CY7C1177V18-300BZI [CYPRESS]
18-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.5 Cycle Read Latency); 18兆位的DDR -II + SRAM 2字突发架构（ 2.5周期读延迟）
| 型号： | CY7C1177V18-300BZI |
| 厂家： | 
CYPRESS |
| 描述： | 18-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.5 Cycle Read Latency) |
| 文件： | 总27页 (文件大小：1176K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CY7C1166V18
CY7C1177V18
CY7C1168V18
CY7C1170V18
18-Mbit DDR-II+ SRAM 2-Word Burst
Architecture (2.5 Cycle Read Latency)
Features
Functional Description
■ 18 Mbit density (2M x 8, 2M x 9, 1M x 18, 512K x 36)
■ 300 MHz to 400 MHz clock for high bandwidth
■ 2-Word burst for reducing address bus frequency
The CY7C1166V18, CY7C1177V18, CY7C1168V18, and
CY7C1170V18 are 1.8V Synchronous Pipelined SRAMs
equipped with DDR-II+ architecture. The DDR-II+ consists of an
SRAM core with an advanced synchronous peripheral circuitry.
Addresses for read and write are latched on alternate rising
edges of the input (K) clock. Write data is registered on the rising
edges of both K and K. Read data is driven on the rising edges
of K and K. Each address location is associated with two 8-bit
words (CY7C1166V18), or 9-bit words (CY7C1177V18), or 18-bit
words (CY7C1168V18), or 36-bit words (CY7C1170V18) that
burst sequentially into or out of the device.
■ Double Data Rate (DDR) interfaces
(data transferred at 800 MHz) @ 400 MHz
■ Read latency of 2.5 clock cycles
■ Two input clocks (K and K) for precise DDR timing
❐ SRAM uses rising edges only
Asynchronous inputs include output impedance matching input
■ Echo clocks (CQ and CQ) simplify data capture in high-speed
systems
(ZQ). Synchronous data outputs (Q, sharing the same physical
pins as the data inputs D) are tightly matched to the two output
echo clocks CQ/CQ, eliminating the need for separately
capturing data from each individual DDR SRAM in the system
design.
■ Data valid pin (QVLD) to indicate valid data on the output
■ Synchronous internally self-timed writes
[1]
■ Core VDD = 1.8V ± 0.1V; IO VDDQ = 1.4V to VDD
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the K or K input clocks. Writes are
conducted with on-chip synchronous self-timed write circuitry.
■ HSTL inputs and Variable drive HSTL output buffers
■ Available in 165-Ball FBGA package (13 x 15 x 1.4 mm)
■ Offered in both Pb-free and non Pb-free packages
■ JTAG 1149.1-compatible test access port
■ Delay Lock Loop (DLL) for accurate data placement
Configurations
With Read Cycle Latency of 2.5 cycles:
CY7C1166V18 – 2M x 8
CY7C1177V18 – 2M x 9
CY7C1168V18 – 1M x 18
CY7C1170V18 – 512K x 36
Selection Guide
400 MHz
375 MHz
375
333 MHz
333
300 MHz
300
Unit
MHz
mA
Maximum Operating Frequency
Maximum Operating Current
400
1080
1020
920
850
Note
1. The QDR consortium specification for V
is 1.5V + 0.1V. The Cypress QDR devices exceed the QDR consortium specification and are capable of supporting V
DDQ
DDQ
= 1.4V to V
.
DD
Cypress Semiconductor Corporation
Document Number: 001-06620 Rev. *C
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised June 21, 2007
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CY7C1166V18
CY7C1177V18
CY7C1168V18
CY7C1170V18
Logic Block Diagram (CY7C1166V18)
Write
Reg
Write
Reg
20
A
(19:0)
Address
Register
LD
8
K
K
Output
Logic
Control
CLK
Gen.
R/W
DOFF
Read Data Reg.
16
CQ
CQ
V
8
REF
8
8
Reg.
Reg.
Reg.
Control
Logic
R/W
8
DQ
[7:0]
8
NWS
[1:0]
QVLD
Logic Block Diagram (CY7C1177V18)
Write
Reg
Write
Reg
20
A
(19:0)
Address
Register
LD
9
K
K
Output
Logic
Control
CLK
Gen.
R/W
DOFF
Read Data Reg.
18
CQ
CQ
V
9
REF
9
9
Reg.
Reg.
Reg.
Control
Logic
R/W
9
DQ
[8:0]
9
BWS
[0]
QVLD
Document Number: 001-06620 Rev. *C
Page 2 of 27
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CY7C1166V18
CY7C1177V18
CY7C1168V18
CY7C1170V18
Logic Block Diagram (CY7C1168V18)
Write
Reg
Write
Reg
19
A
(18:0)
Address
Register
LD
18
K
K
Output
Logic
Control
CLK
Gen.
R/W
DOFF
Read Data Reg.
36
CQ
CQ
V
18
REF
18
18
Reg.
Reg.
Reg.
Control
Logic
R/W
DQ
[17:0]
18
BWS
18
[1:0]
QVLD
Logic Block Diagram (CY7C1170V18)
Write
Reg
Write
Reg
18
A
(17:0)
Address
Register
LD
36
K
K
Output
Logic
Control
CLK
Gen.
R/W
DOFF
Read Data Reg.
72
36
CQ
CQ
V
REF
36
36
Reg.
Reg.
Reg.
Control
Logic
R/W
DQ
[35:0]
36
BWS
36
[3:0]
QVLD
Document Number: 001-06620 Rev. *C
Page 3 of 27
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CY7C1166V18
CY7C1177V18
CY7C1168V18
CY7C1170V18
Pin Configurations
165-Ball FBGA (13 x 15 x 1.4 mm) Pinout
CY7C1166V18 (2M x 8)
1
2
3
A
4
5
6
7
8
9
A
10
NC/36M
11
CQ
DQ3
NC
NC/72M
NC/144M
A
B
C
D
CQ
NC
R/W
A
NWS1
K
K
LD
A
NC
NC
NC
NC
NC
NC
NC/288M
NC
NC
NC
NC
NC
NC
NWS0
A
NC
NC
NC
NC
NC
VSS
VSS
A
A
VSS
VSS
VSS
VSS
VSS
NC
NC
NC
DQ4
NC
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VSS
VDD
VDD
VDD
VDD
VDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
NC
NC
NC
NC
DQ2
E
F
VDD
VDD
VDD
VDD
VDD
VSS
NC
NC
ZQ
NC
DQ5
VDDQ
NC
NC
NC
G
H
J
VREF
NC
VDDQ
NC
VREF
DQ1
NC
DOFF
NC
NC
NC
DQ0
NC
NC
NC
NC
NC
NC
NC
NC
K
L
DQ6
NC
NC
NC
NC
NC
NC
NC
NC
VSS
VSS
VSS
A
VSS
A
VSS
A
VSS
VSS
NC
NC
NC
NC
NC
NC
NC
NC
NC
M
N
P
DQ7
A
QVLD
A
A
A
A
A
A
A
TDO
TCK
A
A
TMS
TDI
R
NC
CY7C1177V18 (2M x 9)
1
2
3
A
4
5
NC
6
K
7
NC/144M
BWS0
A
8
9
A
10
NC/36M
11
CQ
DQ3
NC
NC/72M
A
B
C
D
R/W
A
CQ
NC
NC
NC
NC
NC
NC
LD
A
NC
NC
NC
NC
NC
NC
NC/288M
K
NC
NC
NC
NC
NC
NC
VSS
VSS
A
A
VSS
VSS
VSS
VSS
VSS
NC
NC
NC
DQ4
NC
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VSS
VDD
VDD
VDD
VDD
VDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
NC
NC
NC
NC
DQ2
E
F
VDD
VDD
VDD
VDD
VDD
VSS
NC
NC
ZQ
NC
DQ5
VDDQ
NC
NC
NC
G
H
J
VREF
NC
VDDQ
NC
VREF
DQ1
NC
DOFF
NC
NC
NC
DQ0
NC
NC
NC
NC
NC
K
L
DQ6
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
VSS
VSS
VSS
A
VSS
A
VSS
A
VSS
VSS
NC
NC
NC
NC
NC
NC
NC
NC
M
N
P
DQ7
A
QVLD
A
DQ8
A
A
A
A
A
A
TDO
TCK
A
A
TMS
TDI
R
NC
Document Number: 001-06620 Rev. *C
Page 4 of 27
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CY7C1166V18
CY7C1177V18
CY7C1168V18
CY7C1170V18
Pin Configurations (continued)
165-Ball FBGA (13 x 15 x 1.4 mm) Pinout
CY7C1168V18 (1M x 18)
1
2
3
A
4
5
6
K
7
8
9
A
10
NC/36M
11
CQ
DQ8
NC
NC/72M
NC/144M
A
B
C
D
CQ
NC
R/W
A
BWS1
NC/288M
A
LD
A
DQ9
NC
NC
NC
K
NC
NC
NC
NC
DQ7
NC
BWS0
A
NC
NC
NC
NC
NC
VSS
VSS
NC
VSS
VSS
VSS
NC
DQ10
VSS
VSS
NC
NC
DQ12
NC
DQ11
NC
