CY7C1292DV18-300BZI [CYPRESS]
QDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, FBGA-165;
| 型号： | CY7C1292DV18-300BZI |
| 厂家： | 
CYPRESS |
| 描述： | QDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, FBGA-165 静态存储器 内存集成电路 |
| 文件： | 总23页 (文件大小：279K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CY7C1292DV18
CY7C1294DV18
PRELIMINARY
9-Mbit QDR-II™ SRAM 2-Word
Burst Architecture
Configurations
Features
CY7C1292DV18 – 1M x 18
CY7C1294DV18 – 512K x 36
• Separate Independent Read and Write data ports
— Supports concurrent transactions
• 300-MHz clock for high bandwidth
• 2-Word Burst on all accesses
Functional Description
The CY7C1292DV18, and CY7C1294DV18 are 1.8V
Synchronous Pipelined SRAMs, equipped with QDR™-II
architecture. QDR-II architecture consists of two separate
ports to access the memory array. The Read port has
dedicated Data Outputs to support Read operations and the
Write Port has dedicated Data Inputs to support Write opera-
tions. QDR-II architecture has separate data inputs and data
outputs to completely eliminate the need to “turn-around” the
data bus required with common I/O devices. Access to each
port is accomplished through a common address bus. The
Read address is latched on the rising edge of the K clock and
the Write address is latched on the rising edge of the K clock.
Accesses to the QDR-II Read and Write ports are completely
independent of one another. In order to maximize data
throughput, both Read and Write ports are equipped with
Double Data Rate (DDR) interfaces. Each address location is
associated with 18-bit words (CY7C1292DV18) or 36-bit
words (CY7C1294DV18) that burst sequentially into or out of
the device. Since data can be transferred into and out of the
device on every rising edge of both input clocks (K and K and
C and C), memory bandwidth is maximized while simplifying
system design by eliminating bus “turn-arounds.”
• Double Data Rate (DDR) interfaces on both Read and
Write ports (data transferred at 600 MHz) @ 300 MHz
• Two input clocks (K and K) for precise DDR timing
— SRAM uses rising edges only
• Two output clocks (C and C) accounts for clock skew
and flight time mismatching
• Echo clocks (CQ and CQ) simplify data capture in
high-speed systems
• Single multiplexed address input bus latches address
inputs for both Read and Write ports
• Separate Port Selects for depth expansion
• Synchronous internally self-timed writes
• Available in x18 and x36 configurations
• Full data coherency, providing most current data
• Core VDD = 1.8V (±0.1V); I/O VDDQ = 1.4V to VDD
• 13 x 15 x 1.4 mm 1.0-mm pitch FBGA package, 165 ball
(11x15 matrix)
• Offered in both lead-free and non-lead free packages
• Variable drive HSTL output buffers
Depth expansion is accomplished with Port Selects for each
port. Port selects allow each port to operate independently.
• JTAG 1149.1 compatible test access port
• Delay Lock Loop (DLL) for accurate data placement
All synchronous inputs pass through input registers controlled
by the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
Cypress Semiconductor Corporation
Document #:001-00350 Rev. **
•
3901 North First Street
•
San Jose, CA 95134
•
408-943-2600
Revised June 6, 2005
CY7C1292DV18
CY7C1294DV18
PRELIMINARY
Logic Block Diagram (CY7C1292DV18)
D
[17:0]
18
Write
Reg
Write
Reg
Address
Register
A
(18:0)
19
Address
Register
A
(17:0)
18
RPS
C
K
K
Control
Logic
CLK
Gen.
DOFF
Read Data Reg.
36
CQ
CQ
C
18
V
REF
18
Reg.
Reg.
Reg.
18
WPS
BWS
Control
Logic
18
[1:0]
Q
[17:0]
18
Logic Block Diagram (CY7C1294DV18)
D
[35:0]
36
Write
Reg
Write
Reg
Address
Register
A
(17:0)
18
Address
Register
A
(16:0)
17
RPS
K
K
Control
Logic
CLK
Gen.
C
C
DOFF
Read Data Reg.
72
CQ
CQ
36
V
REF
36
Reg.
Reg.
Reg.
WPS
BWS
Control
Logic
36
[3:0]
36
Q
[35:0]
36
Selection Guide
300 MHz
300
250 MHz
250
200 MHz
200
167 MHz
167
Unit
Maximum Operating Frequency
Maximum Operating Current
MHz
mA
1575
1300
1050
900
Shaded areas contain advance information. Please contact your local Cypress Sales representative for availability of these parts.
