PCM Codec

(Slave)

CYW20710

(Master)

PCM Interface Master Mode

PCM_IN

PCM_OUT

PCM_BCLK

PCM_SYNC

PCM Codec

(Hybrid)

CYW20710

(Hybrid)

PCM Interface Hybrid Mode

5.1.2 Slot Mapping

The device supports up to three simultaneous, full-duplex SCO or eSCO channels. These channels are time-multiplexed onto the

PCM interface using a time slotting scheme based on the audio sampling rate, as described in Table 3.

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Table 3. PCM Interface Time Slotting Scheme

Audio Sample Rate

Time Slotting Scheme

8 kHz

The number of slots depends on the selected interface rate, as follows:

Interface rate Slot

128

1

256

2

512

4

1024

2048

8

16

16 kHz

The number of slots depends on the selected interface rate, as follows:

Interface rate Slot

256

512

1024

2048

1

2

4

8

Transmit and receive PCM data from an SCO channel is always mapped to the same slot. The PCM data output driver tri-states its

output on unused slots to allow other devices to share the same PCM interface signals. The data output driver tri-states its output

after the falling edge of the PCM clock during the last bit of the slot.

5.1.3 Wideband Speech

The CYW20710 provides support for Wideband Speech (WBS) in two ways:

■

Transparent mode The host encodes WBS packets and the encoded packets are transferred over the PCM bus for SCO or eSCO

voice connections. In Transparent mode, the PCM bus is typically configured in master mode for a 4 kHz sync rate with 16-bit

samples, resulting in a 64 kbps bit rate.

■

On-chip SmartAudio® technologyThe CYW20710 can perform Subband-Codec (SBC) encoding and decoding of linear 16 bits

at 16 kHz (256 kbps rate) transferred over the PCM bus.

5.1.4 Frame Synchronization

The device supports both short and long frame synchronization types in both master and slave configurations. In short frame synchro-

nization mode, the frame synchronization signal is an active-high pulse at the 8 kHz audio frame rate (which is a single bit period in

width) and synchronized to the rising edge of the bit clock. The PCM slave expects PCM_SYNC to be high on the falling edge of the

bit clock and the first bit of the first slot to start at the next rising edge of the clock. In the long frame synchronization mode, the frame

synchronization signal is an active-high pulse at the 8 kHz audio frame rate. However, the duration is 3-bit periods and the pulse starts

coincident with the first bit of the first slot.

5.1.5 Data Formatting

The device can be configured to generate and accept several different data formats. The device uses 13 of the 16 bits in each PCM

frame. The location and order of these 13 bits is configurable to support various data formats on the PCM interface. The remaining

three bits are ignored on the input, and may be filled with zeros, ones, a sign bit, or a programmed value on the output. The default

format is 13-bit two’s complement data, left justified, and clocked most significant bit first.

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5.2 HCI Transport Detection Configuration

The CYW20710 supports the following interface types for the HCI transport from the host:

■

UART (H4 and H5)

SPI

Only one host interface can be active at a time. The firmware performs a transport detect function at boot-time to determine which

host is the active transport. It can auto-detect the UART interface, but the SPI interface must be selected by strapping the SCL pin to 0.

The complete algorithm is summarized as follows:

1. Determine if SCL is pulled low. If it is, select SPI as HCI host transport.

2. Determine if any local NVRAM contains a valid configuration file. If it does and a transport configuration entry is present, select

the active transport according to entry, and then exit the transport detection routine.

3. Look for CTS_N = 0 on the UART interface. If it is present, select UART.

4. Repeat Step 3 until transport is determined.

5.3 UART Interface

The UART physical interface is a standard, 4-wire interface (RX, TX, RTS, CTS) with adjustable baud rates from 9600 bps to 4.0

Mbps. The interface features an automatic baud rate detection capability that returns a baud rate selection. Alternatively, the baud

rate can be selected via a vendor-specific UART HCI command. The interface supports Bluetooth UART HCI (H4) specifications. The

default baud rate for H4 is 115.2 Kbaud.

The following baud rates are supported:

9600

115200

230400

460800

921600

1444444

1500000

2000000

3000000

3250000

3692000

4000000

14400

19200

28800

38400

57600

Normally, the UART baud rate is set by a configuration record downloaded after reset or by automatic baud rate detection. The host

does not need to adjust the baud rate. Support for changing the baud rate during normal HCI UART operation is provided through a

vendor-specific command.

The CYW20710 UART operates with the host UART correctly, provided the combined baud rate error of the two devices is within ±2%.

5.3.1 HCI 3-Wire Transport (UART H5)

The CYW20710 supports H5 UART transport for serial UART communications. H5 reduces the number of signal lines required by

eliminating CTS and RTS, when compared to H4. In addition, in-band sleep signaling is supported over the same interface so that

the 4-wire UART and the 2-wire sleep signaling interface can be reduced to a 2-wire UART interface, saving four IOs on the host.

H5 requires the use of an external LPO. CTS must be pulled low.

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5.4 SPI

The CYW20710 supports a slave SPI HCI transport with an input clock range of up to 16 MHz. Higher clock rates may be possible.

The physical interface between the SPI master and the CYW20710 consists of the four SPI signals (SPI_CSB, SPI_CLK, SPI_SI, and

SPI_SO) and one interrupt signal (SPI_INT). The CYW20710 can be configured to accept active-low or active-high polarity on the

SPI_CSB chip select signal. It can also be configured to drive an active-low or active-high SPI_INT interrupt signal. Bit ordering on

the SPI_SI and SPI_SO data lines can be configured as either little-endian or big-endian. Additionally, proprietary sleep mode, half-

duplex handshaking is implemented between the SPI master and the CYW20710.

SPI_INT is required to negotiate the start of a transaction. The SPI interface does not require flow control in the middle of a payload.

The FIFO is large enough to handle the largest packet size. Only the SPI master can stop the flow of bytes on the data lines, since it

controls SPI_CSB and SPI_CLK. Flow control should be implemented in higher layer protocols.

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6. Frequency References

The CYW20710 uses two different frequency references for normal and low-power operational modes. An external crystal or

frequency reference driven by a Temperature Compensated Crystal Oscillator (TCXO) signal is used to generate the radio frequencies

and normal operation clocking. Either an external 32.768 kHz or fully integrated internal Low-Power Oscillator (LPO) is used for low-

power mode timing.

6.1 Crystal Interface and Clock Generation

The CYW20710 uses a fractional-N synthesizer to generate the radio frequencies, clocks, and data/packet timing, enabling it to

operate from any of a multitude of frequency sources. The source can be external, such as a TCXO, or a crystal interfaced directly to

the device.

The default frequency reference setting is for a 20 MHz crystal or TCXO. The signal characteristics for the crystal interface are listed

in Table 4.