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VSS
VDD
VDD
VDD
VDD
VDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
NC
NC
NC
NC
DQ6
E
F
VDD
VDD
VDD
VDD
VDD
VSS
DQ5
NC
DQ13
VDDQ
NC
NC
NC
G
H
J
VREF
NC
VDDQ
NC
VREF
DQ4
NC
ZQ
DOFF
NC
NC
NC
NC
NC
DQ14
NC
NC
DQ3
DQ2
K
L
DQ15
NC
NC
NC
NC
NC
NC
NC
NC
NC
VSS
VSS
VSS
A
VSS
A
VSS
A
VSS
VSS
NC
NC
NC
DQ1
NC
NC
NC
M
N
P
DQ16
DQ17
A
QVLD
A
NC
DQ0
A
A
A
A
A
NC
A
TDO
TCK
A
A
TMS
TDI
R
CY7C1170V18 (512K x 36)
1
2
3
4
5
6
K
7
8
9
A
10
NC/72M
11
CQ
NC/144M NC/36M
A
B
C
D
R/W
A
BWS2
BWS3
A
LD
A
CQ
NC
BWS1
BWS0
A
DQ27
NC
DQ18
DQ28
DQ19
K
NC
NC
NC
NC
DQ17
NC
DQ8
DQ7
DQ16
NC
NC
NC
NC
NC
VSS
VSS
NC
VSS
VSS
VSS
DQ29
VSS
VSS
NC
DQ30
DQ31
VREF
NC
DQ20
DQ21
DQ22
VDDQ
DQ32
DQ23
DQ24
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VSS
VDD
VDD
VDD
VDD
VDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
NC
NC
DQ15
NC
DQ6
E
F
VDD
VDD
VDD
VDD
VDD
VSS
DQ5
DQ14
ZQ
NC
NC
G
H
J
VDDQ
NC
VREF
DQ13
DQ12
NC
DOFF
NC
DQ4
DQ3
DQ2
NC
NC
NC
NC
K
L
DQ33
NC
NC
NC
NC
NC
DQ35
NC
DQ34
DQ25
DQ26
VSS
VSS
VSS
A
VSS
A
VSS
A
VSS
VSS
NC
NC
NC
DQ11
NC
DQ1
DQ10
DQ0
M
N
P
A
QVLD
A
DQ9
A
A
A
A
A
A
TDO
TCK
A
NC
A
TMS
TDI
R
Document Number: 001-06620 Rev. *C
Page 5 of 27
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CY7C1166V18
CY7C1177V18
CY7C1168V18
CY7C1170V18
Pin Definitions
Pin Name
IO
Pin Description
DQ[x:0]
Input Output- Data Input Output Signals. Inputs are sampled on the rising edge of K and K clocks during valid
Synchronous write operations. These pins drive out the requested data when a read operation is active. Valid data
is driven out on the rising edge of both the K and K clocks during read operations. When read access
is deselected, Q[x:0] are automatically tri-stated.
CY7C1166V18 − DQ[7:0]
CY7C1177V18 − DQ[8:0]
CY7C1168V18 − DQ[17:0]
CY7C1170V18 − DQ[35:0]
LD
Input-
Synchronous Load. This input is brought LOW when a bus cycle sequence is to be defined. This
Synchronous definition includes address and read/write direction. All transactions operate on a burst of two data.
LD must meet the setup and hold times around edge of K. LD must meet the setup and hold times
around edge of K.
,
Input-
Synchronous and K clocks during write operations. It is used to select the nibble that is written into the device
NWS0 controls D[3:0] and NWS1 controls D[7:4]
Nibble Write Select 0, 1 − Active LOW.(CY7C1166V18 Only) Sampled on the rising edge of the K
NWS0, NWS1
.
All the Nibble Write Selects are sampled on the same edge as the data. Deselecting a Nibble Write
Select causes the corresponding nibble of data to be ignored and not written into the device.
BWS0 BWS
Input-
Byte Write Select 0, 1, 2, and 3 − Active LOW. Sampled on the rising edge of the K and K clocks
,
,
1
Synchronous during Write operations. It is used to select the byte that is written into the device during the current
BWS2, BWS3
portion of the write operations. Bytes not written remain unaltered.
CY7C1177V18 − BWS0 controls D[8:0]
CY7C1168V18 − BWS0 controls D[8:0], and BWS1 controls D[17:9].
CY7C1170V18 − BWS0 controls D[8:0], BWS1 controls D[17:9], BWS2 controls D[26:18], and BWS3
controls D[35:27]
.
All the Byte Write Selects are sampled on the same edge as the data. Deselecting a Byte Write Select
causes the corresponding byte of data to be ignored and not written into the device.
A
Input-
Address Inputs. Sampled on the rising edge of the K clock during active read and write operations.
Synchronous These address inputs are multiplexed for both read and write operations. Internally, the device is
organized as 2M x 8 (two arrays each of1M x 8) for CY7C1166V18, 2M x 9 (two arrays each of 1M
x 9) for CY7C1177V18, 1M x 18 (two arrays each of 512K x 18) for CY7C1168V18, and 512K x 36
(two arrays each of 256K x 18) for CY7C1170V18. All the address inputs are ignored when the
appropriate port is deselected.
R/W
Input-
Synchronous
Synchronous Read/Write Input. When LD is LOW, this input designates the access type (read
when R/W is HIGH, write when R/W is LOW) for loaded address. R/W must meet the setup and hold
times around edge of K.
QVLD
K
Valid Output Valid Output Indicator. The Q Valid indicates valid output data. QVLD is edge aligned with CQ and
Indicator
CQ.
Input-
Clock
Positive Input Clock Input. The rising edge of K is used to capture synchronous inputs to the device
and to drive out data through Q[x:0] when in single clock mode. All accesses are initiated on the rising
edge of K.
K
Input-
Clock
Negative Input Clock Input. K is used to capture synchronous inputs being presented to the device
and to drive out data through Q[x:0] when in single clock mode.
CQ
Clock Output Synchronous Echo Clock Outputs. This is a free running clock and is synchronized to the input
clock (K) of the DDR-II+. The timings for the echo clocks are shown in the “Switching Characteristics”
on page 22.
CQ
Synchronous Echo Clock Outputs. This is a free running clock and is synchronized to the input
clock (K) of the DDR-II+. The timings for the echo clocks are shown in the “Switching Characteristics”
on page 22.
Clock Output
Document Number: 001-06620 Rev. *C
Page 6 of 27
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CY7C1166V18
CY7C1177V18
CY7C1168V18
CY7C1170V18
Pin Definitions (continued)
Pin Name
ZQ
IO
Pin Description
Input
Output Impedance Matching Input. This input is used to tune the device outputs to the system data
bus impedance. CQ, CQ, and Q[x:0] output impedance are set to 0.2 x RQ, where RQ is a resistor
connected between ZQ and ground. Alternatively, this pin can be connected directly to VDDQ, which
enables the minimum impedance mode. This pin cannot be connected directly to GND or left uncon-
nected.
DOFF
Input
DLL Turn Off − Active LOW. Connecting this pin to ground turns off the DLL inside the device. The
timings in the DLL turned off operation is different from those listed in this data sheet. For normal
operation, this pin can be connected to a pull up through a 10KΩ or less pull up resistor. The device
behaves in DDR-I mode when the DLL is turned off. In this mode, the device can be operated at a
frequency of up to 167 MHz with DDR-I timing.
TDO
Output
Input
Input
Input
N/A
TDO for JTAG.
TCK
TCK pin for JTAG.
TDI
TDI pin for JTAG.
