CY7C1020CV26-15ZSXE [CYPRESS]

512Kb (32K x 16) Static RAM; 512KB ( 32K ×16 )静态RAM
CY7C1020CV26-15ZSXE
型号: CY7C1020CV26-15ZSXE
厂家: CYPRESS    CYPRESS
描述:

512Kb (32K x 16) Static RAM
512KB ( 32K ×16 )静态RAM

存储 内存集成电路 静态存储器 光电二极管
文件: 总8页 (文件大小:147K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
CY7C1020CV26  
512Kb (32K x 16) Static RAM  
Writing to the device is accomplished by taking Chip Enable  
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable  
(BLE) is LOW, then data from I/O pins (I/O1 through I/O8), is  
written into the location specified on the address pins (A0  
through A14). If Byte High Enable (BHE) is LOW, then data  
from I/O pins (I/O9 through I/O16) is written into the location  
specified on the address pins (A0 through A14).  
Features  
• Temperature Range  
— Automotive: –40°C to 125°C  
• High speed  
— tAA = 15 ns  
Reading from the device is accomplished by taking Chip  
Enable (CE) and Output Enable (OE) LOW while forcing the  
Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW,  
then data from the memory location specified by the address  
pins will appear on I/O1 to I/O8. If Byte High Enable (BHE) is  
LOW, then data from memory will appear on I/O9 to I/O16. See  
the truth table at the back of this data sheet for a complete  
description of read and write modes.  
• Optimized voltage range: 2.5V–2.7V  
• Automatic power-down when deselected  
• Independent control of upper and lower bits  
• CMOS for optimum speed/power  
• Package offered: 44-pin TSOP II  
Functional Description  
The input/output pins (I/O1 through I/O16) are placed in a  
high-impedance state when the device is deselected (CE  
HIGH), the outputs are disabled (OE HIGH), the BHE and BLE  
are disabled (BHE, BLE HIGH), or during a write operation (CE  
LOW, and WE LOW).  
The CY7C1020CV26 is a high-performance CMOS static  
RAM organized as 32,768 words by 16 bits. This device has  
an automatic power-down feature that significantly reduces  
power consumption when deselected.  
The CY7C1020CV26 is available in standard 44-pin TSOP  
Type II.  
Logic Block Diagram  
Pin Configuration  
TSOP II  
DATA IN DRIVERS  
Top View  
44  
1
NC  
A
5
43  
42  
41  
40  
39  
38  
A
A
2
3
4
5
6
3
6
A
A
2
7
A7  
A6  
A5  
A4  
A3  
A2  
OE  
A
1
BHE  
BLE  
I/O  
I/O  
I/O  
A
0
32K x 16  
CE  
I/O1–I/O8  
RAM Array  
I/O  
7
1
16  
37  
36  
35  
34  
33  
I/O  
I/O  
8
2
3
15  
14  
13  
I/O9–I/O16  
9
A1  
A0  
10  
11  
12  
13  
I/O  
V
SS  
I/O  
4
CC  
V
SS  
V
V
CC  
32  
I/O  
I/O  
I/O  
5
6
7
8
12  
11  
31  
30  
29  
28  
27  
I/O  
I/O  
I/O  
14  
15  
16  
I/O  
I/O  
10  
9
COLUMN DECODER  
WE 17  
NC  
18  
A
A
4
14  
13  
8
BHE  
19  
26  
25  
A
A
A
9
WE  
CE  
OE  
20  
21  
22  
A
11  
10  
A
A
12  
24  
23  
NC  
NC  
BLE  
Selection Guide  
CY7C1020CV26-15  
Unit  
ns  
Maximum Access Time  
15  
100  
5
Maximum Operating Current  
Maximum CMOS Standby Current  
mA  
mA  
Cypress Semiconductor Corporation  
Document #: 38-05406 Rev. *A  
3901 North First Street  
San Jose, CA 95134  
408-943-2600  
Revised April 18, 2005  
CY7C1020CV26  
DC Input Voltage[1] .................................. –0.5V to VCC+0.5V  
Current into Outputs (LOW)......................................... 20 mA  
Maximum Ratings  
(Above which the useful life may be impaired. For user guide-  
lines, not tested.)  
Static Discharge Voltage...........................................> 2001V  
(per MIL-STD-883, Method 3015)  
Storage Temperature .................................65°C to +150°C  
Latch-up Current.....................................................> 200 mA  
Ambient Temperature with  
Power Applied.............................................55°C to +125°C  
Supply Voltage on VCC to Relative GND[1] .... –0.5V to +4.6V  
Operating Range  
Ambient  
DC Voltage Applied to Outputs  
Range  
Temperature  
VCC  
in High-Z State[1] ......................................–0.5V to VCC+0.5V  
Automotive  
–40°C to +125°C  
2.5V to 2.7V  
Electrical Characteristics Over the Operating Range  
CY7C1020CV26  
Parameter  
VOH  
Description  
Test Conditions  
Min.  