Table 4. Crystal Interface Signal Characteristics

Parameter

Acceptable frequencies

Crystal

External Frequency Reference

Units

12–52 MHz in 2 ppm¹steps

–

Crystal load capacitance

ESR

12 (typical)

60 (max)

200 (max)

N/A

pF

Ω

–

Power dissipation

Input signal amplitude

–

μW

400 to 2000

mVp-p

2000 to 3300 (requires a 10 pF DC

blocking capacitor to attenuate the

signal)

Signal type

N/A

Square-wave or sine-wave

–

Input impedance

 1

 2

MΩ

pF

Phase noise

@ 1 kHz

@ 10 kHz

@ 100 kHz

@ 1 MHz

N/A

–

< –120²

< –131²

< –136²

dBc/Hz

Auto-detection frequencies when using

external LPO³

12, 13, 14.4, 15.36, 16.2, 16.8, 12, 13, 14.4, 15.36, 16.2, 16.8, 18,

18, 19.2, 19.44, 19.68, 19.8, 20, 19.2, 19.44, 19.68, 19.8, 20, 24, 26,

MHz

24, 26, 33.6, 37.4, and 38.4

33.6, 37.4, and 38.4

Tolerance without frequency trimming⁴

±20

±50

ppm

Initial frequency tolerance trimming range ±50

1. The frequency step size is approximately 80 Hz resolution.

2. With a 26 MHz reference clock. For a 13 MHz clock, subtract 6 dB. For a 52 MHz clock, add 6 dB.

3. Auto-detection of the frequency requires the crystal or external frequency reference to have less than ±50 ppm of variation and also requires

an external LPO frequency which has less than ±250 ppm of variation at the time of detection.

4. AT-Cut crystal or TXCO recommended.

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6.2 Crystal Oscillator

The CYW20710 can use an external crystal to provide a frequency reference. The recommended configuration for the crystal oscillator,

including all external components, is shown in Figure 6.

Figure 6. Recommended Oscillator Configuration

XIN

0 to 18 pF*

Crystal

Oscillator

XOUT

0 to 18 pF*

*Capacitor value range depends

on the manufacturer of the XTAL

as well as board layout.

6.3 External Frequency Reference

An external frequency reference generated by a TCXO signal that may be directly connected to the crystal input pin on the CYW20710,

as shown in Figure 7. The external frequency reference input is designed to not change loading on the TCXO when the CYW20710

is powered up or powered down.

When using the CYW20710 with the TXCO OR gate option, GPIO 6 must be driven active high or active low. Excessive leakage

current results if GPIO6 is allowed to float.

Figure 7. Recommended TCXO Connection

TCXO

XIN

10–1000 pF*

No Connection

XOUT

* Recommended value is 100 pF.

Higher values produce a longer startup time.

Lower values have greater isolation.

Larger values help small signal swings.

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6.3.1 TCXO Clock Request Support

If the application utilizes an external TCXO as a clock reference, the CYW20710 provides a clock request output to allow the system

to power off the TCXO when not in use. Optionally, some packages support a TCXO OR function that allows a clock request in the

system to be combined with the CYW20710 clock request output, without requiring an extra component on the board.

Clock Request Output

The CLK_REQ signal on the GPIO_5 lead is asserted whenever the CYW20710 is in the Awake state. It is deasserted when in Sleep

state. When the CYW20710 is sleeping, it uses an LPO clock (external or internal) as the timing reference.

The TM0 lead controls the polarity of the CLK_REQ output on GPIO_5 as follows:

TM0 = 0 CLK_REQ is active low

TM0 = 1 CLK_REQ is active high

If the clock request feature is not desired, GPIO_5 can be configured for other functions.

TCXO OR Option

The CYW20710 has an optional feature that allows the application to perform a logical OR function on a system TCXO clock request

signal and the CYW20710 clock request to form one clock request output to the TCXO device. This logical OR function is embedded

in the pad ring so that it is available at any time, as long as the pad ring is receiving a VDDO supply. The function works even if the

CYW20710’s digital core is sleeping or completely powered off.

To use this feature, the TCXO_MODE lead must be tied high. In this mode, the GPIO_6 lead functions as the external clock request

input. Without TCXO_MODE asserted, GPIO_5 functions as the clock request output (based only on the internal clock requirements

of the CYW20710) and the state of GPIO_6 is ignored.

As mentioned earlier, the TM0 lead controls the polarity of the CLK_REQ output on GPIO_5. However, it assumes that GPIO_6 input

polarity is already consistent with the desired polarity on GPIO_5/CLK_REQ. Therefore, when TM0 is 1 for an active high output, the

function is a simple OR between the external GPIO_6 and the internal clock request state. However, when TM0 is 0 for an active low

output, the logic inverts the internal clock request signal and performs an AND between it and the GPIO_6 input. Even though it is

using an OR gate, it still provides a logical AND on the two clock request states.

Since the logic assumes that it is also active low (similar to GPIO_5 output), it does not invert the GPIO_6 input first. Table 5 shows

the truth table.

Table 5. Truth Table

GPIO_6

GPIO_5

Internal Clock Request State

(0 = sleep)

TM0

CLK_REQ_IN

(0 = active low output)

CLK_REQ

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

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Package Options and TCXO Mode

Only a few package options bring out TM0 to balls, allowing the application to configure them. In most packages, these pins are already

configured.

Table 6 lists available package options.

Table 6. Package Options

Part Number

CYW20710A1KUFBXG

Package Description

TM0

50-ball FPBGA, optimized for cell phone applications

42-ball WLBGA

Brought to ball

1

CYW20710A1KUBXG

6.4 Frequency Selection

Any frequency within the range specified for the crystal and TCXO reference can be used. These frequencies include standard handset

reference frequencies (12, 13, 14.4, 15.36, 16.2, 16.8, 18, 19.2, 19.44, 19.68, 19.8, 20, 24, 26, 33.6, 37.4, and 38.4 MHz) and any

frequency between these reference frequencies, as desired by the system designer. Since bit timing is derived from the reference

frequency, the CYW20710 must have the reference frequency set correctly in order for the UART and PCM interfaces to function

properly.

The CYW20710 reference frequency can be set in one of three ways.

■

Use the default 20 MHz frequency

Designate the reference frequency in external NVRAM

Auto-detect the standard handset reference frequencies using an external LPO clock

The CYW20710 is set to a default frequency of 20 MHz at the factory. For a typical design using a crystal, it is recommended that the

default frequency be used, since this simplifies the design by removing the need for either external NVRAM or external LPO clock.

If the application requires a frequency other than the default, the value can be stored in an external NVRAM. Programming the

reference frequency in NVRAM provides the maximum flexibility in the selection of the reference frequency, since any frequency within

the specified range for crystal and external frequency reference can be used. During power-on reset (POR), the device downloads

the parameter settings stored in NVRAM, which can be programmed to include the reference frequency and frequency trim values.

Typically, this is how a PC Bluetooth application is configured.

For applications such as handsets and portable smart communication devices, where the reference frequency is one of the standard

frequencies commonly used, the CYW20710 automatically detects the reference frequency and programs itself to the correct

reference frequency. In order for auto-frequency detection to work properly, the CYW20710 must have a valid and stable 32.768 kHz

external LPO clock present during POR. This eliminates the need for NVRAM in applications where the external LPO clock is available

and an external NVRAM is typically not used.