TMS
TMS pin for JTAG.
NC
Not connected to the die. Tie to any voltage level.
Not connected to the die. Tie to any voltage level.
Not connected to the die. Tie to any voltage level.
Not connected to the die. Tie to any voltage level.
Not connected to the die. Tie to any voltage level.
Reference Voltage Input. Static input used to set the reference level for HSTL inputs, outputs, and
NC/36M
NC/72M
NC/144M
NC/288M
VREF
N/A
N/A
N/A
N/A
Input-
Reference AC measurement points.
VDD
VSS
Power Supply Power supply inputs to the core of the device.
Ground
Ground for the device.
VDDQ
Power Supply Power supply inputs for the outputs of the device.
Document Number: 001-06620 Rev. *C
Page 7 of 27
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CY7C1166V18
CY7C1177V18
CY7C1168V18
CY7C1170V18
Byte Write Operations
Functional Overview
Byte Write operations are supported by the CY7C1168V18. A
Write operation is initiated as described in the Write Operations
section. The bytes that are written are determined by BWS0 and
BWS1 which are sampled with each set of 18-bit data word.
Asserting the appropriate Byte Write Select input during the data
portion of a write enables the data being presented to be latched
and written into the device. Deasserting the Byte Write Select
input during the data portion of a write enables the data stored in
the device for that byte to remain unaltered. This feature can be
used to simplify read/modify/write operations to a Byte Write
operation.
The CY7C1166V18, CY7C1177V18, CY7C1168V18, and
CY7C1170V18 are synchronous pipelined Burst SRAMs
equipped with a DDR interface.
Accesses are initiated on the rising edge of the positive input
clock (K). All synchronous input and output timing are referenced
to the rising edge of the Input clocks (K/K).
All synchronous data inputs (D[x:0]) pass through input registers
controlled by the rising edge of the input clocks (K and K). All
synchronous data outputs (Q[x:0]) pass through output registers
controlled by the rising edge of the input clocks (K and K) also.
All synchronous control (R/W, LD, BWS[0:X]) inputs pass through
input registers controlled by the rising edge of the input clock
(K/K).
Double Data Rate Operation
The CY7C1168V18 enables high-performance operation
through high clock frequencies (achieved through pipelining) and
double data rate mode of operation. The CY7C1168V18 requires
two No Operation (NOP) cycle when transitioning from a read to
a write cycle. At higher frequencies, some applications may
require a third NOP cycle to avoid contention.
CY7C1168V18 is described in the following sections. The same
basic descriptions apply to CY7C1166V18, CY7C1177V18, and
CY7C1170V18.
Read Operations
If a read occurs after a write cycle, then the address and data for
the write are stored in registers. The write information must be
stored because the SRAM cannot perform the last word write to
the array without conflicting with the read. The data stays in this
register until the next write cycle occurs. On the first write cycle
after the read(s), the stored data from the earlier write is written
into the SRAM array. This is called a Posted Write.
The CY7C1168V18 is organized internally as a single array of
1M x 18. Accesses are completed in a burst of two sequential
18-bit data words. Read operations are initiated by asserting
R/W HIGH and LD LOW at the rising edge of the positive input
clock (K). The address presented to address inputs is stored in
the read address register. Following the next two K clock rise, the
corresponding 18-bit word of data from this address location is
driven onto the Q[17:0] using K as the output timing reference. On
the subsequent rising edge of K the next 18-bit data word from
the address location generated by the burst counter is driven
onto the Q[17:0]. The requested data is valid 0.45 ns from the
rising edge of the input clock (K/K). In order to maintain the
internal logic, each read access must be allowed to complete.
Read accesses can be initiated on every rising edge of the
positive input clock (K).
If a read is performed on the same address on which a write is
performed in the previous cycle, the SRAM reads out the most
current data. The SRAM does this by bypassing the memory
array and reading the data from the registers.
Depth Expansion
Depth expansion requires replicating the LD control signal for
each bank. All other control signals can be common between
banks as appropriate.
When read access is deselected, the CY7C1168V18 first
completes the pending read transactions. Synchronous internal
circuitry automatically tri-states the outputs following the next
rising edge of the negative Input clock (K). This enables for a
seamless transition between devices without the insertion of wait
states in a depth expanded memory.
Programmable Impedance
An external resistor, RQ, must be connected between the ZQ pin
on the SRAM and VSS to enable the SRAM to adjust its output
driver impedance. The value of RQ must be 5x the value of the
intended line impedance driven by the SRAM. The allowable
range of RQ to guarantee impedance matching with a tolerance
of ±15% is between 175Ω and 350Ω, with VDDQ = 1.5V. The
output impedance is adjusted every 1024 cycles upon power up
to account for drifts in supply voltage and temperature.
Write Operations
Write operations are initiated by asserting R/W LOW and LD
LOW at the rising edge of the positive input clock (K). The
address presented to address inputs is stored in the write
address register. On the following K clock rise the data presented
to D[17:0] is latched and stored into the 18-bit Write Data register
provided BWS[1:0] are both asserted active. On the subsequent
rising edge of the Negative Input Clock (K) the information
presented to D[17:0] is also stored into the Write Data register
provided BWS[1:0] are both asserted active. The 36 bits of data
is then written into the memory array at the specified location.
Write accesses can be initiated on every rising edge of the
positive input clock (K). This pipelines the data flow such that 18
bits of data can be transferred into the device on every rising
edge of the input clocks (K and K).
Echo Clocks
Echo clocks are provided on the DDR-II+ to simplify data capture
on high-speed systems. Two echo clocks are generated by the
DDR-II+. CQ is referenced with respect to K and CQ is refer-
enced with respect to K. These are free-running clocks and are
synchronized to the input clock of the DDR-II+. The timings for
the echo clocks are shown in the “Switching Characteristics” on
page 22.
Valid Data Indicator (QVLD)
QVLD is provided on the DDR-II+ to simplify data capture on high
speed systems. The QVLD is generated by the DDR-II+ device
along with data output. This signal is also edge-aligned with the
When write access is deselected, the device ignores all inputs
after the pending write operations are completed.
Document Number: 001-06620 Rev. *C
Page 8 of 27
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CY7C1166V18
CY7C1177V18
CY7C1168V18
CY7C1170V18
echo clock and follows the timing of any data pin. This signal is
asserted half a cycle before valid data arrives.
DDR-I mode (with 1.0 cycle latency and a longer access time).
For more information, refer to the application note, “DLL Consid-
erations in QDRII/DDRII/QDRII+/DDRII+”. The DLL can also be
reset by slowing or stopping the input clocks K and K for a
minimum of 30 ns. However, it is not necessary for the DLL to be
reset to lock to the desired frequency. During power up, when the
DOFF is tied HIGH, the DLL gets locked after 2048 cycles of
stable clock.
DLL
These chips use a Delay Lock Loop (DLL) that is designed to
function between 120 MHz and the specified maximum clock
frequency. The DLL may be disabled by applying ground to the
DOFF pin. When the DLL is turned off, the device behaves in
Application Example
Figure 1 shows two DDR-II+ used in an application.
Figure 1. Application Example
ZQ
CQ/CQ
K
K
ZQ
CQ/CQ
K
K
SRAM#1
LD R/W
SRAM#2
DQ
A
DQ
A
R = 250ohms
R = 250ohms
LD R/W
DQ
Addresses
Cycle Start
R/W
Source CLK
Source CLK
BUS
MASTER
(CPU or ASIC)
Echo Clock1/Echo Clock1
Echo Clock2/Echo Clock2
Truth Table
The truth table for the CY7C1166V18, CY7C1177V18, CY7C1168V18, and CY7C1170V18 follows. [2, 3, 4, 5, 6, 7]
Operation
K
LD R/W
DQ
DQ
Write Cycle:
L-H
L
L
L
D(A) at K (t + 1) ↑
D(A + 1) at K (t + 1) ↑
Load address; wait one cycle; input write data on consecutive
K and K rising edges.
Read Cycle: (2.5 Cycle Latency)
Load address; wait two and a half cycle; read data on consec-
utive K and K rising edges.
L-H
H
Q(A) at K (t + 2)↑
Q(A + 1) at K (t + 3) ↑
NOP: No Operation
L-H
H
X
X
X
High-Z
High-Z
Standby: Clock Stopped
Stopped
Previous State
Previous State
Notes
2. X = “Don’t Care,” H = Logic HIGH, L = Logic LOW, ↑ represents rising edge.
3. Device powers up deselected and the outputs in a tri-state condition.
4. “A” represents address location latched by the devices when transaction was initiated and A + 1 represents the addresses sequence in the burst.