Max.  
Unit  
Output HIGH Voltage  
VCC = Min.,  
IOH = –1.0 mA  
2.3  
V
VOL  
Output LOW Voltage  
VCC = Min.,  
IOL = 1.0 mA  
0.4  
V
VIH  
VIL  
IIX  
Input HIGH Voltage  
Input LOW Voltage[1]  
2.0  
–0.3  
–5  
VCC + 0.3  
0.8  
V
V
Input Load Current  
GND < VI < VCC  
+5  
µA  
µA  
mA  
mA  
IOZ  
Output Leakage Current  
Output Short Circuit Current  
VCC Operating Supply Current  
GND < VI < VCC, Output Disabled  
VCC = Max., VOUT = GND  
–5  
+5  
[2]  
IOS  
ICC  
–300  
100  
VCC = Max., IOUT = 0 mA,  
f = fMAX = 1/tRC  
ISB1  
ISB2  
Automatic CE Power-Down  
Current —TTL Inputs  
Max. VCC, CE > VIH  
VIN > VIH or VIN < VIL, f = fMAX  
40  
5
mA  
mA  
Automatic CE Power-down  
Current —CMOS Inputs  
Max. VCC  
CE > VCC – 0.3V, VIN > VCC – 0.3V, or  
IN < 0.3V, f = 0  
,
V
Capacitance[3]  
Parameter  
CIN  
Description  
Input Capacitance  
Output Capacitance  
Test Conditions  
TA = 25°C, f = 1 MHz,  
Max.  
Unit  
8
8
pF  
pF  
VCC = 2.6V  
COUT  
Notes:  
1. V (min.) = –2.0V for pulse durations of less than 20 ns.  
IL  
2. Not more than one output should be shorted at one time. Duration of the short circuit should not exceed 30 seconds.  
3. Tested initially and after any design or process changes that may affect these parameters.  
Document #: 38-05406 Rev. *A  
Page 2 of 8  
CY7C1020CV26  
AC Test Loads and Waveforms[4]  
ALL INPUT PULSES  
R 1830  
2.5V  
2.6V  
90%  
10%  
90%  
10%  
OUTPUT  
GND  
R2  
30 pF  
1976  
Fall Time:1 V/ns  
Rise Time: 1 V/ns  
(a)  
(b)  
AC Switching Characteristics Over the Operating Range  
CY7C1020CV26  
Min. Max.  
Parameter  
Description  
Unit  
READ CYCLE  
tRC  
Read Cycle Time  
15  
3
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tAA  
Address to Data Valid  
15  
tOHA  
Data Hold from Address Change  
CE LOW to Data Valid  
OE LOW to Data Valid  
OE LOW to Low Z[5]  
OE HIGH to High Z[5, 6]  
CE LOW to Low Z[5]  
CE HIGH to High Z[5, 6]  
CE LOW to Power-up  
CE HIGH to Power-down  
Byte Enable to Data Valid  
Byte Enable to Low Z  
Byte Disable to High Z  
tACE  
15  
7
tDOE  
tLZOE  
tHZOE  
tLZCE  
tHZCE  
0
3
0
7
7
[7]  
tPU  
[7]  
tPD  
15  
7
tDBE  
tLZBE  
0
tHZBE  
7
WRITE CYCLE[8]  
tWC  
tSCE  
tAW  
Write Cycle Time  
15  
10  
10  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
CE LOW to Write End  
Address Set-Up to Write End  
Address Hold from Write End  
Address Set-Up to Write Start  
WE Pulse Width  
tHA  
tSA  
0
tPWE  
tSD  
10  
8
Data Set-Up to Write End  
Data Hold from Write End  
WE HIGH to Low Z[5]  
tHD  
0
tLZWE  
tHZWE  
3
WE LOW to High Z[5, 6]  
4
tBW  
Byte Enable to End of Write  
10  
Notes:  
4. Test conditions assume signal transition time of 1V/ns or less, timing reference levels of 1.3V, input pulse levels of 0 to 2.5V and transmission line loads as in  
(a) of AC Test Loads.  
5. At any given temperature and voltage condition, t  
is less than t  
, t  
is less than t  
, and t  
is less than t  
for any given device.  
HZCE  
LZCE HZOE  
LZOE  
HZWE  
LZWE  
6. t  
, t  
, t  
, and t  
are specified with a load capacitance of 5 pF as in (b) of AC Test Loads. Transition is measured ±500 mV from steady-state voltage.  
HZOE HZBE HZCE  
HZWE  
7. This parameter is guaranteed by design and is not tested.  
8. The internal write time of the memory is defined by the overlap of CE LOW, WE LOW and BHE / BLE LOW. CE, WE and BHE / BLE must be LOW to initiate a  
write, and the transition of these signals can terminate the write. The input data set-up and hold timing should be referenced to the leading edge of the signal  
that terminates the write.  