Document #:001-00350 Rev. **
Page 2 of 23
CY7C1292DV18
CY7C1294DV18
PRELIMINARY
Pin Configurations
CY7C1292DV18 (1M × 18) – 11 × 15 BGA
1
2
3
4
5
BWS1
NC
6
K
7
NC/288M
BWS0
A
8
RPS
A
9
10
11
CQ
Q8
D8
D7
Q6
CQ
NC
NC
NC
NC
NC
NC
NC/144M NC/36M
WPS
A
NC/18M NC/72M
A
B
C
D
Q9
NC
D9
NC
NC
NC
NC
Q7
NC
K
D10
Q10
VSS
VSS
A
A
VSS
VSS
D11
VSS
VSS
VSS
NC
Q12
D13
VREF
NC
Q11
D12
Q13
VDDQ
D14
Q14
D15
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VSS
VDD
VDD
VDD
VDD
VDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
NC
NC
D6
NC
NC
VREF
Q4
E
F
VDD
VDD
VDD
VDD
VDD
VSS
Q5
D5
ZQ
D4
Q3
Q2
NC
G
H
J
VDDQ
NC
DOFF
NC
NC
NC
NC
NC
NC
NC
NC
D3
K
L
Q15
NC
NC
NC
D17
NC
D16
Q16
Q17
VSS
VSS
VSS
A
VSS
A
VSS
A
VSS
VSS
NC
NC
NC
Q1
NC
D0
D2
D1
Q0
M
N
P
C
A
A
A
A
A
A
A
A
A
TDO
TCK
A
TMS
TDI
R
C
CY7C1294DV18 (512K × 36) – 11 × 15 BGA
1
2
3
5
6
7
8
9
10
11
CQ
Q8
D8
D7
Q6
4
WPS
A
CQ
Q27
D27
D28
NC/288M NC/72M
BWS2
BWS3
A
K
BWS1
BWS0
A
RPS
A
NC/36M NC/144M
A
B
C
D
Q18
Q28
D20
D18
D19
Q19
D17
D16
Q16
Q17
Q7
K
VSS
VSS
NC/18M
VSS
VSS
VSS
VSS
VSS
VSS
D15
Q29
Q30
D30
D29
Q21
D22
VREF
Q31
D32
Q24
Q20
D21
Q22
VDDQ
D23
Q23
D24
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VSS
VDD
VDD
VDD
VDD
VDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
Q15
D14
D6
Q14
D13
VREF
Q4
E
F
VDD
VDD
VDD
VDD
VDD
VSS
Q5
D5
ZQ
D4
Q3
Q2
Q13
VDDQ
D12
G
H
J
DOFF
D31
Q32
Q33
D33
D34
Q35
Q12
D11
D3
K
L
Q11
Q34
D26
D35
D25
Q25
Q26
VSS
VSS
VSS
A
VSS
A
VSS
A
VSS
VSS
D10
Q10
Q9
Q1
D9
D0
D2
D1
Q0
M
N
P
A
C
A
A
A
A
A
A
A
TDO
TCK
A
A
TMS
TDI
R
C
Document #:001-00350 Rev. **
Page 3 of 23
CY7C1292DV18
CY7C1294DV18
PRELIMINARY
Pin Definitions
Pin Name
I/O
Pin Description
D[x:0]
Input-
Synchronous
Data input signals, sampled on the rising edge of K and K clocks during valid write
operations.
CY7C1292DV18 - D[17:0]
CY7C1294DV18 - D[35:0]
WPS
Input-
Synchronous
Write Port Select, active LOW. Sampled on the rising edge of the K clock. When
asserted active, a Write operation is initiated. Deasserting will deselect the Write port.
Deselecting the Write port will cause D[x:0] to be ignored.
BWS0, BWS1,
BWS2, BWS3
Input-
Synchronous
Byte Write Select 0, 1, 2 and 3 − active LOW. Sampled on the rising edge of the K and
K clocks during Write operations. Used to select which byte is written into the device
during the current portion of the Write operations. Bytes not written remain unaltered.
CY7C1292DV18 − BWS0 controls D[8:0], BWS1 controls D[17:9]
.
CY7C1294DV18 − BWS0 controls D[8:0], BWS1 controls D[17:9],BWS2 controls D[26:18]
and BWS3 controls D[35:27].
All the Byte Write Selects are sampled on the same edge as the data. Deselecting a Byte
Write Select will cause the corresponding byte of data to be ignored and not written into
the device.
A
Input-
Synchronous
Address Inputs. Sampled on the rising edge of the K (Read address) and K (Write
address) clocks during active Read and Write operations. These address inputs are
multiplexed for both Read and Write operations. Internally, the device is organized as 1M
x 18 (2 arrays each of 512K x 18) for CY7C1292DV18 and 512K x 36 (2 arrays each of
256K x 36) for CY7C1294DV18. Therefore 18 address inputs for CY7C1292DV18 and
17 address inputs for CY7C1294DV18. These inputs are ignored when the appropriate
port is deselected.
Q[x:0]
Outputs-
Synchronous
Data Output signals. These pins drive out the requested data during a Read operation.