5. “t” represents the cycle at which a Read/Write operation is started. t + 1, t + 2, and t + 3 are the first, second, and third clock cycles succeeding the “t” clock cycle.
6. Data inputs are registered at K and K rising edges. Data outputs are delivered on K and K rising edges.
7. Do K = K = HIGH when clock is stopped. This is not essential, but permits most rapid restart by overcoming transmission line charging symmetrically.
Document Number: 001-06620 Rev. *C
Page 9 of 27
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CY7C1166V18
CY7C1177V18
CY7C1168V18
CY7C1170V18
Write Cycle Descriptions
The write cycle descriptions of CY7C1166V18 and CY7C1168V18 follows. [2, 8]
BWS0/ BWS1/
K
Comments
K
NWS0 NWS1
L
L
L–H
–
During the Data portion of a write sequence :
CY7C1166V18 − both nibbles (D[7:0]) are written into the device,
CY7C1168V18 − both bytes (D[17:0]) are written into the device.
L
L
–
L–H
–
L-H During the Data portion of a write sequence :
CY7C1166V18 − both nibbles (D[7:0]) are written into the device,
CY7C1168V18 − both bytes (D[17:0]) are written into the device.
L
H
H
L
–
During the Data portion of a write sequence :
CY7C1166V18 − only the lower nibble (D[3:0]) is written into the device, D[7:4] remains unaltered.
CY7C1168V18 − only the lower byte (D[8:0]) is written into the device, D[17:9] remains unaltered.
L
L–H During the Data portion of a write sequence :
CY7C1166V18 − only the lower nibble (D[3:0]) is written into the device, D[7:4] remains unaltered.
CY7C1168V18 − only the lower byte (D[8:0]) is written into the device, D[17:9] remains unaltered.
H
H
L–H
–
–
During the Data portion of a write sequence :
CY7C1166V18 − only the upper nibble (D[7:4]) is written into the device, D[3:0] remains unaltered.
CY7C1168V18 − only the upper byte (D[17:9]) is written into the device, D[8:0] remains unaltered.
L
L–H During the Data portion of a write sequence :
CY7C1166V18 − only the upper nibble (D[7:4]) is written into the device, D[3:0] remains unaltered.
CY7C1168V18 − only the upper byte (D[17:9]) is written into the device, D[8:0] remains unaltered.
H
H
H
H
L–H
–
–
No data is written into the devices during this portion of a write operation.
L–H No data is written into the devices during this portion of a write operation.
The write cycle descriptions of CY7C1177V18 follows. [2, 8]
BWS0
K
L-H
–
K
Comments
L
L
–
During the Data portion of a Write sequence, the single byte (D[8:0]) is written into the device.
L-H During the Data portion of a Write sequence, the single byte (D[8:0]) is written into the device.
No data is written into the device during this portion of a Write operation.
L-H No data is written into the device during this portion of a Write operation.
H
H
L-H
–
–
Note
8. Is based on a write cycle was initiated in accordance with the Write Cycle Description Truth Table. Alter NWS , NWS , BWS , BWS , BWS , and BWS on different
0
1
0
1
2
3
portions of a write cycle, as long as the setup and hold requirements are achieved.
Document Number: 001-06620 Rev. *C
Page 10 of 27
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CY7C1166V18
CY7C1177V18
CY7C1168V18
CY7C1170V18
The write cycle descriptions of CY7C1170V18 follows. [2, 8]
BWS0 BWS1 BWS2 BWS3
K
K
Comments
L
L
L
L
L-H
–
During the data portion of a write sequence, all four bytes (D[35:0]) are written into
the device.
L
L
L
L
–
L-H
–
L-H During the data portion of a write sequence, all four bytes (D[35:0]) are written into
the device.
L
H
H
L
H
H
H
H
L
H
H
H
H
H
H
L
–
During the data portion of a write sequence, only the lower byte (D[8:0]) is written
into the device. D[35:9] remains unaltered.
L
L-H During the data portion of a write sequence, only the lower byte (D[8:0]) is written
into the device. D[35:9] remains unaltered.
H
H
H
H
H
H
L-H
–
–
During the data portion of a write sequence, only the byte (D[17:9]) is written into
the device. D[8:0] and D[35:18] remains unaltered.
L
L-H During the data portion of a write sequence, only the byte (D[17:9]) is written into
the device. D[8:0] and D[35:18] remains unaltered.
H
H
H
H
L-H
–
–
During the data portion of a write sequence, only the byte (D[26:18]) is written into
the device. D[17:0] and D[35:27] remains unaltered.
L
L-H During the data portion of a write sequence, only the byte (D[26:18]) is written into
the device. D[17:0] and D[35:27] remains unaltered.
H
H
L-H
–
–
During the data portion of a write sequence, only the byte (D[35:27]) is written into
the device. D[26:0] remains unaltered.
L
L-H During the data portion of a write sequence, only the byte (D[35:27]) is written into
the device. D[26:0] remains unaltered.
H
H
H
H
H
H
H
H
L-H
–
–
No data is written into the device during this portion of a write operation.
L-H No data is written into the device during this portion of a write operation.
Document Number: 001-06620 Rev. *C
Page 11 of 27
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CY7C1166V18
CY7C1177V18
CY7C1168V18
CY7C1170V18
IEEE 1149.1 Serial Boundary Scan (JTAG)
Instruction Register
These SRAMs incorporate a serial boundary scan test access
port (TAP) in the FBGA package. This part is fully compliant with
IEEE Standard #1149.1-2001. The TAP operates using JEDEC
standard 1.8V IO logic levels.
Load three-bit instructions serially into the instruction register.
This register is loaded when it is placed between the TDI and
TDO pins as shown in “TAP Controller Block Diagram” on
page 15. Upon power up, the instruction register is loaded with
the IDCODE instruction. It is also loaded with the IDCODE
instruction if the controller is placed in a reset state as described
in the previous section.
Disabling the JTAG Feature
It is possible to operate the SRAM without using the JTAG
feature. To disable the TAP controller, TCK must be tied LOW
(VSS) to prevent clocking of the device. TDI and TMS are inter-
nally pulled up and may be unconnected. They may alternately
be connected to VDD through a pull up resistor. TDO must be left
unconnected. Upon power up, the device comes up in a reset
state which does not interfere with the operation of the device.
When the TAP controller is in the Capture IR state, the two least
significant bits are loaded with a binary “01” pattern to allow fault
isolation of the board level serial test path.
Bypass Register
To save time when serially shifting data through registers, it is
sometimes advantageous to skip certain chips. The bypass
register is a single-bit register that can be placed between TDI
and TDO pins. This enables data to be shifted through the SRAM
with minimal delay. The bypass register is set LOW (VSS) when
the BYPASS instruction is executed.
Test Access Port—Test Clock
The test clock is used only with the TAP controller. All inputs are
captured on the rising edge of TCK. All outputs are driven from
the falling edge of TCK.
Test Mode Select
Boundary Scan Register
The TMS input is used to give commands to the TAP controller
and is sampled on the rising edge of TCK. It is allowable to leave
this pin unconnected if the TAP is not used. The pin is pulled up
internally, resulting in a logic HIGH level.
The boundary scan register is connected to all of the input and
output pins on the SRAM. Several no connect (NC) pins are also
included in the scan register to reserve pins for higher density
devices.
Test Data-In (TDI)
The boundary scan register is loaded with the contents of the
RAM Input and Output ring when the TAP controller is in the
Capture-DR state and is then placed between the TDI and TDO
pins when the controller is moved to the Shift-DR state. Use the
EXTEST, SAMPLE/PRELOAD, and SAMPLE Z instructions to
capture the contents of the input and output ring.
The TDI pin is used to serially input information into the registers
and connect to the input of any of the registers. The register
between TDI and TDO is chosen by the instruction that is loaded
into the TAP instruction register. For more information about
loading the instruction register, see “TAP Controller State
Diagram” on page 14. TDI is internally pulled up and uncon-
nected if the TAP is not used in an application. TDI is connected
to the most significant bit (MSB) on any register.
