CY7C1021BN-12VXCT [CYPRESS]
Standard SRAM, 64KX16, 12ns, CMOS, PDSO44, 0.400 INCH, LEAD FREE, SOJ-44;型号: | CY7C1021BN-12VXCT |
厂家: | CYPRESS |
描述: | Standard SRAM, 64KX16, 12ns, CMOS, PDSO44, 0.400 INCH, LEAD FREE, SOJ-44 静态存储器 光电二极管 |
文件: | 总10页 (文件大小:461K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
CY7C1021BN
CY7C10211BN
1-Mbit (64K x 16) Static RAM
Writing to the device is accomplished by taking Chip Enable
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable
(BLE) is LOW, then data from I/O pins (I/O1 through I/O8), is
written into the location specified on the address pins (A0
through A15). If Byte High Enable (BHE) is LOW, then data
from I/O pins (I/O9 through I/O16) is written into the location
specified on the address pins (A0 through A15).
Features
• Temperature Ranges
— Commercial: 0°C to 70°C
— Industrial: –40°C to 85°C
— Automotive-A: –40°C to 85°C
— Automotive-E: –40°C to 125°C
• High speed
Reading from the device is accomplished by taking Chip
Enable (CE) and Output Enable (OE) LOW while forcing the
Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW,
then data from the memory location specified by the address
pins will appear on I/O1 to I/O8. If Byte High Enable (BHE) is
LOW, then data from memory will appear on I/O9 to I/O16. See
the truth table at the back of this data sheet for a complete
description of read and write modes.
— tAA = 10 ns (Commercial)
— tAA = 15 ns (Automotive)
• CMOS for optimum speed/power
• Low active power
The input/output pins (I/O1 through I/O16) are placed in a
high-impedance state when the device is deselected (CE
HIGH), the outputs are disabled (OE HIGH), the BHE and BLE
are disabled (BHE, BLE HIGH), or during a write operation (CE
LOW, and WE LOW).
— 825 mW (max.)
• Automatic power-down when deselected
• Independent control of upper and lower bits
• Available in Pb free and non Pb free 44-pin TSOP II and
44-pin 400-mil-wide SOJ
The CY7C1021BN/CY7C10211BN is available in standard
44-pin TSOP Type II and 44-pin 400-mil-wide SOJ packages.
Customers should use part number CY7C10211BN when
ordering parts with 10 ns tAA, and CY7C1021BN when
Functional Description[1]
The CY7C1021BN/CY7C10211BN is a high-performance
CMOS static RAM organized as 65,536 words by 16 bits. This
device has an automatic power-down feature that significantly
reduces power consumption when deselected.
ordering 12 ns and 15 ns tAA
.
Logic Block Diagram
PinConfigurations
DATA IN
DRIVERS
SOJ / TSOP II
Top View
44
1
A
4
A
5
43
42
41
40
39
38
A
A
2
3
4
5
6
3
6
A
A
A7
A6
A5
A4
A3
A2
A1
A0
2
7
OE
A
1
BHE
BLE
I/O
I/O
I/O
A
0
64K x 16
CE
I/O1–I/O8
RAM Array
512 X 2048
I/O
7
1
16
37
36
35
34
33
I/O
I/O
8
2
3
15
14
13
I/O9–I/O16
9
10
11
12
13
I/O
V
SS
I/O
4
CC
V
SS
V
V
CC
32
I/O
I/O
I/O
5
6
7
8
12
11
31
30
29
28
I/O
I/O
I/O
14
15
16
I/O
I/O
10
9
COLUMN DECODER
WE 17
NC
18
27
26
25
A
A
8
15
BHE
19
A
A
14
9
WE
A
13
20
21
22
A
11
10
CE
A
A
12
24
23
OE
NC
NC
BLE
Note:
1. For best-practice recommendations, please refer to the Cypress application note “System Design Guidelines” on http://www.cypress.com
Cypress Semiconductor Corporation
Document #: 001-06494 Rev. *A
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised September 28, 2006
CY7C1021BN
CY7C10211BN
Selection Guide
7C10211B-10
7C1021B-12
7C1021B-15
Maximum Access Time (ns)
10
12
15
130
130
130
10
Maximum Operating Current (mA)
Com’l / Ind’l
Automotive-A
Automotive-E
150
140
Maximum CMOS Standby Current (mA) Com’l / Ind’l
Com’l / Ind’l (L version)
10
10
0.5
0.5
0.5
0.5
15
Automotive-A (L version)
Automotive-E
Pin Definitions
Pin Name SOJ, TSOP–Pin Number
I/O Type
Description
Address Inputs used to select one of the address locations.
