CY2CP1504ZXC [CYPRESS]

1:4 LVCMOS to LVPECL Fanout Buffer with Selectable Clock Input; 1 : 4 LVCMOS至LVPECL扇出缓冲器,具有可选时钟输入
CY2CP1504ZXC
型号: CY2CP1504ZXC
厂家: CYPRESS    CYPRESS
描述:

1:4 LVCMOS to LVPECL Fanout Buffer with Selectable Clock Input
1 : 4 LVCMOS至LVPECL扇出缓冲器,具有可选时钟输入

时钟
文件: 总13页 (文件大小:286K)
中文:  中文翻译
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CY2CP1504  
1:4 LVCMOS to LVPECL Fanout Buffer  
with Selectable Clock Input  
Features  
Functional Description  
Select one of two low-voltage complementary metal oxide  
semiconductor (LVCMOS) inputs to distribute to four  
low-voltage positive emitter-coupled logic (LVPECL) output  
pairs  
The CY2CP1504 is an ultra-low noise, low-skew,  
low-propagation delay 1:4 LVCMOS to LVPECL fanout buffer  
targeted to meet the requirements of high-speed clock  
distribution applications. The CY2CP1504 can select between  
two separate LVCMOS input clocks using the IN_SEL pin. The  
synchronous clock enable function ensures glitch-free output  
transitions during enable and disable periods. The device has a  
fully differential internal architecture that is optimized to achieve  
low additive jitter and low skew at operating frequencies of up to  
250 MHz.  
30-ps maximum output-to-output skew  
480-ps maximum propagation delay  
0.15-ps maximum additive RMS phase jitter at 156.25 MHz  
(12-kHz to 20-MHz offset)  
Up to 250 MHz operation  
Synchronous clock enable function  
20-Pin thin shrunk small outline package (TSSOP) package  
2.5-V or 3.3-V operating voltage[1]  
Commercial and industrial operating temperature range  
Logic Block Diagram  
Q0  
Q0#  
VDD  
VSS  
Q1  
Q1#  
IN0  
IN1  
Q2  
Q2#  
Q3  
Q3#  
IN_SEL  
100k  
VDD  
100k  
Q
D
CLK_EN  
Note  
1. Input AC-coupling capacitors are required for voltage-translation applications.  
Cypress Semiconductor Corporation  
Document Number: 001-56313 Rev. *F  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised February 25, 2011  
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CY2CP1504  
Contents  
Pinouts .............................................................................. 3  
Absolute Maximum Ratings ............................................ 4  
Operating Conditions....................................................... 4  
DC Electrical Specifications............................................ 5  
AC Electrical Specifications............................................ 6  
Ordering Information........................................................ 9  
Ordering Code Definition............................................. 9  
Package Dimension........................................................ 10  
Acronyms........................................................................ 11  
Document Conventions ................................................. 11  
Document History Page................................................. 12  
Sales, Solutions, and Legal Information ...................... 13  
Worldwide Sales and Design Support....................... 13  
Products.................................................................... 13  
PSoC Solutions......................................................... 13  
Document Number: 001-56313 Rev. *F  
Page 2 of 13  
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CY2CP1504  
Pinouts  
Figure 1. Pin Diagram – 20-Pin TSSOP Package  
VSS  
1
20  
Q0  
CLK_EN  
IN_SEL  
2
3
4
5
19  
18  
17  
16  
Q0#  
VDD  
Q1  
IN0  
NC  
IN1  
NC  
NC  
Q1#  
Q2  
6
7
8
15  
14  
13  
Q2#  
VDD  
Q3  
9
12  
11  
NC  
VDD  
Q3#  
10  
Table 1. Pin Definitions  
Pin No.  
Pin Name  
Pin Type  
Power  
Description  
1
2
VSS  
Ground  
CLK_EN  
Input  
Synchronousclockenable. LVCMOS/low-voltagetransistor-transistorlogic  
(LVTTL).  