Document #: 38-05406 Rev. *A  
Page 3 of 8  
CY7C1020CV26  
Switching Waveforms  
Read Cycle No. 1[9, 10]  
t
RC  
ADDRESS  
t
AA  
t
OHA  
DATA OUT  
PREVIOUS DATA VALID  
DATA VALID  
Read Cycle No. 2 (OE Controlled)[10, 11]  
ADDRESS  
CE  
t
RC  
t
ACE  
OE  
t
HZOE  
t
DOE  
BHE, BLE  
t
LZOE  
t
HZCE  
t
DBE  
t
LZBE  
t
HZBE  
HIGH  
IMPEDANCE  
HIGH IMPEDANCE  
DATA OUT  
VCC  
SUPPLY  
CURRENT  
DATA VALID  
t
LZCE  
t
PD  
I
CC
t
PU  
50%  
50%  
I
SB  
Notes:  
9. Device is continuously selected. OE, CE, BHE and/or BHE = V .  
IL  
10. WE is HIGH for read cycle.  
11. Address valid prior to or coincident with CE transition LOW.  
Document #: 38-05406 Rev. *A  
Page 4 of 8  
CY7C1020CV26  
Switching Waveforms  
Write Cycle No. 1 (CE Controlled)[12, 13]  
t
WC  
ADDRESS  
t
SA  
t
SCE  
CE  
t
AW  
t
HA  
t
PWE  
WE  
t
BW  
BHE, BLE  
t
t
SD  
HD  
DATA I/O  
Write Cycle No. 2 (BLE or BHE Controlled)  
t
WC  
ADDRESS  
t
SA  
t
BW  
BHE, BLE  
t
AW  
t
HA  
t
PWE  
WE  
CE  
t
SCE  
t
t
SD  
HD  
DATA I/O  
Notes:  
12. Data I/O is high impedance if OE or BHE and BLE = V  
.
IH  
13. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high-impedance state.  
Document #: 38-05406 Rev. *A  
Page 5 of 8  
CY7C1020CV26  
Switching Waveforms  
Write Cycle No. 3 (WE Controlled, OE LOW)  
t
WC  
ADDRESS  
CE  
t
SCE  
t
AW  
t
HA  
t
SA  
t
PWE  
WE  
t
BW  
BHE, BLE  
t
HZWE  
t
t
SD  
HD  
DATA I/O  
t
LZWE  
Truth Table  
CE  
H
OE WE  
BLE  
X
BHE  
X
I/O1–I/O8  
I/O9–I/O16  
High Z  
Mode  
Power  
X
L
X
H
High Z  
Power-down  
Standby (ISB  
Active (ICC  
Active (ICC  
Active (ICC  
Active (ICC  
Active (ICC  
Active (ICC  
Active (ICC  
Active (ICC  
)
L
L
L
Data Out  
Data Out  
High Z  
Data Out  
High Z  
Read – All bits  
)
L
H
L
Read – Lower bits only  
Read – Upper bits only  
Write – All bits  
)
H
L
Data Out  
Data In  
High Z  
)
L
X
L
L
Data In  
Data In  
High Z  
)
L
H
L
Write – Lower bits only  
Write – Upper bits only  
Selected, Outputs Disabled  
Selected, Outputs Disabled  
)
H
X
Data In  
High Z  
)
L
L
H
X
H
X
X
High Z  
)
H
H
High Z  
High Z  
)
Ordering Information  
Speed  
(ns)  
Package  
Name  
Operating  
Range  
Ordering Code  
Package Type  
15  
CY7C1020CV26-15ZSXE  
Z44  
44-Lead TSOP Type II (Pb-Free)  
Automotive  
Document #: 38-05406 Rev. *A  
Page 6 of 8  
CY7C1020CV26  
Package Diagrams  
44-Pin TSOP II Z44  
51-85087-*A  
All product and company names mentioned in this document are the trademarks of their respective holders.  
Document #: 38-05406 Rev. *A  
Page 7 of 8  
© Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use  
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be  
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its  
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress  
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.  
CY7C1020CV26  
Document History Page  
Document Title: CY7C1020CV26 512Kb (32K x 16) Static RAM  
Document Number: 38-05406  
Orig. of  
REV.  
ECN NO. Issue Date Change  
Description of Change  
**  
128060  
07/30/03  
EJH  
SYT  
Customized data sheet to meet special requirements for CG5988AF  
Automotive temperature range: –40°C / +125°C  
*A  
352999  
See ECN  
Removed ‘CG5988AF’ from the Datasheet  
Edited the features section for better structure on Page 1  
Edited the title to include the mention of ‘512Kb’  
Document #: 38-05406 Rev. *A  
Page 8 of 8  

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