The “Boundary Scan Order” on page 18 show the order in which
the bits are connected. Each bit corresponds to one of the bumps
on the SRAM package. The MSb of the register is connected to
TDI, and the LSb is connected to TDO.
Test Data-Out (TDO)
The TDO output pin is used to serially clock data-out from the
registers. The output is active depending upon the current state
of the TAP state machine (see “Instruction Codes” on page 17).
The output changes on the falling edge of TCK. TDO is
connected to the least significant bit (LSb) of any register.
Identification (ID) Register
The ID register is loaded with a vendor-specific 32-bit code
during the Capture-DR state when the IDCODE command is
loaded in the instruction register. The IDCODE is hardwired into
the SRAM and can be shifted out when the TAP controller is in
the Shift-DR state. The ID register has a vendor code and other
information described in the “Identification Register Definitions”
on page 17.
Performing a TAP Reset
A Reset is performed by forcing TMS HIGH (VDD) for five rising
edges of TCK. This RESET does not affect the operation of the
SRAM and may be performed while the SRAM is operating. At
power up, the TAP is reset internally to ensure that TDO comes
up in a high-Z state.
TAP Instruction Set
Eight different instructions are possible with the three-bit
instruction register. All combinations are listed in the “Instruction
Codes” on page 17. Three of these instructions are listed as
RESERVED and must not be used. The other five instructions
are described in this section.
TAP Registers
Registers are connected between the TDI and TDO pins and
enable data to be scanned into and out of the SRAM test circuitry.
Select only one register at a time through the instruction
registers. Data is serially loaded into the TDI pin on the rising
edge of TCK. Data is output on the TDO pin on the falling edge
of TCK.
Instructions are loaded into the TAP controller during the Shift-IR
state when the instruction register is placed between TDI and
TDO. During this state, instructions are shifted through the
instruction register through the TDI and TDO pins. To execute
the instruction after it is shifted in, the TAP controller must be
moved into the Update-IR state.
Document Number: 001-06620 Rev. *C
Page 12 of 27
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CY7C1177V18
CY7C1168V18
CY7C1170V18
IDCODE
PRELOAD enables an initial data pattern to be placed at the
latched parallel outputs of the boundary scan register cells be-
fore the selection of another boundary scan test operation.
The IDCODE instruction causes a vendor-specific 32-bit code to
be loaded into the instruction register. It also places the
instruction register between the TDI and TDO pins and enables
the IDCODE to be shifted out of the device when the TAP
controller enters the Shift-DR state. The IDCODE instruction is
loaded into the instruction register upon power up or whenever
the TAP controller is supplied a test logic reset state.
The shifting of data for the SAMPLE and PRELOAD phases can
occur concurrently when required—that is, while data captured
is shifted out, the preloaded data can be shifted in.
BYPASS
When the BYPASS instruction is loaded in the instruction register
and the TAP is placed in a Shift-DR state, the bypass register is
placed between the TDI and TDO pins. The advantage of the
BYPASS instruction is that it shortens the boundary scan path
when multiple devices are connected together on a board.
SAMPLE Z
The SAMPLE Z instruction causes the boundary scan register to
be connected between the TDI and TDO pins when the TAP
controller is in a Shift-DR state. The SAMPLE Z command puts
the output bus into a High-Z state until the next command is
supplied during the Update IR state.
EXTEST
The EXTEST instruction enables the preloaded data to be driven
out through the system output pins. This instruction also selects
the boundary scan register to be connected for serial access
between the TDI and TDO in the shift-DR controller state.
SAMPLE/PRELOAD
SAMPLE/PRELOAD is a 1149.1 mandatory instruction. When
the SAMPLE/PRELOAD instructions are loaded into the instruc-
tion register and the TAP controller is in the Capture-DR state, a
snapshot of data on the inputs and output pins is captured in the
boundary scan register.
EXTEST Output Bus Tri-State
IEEE Standard 1149.1 mandates that the TAP controller is able
to put the output bus into a tri-state mode.
The user must be aware that the TAP controller clock can only
operate at a frequency up to 20 MHz, while the SRAM clock
operates more than an order of magnitude faster. Because there
is a large difference in the clock frequencies, it is possible that
during the Capture-DR state, an input or output undergoes a
transition. The TAP may then try to capture a signal while in
transition (metastable state). This does not harm the device, but
there is no guarantee as to the value that is captured.
Repeatable results may not be possible.
The boundary scan register has a special bit located at bit #47.
When this scan cell, called the “extest output bus tri-state”, is
latched into the preload register during the Update-DR state in
the TAP controller, it directly controls the state of the output
(Q-bus) pins, when the EXTEST is entered as the current
instruction. When HIGH, it enables the output buffers to drive the
output bus. When LOW, this bit places the output bus into a
High-Z condition.
To guarantee that the boundary scan register captures the cor-
rect value of a signal, the SRAM signal must be stabilized long
enough to meet the TAP controller's capture setup plus hold
times (tCS and tCH). The SRAM clock input might not be captured
correctly if there is no way in a design to stop (or slow) the clock
during a SAMPLE/PRELOAD instruction. If this is an issue, it is
still possible to capture all other signals and simply ignore the
value of the CK and CK captured in the boundary scan register.
Set this bit by entering the SAMPLE/PRELOAD or EXTEST
command, and then shifting the desired bit into that cell, during
the Shift-DR state. During Update-DR, the value loaded into that
shift-register cell latches into the preload register. When the
EXTEST instruction is entered, this bit directly controls the output
Q-bus pins. Note that this bit is preset HIGH to enable the output
when the device is powered up, and also when the TAP controller
is in the Test-Logic-Reset state.
After the data is captured, it is possible to shift out the data by
putting the TAP into the Shift-DR state. This places the boundary
scan register between the TDI and TDO pins.
Reserved
These instructions are not implemented but are reserved for
future use. Do not use these instructions.
Document Number: 001-06620 Rev. *C
Page 13 of 27
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CY7C1177V18
CY7C1168V18
CY7C1170V18
TAP Controller State Diagram
Figure 2 shows the tap controller state diagram. [9]
Figure 2. Tap Controller State Diagram
TEST-LOGIC
RESET
1
0
0
1
1
1
TEST-LOGIC/
IDLE
SELECT
SELECT
DR-SCAN
IR-SCAN
0
0
1
1
CAPTURE-DR
CAPTURE-IR
0
0
SHIFT-DR
0
SHIFT-IR
0
1
1
EXIT1-DR
0
1
EXIT1-IR
0
1
0
0
PAUSE-DR
1
PAUSE-IR
1
0
0
EXIT2-DR
1
EXIT2-IR
1
UPDATE-DR
UPDATE-IR
1
1
0
0
Note
9. The 0/1 next to each state represents the value at TMS at the rising edge of TCK.
Document Number: 001-06620 Rev. *C
Page 14 of 27
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CY7C1177V18
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CY7C1170V18
TAP Controller Block Diagram
Figure 3. Tap Controller Block Diagram
0
Bypass Register
Selection
TDI
Selection
Circuitry
2
1
0
0
0
TDO
Circuitry
Instruction Register
29
31 30
.
.
2
1
Identification Register
.
106 .
.
.
2
1
Boundary Scan Register
TCK
TMS
TAP Controller
TAP Electrical Characteristics
The Tap Electrical Characteristics table over the operating range follows.[10, 11, 12]
Parameter Description Test Conditions
VOH1 Output HIGH Voltage IOH = −2.0 mA
Min
1.4
1.6
Max
Unit
V
VOH2
VOL1
VOL2
VIH
Output HIGH Voltage
Output LOW Voltage
Output LOW Voltage
Input HIGH Voltage
IOH = −100 µA
IOL = 2.0 mA
IOL = 100 µA
V
0.4
0.2
V
V
0.65 VDD VDD + 0.3
V
VIL
Input LOW Voltage
–0.3
0.35 VDD
5
V
IX
Input and Output Load Current
GND ≤ VI ≤ VDD
−5
µA
Notes
10. These characteristics pertain to the TAP inputs (TMS, TCK, TDI and TDO). Parallel load levels are specified in the Electrical Characteristics Table.