When CLK_EN = Low, Q(0:3) outputs are held low and Q(0:3)# outputs are  
held high  
3
4
IN_SEL  
Input  
Input  
Input clock select pin. LVCMOS/LVTTL;  
When IN_SEL = Low, input IN0 is active  
When IN_SEL = High, input IN1 is active  
IN0  
LVCMOS input clock. Active when IN_SEL = Low  
No connection  
5,7,8,9  
NC  
6
IN1  
Input  
LVCMOS input clock. Active when IN_SEL = High  
Power supply  
10,13,18  
11,14,16,19  
12,15,17,20  
VDD  
Power  
Output  
Output  
Q(0:3)#  
Q(0:3)  
LVPECL complementary output clocks  
LVPECL output clocks  
Document Number: 001-56313 Rev. *F  
Page 3 of 13  
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CY2CP1504  
Absolute Maximum Ratings  
Parameter  
Description  
Condition  
Nonfunctional  
Min  
–0.5  
–0.5  
Max  
Unit  
V
VDD  
Supply voltage  
4.6  
[2]  
lesser of 4.0  
VIN  
Input voltage, relative to VSS  
Nonfunctional  
V
or V + 0.4  
DD  
[2]  
lesser of 4.0  
VOUT  
DC output or I/O voltage, relative to VSS  
Nonfunctional  
–0.5  
V
or V + 0.4  
DD  
TS  
Storage temperature  
Nonfunctional  
–55  
150  
°C  
V
ESDHBM  
LU  
Electrostatic discharge (ESD) protection  
(Human body model)  
JEDEC STD 22-A114-B  
2000  
Latch up  
Meets or exceeds JEDEC Spec  
JESD78B IC Latchup Test  
UL–94  
MSL  
Flammability rating  
At 1/8 in  
V-0  
3
Moisture sensitivity level  
Operating Conditions  
Parameter  
Description  
Condition  
2.5-V supply  
3.3-V supply  
Commercial  
Min  
2.375  
3.135  
0
Max  
2.625  
3.465  
70  
Unit  
V
VDD  
TA  
Supply voltage  
V
Ambient operating temperature  
Power ramp time  
°C  
°C  
ms  
Industrial  
–40  
85  
tPU  
Power-up time for VDD to reach  
minimum specified voltage (power  
ramp must be monotonic)  
0.05  
500  
Note  
2. The voltage on any I/O pin cannot exceed the power pin during power up. Power supply sequencing is not required.  
Document Number: 001-56313 Rev. *F  
Page 4 of 13  
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CY2CP1504  
DC Electrical Specifications  
(VDD = 3.3 V ± 5% or 2.5 V ± 5%; TA = 0 °C to 70 °C (Commercial) or –40 °C to 85 °C (Industrial))  
Parameter  
IDD  
Description  
Operating supply current  
Condition  
All LVPECL outputs floating (internal IDD  
VDD = 3.3 V  
Min  
Max  
61  
Unit  
mA  
V
)
VIH1  
VIL1  
VIH2  
VIL2  
IIH  
Input high voltage, All inputs  
Input low voltage, All inputs  
Input high voltage, All inputs  
Input low voltage, All inputs  
Input high current, All inputs  
Input low current, All inputs  
LVPECL output high voltage  
LVPECL output low voltage  
Internal pull-up/pull-down resistance  
2.0  
–0.3  
1.7  
–0.3  
VDD + 0.3  
0.8  
VDD = 3.3 V  
V
VDD = 2.5 V  
VDD + 0.3  
0.7  
V
VDD = 2.5 V  
V
[3]  
Input = VDD  
150  
μA  
μA  
V
[3]  
IIL  
Input = VSS  
–150  
VOH  
VOL  
RP  
Terminated with 50 Ω to VDD – 2.0[4]  
Terminated with 50 Ω to VDD – 2.0[4]  