6.5 Frequency Trimming

The CYW20710 uses a fractional-N synthesizer to digitally fine-tune the frequency reference input to within ±2 ppm tuning accuracy.

This trimming function can be applied to either the crystal or an external frequency source such as a TCXO. Unlike the typical crystal-

trimming methods used, the CYW20710 changes the frequency using a fully digital implementation and is much more stable and

unaffected by crystal characteristics or temperature. Input impedance and loading characteristics remain unchanged on the TCXO or

crystal during the trimming process and are unaffected by process and temperature variations.

The option to use or not use frequency trimming is based on the system designer’s cost trade-off between bill-of-materials (BOM) cost

of the crystal and the added manufacturing cost associated with frequency trimming. The frequency trimming value can either be

stored in the host and written to the CYW20710 as a vendor-specific HCI command or stored in NVRAM and subsequently recalled

during POR.

Frequency trimming is not a substitute for the poor use of tuning capacitors at an crystal oscillator (XTAL). Occasionally, trimming can

help alleviate hardware changes.

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6.6 LPO Clock Interface

The LPO clock is the second frequency reference that the CYW20710 uses to provide low-power mode timing for park, hold, and sniff.

The LPO clock can be provided to the device externally, from a 32.768 kHz source or the CYW20710 can operate using the internal

LPO clock.

The LPO can be internally driven from the main clock. However, sleep current will be impacted.

The accuracy of the internal LPO limits the maximum park, hold, and sniff intervals.

Table 7. External LPO Signal Requirements

Parameter

External LPO Clock

Units

Nominal input frequency

Frequency accuracy

Input signal amplitude

Signal type

32.768

±250

kHz

ppm

mVp-p

–

200 to 3600

Square-wave or sine-wave

Input impedance (when power is applied or power is off)

>100

<5

kΩ

pF

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7. Pin-Out and Signal Descriptions

7.1 Pin Descriptions

Table 8. CYW20710 Signal Descriptions

FPBGA

50-Ball

WLBGA

42-Bump

Signal

Radio

I/O

Power Domain

Description

RES

G4

D6

O

VDD_RF

External calibration resistor,

15 kΩ @ 1%

RFP

D1

G2

G3

C7

F5

E5

I/O

I

VDD_RF

RF I/O antenna port

XIN

Crystal or reference input

Crystal oscillator output

XOUT

O

Analog

LPO_IN

Voltage Regulators

REG_EN

VBAT

A4

B4

I

VDDRF

External LPO input

B2

A3

A2

A1

B5

A5

A6

A7

I

VDDO

N/A

HV LDO and main enable

HV LDO input

VREGHV

VREG

I/O

O

N/A

HV LDO output: main LDO input

Main LDO output

N/A

Straps

RST_N

TM0

B4

C4

–

C5

–

I

VDDO

Active-low reset input

Clock request polarity select

Internally connected to ground

Reserved: connect to ground.

TM1

–

TM2

F3

C6

Digital I/O

GPIO_0

GPIO_1

GPIO_2

GPIO_3

B5

B3

–

C3

B3

–

I/O

VDDO

GPIO/BT_WAKE

GPIO/HOST_WAKE

GPIO

–

GPIO/LINK_IND

Note: Can be configured for active high or low

as well as open drain.

GPIO_4

GPIO_5

–

I/O

VDDO

GPIO

E6

F4

GPIO/CLK_REQ

TCXO-OR Function Out available on some

packages. See Section 11.“Ordering

Information”.

GPIO_6

E3

D5

I/O

VDDO

GPIO

TCXO-OR Function In available on some

packages. See Section 11.“Ordering

Information”.

GPIO_7

B7

D8

C8

D7

E8

F7

E7

–

I/O

VDDO

DETATCH/CARD_DETECT

UART receive data

UART transmit data

UART request to send output

UART clear to send input

I²C clock

UART_RXD

UART_TXD

UART_RTS_N

UART_CTS_N

SCL

D2

C2

F2

E3

E1

D1

SDA

I²C data

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Table 8. CYW20710 Signal Descriptions (Cont.)

FPBGA

50-Ball

WLBGA

Signal

42-Bump

I/O

Power Domain

Description

Serial flash SPI clock

SPIM_CLK

SPIM_CS_N

PCM_IN

A8

C7

F6

G6

F4

F5

B6

E4

E5

–

C1

E2

D4

E4

C4

A4

–

I/O

VDDO

Serial flash active-low chip select

PCM/I2S data input

PCM/I2S data output

PCM/I2S clock

PCM_OUT

PCM_CLK

PCM_SYNC

COEX_IN

PCM sync/I2S word select

Coexistence input

COEX_OUT0

COEX_OUT1

OTP_DIS

–

Coexistence output

–

Coexistence output

A2

OTP disable pin. By default, leave this pin

floating.

Supplies

VDDIF

VDDTF

VDDLNA

VDDRF

VDDPX

VDDC

VDDO

NC

B1

C1

E1

F1

G1

A5

B8

F8

G5

A6

G8

–

I

N/A

Radio IF PLL supply

Radio PA supply

Radio LNA supply

Radio supply

B7

–

I

E7

F7

A3

F1

–

I

Radio RF PLL supply

Core logic supply

Digital I/O supply voltage

No connect

I

D3

–

I

–

I

B1

D7

B6

E6

F6

F3

A1

–

I

VSS

C2

D2

F2

D3

C6

A7

G7

–

Ground

VSS

Ground

VSS

Ground

VSS

Ground

VSS

Ground

VSS

Ground

VSS

Ground

VSS

B2

Ground

Document No. 002-14804 Rev. *H

Page 27 of 50

PRELIMINARY

CYW20710

8. Ball Grid Arrays

Figure 8 shows the top view of the 50-ball 4.5 x 4 x 0.6 mm (FPBGA).

Figure 8. 50-Ball 4.5 x 4 x 0.6 mm (FPBGA) Array

1

2

3

4

5

6

7

8

A

B

C

D

E

F

G

Table 9. Ball-Out for the 50-Ball CYW20710A1KUFBXG

1

2

3

4

5

6

7

8

VREG

VREGHV VBAT

LPO_IN

VDDC

VDDO

VSS

GPIO_7

SPIM_CLK

A

B

C

D

E

F

VDDIF

REG_EN GPIO_1

RST_N

TM0

–

GPIO_0

COEX_IN

VDDC

VDDTF VSS

RFP VSS

–

VSS

–

SPIM_CS_N UART_TXD

UART_RTS_N UART_RXD

VSS

GPIO6

TM2

XOUT

VDDLNA –

COEX_OUT0 COEX_OUT1 GPIO_5

SDA

SCL

VSS

UART_CTS_N

VDDC

VDDRF VSS

VDDPX XIN

PCM_CLK

RES

PCM_SYNC PCM_IN

VDDO PCM_OUT

VDDO

G

Figure 9 shows the top view of the 42-bump, 2.97 x 2.46 x 0.5 mm array.