11. Overshoot: V (AC) < V + 0.35V (pulse width less than t /2).
/2), undershoot: V (AC) > −0.3V (pulse width less than t
IH
DDQ
CYC
IL
CYC
12. All voltage refer to ground.
Document Number: 001-06620 Rev. *C
Page 15 of 27
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CY7C1166V18
CY7C1177V18
CY7C1168V18
CY7C1170V18
TAP AC Switching Characteristics
The Tap AC Switching Characteristics over the operating range follows.[13, 14]
Parameter
tTCYC
Description
Min
Max
Unit
ns
TCK Clock Cycle Time
TCK Clock Frequency
TCK Clock HIGH
50
tTF
20
MHz
ns
tTH
20
20
tTL
TCK Clock LOW
ns
Setup Times
tTMSS
TMS Setup to TCK Clock Rise
TDI Setup to TCK Clock Rise
Capture Setup to TCK Rise
5
5
5
ns
ns
ns
tTDIS
tCS
Hold Times
tTMSH
tTDIH
TMS Hold after TCK Clock Rise
TDI Hold after Clock Rise
5
5
5
ns
ns
ns
tCH
Capture Hold after Clock Rise
Output Times
tTDOV
TCK Clock LOW to TDO Valid
TCK Clock LOW to TDO Invalid
10
ns
ns
tTDOX
0
TAP Timing and Test Condition
The Tap Timing and Test Conditions for the CY7C1166V18, CY7C1177V18, CY7C1168V18, and CY7C1170V18 follows.[14]
Figure 4. TAP Timing and Test Conditions
0.9V
ALL INPUT PULSES
50Ω
1.8V
TDO
0.9V
0V
Z = 50
0
Ω
C = 20 pF
L
tTL
tTH
GND
(a)
Test Clock
TCK
tTCYC
tTMSH
tTMSS
Test Mode Select
TMS
tTDIS
tTDIH
Test Data In
TDI
Test Data Out
TDO
tTDOV
tTDOX
Notes
13. t and t refer to the setup and hold time requirements of latching data from the boundary scan register.
CS
CH
14. Test conditions are specified using the load in TAP AC test conditions. t /t = 1 ns
R
F
Document Number: 001-06620 Rev. *C
Page 16 of 27
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CY7C1166V18
CY7C1177V18
CY7C1168V18
CY7C1170V18
Identification Register Definitions
Value
Instruction Field
Description
CY7C1166V18
CY7C1177V18
000
CY7C1168V18
CY7C1170V18
Revision Number
(31:29)
000
000
000
Version number.
Cypress Device ID 11010111000000101 11010111000001101 11010111000010101 11010111000100101 Defines the type of
(28:12)
SRAM.
Cypress JEDEC ID
(11:1)
00000110100
1
00000110100
1
00000110100
1
00000110100
1
Allows unique
identification of
SRAM vendor.
ID Register
Presence (0)
Indicates the
presence of an ID
register.
Scan Register Sizes
Register Name
Bit Size
Instruction
Bypass
3
1
ID
32
107
Boundary Scan
Instruction Codes
Instruction
EXTEST
Code
000
Description
Captures the input output ring contents.
IDCODE
001
Loads the ID register with the vendor ID code and places the register between TDI
and TDO. This operation does not affect SRAM operation.
SAMPLE Z
010
Captures the Input Output contents. It places the boundary scan register between
TDI and TDO. This forces all SRAM output drivers to a High-Z state.
RESERVED
011
100
Do Not Use: This instruction is reserved for future use.
SAMPLE/PRELOAD
Captures the input output ring contents. It places the boundary scan register between
TDI and TDO. This operation does not affect the SRAM operation.
RESERVED
RESERVED
BYPASS
101
110
111
Do Not Use: This instruction is reserved for future use.
Do Not Use: This instruction is reserved for future use.
Places the bypass register between TDI and TDO. This operation does not affect
SRAM operation.
Document Number: 001-06620 Rev. *C
Page 17 of 27
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CY7C1177V18
CY7C1168V18
CY7C1170V18
Boundary Scan Order
Bit #
0
Bump ID
6R
Bit #
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
Bump ID
11H
10G
9G
Bit #
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
Bump ID
7B
6B
6A
5B
5A
4A
5C
4B
3A
1H
1A
2B
3B
1C
1B
3D
3C
1D
2C
3E
2D
2E
1E
2F
Bit #
81
Bump ID
3G
2G
1J
1
6P
82
2
6N
83
3
7P
11F
11G
9F
84
2J
4
7N
85
3K
3J
5
7R
86
6
8R
10F
11E
10E
10D
9E
87
2K
1K
2L
7
8P
88
8
9R
89
9
11P
10P
10N
9P
90
3L
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
91
1M
1L
10C
11D
9C
92
93
3N
3M
1N
2M
3P
2N
2P
1P
3R
4R
4P
5P
5N
5R
10M
11N
9M
94
9D
95
11B
11C
9B
96
9N
97
11L
11M
9L
98
10B
11A
Internal
9A
99
100
101
102
103
104
105
106
10L
11K
10K
9J
8B
7C
9K
6C
3F
10J
11J
8A
1G
1F
7A
Document Number: 001-06620 Rev. *C
Page 18 of 27
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CY7C1177V18
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CY7C1170V18
Power Up Sequence in DDR-II+ SRAM
DLL Constraints
DDR-II+ SRAMs must be powered up and initialized in a
predefined manner to prevent undefined operations. During
power up, when the DOFF is tied HIGH, the DLL gets locked after
2048 cycles of stable clock.
■ DLL uses K clock as its synchronizing input. The input must
have low phase jitter, which is specified as tKC Var
.
■ The DLL functions at frequencies down to 120 MHz.
■ If the input clock is unstable and the DLL is enabled, then the
DLL may lock onto an incorrect frequency, causing unstable
SRAM behavior. To avoid this, provide 2048 cycles stable clock
to relock to the desired clock frequency.
Power Up Sequence
■ Apply power with DOFF tied HIGH (all other inputscan be HIGH
or LOW)
❐ Apply VDD before VDDQ
❐ Apply VDDQ before VREF or at the same time as VREF
■ Provide stable power and clock (K, K) for 2048 cycles to lock
the DLL.
Power Up Waveforms
Figure 5. Power Up Waveforms
K
K
Start Normal
Operation
Unstable Clock
> 2048 Stable Clock
Clock Start (Clock Starts after V /V
DD DDQ
is Stable)
V
/V
+
/V Stable (< 0.1V DC per 50 ns)
DD DDQ
V
DD DDQ
Fix HIGH (tie to V
DDQ
)
DOFF
Document Number: 001-06620 Rev. *C
Page 19 of 27
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Current into Outputs (LOW)......................................... 20 mA
Static Discharge Voltage (MIL-STD-883, M 3015).... >2001V
Latch up Current..................................................... >200 mA
Maximum Ratings
Exceeding maximum ratings may shorten the useful life of the
device. User guidelines are not tested.
Storage Temperature ................................ –65°C to + 150°C
Ambient Temperature with Power Applied. –55°C to + 125°C
Supply Voltage on VDD Relative to GND.......–0.5V to + 2.9V
Supply Voltage on VDDQ Relative to GND..... –0.5V to + VDD
DC Applied to Outputs in High-Z .........–0.5V to VDDQ + 0.3V
DC Input Voltage[11]...............................–0.5V to VDD + 0.3V
Operating Range
Ambient
[15]
[15]
Range
Commercial
Industrial
Temperature
0°C to +70°C
–40°C to +85°C
VDD
VDDQ
1.8 ± 0.1V
1.4V to
VDD
Electrical Characteristic
The DC Electrical Characteristics over the operating range follows.[12]
Parameter
VDD
Description
Power Supply Voltage
IO Supply Voltage
Test Conditions
Min
1.7
Typ
1.8
1.5
Max
Unit
1.9
V
V
VDDQ
VOH
1.4
VDD
Output HIGH Voltage
Output LOW Voltage
Output HIGH Voltage
Output LOW Voltage
Input HIGH Voltage
Note 16
Note 17
VDDQ/2 – 0.12
VDDQ/2 – 0.12
VDDQ – 0.2
VSS
VDDQ/2 + 0.12
V
VOL
VDDQ/2 + 0.12
V
VOH(LOW)
VOL(LOW)
VIH
IOH = –0.1 mA, Nominal Impedance
IOL = 0.1 mA, Nominal Impedance
VDDQ
0.2
V
V
VREF + 0.1
–0.15
VDDQ + 0.15
VREF – 0.1
2
V
VIL
Input LOW Voltage
V
IX
Input Leakage Current
Output Leakage Current
Input Reference Voltage[18]
VDD Operating Supply
GND ≤ VI ≤ VDDQ
–2
µA
µA
V
IOZ
GND ≤ VI ≤ VDDQ, Output Disabled
Typical Value = 0.75V
–2
2
VREF
IDD
0.68
0.75
0.95
VDD = Max, IOUT = 0 mA, 300 MHz
850
mA
mA
mA
mA
mA
mA
mA
mA
f = fmax = 1/tCYC
333 MHz
920
375 MHz
400 MHz
1020
1080
250
ISB1
Automatic Power Down Current Max VDD
,
300 MHz
333 MHz
375 MHz
400 MHz
Both Ports Deselected,
VIN ≥ VIH or VIN ≤ VIL
260
290
f = fmax = 1/tCYC
,
Inputs Static
300
AC Input Requirements
Over the operating range [11]
Parameter
Description
Input HIGH Voltage
Input LOW Voltage
Test Conditions
Min
VREF + 0.2
–0.24
Typ
–
Max
Unit
V
VIH
VIL
VDDQ + 0.24
VREF – 0.2
–
V
Notes
15. Power up: Is based on a linear ramp from 0V to V (min) within 200 ms. During this time V < V and V
< V
DD.