Valid data is driven out on the rising edge of both the C and C clocks during Read
operations or K and K when in single clock mode. When the Read port is deselected,
Q
[x:0] are automatically three-stated.
CY7C1292DV18 − Q[17:0]
CY7C1294DV18 − Q[35:0]
RPS
Input-
Synchronous
Read Port Select, active LOW. Sampled on the rising edge of Positive Input Clock (K).
When active, a Read operation is initiated. Deasserting will cause the Read port to be
deselected. When deselected, the pending access is allowed to complete and the output
drivers are automatically three-stated following the next rising edge of the C clock. Each
read access consists of a burst of two sequential transfers.
C
C
K
Input-
Clock
Positive Output Clock Input. C is used in conjunction with C to clock out the Read data
from the device. C and C can be used together to deskew the flight times of various
devices on the board back to the controller. See application example for further details.
Input-Clock
Input-Clock
Negative Output Clock Input. C is used in conjunction with C to clock out the Read data
from the device. C and C can be used together to deskew the flight times of various
devices on the board back to the controller. See application example for further details.
Positive Input Clock Input. The rising edge of K is used to capture synchronous inputs
to the device and to drive out data through Q[x:0] when in single clock mode. All accesses
are initiated on the rising edge of K.
K
Input-Clock
Echo Clock
Negative Input Clock Input. K is used to capture synchronous inputs being presented
to the device and to drive out data through Q[x:0] when in single clock mode.
CQ
CQ is referenced with respect to C. This is a free running clock and is synchronized
to the output clock (C) of the QDR-II. In the single clock mode, CQ is generated with
respect to K. The timings for the echo clocks are shown in the AC Timing table.
CQ
Echo Clock
CQ is referenced with respect to C. This is a free running clock and is synchronized
to the output clock (C) of the QDR-II. In the single clock mode, CQ is generated with
respect to K. The timings for the echo clocks are shown in the AC Timing table.
Document #:001-00350 Rev. **
Page 4 of 23
CY7C1292DV18
CY7C1294DV18
PRELIMINARY
Pin Definitions (continued)
Pin Name
I/O
Pin Description
ZQ
Input
Output Impedance Matching Input. This input is used to tune the device outputs to the
system data bus impedance. CQ, CQ, and Q[x:0] output impedance are set to 0.2 x RQ,
where RQ is a resistor connected between ZQ and ground. Alternately, this pin can be
connected directly to VDD, which enables the minimum impedance mode. This pin cannot
be connected directly to GND or left unconnected.
DOFF
Input
DLL Turn Off, active LOW. Connecting this pin to ground will turn off the DLL inside the
device. The timings in the DLL turned off operation will be different from those listed in
this data sheet. More details on this operation can be found in the application note, “DLL
Operation in the QDR-II.”
TDO
Output
Input
Input
Input
N/A
TDO for JTAG.
TCK
TCK pin for JTAG.
TDI
TDI pin for JTAG.
TMS
TMS pin for JTAG.
NC
Not connected to the die. Can be tied to any voltage level.
Not connected to the die. Can be tied to any voltage level.
Not connected to the die. Can be tied to any voltage level.
Not connected to the die. Can be tied to any voltage level.
Not connected to the die. Can be tied to any voltage level.
Not connected to the die. Can be tied to any voltage level.
NC/18M
NC/36M
NC/72M
NC/144M
NC/288M
VREF
N/A
N/A
N/A
N/A
N/A
Input-
Reference Voltage Input. Static input used to set the reference level for HSTL inputs
Reference
and Outputs as well as AC measurement points.
VDD
VSS
Power Supply
Ground
Power supply inputs to the core of the device.
Ground for the device.
VDDQ
Power Supply
Power supply inputs for the outputs of the device.
CY7C1292DV18 is described in the following sections. The
same basic descriptions apply to CY7C1294DV18.
Functional Overview
The CY7C1292DV18 and CY7C1294DV18 are synchronous
pipelined Burst SRAMs equipped with both a Read port and a
Write port. The Read port is dedicated to Read operations and
the Write port is dedicated to Write operations. Data flows into
the SRAM through the Write port and out through the Read
port. These devices multiplex the address inputs in order to
minimize the number of address pins required. By having
separate Read and Write ports, the QDR-II completely elimi-
nates the need to “turn-around” the data bus and avoids any
possible data contention, thereby simplifying system design.
Each access consists of two 18-bit data transfers in the case
of CY7C1292DV18 and two 36-bit data transfers in the case
of CY7C1294DV18, in one clock cycle.