Figure 9. 42-Bump 2.97 x 2.46 x 0.5 mm Array (Top View)

1

2

3

4

5

6

7

A

B

C

D

E

F

Document No. 002-14804 Rev. *H

Page 28 of 50

PRELIMINARY

CYW20710

Table 10. Ball-Out for the 42-Bump CYW20710A1KUBXG

1

2

3

4

5

6

7

VSS

N/C

OTP_DIS

VDDC

PCM_SYNC

VBAT

VREGHV

VREG

A

B

C

D

E

F

VSS

GPIO_1

GPIO_0

VDDO

LPO_IN

REG_EN

RST_N

GPIO_6

XOUT

VSS

TM2

RES

VSS

VDDTF

RFP

SPIM_CLK UART_TXD

PCM_CLK

PCM_IN

SDA

UART_RXD

SPIM_CS_N

VSS

SCL

UART_CTS_N PCM_OUT

GPIO_5

VDDRF

VDDPX

VDDC

UART_RTS_N VSS

XIN

Document No. 002-14804 Rev. *H

Page 29 of 50

PRELIMINARY

CYW20710

9. Electrical Characteristics

Note: All voltages listed in Table 11 are referenced to V_DD

.

Table 11. Absolute Maximum Ratings

Rating

Signal\Parameter

VDD_RF¹

Value

Unit

DC supply voltage for RF

1.32

3.6

V

DC supply voltage for core

DC supply voltage for I/O

VDDC

VDDO²

VDDTF

VIMAX

VIMIN

TSTG

V

DC supply voltage for PA

3.3

V

Maximum voltage on input or output pins

Minimum voltage on input or output pins

Storage temperature

VDDO + 0.3

VSS – 0.3

–40 to 125

V

°C

1. VDD_RF collectively refers to the VDDIF, VDDLNA, VDDPX, and VDDRF RF power supplies.

2. If VDDO is not applied, voltage should never be applied to any digital I/O pins (I/O pins should never be driven or pulled high). The list of

digital I/O pins includes the following (these pins are listed in Section 7.“Pin-Out and Signal Descriptions” with VDDO shown as their power

domain):

GPIO[3], GPIO[5], GPIO[6]

SCL, SDA

N_MODE

SPIM_CS_N, SPIM_CLK

Table 12. Power Supply

Parameter

DC supply voltage for RF

Symbol

Minimum

1.159

Typical

1.22

Maximum

1.281

Unit

VDD_RF ¹

VDD_RF ²

VDDC

V

DC supply noise for RF, from 100 kHz to 1 MHz

DC supply voltage for core

DC supply voltage for I/O

DC supply

–

150

1.281

3.6

μV rms

1.159

1.7

1.22

–

V

VDDO

VDDTF ³

1.12

–

3.3

1. VDD_RF collectively refers to the VDDIF, VDDLNA, VDDPX, VDDLNA, VDDRF RF power supplies.

2. Overall performance defined using integrated regulation.

3. VDDTF for Class 2 must be connected to VREG (main LDO output). VDDTF for Class 1 must be connected to VREGHV (HV LDO output)

or an external voltage source. Refer to the Cypress compatibility guide for configuration details. VDDTF requires a capacitor to ground. The

value of the capacitor must be tuned to ensure optimal RF RX sensitivity. The typical capacitor value is 10 pF for both packages. The value

may depend on board layout.

Document No. 002-14804 Rev. *H

Page 30 of 50

PRELIMINARY

CYW20710

Table 13. High-Voltage Regulator (HV LDO) Electrical Specifications

Parameter

Minimum

Typical

Maximum

Unit

Input voltage

2.3

1.8

–

5.5

3.3

95

V

Output voltage

V

Max current load

Load capacitance

Load capacitor ESR

PSRR

mA

F

Ω

1

10

0.01

20

–

2

40

dB

s

mV

Turn-on time (C_load= 2.2 μF)

Dropout voltage

200

–

Table 14. Main Regulator (Main LDO) Electrical Specifications

Parameter

Minimum

Typical

Maximum

3.63

Unit

Input voltage

Output voltage

Load current

Load capacitance

ESR

1.63

1.159

–

V

1.22

–

1.281

60

mA

1

–

2.2

0.5

300

–

F

Ω

0.1

–

Turn-on time

PSRR

–

s

dB

mV

15

–

Dropout voltage

–

200

Note: By default, the drive strength settings specified in Table 15 are for 3.3V. To achieve the required drive strength for a VDDIO of

2.5V or 1.8V, contact a Cypress technical support representative (see “Technical Support” for contact information).

Table 15. Digital I/O Characteristics

Characteristics

Input low voltage (VDDO = 3.3V)

Symbol

V_IL

Minimum

Typical

Maximum

0.8

Unit

–

V

Input high voltage (VDDO = 3.3V)

Input low voltage (VDDO = 1.8V)

Input high voltage (VDDO = 1.8V)

Output low voltage

V_IH

V_IL

V_IH

V_OL

V_OH

I_IL

2.0

–

0.6

–

1.1

–

0.4

–

Output high voltage

VDDO – 0.4V –

Input low current

–

1.0

3.0

0.4

A

Input high current

I_IH

A

Output low current (VDDO = 3.3V, V_OL= 0.4V)

Output high current (VDDO = 3.3V, V_OH= 2.9V)

Output low current (VDDO = 1.8V, V_OL= 0.4V)

Output high current (VDDO = 1.8V, V_OH= 1.4V)

Input capacitance

I_OL

I_OH

I_OL

I_OH

C_IN

mA

pF

Document No. 002-14804 Rev. *H

Page 31 of 50

PRELIMINARY

CYW20710

Table 16. Pad I/O Characteristics¹

Pad Name

I/O Pad Characteristics

Pull-Up/Pull-Down

Fail-Safe

COEX_OUT0

COEX_OUT1

COEX_IN

PCM_CLK

PCM_OUT

PCM_IN

Y

N/A

Y

N

PCM_SYNC

UART_RTS_N

UART_CTS_N

UART_RXD

UART_TXD

GPIO_0

GPIO_1

GPIO_2

GPIO_4

GPIO_7

RST_N

OTP_DIS

1. All digital I/O internal pull-up or pull-down values are around 60 kΩ.

Document No. 002-14804 Rev. *H

Page 32 of 50

PRELIMINARY

CYW20710

Table 17. Current Consumption—Class 1(10 dBm)

Operational Mode

Conditions

Typical

Units

mA

Receive (1 Mbps)

Transmit (1 Mbps)

Current level during receive of a basic rate packet

31

65

Current level during transmit of a basic rate packet, GFSK output power = 10

dBm

mA

Receive (EDR)

Transmit (EDR)

Current level during receive of a 2 or 3 Mbps rate packet

32

mA

Current level during transmit of a 2 or 3 Mbps rate packet, GFSK output power = 59

10 dBm

DM1/DH1

DM3/DH3

DM5/DH5

HV1

Average current during basic rate max throughput connection

which includes only this packet type.