VDD – 1.20 VDD – 0.70  
VDD – 2.0 VDD – 1.63  
V
CLK_EN has pull-up only  
IN_SEL has pull-down only  
60  
140  
kΩ  
CIN  
Input capacitance  
Measured at 10 MHz; per pin  
3
pF  
Notes  
3. Positive current flows into the input pin, negative current flows out of the input pin.  
4. Refer to Figure 2 on page 7.  
Document Number: 001-56313 Rev. *F  
Page 5 of 13  
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CY2CP1504  
AC Electrical Specifications  
(VDD = 3.3 V ± 5% or 2.5 V ± 5%; TA = 0 °C to 70 °C (Commercial) or –40 °C to 85°C (Industrial))  
Parameter  
Description  
Input frequency  
Condition  
Min  
DC  
Typ  
Max  
250  
250  
Unit  
MHz  
MHz  
mV  
FIN  
FOUT  
VPP  
Output frequency  
FOUT = FIN  
DC  
LVPECL differential output voltage  
peak- to-peak, single-ended.  
Fout = DC to 150 MHz  
600  
400  
Fout = >150 MHz to 250 MHz  
mV  
Terminated with 50 Ω to VDD – 2.0[4]  
[5]  
tPD  
Propagation delay input to output pair Input rise/fall time < 1.5 ns  
(20% to 80%)  
45  
480  
55  
ps  
%
[6]  
tODC  
Output duty cycle  
Rail-to-rail input swing, 50%  
input DTCY measured at Vdd/2  
[7]  
tSK1  
Output-to-output skew  
Device-to-device output skew  
Any output to any output, with  
same load conditions at DUT  
30  
ps  
ps  
[7]  
tSK1 D  
Any output to any output  
between two or more devices.  
Devices must have the same  
input and have the same output  
load.  
150  
PNADD  
Additive RMS phase noise  
156.25-MHz Input  
Rise/fall time < 150 ps (20% to 80%)  
Offset = 1 kHz  
Offset = 10 kHz  
Offset = 100 kHz  
Offset = 1 MHz  
Offset = 10 MHz  
Offset = 20 MHz  
–120  
–130  
–135  
–150  
–150  
–150  
0.15  
dBc/Hz  
dBc/Hz  
dBc/Hz  
dBc/Hz  
dBc/Hz  
dBc/Hz  
ps  
VID > 400 mV  
[8]  
tJIT  
Additive RMS phase jitter (Random)  
Output rise/fall time  
156.25 MHz sinewave,  
12 kHz to 20 MHz offset; input  
swing = 2.2V, Vbias = VDD/2  
[9]  
tR, tF  
50% duty cycle at input,  
20% to 80% of full swing  
300  
ps  
(VOL to VOH  
)
Input rise/fall time < 1.5 ns  
(20% to 80%)  