A0–A15
1–5,18–21, 24–27, 42–44
Input
I/O1–I/O16
7–10, 13–16, 29–32,
35–38
Input/Output Bidirectional Data I/O lines. Used as input or output lines depending
on operation.
NC
22, 23, 28
17
No Connect No Connects. Not connected to the die.
WE
Input/Control Write Enable Input, active LOW. When selected LOW, a Write is
conducted. When deselected HIGH, a Read is conducted.
CE
BHE, BLE
OE
6
Input/Control Chip Enable Input, active LOW. When LOW, selects the chip. When
HIGH, deselects the chip.
40, 39
41
Input/Control Byte Write Select Inputs, active LOW. BHE controls I/O16–I/O9,
BLE controls I/O8–I/O1, .
Input/Control Output Enable, active LOW. Controls the direction of the I/O pins.
When LOW, the I/O pins are allowed to behave as outputs. When
deasserted HIGH, I/O pins are tri-stated, and act as input data pins.
VSS
VCC
12, 34
11, 33
Ground
Ground for the device. Should be connected to ground of the
system.
Power Supply Power Supply inputs to the device.
Document #: 001-06494 Rev. *A
Page 2 of 10
CY7C1021BN
CY7C10211BN
Static Discharge Voltage............................................>2001V
(per MIL-STD-883, Method 3015)
Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Latch-Up Current.....................................................>200 mA
Operating Range
Storage Temperature .................................–65°C to +150°C
Ambient Temperature with
Power Applied.............................................–55°C to +125°C
Supply Voltage on VCC Relative to GND[2] .... –0.5V to +7.0V
Ambient
Range
Commercial
Industrial
Temperature (TA)[3]
0°C to +70°C
VCC
5V ± 10%
–40°C to +85°C
–40°C to +85°C
–40°C to +125°C
DC Voltage Applied to Outputs
in High Z State[2] ......................................–0.5V to VCC+0.5V
Automotive-A
Automotive-E
DC Input Voltage[2]...................................–0.5V to VCC+0.5V
Current into Outputs (LOW).........................................20 mA
Electrical Characteristics Over the Operating Range
-10
Min.
-12
-15
Test
Conditions
Parameter Description
Max.
Min.
Max.
Min.
Max. Unit
VOH
VOL
VIH
VIL
Output HIGH
Voltage
VCC = Min., IOH = –4.0 mA
2.4
2.4
2.4
V
Output LOW
Voltage
VCC = Min., IOL = 8.0 mA
0.4
6.0
0.8
+1
0.4
6.0
0.8
+1
0.4
6.0
0.8
V
V
V
Input HIGH
Voltage
2.2
−0.5
−1
2.2
–0.5
–1
2.2
Input LOW
Voltage[2]
–0.5
IIX
Input Leakage GND < VI < VCC Com’l / Ind’l
Current
–1
–1
–4
–1
–1
–4
+1
+1
µA
µA
µA
µA
µA
µA
mA
Automotive-A
Automotive-E
+4
IOZ
Output Leakage GND < VI < VCC
Current Output Disabled
,
Com’l / Ind’l
Automotive-A
Automotive-E
Com’l / Ind’l
Automotive-A
Automotive-E
Com’l / Ind’l
Automotive-A
−1
+1
150
40
–1
+1
140
40
+1
+1
+4
ICC
VCC Operating VCC = Max.,
Supply Current IOUT = 0 mA,
f = fMAX = 1/tRC
130
130
130
40
ISB1
Automatic CE Max. VCC
Power-Down CE > VIH
Current—TTL VIN > VIH or
Inputs VIN < VIL, f = fMAX Automotive-E
,
mA
mA
40
50
ISB2
Automatic CE Max. VCC
,
Com’l / Ind’l
10
10
10
Power-Down
Current—
CMOS Inputs
CE > VCC – 0.3V,
Com’l / Ind’l (L)
0.5
0.5
0.5
0.5
15
V
IN > VCC – 0.3V,
or VIN < 0.3V, f = 0 Automotive-A (L)
Automotive-E
Capacitance[4]
Parameter
Description
Input Capacitance
Output Capacitance
Test Conditions
Max.