DD
IH
DD
DDQ
16. Outputs are impedance controlled. I = –(V
/2)/(RQ/5) for values of 175Ω < RQ < 350Ω.
OH
DDQ
17. Outputs are impedance controlled. I = (V
/2)/(RQ/5) for values of 175Ω < RQ < 350Ω
OL
DDQ
18. V
(min) = 0.68V or 0.46V
, whichever is larger, V
(max) = 0.95V or 0.54V
, whichever is smaller.
DDQ
REF
DDQ
REF
Document Number: 001-06620 Rev. *C
Page 20 of 27
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Capacitance
Tested initially and after any design or process change that may affect these parameters.
Parameter
CIN
Description
Input Capacitance
Test Conditions
Max
Unit
pF
TA = 25°C, f = 1 MHz,
5
6
7
V
DD = 1.8V
CCLK
Clock Input Capacitance
Output Capacitance
pF
VDDQ = 1.5V
CO
pF
Thermal Resistance
Tested initially and after any design or process change that may affect these parameters.
165 FBGA
Package
Parameter
Description
Test Conditions
Unit
ΘJA
Thermal Resistance
(junction to ambient)
Test conditions follow standard test methods and
procedures for measuring thermal impedance, in
accordance with EIA/JESD51.
17.2
°C/W
ΘJC
Thermal Resistance
(junction to case)
4.15
°C/W
AC Test Loads and Waveforms
Figure 6. AC Test loads and Waveforms
V
REF = 0.75V
0.75V
VREF
VREF
0.75V
R = 50Ω
OUTPUT
[19]
ALL INPUT PULSES
Z = 50Ω
0
DEVICE
R = 50Ω
L
OUTPUT
1.25V
0.75V
UNDER
DEVICE
UNDER
0.25V
TEST
5 pF
VREF = 0.75V
SLEW RATE= 2 V/ns
ZQ
TEST
ZQ
RQ =
RQ =
250Ω
250Ω
INCLUDING
JIG AND
SCOPE
(a)
(b)
Notes
19. Unless otherwise noted, test conditions are based on a signal transition time of 2V/ns, timing reference levels of 0.75V, V
= 0.75V, RQ = 250Ω, V
= 1.5V, input
REF
DDQ
pulse levels of 0.25V to 1.25V, and output loading of the specified I /I and load capacitance shown in (a) of AC Test Loads.
OL OH
Document Number: 001-06620 Rev. *C
Page 21 of 27
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Switching Characteristics
Over the operating range[19, 20]
400 MHz
375 MHz
333 MHz
300 MHz
Cypress Consortium
Parameter Parameter
Description
Unit
Min Max Min Max Min Max Min Max
tPOWER
tCYC
tKH
VDD(Typical) to the first Access[21]
K Clock Cycle Time
1
–
1
–
1
–
1
–
ms
tKHKH
tKHKL
tKLKH
tKHKH
2.50 8.40 2.66 8.40 3.0 8.40 3.3 8.40 ns
Input Clock (K/K) HIGH
Input Clock (K/K) LOW
0.4
0.4
–
–
–
0.4
0.4
–
–
–
0.4
0.4
–
–
–
0.4
0.4
–
–
–
tCYC
tCYC
ns
tKL
tKHKH
K Clock Rise to K Clock Rise
(rising edge to rising edge)
1.06
1.13
1.28
1.40
Setup Times
tSA
tAVKH
tIVKH
tIVKH
Address Setup to K Clock Rise
0.4
0.4
–
–
–
0.4
0.4
–
–
–
0.4
0.4
–
–
–
0.4
0.4
–
–
–
ns
ns
ns
tSC
Control Setup to K Clock Rise (LD, R/W)
tSCDDR
Double Data Rate Control Setup to Clock (K/K) 0.28
Rise (BWS0, BWS1, BWS2, BWS3)
0.28
0.28
0.28
tSD
tDVKH
D[X:0] Setup to Clock (K/K) Rise
0.28
–
0.28
–
0.28
–
0.28
–
ns
Hold Times
tHA
tKHAX
tKHIX
tKHIX
0.4
0.4
–
–
–
0.4
0.4
–
–
–
0.4
0.4
–
–
–
0.4
0.4
–
–
–
ns
ns
ns
Address Hold after K Clock Rise
tHC
Control Hold after K Clock Rise (LD, R/W)
tHCDDR
Double Data Rate Control Hold after Clock (K/K) 0.28
Rise (BWS0, BWS1, BWS2, BWS3)
0.28
0.28
0.28
tHD
tKHDX
D[X:0] Hold after Clock (K/K) Rise
0.28
–
0.28
–
0.28
–
0.28
–
ns
Output Times
tCO
tCHQV
K/K Clock Rise to Data Valid
–
0.45
–
–
0.45
–
–
0.45
–
–
0.45 ns
ns
tDOH
tCHQX
Data Output Hold after K/K Clock Rise
(Active to Active)
–0.45
–0.45
–0.45
–0.45
–
tCCQO
tCQOH
tCQD
tCHCQV
tCHCQX
tCQHQV
tCQHQX
tCQHCQL
K/K Clock Rise to Echo Clock Valid
Echo Clock Hold after K/K Clock Rise
Echo Clock High to Data Valid
–
0.45
–
–
0.45
–
–
0.45
–
–
0.45 ns
–0.45
–
–0.45
–
–0.45
–
–0.45
–
–
0.2
–
ns
ns
ns
ns
ns
0.2
–
0.2
–
0.2
–
tCQDOH
tCQH
Echo Clock High to Data Invalid
Output Clock (CQ/CQ) HIGH[22]
CQ Clock Rise to CQ Clock Rise[22]
–0.2
0.81
0.81
–0.2
0.88
0.88
–0.2
1.03
1.03
–0.2
1.15
1.15
–
–
–
–
tCQHCQH tCQHCQH
–
–
–
–
(rising edge to rising edge)
tCHZ
tCLZ
tCHQZ
tCHQX1
tQVLD
Clock (K/K) Rise to High-Z (Active to High-Z)[23, 24]
Clock (K/K) Rise to Low-Z[23, 24]
Echo Clock High to QVLD Valid[25]
–
0.45
–
–
0.45
–
–
0.45
–
–
0.45 ns
ns
–0.45
–0.45
–0.45
–0.45
–
tQVLD
–0.20 0.20 –0.20 0.20 –0.20 0.20 –0.20 0.20 ns
DLL Timing
tKC Var tKC Var
tKC lock tKC lock
Clock Phase Jitter
–
0.20
–
–
0.20
–
–
0.20
–
–
0.20 ns
DLL Lock Time (K)
K Static to DLL Reset[26]
2048
30
2048
30
2048
30
2048
30
–
–
Cycles
ns
tKC Reset tKC Reset
–
–
–
Notes
20. When a part with a maximum frequency above 300 MHz is operating at a lower clock frequency, it requires the input timings of the frequency range in which it is being
operated and outputs data with the output timings of that frequency range.
21. This part has a voltage regulator internally; t
initiated.
is the time that the power must be supplied above V minimum initially before a read or write operation can be
DD
POWER
22. These parameters are extrapolated from the input timing parameters (t
- 250 ps, where 250 ps is the internal jitter. An input jitter of 200 ps (t
) is already
KHKH
KC Var
included in the t
). These parameters are only guaranteed by design and are not tested in production.