tSOD  
tSOE  
Time from clock edge to outputs  
disabled  
Synchronous clock enable  
(CLK_EN) switched Low  
700  
700  
ps  
ps  
Time from clock edge to outputs  
enabled  
Synchronous clock enable  
(CLK_EN) switched high  
Notes  
5. Refer to Figure 3 on page 7.  
6. Refer to Figure 4 on page 7.  
7. Refer to Figure 5 on page 7.  
8. Refer to Figure 6 on page 8.  
9. Refer to Figure 7 on page 8.  
Document Number: 001-56313 Rev. *F  
Page 6 of 13  
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CY2CP1504  
Figure 2. Output Differential Voltage  
VOH  
Q
VPP  
Q#  
VOL  
Figure 3. Input to Any Output Pair Propagation Delay  
IN  
QX#  
QX  
tPD  
Figure 4. Output Duty Cycle  
QX  
QX#  
tPW  
tPERIOD  
tPW  
tPERIOD  
tODC  
=
Figure 5. Output-to-Output and Device-to-Device Skew  
QX  
QX#  
QY  
Device 1  
Device 2  
QY#  
QZ  
tSK1  
QZ#  
tSK1 D  
Document Number: 001-56313 Rev. *F  
Page 7 of 13  
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CY2CP1504  
Figure 6. RMS Phase Jitter  
Phase noise  
Noise Power  
Phase noise mark  
Offset Frequency  
f2  
f1  
Area Under the Masked Phase Noise Plot  
RMS Jitter   
Figure 7. Output Rise/Fall Time  
QX  
80%  
80%  
VPP  
20%  
20%  
QX#  
tR  
tF  
Figure 8. Synchronous Clock Enable Timing  
CLK_EN  
INX  
tSOD  
tPD  
tSOE  
QX  
QX#  
Document Number: 001-56313 Rev. *F  
Page 8 of 13  
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CY2CP1504  
Ordering Information  
Part Number  
Pb-free  
Type  
Production Flow  
Commercial, 0 °C to 70 °C  
CY2CP1504ZXC  
CY2CP1504ZXCT  
CY2CP1504ZXI  
CY2CP1504ZXIT  
20-Pin TSSOP  
20-Pin TSSOP tape and reel  
20-Pin TSSOP  
Commercial, 0 °C to 70 °C  
Industrial, –40 °C to 85 °C  
Industrial, –40 °C to 85 °C  
20-Pin TSSOP tape and reel  
Ordering Code Definition  
CY 2CP15 04 ZX C/I T  
Tape and reel  
Temperature range  
C = Commercial  
I = Industrial  
Pb-free TSSOP package  
Number of differential output pairs  
Base part number  
Company ID: CY = Cypress  
Document Number: 001-56313 Rev. *F  
Page 9 of 13  
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CY2CP1504  
Package Dimension  
Figure 9. 20-Pin Thin Shrunk Small Outline Package (4.40-mm Body) ZZ20  
51-85118 *C  
Document Number: 001-56313 Rev. *F  
Page 10 of 13  
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CY2CP1504  
Acronyms  
Document Conventions  
Table 2. Acronyms Used in this Document  
Table 3. Units of Measure  
Acronym  
ESD  
Description  
electrostatic discharge  
Symbol  
°C  
Unit of Measure  
degree Celsius  
decibels relative to the carrier  
giga hertz  
HBM  
human body model  
dBc  
GHz  
Hz  
kΩ  
µA  
µF  
µs  
JEDEC  
LVDS  
Joint electron devices engineering council  
low-voltage differential signal  
hertz  
LVCMOS  
low-voltage complementary metal oxide  
semiconductor  
kilo ohm  
microamperes  
micro Farad  
microsecond  
milliamperes  
millisecond  
millivolt  
LVPECL  
LVTTL  
OE  
low-voltage positive emitter-coupled logic  
low-voltage transistor-transistor logic  
Output enable  
mA  
ms  
mV  
MHz  
ns  
RMS  
root mean square  
TSSOP  
thin shrunk small outline package  
megahertz  
nanosecond  
ohm  
Ω
pF  
ps  
pico Farad  
pico second  
volts  
V
W
watts  
Document Number: 001-56313 Rev. *F  
Page 11 of 13  
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CY2CP1504  
Document History Page  
Document Title: CY2CP1504 1:4 LVCMOS to LVPECL Fanout Buffer with Selectable Clock Input  
Document Number: 001-56313  
Orig. of  
Change  
Submission  
Date  
Revision  
ECN  
Description of Change  
**  
2782891  
2838916  
CXQ  
CXQ  
10/09/09  
New Datasheet  
*A  
05/01/2010 Changed status from “ADVANCE” to “PRELIMINARY”.  
Changed from 0.34 ps to 0.25 ps maximum additive jitter in “Features” on page  
1 and in tJIT in the AC Electrical Specs table on page 5.  
Added tPU spec to the Operating Conditions table on page 3.  
Changed max IDD spec in the DC Electrical Specs table on page 4 from 60  
mA to 61 mA.  
Changed VOH in the DC Electrical Specs table on page 4: minimum from VDD  
- 1.15V to VDD - 1.20V; maximum from VDD - 0.75V to VDD - 0.70V.  
Removed VOD spec from the DC Electrical Specs table on page 4.  
Added RP spec in the DC Electrical Specs table on page 4. Min = 60 kΩ, Max  
= 140 kΩ.  