Unit
CIN
TA = 25°C, f = 1 MHz,
VCC = 5.0V
8
8
pF
pF
COUT
Notes:
2. V (min.) = –2.0V and V (max) = V + 0.5V for pulse durations of less than 20 ns.
IL
IH
CC
3. T is the “Instant On” case temperature.
A
4. Tested initially and after any design or process changes that may affect these parameters.
Document #: 001-06494 Rev. *A
Page 3 of 10
CY7C1021BN
CY7C10211BN
Thermal Resistance[4]
Parameter
Description
Test Conditions
44-pin SOJ
44-pin TSOP-II
Unit
ΘJA
Thermal Resistance Test conditions follow standard test methods
(Junction to Ambient) and procedures for measuring thermal
64.32
76.89
°C/W
impedance, per EIA / JESD51.
ΘJC
Thermal Resistance
(Junction to Case)
31.03
14.28
°C/W
AC Test Loads and Waveforms
R 481Ω
R 481Ω
ALL INPUT PULSES
5V
5V
OUTPUT
3.0V
GND
90%
10%
90%
10%
OUTPUT
R2
255Ω
R2
255Ω
30 pF
5 pF
INCLUDING
JIG AND
SCOPE
INCLUDING
JIG AND
SCOPE
Rise Time: 1 V/ns
Fall Time: 1 V/ns
(b)
(a)
167
30 pF
1.73V
OUTPUT
Equivalent to:
THÉVENIN
EQUIVALENT
Switching Characteristics[5] Over the Operating Range
7C10211B-10
7C1021B-12
7C1021B-15
Parameter
Read Cycle
tRC
Description
Min.
10
Max.
Min.
12
3
Max.
Min.
Max.
Unit
Read Cycle Time
15
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tAA
Address to Data Valid
Data Hold from Address Change
CE LOW to Data Valid
OE LOW to Data Valid
OE LOW to Low Z[6]
OE HIGH to High Z[6, 7]
CE LOW to Low Z[6]
CE HIGH to High Z[6, 7]
CE LOW to Power-Up
CE HIGH to Power-Down
Byte Enable to Data Valid
Byte Enable to Low Z
Byte Disable to High Z
10
12
15
tOHA
3
3
tACE
10
5
12
6
15
7
tDOE
tLZOE
tHZOE
tLZCE
tHZCE
tPU
0
3
0
0
3
0
0
3
0
5
5
6
6
7
7
tPD
10
5
12
6
15
7
tDBE
tLZBE
0
0
0
tHZBE
5
6
7
Notes:
5. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified
I
/I and 30-pF load capacitance.
OL OH
6. At any given temperature and voltage condition, t
is less than t
, t
is less than t
, and t
is less than t
for any given device.
HZCE
LZCE HZOE
LZOE
HZWE
LZWE
7. t
, t
, t
, and t
are specified with a load capacitance of 5 pF as in part (b) of AC Test Loads. Transition is measured ±500 mV from steady-state
HZOE HZBE HZCE
HZWE
voltage.