KHKH
23. t
, t
, are specified with a load capacitance of 5 pF as in (b) of AC Test Loads and Waveforms. Transition is measured ± 100 mV from steady-state voltage.
CHZ CLZ
24. At any given voltage and temperature t
is less than t
and t
less than t
.
CHZ
CLZ
CHZ
CO
25. t
spec is applicable for both rising and falling edges of QVLD signal.
QVLD
26. Hold to >V or <V .
IH
IL
Document Number: 001-06620 Rev. *C
Page 22 of 27
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Switching Waveform
Read/Write/Deselect Sequence
Figure 7. Waveform for 2.5 Cycle Read Latency[27, 28]
NOP
1
READ
2
READ
3
NOP
5
NOP
6
WRITE
7
WRITE
8
NOP
11
NOP
4
READ
9
NOP
10
12
K
t
t
t
t
KH
KL
KHKH
CYC
K
LD
t
t
HC
SC
R/W
A
A2
A3
A0
A4
A1
t
QVLD
t
t
t
t
SA HA
QVLD
QVLD
QVLD
t
t
HD
HD
SD
t
t
SD
D21 D30 D31
Q00 Q01 Q10 Q11
D20
Q40
DQ
t
t
DOH
t
CHZ
CLZ
t
t
t
CO
CQD
(Read Latency = 2.5 Cycles)
t
CQDOH
CCQO
CQOH
t
CQ
CQ
t
CQH
t
CQHCQH
t
CCQO
t
CQOH
DON’T CARE
UNDEFINED
Notes
27. Q00 refers to output from address A0. Q01 refers to output from the next internal burst address following A0, i.e., A0 + 1.
28. Outputs are disabled (High-Z) one clock cycle after a NOP.
Document Number: 001-06620 Rev. *C
Page 23 of 27
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Ordering Information
Not all of the speed, package and temperature ranges are available. Contact your local sales representative or visit www.cypress.com
for actual products offered.
Speed
(MHz)
Package
Diagram
Operating
Range
Ordering Code
Package Type
400 CY7C1166V18-400BZC
CY7C1177V18-400BZC
CY7C1168V18-400BZC
CY7C1170V18-400BZC
CY7C1166V18-400BZXC
CY7C1177V18-400BZXC
CY7C1168V18-400BZXC
CY7C1170V18-400BZXC
CY7C1166V18-400BZI
CY7C1177V18-400BZI
CY7C1168V18-400BZI
CY7C1170V18-400BZI
CY7C1166V18-400BZXI
CY7C1177V18-400BZXI
CY7C1168V18-400BZXI
CY7C1170V18-400BZXI
375 CY7C1166V18-375BZC
CY7C1177V18-375BZC
CY7C1168V18-375BZC
CY7C1170V18-375BZC
CY7C1166V18-375BZXC
CY7C1177V18-375BZXC
CY7C1168V18-375BZXC
CY7C1170V18-375BZXC
CY7C1166V18-375BZI
CY7C1177V18-375BZI
CY7C1168V18-375BZI
CY7C1170V18-375BZI
CY7C1166V18-375BZXI
CY7C1177V18-375BZXI
CY7C1168V18-375BZXI
CY7C1170V18-375BZXI
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free
Commercial
Industrial
Commercial
Industrial
Document Number: 001-06620 Rev. *C
Page 24 of 27
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Ordering Information (continued)
Not all of the speed, package and temperature ranges are available. Contact your local sales representative or visit www.cypress.com
for actual products offered.
Speed
(MHz)
Package
Diagram
Operating
Range
Ordering Code
Package Type
333 CY7C1166V18-333BZC
CY7C1177V18-333BZC
CY7C1168V18-333BZC
CY7C1170V18-333BZC
CY7C1166V18-333BZXC
CY7C1177V18-333BZXC
CY7C1168V18-333BZXC
CY7C1170V18-333BZXC
CY7C1166V18-333BZI
CY7C1177V18-333BZI
CY7C1168V18-333BZI
CY7C1170V18-333BZI
CY7C1166V18-333BZXI
CY7C1177V18-333BZXI
CY7C1168V18-333BZXI
CY7C1170V18-333BZXI
300 CY7C1166V18-300BZC
CY7C1177V18-300BZC
CY7C1168V18-300BZC
CY7C1170V18-300BZC
CY7C1166V18-300BZXC
CY7C1177V18-300BZXC
CY7C1168V18-300BZXC
CY7C1170V18-300BZXC
CY7C1166V18-300BZI
CY7C1177V18-300BZI
CY7C1168V18-300BZI
CY7C1170V18-300BZI
CY7C1166V18-300BZXI
CY7C1177V18-300BZXI
CY7C1168V18-300BZXI
CY7C1170V18-300BZXI
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free
Commercial
Industrial
Commercial
Industrial
Document Number: 001-06620 Rev. *C
Page 25 of 27
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Package Diagram
Figure 8. 165-Ball FBGA (13 x 15 x 1.4 mm), 51-85180
BOTTOM VIEW
PIN 1 CORNER
TOP VIEW
Ø0.05 M C
Ø0.25 M C A B
-0.06
PIN 1 CORNER
Ø0.50
(165X)
+0.14
1
2
3
4
5
6
7
8
9
10
11
11 10
9
8
7
6
5
4
3
2
1
A
B
A
B
C
D
C
D
E
E
F
F
G
G
H
J
H
J
K
K
L
L
M
M
N
P
R
N
P
R
A
A
1.00
5.00
10.00
13.00 0.10
B
13.00 0.10
B
0.15(4X)
NOTES :
SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)
PACKAGE WEIGHT : 0.475g
JEDEC REFERENCE : MO-216 / DESIGN 4.6C
PACKAGE CODE : BB0AC
SEATING PLANE
C
51-85180-*A
Document Number: 001-06620 Rev. *C
Page 26 of 27
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Document History Page
Document Title: CY7C1166V18/CY7C1177V18/CY7C1168V18/CY7C1170V18, 18-Mbit DDR-II+ SRAM 2-Word Burst
Architecture (2.5 Cycle Read Latency)
Document Number: 001-06620
Orig. of
Change
REV.
ECN No. Issue Date
Description of Change
**
430351
461654
See ECN
See ECN
NXR
New data sheet
*A
NXR
Revised the MPNs from
CY7C1177BV18 to CY7C1166V18
CY7C1168BV18 to CY7C1177V18
CY7C1170BV18 to CY7C1168V18
Changed tTH and tTL from 40 ns to 20 ns, changed tTMSS, tTDIS, tCS, tTMSH, tTDIH
,
t
CH from 10 ns to 5 ns and changed tTDOV from 20 ns to 10 ns in TAP AC
Switching Characteristics table
Modified Power Up waveform
*B
497629
See ECN
NXR
Changed the VDDQ operating voltage to 1.4V to VDD in the Features section, in
Operating Range table and in the DC Electrical Characteristics table
Added foot note in page 1
Changed the Maximum rating of Ambient Temperature with Power Applied from
–10°C to +85°C to –55°C to +125°C
Changed VREF (max) spec from 0.85V to 0.95V in the DC Electrical Character-
istics table and in the note below the table
Updated foot note 21 to specify Overshoot and Undershoot Spec
Updated ΘJA and ΘJC values
Removed x9 part and its related information
Updated foot note 24
*C
1175245
See ECN VKN/KKVTMP Converted from preliminary to final
Added x8 and x9 parts
Updated logic block diagram for x18 and x36 parts
Changed IDD values from 830 mA to 1080 mA for 400 MHz, 794 mA to 1020 mA
for 375 MHz, 733 mA to 920 mA for 333 MHz, 685 mA to 850 mA for 300 MHz
Changed ISB values from 235 mA to 300 mA for 400 MHz, 227 mA to 290 mA
for 375 MHz, 212 mA to 260 mA for 333 MHz, 201 mA to 250 mA for 300 MHz
Changed tCYC(max) spec to 8.4 ns for all speed bins
Changed ΘJA value from 13.48 °C/W to 17.2 °C/W
Updated Ordering Information table
© Cypress Semiconductor Corporation, 2006-2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used
for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use
as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support
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and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
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Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
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assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
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Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 001-06620 Rev. *C
Revised June 21, 2007
Page 27 of 27
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