45

46

48

38

23

17

mA

Average current during basic rate max throughput connection

which includes only this packet type.

Average current during max basic rate throughput connection

which includes only this packet type.

Average current during SCO voice connection consisting of only

this packet type. ACL channel is in 500 ms sniff.

HV2

Average current during SCO voice connection consisting of only

this packet type. ACL channel is in 500 ms sniff.

HV3

Average current during SCO voice connection consisting of only

this packet type. ACL channel is in 500 ms sniff.

HCI only active

Sleep

Average current when waiting for HCI command UART or SPI transports.

UART transport active, external LPO clock available.

4.8

55

45

mA

μA

Sleep, HV Reg Bypass

UART transport active, external LPO clock available, HV LDO

disabled and in bypass mode.

Inquiry Scan (1.28 sec)

Page Scan (R1)

Periodic scan rate is 1.28 sec.

350

μA

Periodic scan rate is R1 (1.28 sec).

Inquiry Scan + Page Scan Both inquiry and page scans are interlaced together at 1.28 sec periodic scan 630

(R1)

rate.

Sniff master (500 ms)

Attempt and timeout parameters set to 4. Quality connection which rarely

requires more than minimum packet exchange.

175

160

μA

Sniff slave (500 ms)

Attempt and timeout parameters set to 4. Quality connection which rarely

requires more than minimum packet exchange. Sniff master follows optimal sniff

protocol of CYW20710 master.

Sniff (500 ms) + Inquiry/

Page Scan (R1)

Same conditions as Sniff master and Page Scan (R1). Scan maybe either Inquiry 455

Scan or Page Scan at 1.28 sec periodic scan rate.

μA

Sniff (500ms) + Inquiry

Scan + Page Scan (R1)

Same conditions as Sniff master and Inquiry Scan + Page Scan.

760

Document No. 002-14804 Rev. *H

Page 33 of 50

PRELIMINARY

CYW20710

Table 18. Current Consumption—Class 2 (2 dBm)

Operational Mode

Receive (1 Mbps)

Conditions

Typical

31

Unit

mA

Current level during receive of a basic rate packet

Transmit (1 Mbps)

Receive (EDR)

Transmit (EDR)

Current level during transmit of a basic rate packet, GFSK output power = 2 dBm 44

Current level during receive of a 2 or 3 Mbps rate packet 32

mA

Current level during transmit of a 2 or 3 Mbps rate packet, GFSK output power = 41

2 dBm

DM1/DH1

DM3/DH3

DM5/DH5

HV1

Average current during basic rate max throughput connection, which includes 35

only this packet type.

mA

Average current during basic rate max throughput connection, which includes 36

only this packet type.

Average current during max basic rate throughput connection, which includes 37

only this packet type.

Average current during SCO voice connection consisting of only this packet type. 28

ACL channel is in 500 ms sniff.

HV2

Average current during SCO voice connection consisting of only this packet type. 17

ACL channel is in 500 ms sniff.

HV3

Average current during SCO voice connection consisting of only this packet type. 13

ACL channel is in 500 ms sniff.

HCI only active

Sleep

Average current when waiting for HCI command UART or SPI transports.

UART transport active, external LPO clock available.

4.8

55

mA

μA

Sleep, HV Reg Bypass

UART transport active, external LPO clock available, HV LDO disabled and in 45

bypass mode.

Inquiry Scan (1.28 sec)

Page Scan (R1)

Periodic scan rate is 1.28 sec.

350

μA

Periodic scan rate is R1 (1.28 sec).

Inquiry Scan + Page Scan

(R1)

Both inquiry and page scans are interlaced together at 1.28 sec periodic scan 630

rate.

Sniff master (500 ms)

Attempt and timeout parameters set to 4. Quality connection which rarely

requires more than minimum packet exchange.

145

μA

Sniff slave (500 ms)

Attempt and timeout parameters set to 4. Quality connection which rarely

requires more than minimum packet exchange. Sniff master follows optimal sniff

protocol of CYW20710 master.

135

Sniff (500 ms) + Inquiry/Page Same conditions as Sniff master and Page Scan (R1). Scan can be either Inquiry 425

Scan (R1) Scan or Page Scan at 1.28 sec periodic scan rate.

μA

Sniff (500 ms) + Inquiry Scan Same conditions as Sniff master and Inquiry Scan + Page Scan.

+ Page Scan (R1)

730

Table 19. Operating Conditions

Parameter

Conditions

Commercial

Minimum

Typical

Maximum

Unit

°C

Temperature

Power supply

–30.0

1.14

–

85

RF, Core

–

1.22

2.9

1.32

3.3

V

PA supply (VDDTF)

Document No. 002-14804 Rev. *H

Page 34 of 50

PRELIMINARY

CYW20710

9.1 RF Specifications

Table 20. Receiver RF Specifications^{1, 2}

Parameter

Conditions

Minimum Typical ³Maximum

Unit

General

Frequency range

RX sensitivity ⁴

–

2402

–

2480

–85

–84

–85

–81

MHz

GFSK, 0.1% BER, 1 Mbps, FPBGA package –

GFSK, 0.1% BER, 1 Mbps, WLBGA package –

–89⁵

–88⁵

–91⁵

–86⁵

dBm

/4-DQPSK, 0.01% BER, 2 Mbps

8-DPSK, 0.01% BER, 3 Mbps FPBGA

package

–

8-DPSK, 0.01% BER, 3 Mbps, WLBGA

package

–

–85⁵

–80

dBm

Maximum input

GFSK, 1 Mbps

–

–20

dBm

Maximum input

/4-DQPSK, 8-DPSK, 2/3 Mbps

Interference Performance

C/I cochannel

GFSK, 0.1% BER

–

11

dB

C/I 1 MHz adjacent channel

C/I 2 MHz adjacent channel

C/I > 3 MHz adjacent channel

C/I image channel

0

–30.0

–40.0

–9.0

–20.0

C/I 1 MHz adjacent to image

channel

C/I cochannel

/4-DQPSK, 0.1% BER

8-DPSK, 0.1% BER

–

13

dB

C/I 1 MHz adjacent channel

C/I 2 MHz adjacent channel

C/I > 3 MHz adjacent channel

C/I image channel

0

–30.0

–40.0

–7.0

–20.0

/4-DQPSK, 0.1% BER

C/I 1 MHz adjacent to image

channel

C/I cochannel

8-DPSK, 0.1% BER

–

21

dB

C/I 1 MHz adjacent channel

C/I 2 MHz adjacent channel

C/I > 3 MHz adjacent channel

C/I Image channel

5

–25.0

–33.0

0

C/I 1 MHz adjacent to image

channel

–13.0

Out-of-Band Blocking Performance (CW) ⁶

30 MHz–2000 MHz

0.1% BER

–

–10.0

–27

–

dBm

2000–2399 MHz

2498–3000 MHz

–27

3000 MHz–12.75 GHz

–10.0

Document No. 002-14804 Rev. *H

Page 35 of 50

PRELIMINARY

CYW20710

Table 20. Receiver RF Specifications^{1, 2}(Cont.)