Document #: 001-06494 Rev. *A
Page 4 of 10
CY7C1021BN
CY7C10211BN
Switching Characteristics[5] Over the Operating Range (continued)
7C10211B-10
7C1021B-12
7C1021B-15
Parameter
Description
Min.
Max.
Min.
Max.
Min.
Max.
Unit
Write Cycle[8]
tWC
Write Cycle Time
10
8
12
9
15
10
10
0
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tSCE
CE LOW to Write End
tAW
Address Set-Up to Write End
Address Hold from Write End
Address Set-Up to Write Start
Data Set-Up to Write End
Data Hold from Write End
WE HIGH to Low Z[6]
7
8
tHA
0
0
tSA
0
0
0
tSD
5
6
8
tHD
0
0
0
tLZWE
tHZWE
tBW
3
3
3
WE LOW to High Z[6, 7]
5
6
7
Byte Enable to End of Write
7
8
9
Switching Waveforms
Read Cycle No. 1[9, 10]
t
RC
ADDRESS
t
AA
t
OHA
DATA OUT
PREVIOUS DATA VALID
DATA VALID
Read Cycle No. 2 (OE Controlled)[10, 11]
ADDRESS
CE
t
RC
t
ACE
OE
t
HZOE
t
DOE
BHE, BLE
t
LZOE
t
HZCE
t
DBE
t
LZBE
t
HZBE
HIGH
IMPEDANCE
HIGH IMPEDANCE
DATA OUT
VCC
SUPPLY
CURRENT
DATA VALID
t
LZCE
t
PD
I
CC
t
PU
50%
50%
I
SB
Notes:
8. The internal write time of the memory is defined by the overlap of CE LOW, WE LOW and BHE / BLE LOW. CE, WE and BHE / BLE must be LOW to initiate a
write, and the transition of these signals can terminate the write. The input data set-up and hold timing should be referenced to the leading edge of the signal that
terminates the write.
9. Device is continuously selected. OE, CE, BHE and/or BHE = V .
IL
10. WE is HIGH for read cycle.
Document #: 001-06494 Rev. *A
Page 5 of 10
CY7C1021BN
CY7C10211BN
Switching Waveforms (continued)
Write Cycle No. 1 (CE Controlled)[12, 13]
t
WC
ADDRESS
t
SA
t
SCE
CE
t
AW
t
HA
t
PWE
WE
t
BW
BHE, BLE
t
t
SD
HD
DATA I/O
Write Cycle No. 2 (BLE or BHE Controlled)
t
WC
ADDRESS
t
SA
t
BW
BHE, BLE
t
AW
t
HA
t
PWE
WE
CE
t
SCE
t
t
SD
HD
DATA I/O
Notes:
11. Address valid prior to or coincident with CE transition LOW.
12. Data I/O is high impedance if OE or BHE and/or BLE= V
.
IH
13. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high-impedance state.