Added a measurement definition for CIN in the DC Electrical Specs table on  
page 4.  
Added VPP spec to the AC Electrical Specs table on page 5. VPP min = 600  
mV for DC - 150 MHz and min = 400 mV for 150 MHz to 250 MHz.  
Changed letter case and some names of all the timing parameters in the AC  
Electrical Specs table on page 5 to be consistent with EROS.  
Lowered all additive phase noise mask specs by 3 dB in the AC Electrical  
Specs table on page 5.  
Added condition to tR and tF specs in the AC Electrical specs table on page 5  
that input rise/fall time must be less than 1.5 ns (20% to 80%).  
Changed letter case and some names of all the timing parameters in Figures  
2, 3, 4, 5 and 7, to be consistent with EROS.  
*B  
3011766  
CXQ  
08/20/2010 Changed from 0.25 ps to 0.15 ps maximum additive jitter in “Features” on page  
1 and in tJIT in the AC Electrical Specs table on page 6.  
Added note 2 to describe IIH and IIL specs.  
Removed reference to data distribution from “Functional Description”.  
Updated phase noise specs for 1 k/10 k/100 k/1 M/10 M/20 MHz offset to  
-120/-130/-135/-150/-150/-150dBc/Hz, respectively, in the AC Electrical  
Specs table.  
Updated package diagram.  
Added Acronyms and Ordering Code Definition.  
*C  
*D  
3017258  
3100234  
CXQ  
CXQ  
08/27/2010 Corrected Output Rise/Fall time diagram.  
11/18/2010 Changed VIN and VOUT specs from 4.0V to “lesser of 4.0 or VDD + 0.4”  
Removed 200mA min LU spec, replaced with “Meets or exceeds JEDEC Spec  
JESD78B IC Latchup Test”  
Changed CIN condition to “Measured at 10 MHz”.  
Removed tR and tF input specs from AC specs table.  
Changed tODC from 48/52% to 45/55%, changed condition to “Rail-to-rail input  
swing, 50% input duty cycle measured at Vdd/2”.  
Changed phase jitter condition to “156.25 MHz sinewave, 12 kHz to 20 MHz  
offset; input swing = 2.2V, Vbias = VDD/2 “  
Removed tS and tH specs from AC specs table.  
*E  
*F  
3137726  
3182321  
CXQ  
CXQ  
01/13/2011 Removed “Preliminary” status heading.  
Removed resistors from IN0/IN1 in Logic Block Diagram.  
Added Figure 8 to describe TSOE and TSOD  
.
02/25/11  
Post to external web.  
Document Number: 001-56313 Rev. *F  
Page 12 of 13  
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CY2CP1504  
Sales, Solutions, and Legal Information  
Worldwide Sales and Design Support  
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office  
closest to you, visit us at Cypress Locations.  
Products  
PSoC Solutions  
Automotive  
cypress.com/go/automotive  
cypress.com/go/clocks  
cypress.com/go/interface  
cypress.com/go/powerpsoc  
cypress.com/go/plc  
psoc.cypress.com/solutions  
PSoC 1 | PSoC 3 | PSoC 5  
Clocks & Buffers  
Interface  
Lighting & Power Control  
Memory  
cypress.com/go/memory  
cypress.com/go/image  
cypress.com/go/psoc  
Optical & Image Sensing  
PSoC  
Touch Sensing  
USB Controllers  
Wireless/RF  
cypress.com/go/touch  
cypress.com/go/USB  
cypress.com/go/wireless  
© Cypress Semiconductor Corporation, 2009-2011. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of  
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for  
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as  
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems  
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.  
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),  
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,  
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress  
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without  
the express written permission of Cypress.  
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES  
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not  
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where  
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer  
assumes all risk of such use and in doing so indemnifies Cypress against all charges.  
Use may be limited by and subject to the applicable Cypress software license agreement.  
Document Number: 001-56313 Rev. *F  
Revised February 25, 2011  
Page 13 of 13  
All products and company names mentioned in this document may be the trademarks of their respective holders.  
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