Parameter

Conditions

Minimum Typical ³Maximum

Unit

Out-of-Band Blocking Performance, Modulated Interferer

776–764 MHz

CDMA

–

–15

–20

–10

–15

–25

–

dBm

824–849 MHz

CDMA

dBm

1850–1910 MHz

824–849 MHz

CDMA

EDGE/GSM

WCDMA

880–915 MHz

1710–1785 MHz

1850–1910 MHz

1920–1980 MHz

Intermodulation Performance ⁷

BT, Df = 5 MHz

–

–39.0

–

dBm

Spurious Emissions ⁸

30 MHz to 1 GHz

1 GHz to 12.75 GHz

65 MHz to 108 MHz

746 MHz to 764 MHz

851–894 MHz

–

–57

–47

–

dBm

–

dBm

FM Rx

CDMA

EDGE/GSM

PCS

–145

dBm/Hz

–

925–960 MHz

–

1805–1880 MHz

1930–1990 MHz

2110–2170 MHz

–

WCDMA

–

1. All specifications are single ended. Unused inputs are left open.

2. All specifications, except typical, are for industrial temperatures. For details see Table 19.

3. Typical operating conditions are 1.22V operating voltage and 25°C ambient temperature.

4. The receiver sensitivity is measured at BER of 0.1% on the device interface.

5. Measured with the dirty transmitter OFF. Typically, there is approximately 1 dB less in Rx sensitivity when the dirty transmitter is ON.

6. Meets this specification using front-end band pass filter.

7. f0 = -64 dBm Bluetooth-modulated signal, f1 = –39 dBm sine wave, f2 = –39 dBm Bluetooth-modulated signal, f0 = 2f1 – f2, and |f2 –

f1| = n*1 MHz, where n is 3, 4, or 5. For the typical case, n = 5.

8. Includes baseband radiated emissions.

Document No. 002-14804 Rev. *H

Page 36 of 50

PRELIMINARY

CYW20710

Table 21. Transmitter RF Specifications ^{1, 2}

Parameter

Conditions

Minimum

Typical

Maximum

Unit

General

Frequency range

–

2402

6.5

4.5

–1.5

2

–

2480

MHz

Class1: GFSK Tx power ³

Class1: EDR Tx power ⁴

Class 2: GFSK Tx power

Power control step

10

8

–

6

dBm

dB

2

4

Modulation Accuracy

p/4-DQPSK Frequency Stability

p/4-DQPSK RMS DEVM

p/4-QPSK Peak DEVM

p/4-DQPSK 99% DEVM

8-DPSK frequency stability

8-DPSK RMS DEVM

8-DPSK Peak DEVM

8-DPSK 99% DEVM

–

–10

–

10

20

35

30

10

13

25

20

kHz

%

–

%

–

%

–10

–

kHz

%

–

%

–

%

In-Band Spurious Emissions

+500 kHz

–

–20

–26

–20

–40

dBc

dBm

1.0 MHz < |M – N| < 1.5 MHz

1.5 MHz < |M – N| < 2.5 MHz

|M – N| > 2.5 MHz

Out-of-Band Spurious Emissions

30 MHz to 1 GHz

–

–36.0 ⁵

–30.0 ^{5, 6}

–47.0

dBm

1 GHz to 12.75 GHz

1.8 GHz to 1.9 GHz

5.15 GHz to 5.3 GHz

–47.0

GPS Band Noise Emission (without a front-end band pass filter)

1572.92 MHz to 1577.92 MHz

Out-of-Band Noise Emissions (without a front-end band pass filter)

–

–150

–127

dBm/Hz

65 MHz to 108 MHz

FM Rx

–

–145

–

dBm/Hz

746 MHz to 764 MHz

869 MHz to 960 MHz

925 MHz to 960 MHz

1805 MHz to 1880 MHz

1930 MHz to 1990 MHz

2110 MHz to 2170 MHz

CDMA

EDGE/GSM

PCS

WCDMA

1. All specifications are for industrial temperatures. For details, see Table 19.

2. All specifications are single-ended. Unused input are left open.

3. +10 dBm output for GFSK measured with VDDTF = 2.9 V.

4. +8 dBm output for EDR measured with VDDTF = 2.9 V.

5. Maximum value is the value required for Bluetooth qualification.

6. Meets this spec using a front-end bandpass filter.

Document No. 002-14804 Rev. *H

Page 37 of 50

PRELIMINARY

CYW20710

9.2 Timing and AC Characteristics

In this section, use the numbers listed in the reference column to interpret the timing diagrams.

9.2.1 Startup Timing

There are two basic startup scenarios. In one scenario, the chip startup and firmware boot is held off while the RST_N pin is asserted.

In the second scenario, the chip startup and firmware boot is directly triggered by the chip power-up. In this case, an internal power-

on reset (POR) is held for a few ms, after which the chip commences startup.

The global reset signal in the CYW20710 is a logical OR (actually a wired AND, since the signals are active low) of the RST_N input

and the internal POR signals. The last signal to be released determines the time at which the chip is released from reset. The POR

is typically asserted for 3 ms after VDDC crosses the 0.8V threshold, but it may be as soon as 1.5 ms after this event.

After the chip is released from reset, both startup scenarios follow the same sequence, as follows:

1. After approximately 120 μs, the CLK_REQ (GPIO_5) signal is asserted.

2. The chip remains in sleep state for a minimum of 4.2 ms.

3. If present, the TCXO and LPO clocks must be oscillating by the end of the 4.2 ms period.

If a TCXO clock is not in the system, a crystal is assumed to be present at the XIN and XOUT pins. If an LPO clock is not used, the

firmware will detect the absence of a clock at the LPO_IN lead and use the internal LPO clock instead.

Figure 10 and Figure 11 illustrate the two startup timing scenarios.

Figure 10. Startup Timing from RST_N

t_{ra m}

= 2 0 0

μ s

p m a x

V D D IO , V B A T ,R E G _ E N *

V R E G

V D D C

> 0 .8 V

t

=

3 0 0

μ s

R S T _ N

t

= 6 4 to 1 7 1 μ s

G P IO 5 (C L K _ R E Q )

t_m

= 4 .2 m s

a x

T C X O

L P O

Figure 11. Startup Timing from Power-on Reset

t_rampmax= 200 μs

VDDIO, VBAT,REG_EN*

VREG

VDDC > 0.8V

t = 300 μs

t_min= 1.5 ms

Internal POR

μs

t = 64 to 171

GPIO5 (CLK_REQ)

t_max= 4.2 ms

TCXO

LPO

Document No. 002-14804 Rev. *H

Page 38 of 50

PRELIMINARY

CYW20710

9.2.2 UART Timing

Table 22. UART Timing Specifications

Reference

Characteristics

Delay time, UART_CTS_N low to UART_TXD valid

Minimum

Maximum

24

Unit

1

2

3

–

Baudout cycles

ns

Setup time, UART_CTS_N high before midpoint of stop bit

Delay time, midpoint of stop bit to UART_RTS_N high

10

2

Baudout cycles

Figure 12. UART Timing

UART_CTS_N

2

1

UART_TXD

Midpoint of STOP

bit

Midpoint of STOP

bit

UART_RXD

3

UART_RTS_N

Document No. 002-14804 Rev. *H

Page 39 of 50

PRELIMINARY

CYW20710

9.2.3 PCM Interface Timing

Table 23. PCM Interface Timing Specifications (Short Frame Synchronization, Master Mode)