Document #: 001-06494 Rev. *A
Page 6 of 10
CY7C1021BN
CY7C10211BN
Switching Waveforms (continued)
Write Cycle No. 3 (WE Controlled, OE LOW)
t
WC
ADDRESS
CE
t
SCE
t
AW
t
HA
t
SA
t
PWE
WE
t
BW
BHE, BLE
t
HZWE
t
t
SD
HD
DATA I/O
t
LZWE
Truth Table
CE OE WE BLE BHE
I/O1–I/O8
High Z
I/O9–I/O16
Mode
Power
H
L
X
L
X
H
X
L
X
L
High Z
Power-Down
Read - All bits
Standby (ISB)
Data Out
Data Out
High Z
Data Out
High Z
Data Out
Data In
High Z
Data In
High Z
High Z
Active (ICC
Active (ICC
Active (ICC
Active (ICC
Active (ICC
Active (ICC
Active (ICC
Active (ICC
)
)
)
)
)
)
)
)
L
H
L
Read - Lower bits only
Read - Upper bits only
Write - All bits
H
L
L
X
L
L
Data In
Data In
High Z
L
H
L
Write - Lower bits only
Write - Upper bits only
H
X
H
L
L
H
X
H
X
X
H
High Z
Selected, Outputs Disabled
Selected, Outputs Disabled
High Z
Document #: 001-06494 Rev. *A
Page 7 of 10
CY7C1021BN
CY7C10211BN
Ordering Information
Speed
Package
Diagram
Operating
Range
(ns)
Ordering Code
Package Type
44-pin TSOP Type II
10
CY7C10211BN-10ZXC
CY7C1021BN-12VC
CY7C1021BN-12VXC
CY7C1021BN-12ZC
CY7C1021BN-12ZXC
CY7C1021BN-12VI
51-85087
51-85082
Commercial
Commercial
12
44-pin (400-Mil) Molded SOJ
44-pin (400-Mil) Molded SOJ (Pb-Free)
44-pin TSOP Type II
51-85087
51-85082
51-85082
44-pin TSOP Type II (Pb-Free)
44-pin (400-Mil) Molded SOJ
44-pin (400-Mil) Molded SOJ (Pb-Free)
44-pin (400-Mil) Molded SOJ
44-pin (400-Mil) Molded SOJ (Pb-Free)
44-pin (400-Mil) Molded SOJ (Pb-Free)
44-pin TSOP Type II
Industrial
CY7C1021BN-12VXI
CY7C1021BN-15VC
CY7C1021BN-15VXC
CY7C1021BNL-15VXC
CY7C1021BN-15ZC
CY7C1021BN-15ZXC
CY7C1021BNL-15ZC
CY7C1021BNL-15ZXC
CY7C1021BN-15VI
15
Commercial
51-85087
44-pin TSOP Type II (Pb-Free)
44-pin TSOP Type II
44-pin TSOP Type II (Pb-Free)
44-pin (400-Mil) Molded SOJ
44-pin (400-Mil) Molded SOJ (Pb-Free)
44-pin TSOP Type II
51-85082
51-85087
Industrial
CY7C1021BN-15VXI
CY7C1021BN-15ZI
CY7C1021BNL-15ZI
CY7C1021BN-15ZXI
CY7C1021BNL-15ZXI
CY7C1021BNL-15ZSXA
CY7C1021BN-15VXE
CY7C1021BN-15ZSXE
44-pin TSOP Type II
44-pin TSOP Type II (Pb-Free)
44-pin TSOP Type II (Pb-Free)
44-pin TSOP Type II (Pb-Free)
44-pin (400-Mil) Molded SOJ (Pb-Free)
44-pin TSOP Type II (Pb-Free)
51-85087
51-85082
51-85087
Automotive-A
Automotive-E
Package Diagrams
44-pin (400-Mil) Molded SOJ (51-85082)
44
23
DIMENSIONS IN INCHES MIN.
MAX.
0.395
0.405
0.435
0.445
22
1
SEATING PLANE
1.120
1.130
0.095
0.115
0.128
0.148
0.082
MIN.
0.007
0.013
0.004
0.365
0.375
0.023
0.033
0.050
TYP.
0.045
MAX.
0°-10°
0.025
MIN.
0.013
0.023
51-85082-*B
Document #: 001-06494 Rev. *A
Page 8 of 10
CY7C1021BN
CY7C10211BN
Package Diagrams (continued)
44-Pin TSOP II (51-85087)
51-85087-*A
All products and company names mentioned in this document may be the trademarks of their respective holders.
Document #: 001-06494 Rev. *A
Page 9 of 10
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
CY7C1021BN
CY7C10211BN
Document History Page
Document Title: CY7C1021BN/CY7C10211BN (64K x 16) Static RAM
Document Number: 001-06494
Orig. of
REV.
**
ECN NO. Issue Date Change
Description of Change
423877
505726
See ECN
See ECN
NXR
NXR
New Data Sheet
*A
Removed IOS parameter from DC Electrical Characteristics table.
Added Automotive products
Updated ordering Information table
Document #: 001-06494 Rev. *A
Page 10 of 10
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