Reference

Characteristics

Minimum

128

Maximum

Unit

kHz

1

2

3

4

5

6

7

8

9

PCM bit clock frequency

PCM bit clock HIGH time

PCM bit clock LOW time

2048

–

128

209

–

ns

–

Delay from PCM_BCLK rising edge to PCM_SYNC high

Delay from PCM_BCLK rising edge to PCM_SYNC low

Delay from PCM_BCLK rising edge to data valid on PCM_OUT

Setup time for PCM_IN before PCM_BCLK falling edge

Hold time for PCM_IN after PCM_BCLK falling edge

50

–

50

10

–

Delay from falling edge of PCM_BCLK during last bit period to PCM_OUT –

becoming high impedance

50

Figure 13. PCM Interface Timing (Short Frame Synchronization, Master Mode)

2

1

3

PCM_BCLK

4

5

PCM_SYNC

6

9

HIGH

IMPEDENCE

Bit 15 (Previous Frame)

Bit 15

Bit 0

PCM_OUT

PCM_IN

7

8

Bit 15 (Previous Frame)

Bit 0

Bit 15

Document No. 002-14804 Rev. *H

Page 40 of 50

PRELIMINARY

CYW20710

Table 24. PCM Interface Timing Specifications (Short Frame Synchronization, Slave Mode)

Reference

Characteristics

Minimum

128

Maximum

Unit

1

2

3

4

5

6

7

8

9

PCM bit clock frequency

PCM bit clock HIGH time

PCM bit clock LOW time

2048

–

kHz

ns

209

50

10

–

Setup time for PCM_SYNC before falling edge of PCM_BCLK

Hold time for PCM_SYNC after falling edge of PCM_BCLK

Hold time of PCM_OUT after PCM_BCLK falling edge

Setup time for PCM_IN before PCM_BCLK falling edge

Hold time for PCM_IN after PCM_BCLK falling edge

–

175

–

50

10

–

Delay from falling edge of PCM_BCLK during last bit period

to PCM_OUT becoming high impedance

100

Figure 14. PCM Interface Timing (Short Frame Synchronization, Slave Mode)

2

1

3

PCM_BCLK

4

5

PCM_SYNC

6

9

HIGH

IMPEDENCE

Bit 15 (Previous Frame)

Bit 0

Bit 15

PCM_OUT

PCM_IN

7

8

Bit 15 (Previous Frame)

Bit 0

Bit 15

Document No. 002-14804 Rev. *H

Page 41 of 50

PRELIMINARY

CYW20710

Table 25. PCM Interface Timing Specifications (Long Frame Synchronization, Master Mode)

Reference

Characteristics

Minimum

128

Maximum

Unit

kHz

1

PCM bit clock frequency

PCM bit clock HIGH time

PCM bit clock LOW time

2048

–

2

3

4

209

–

ns

–

Delay from PCM_BCLK rising edge to PCM_SYNC HIGH during first bit

time

50

5

Delay from PCM_BCLK rising edge to PCM_SYNC LOW during third bit

time

–

50

ns

6

7

8

9

Delay from PCM_BCLK rising edge to data valid on PCM_OUT

Setup time for PCM_IN before PCM_BCLK falling edge

Hold time for PCM_IN after PCM_BCLK falling edge

–

50

–

ns

50

10

–

Delay from falling edge of PCM_BCLK during last bit period to PCM_OUT –

becoming high impedance

50

Figure 15. PCM Interface Timing (Long Frame Synchronization, Master Mode)

2

1

3

PCM_BCLK

PCM_SYNC

4

5

6

9

HIGH

IMPEDENCE

Bit 0

Bit 1

Bit 2

Bit 15

PCM_OUT

PCM_IN

7

8

Bit 0

Bit 1

Bit 2

Bit 15

Document No. 002-14804 Rev. *H

Page 42 of 50

PRELIMINARY

CYW20710

Table 26. PCM Interface Timing Specifications (Long Frame Synchronization, Slave Mode)

Reference

Characteristics

Minimum

128

Maximum

Unit

kHz

1

2

3

4

PCM bit clock frequency.

PCM bit clock HIGH time.

PCM bit clock LOW time.

2048

209

–

ns

Setup time for PCM_SYNC before falling edge of PCM_BCLK during first 50

bit time.

5

6

Hold time for PCM_SYNC after falling edge of PCM_BCLK during second 10

bit period. (PCM_SYNC may go low any time from second bit period to last

bit period).

–

ns

Delay from rising edge of PCM_BCLK or PCM_SYNC

(whichever is later) to data valid for first bit on PCM_OUT.

–

50

7

8

9

Hold time of PCM_OUT after PCM_BCLK falling edge.

Setup time for PCM_IN before PCM_BCLK falling edge.

Hold time for PCM_IN after PCM_BCLK falling edge.

–

175

–

ns

50

10

–

10

Delay from falling edge of PCM_BCLK or PCM_SYNC

(whichever is later) during last bit in slot to PCM_OUT becoming high

impedance.

100

Figure 16. PCM Interface Timing (Long Frame Synchronization, Slave Mode)

2

1

PCM_BCLK

PCM_SYNC

3

4

5

7

6

10

HIGH

IMPEDENCE

Bit 0

Bit 1

Bit 15

PCM_OUT

PCM_IN

8

9

Bit 0

Bit 1

Bit 15

Document No. 002-14804 Rev. *H

Page 43 of 50

PRELIMINARY

CYW20710

9.2.4 BSC Interface Timing

Table 27. BSC Interface Timing Specifications

Reference

Characteristics

Minimum

Maximum

Unit

kHz

1

Clock frequency

–

100

400

800

1000

2

3

4

5

6

7

8

9

START condition setup time

START condition hold time

Clock low time

650

280

650

280

0

–

ns

–

Clock high time

–

Data input hold time¹

Data input setup time

STOP condition setup time

Output valid from clock

Bus free time²

–

100

280

–

400

–

10

650

1. As a transmitter, 300 ns of delay is provided to bridge the undefined region of the falling edge of SCL to avoid unintended generation of

START or STOP conditions

2. Time that the cbus must be free before a new transaction can start.

Figure 17. BSC Interface Timing Diagram

1

5

SCL

2

4

7

8

6

3

SDA

IN

10

9

SDA

OUT

Document No. 002-14804 Rev. *H

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PRELIMINARY

CYW20710

10. Mechanical Information

Figure 18. CYW20710A1KUFBXG Mechanical Drawing

Document No. 002-14804 Rev. *H

Page 45 of 50

PRELIMINARY

CYW20710

Figure 19. 42-Bump CYW20710A1KUBXG Mechanical Drawing

Document No. 002-14804 Rev. *H

Page 46 of 50

PRELIMINARY

CYW20710

10.1 Tape, Reel, and Packing Specification

Figure 20. Reel, Labeling, and Packing Specification

Device Orientation/Mix Lot Number

Each reel may contain up to three lot numbers, independent of the date code.

Individual lots must be labeled on the box, moisture barrier bag, and the reel.

Pin 1

Top-right corner toward sprocket holes.



Moisture Barrier Bag Contents/Label

Desiccant pouch (minimum 1)

Humidity indicator (minimum 1)

Reel (maximum 1)

Document No. 002-14804 Rev. *H

Page 47 of 50

PRELIMINARY

CYW20710

11. Ordering Information

The following table lists available part numbers and describes differences in package type, available I/O, and functional configuration.

See the referenced figures and tables for mechanical drawings and package I/O information.

All packages are rated from –30°C to +85°C.

Strapped

Part Number

Package Type

Functional I/O Features

Configuration

CYW20710A1KUFBXG

Commercial 50-ball FPBGA, 4.5 mm x Dedicated Coex¹, more GPIO,

TCXO AND/OR

mode enabled

4.0 mm x 0.6 mm.

See Figure 18.

TM0²

Table 9

CYW20710A1KUBXG

Commercial 42-bump WLBGA, 3.02 Table 10

mm x 2.51 mm x 0.55 mm.

TCXO AND/OR

mode enabled

See Figure 19.

1. All packages support coexistence features through the ability to re-purpose most digital I/O based on the desired user configuration.

Package include balls coexistence functionality (default).

2. TM0 allows configuration of CLK_REQ output polarity.

12. Additional Information

12.1 Acronyms and Abbreviations

In most cases, acronyms and abbreviations are defined upon first use. For a more complete list of acronyms and other terms used in

Cypress documents, go to: http://www.cypress.com/glossary.

12.2 IoT Resources

Cypress provides a wealth of data at http://www.cypress.com/internet-things-iot to help you to select the right IoT device for your

design, and quickly and effectively integrate the device into your design. Cypress provides customer access to a wide range of

information, including technical documentation, schematic diagrams, product bill of materials, PCB layout information, and software

updates. Customers can acquire technical documentation and software from the Cypress Support Community website

(https://community.cypress.com/)

Document No. 002-14804 Rev. *H

Page 48 of 50

PRELIMINARY

CYW20710

Document History Page

Document Title: CYW20710 Single-Chip Bluetooth® Transceiver and Baseband Processor

Document Number: 002-14804

Orig. of

Change

Submission

Date

Revision

ECN

Description of Change

**

-

6/09/2010

20710-DS100-R

Initial release

*A

*B

-

6/23/2010

20710-DS100-R

Updated:

•

“Programming”.

“Frequency Selection” on page 37 by adding 24 MHz as a reference

frequency.

• Table 9: “Ball-Out for the 42-Bump CYW20710A0KUBXG”.

-

8/16/2010

20710-DS102-R

Updated:

•

Table 10: “Absolute Maximum Voltages”

•

Table 11: “Power Supply”

• Table 13: “Main Regulator (Main LDO) Electrical Specifications”

20710-DS103-R

*C

*D

-

2/16/2010

7/28/2011

Updated:

•

Part numbers changed to CYW20710A1KUFBXG (50-ball FPBGA) and

CYW20710A1KUBXG (42-ball WLBGA) throughout the document

20710-DS104-R

Updated:

•

“Simultaneous UART Transport and Bridging” (removed)

Changed “UFBGA” to “FPBGA” throughout.

*E

*F

-

10/17/2011

12/16/2011

20710-DS105-R

Updated:

•

Table 20: “Transmitter RF Specifications”

20710-DS107-R

Updated:

•

Table 7: “CYW20710 Signal Descriptions”

Table 10: “Absolute Maximum Ratings”

Table 17: “Current Consumption — Class 2 (2 dBm)”

Table 18: “Operating Conditions”

Table 19: “Receiver RF Specifications”

*G

-

10/4/2013

20710-DS107-R

•

Updated:

“UART Interface”

“External Frequency Reference”

Table15. “Digital I/O Characteristics"

Figure 10. “Startup Timing from RST_N

Figure 11. “Startup Timing from Power-on Reset

Added Cypress Part Numbering Scheme and Mapping Table on Page 1.

Updated to Cypress template.

*H

5484548

UTSV

11/25/2016

Document No.002-14804 Rev. *H

Page 49 of 50

PRELIMINARY

CYW20710

Sales, Solutions, and Legal Information

Worldwide Sales and Design Support

Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office

closest to you, visit us at Cypress Locations.

®

Products

PSoC Solutions

ARM^®Cortex^®Microcontrollers

cypress.com/arm

cypress.com/automotive

cypress.com/clocks

cypress.com/interface

cypress.com/iot

PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP

Automotive

Cypress Developer Community

Clocks & Buffers

Interface

| Components

Internet of Things

Lighting & Power Control

Memory

Technical Support

cypress.com/powerpsoc

cypress.com/memory

cypress.com/psoc

cypress.com/support

PSoC

Touch Sensing

USB Controllers

cypress.com/touch

cypress.com/usb

Wireless/RF

cypress.com/wireless

50

including any software or firmware included or referenced in this document ("Software"), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries

worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or other

intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software, then Cypress

hereby grants you a personal, non-exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the Software (a) for Software provided in source code form, to

modify and reproduce the Software solely for use with Cypress hardware products, only internally within your organization, and (b) to distribute the Software in binary code form externally to end users

(either directly or indirectly through resellers and distributors), solely for use on Cypress hardware product units, and (2) under those claims of Cypress's patents that are infringed by the Software (as

provided by Cypress, unmodified) to make, use, distribute, and import the Software solely for use with Cypress hardware products. Any other use, reproduction, modification, translation, or compilation

of the Software is prohibited.

TO THE EXTENT PERMITTED BY APPLICABLE LAW, CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE

OR ACCOMPANYING HARDWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. To the extent

permitted by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any liability arising out of the application or use of any

product or circuit described in this document. Any information provided in this document, including any sample design information or programming code, is provided only for reference purposes. It is

the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this information and any resulting product. Cypress products

are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons systems, nuclear installations, life-support devices or

systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances management, or other uses where the failure of the

device or system could cause personal injury, death, or property damage ("Unintended Uses"). A critical component is any component of a device or system whose failure to perform can be reasonably

expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim,

damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from and against all claims, costs, damages, and other

liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products.

Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in

the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners.

Document No. 002-14804 Rev. *H

Revised November 25, 2016

Page 50 of 50


型号：	BCM20710A1KUFBXG
厂家：	CYPRESS
描述：	Bluetooth 4.0 EDR compliant
文件：	总50页 (文件大小：4157K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BCM20710A1KUFBXG [CYPRESS]

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