Read Operations
The CY7C1292DV18 is organized internally as 2 arrays of
512K x 18. Accesses are completed in a burst of two
sequential 18-bit data words. Read operations are initiated by
asserting RPS active at the rising edge of the Positive Input
Clock (K). The address is latched on the rising edge of the K
Clock. The address presented to Address inputs is stored in
the Read address register. Following the next K clock rise the
corresponding lowest order 18-bit word of data is driven onto
the Q[17:0] using C as the output timing reference. On the
subsequent rising edge of C, the next 18-bit data word is
driven onto the Q[17:0]. The requested data will be valid 0.45
ns from the rising edge of the output clock (C and C or K and
K when in single clock mode).
Accesses for both ports are initiated on the rising edge of the
positive Input Clock (K). All synchronous input timings are
referenced from the rising edge of the input clocks (K and K)
and all output timings are referenced to the rising edge of
output clocks (C and C or K and K when in single clock mode).
Synchronous internal circuitry will automatically three-state
the outputs following the next rising edge of the Output Clocks
(C/C). This will allow for a seamless transition between
devices without the insertion of wait states in a depth
expanded memory.
All synchronous data inputs (D[x:0]) inputs pass through input
registers controlled by the input clocks (K and K). All
synchronous data outputs (Q[x:0]) outputs pass through output
registers controlled by the rising edge of the output clocks (C
and C or K and K when in single clock mode).
Write Operations
Write operations are initiated by asserting WPS active at the
rising edge of the Positive Input Clock (K). On the same K
clock rise, the data presented to D[17:0] is latched and stored
into the lower 18-bit Write Data register provided BWS[1:0] are
All synchronous control (RPS, WPS, BWS[x:0]) inputs pass
through input registers controlled by the rising edge of the
input clocks (K and K).
Document #:001-00350 Rev. **
Page 5 of 23
CY7C1292DV18
CY7C1294DV18
PRELIMINARY
both asserted active. On the subsequent rising edge of the
Negative Input Clock (K), the address is latched and the infor-
mation presented to D[17:0] is stored into the Write Data
register provided BWS[1:0] are both asserted active. The 36
bits of data are then written into the memory array at the
specified location. When deselected, the write port will ignore
all inputs after the pending Write operations have been
completed.
mation associated with the specified address location. This
includes forwarding data from a Write cycle that was initiated
on the previous K clock rise.
Depth Expansion
The CY7C1292DV18 has a Port Select input for each port.
This allows for easy depth expansion. Both Port Selects are
sampled on the rising edge of the Positive Input Clock only (K).
Each port select input can deselect the specified port.
Deselecting a port will not affect the other port. All pending
transactions (Read and Write) will be completed prior to the
device being deselected.
Byte Write Operations
Byte Write operations are supported by the CY7C1292DV18.
A Write operation is initiated as described in the Write Opera-
tions section above. The bytes that are written are determined
by BWS0 and BWS1, which are sampled with each 18-bit data
word. Asserting the appropriate Byte Write Select input during
the data portion of a Write will allow the data being presented
to be latched and written into the device. Deasserting the Byte
Write Select input during the data portion of a write will allow
the data stored in the device for that byte to remain unaltered.
This feature can be used to simplify Read/Modify/Write opera-
tions to a Byte Write operation.
Programmable Impedance
An external resistor, RQ, must be connected between the ZQ
pin on the SRAM and VSS to allow the SRAM to adjust its
output driver impedance. The value of RQ must be 5x the
value of the intended line impedance driven by the SRAM. The
allowable range of RQ to guarantee impedance matching with
a tolerance of ±15% is between 175Ω and 350Ω, with
VDDQ = 1.5V.The output impedance is adjusted every 1024
cycles upon power-up to account for drifts in supply voltage
and temperature.
Single Clock Mode
The CY7C1292DV18 can be used with a single clock that
controls both the input and output registers. In this mode, the
device will recognize only a single pair of input clocks (K and
K) that control both the input and output registers. This
operation is identical to the operation if the device had zero
skew between the K/K and C/C clocks. All timing parameters
remain the same in this mode. To use this mode of operation,
the user must tie C and C HIGH at power on. This function is
a strap option and not alterable during device operation.
Echo Clocks
Echo clocks are provided on the QDR-II to simplify data
capture on high-speed systems. Two echo clocks are
generated by the QDR-II. CQ is referenced with respect to C
and CQ is referenced with respect to C. These are
free-running clocks and are synchronized to the output clock
(C/C) of the QDR-II. In the single clock mode, CQ is generated
with respect to K and CQ is generated with respect to K. The
timings for the echo clocks are shown in the AC Timing table.
Concurrent Transactions
DLL
The Read and Write ports on the CY7C1292DV18 operate
completely independently of one another. Since each port
latches the address inputs on different clock edges, the user
can Read or Write to any location, regardless of the trans-
action on the other port. Also, reads and writes can be started
in the same clock cycle. If the ports access the same location
at the same time, the SRAM will deliver the most recent infor-
These chips utilize a Delay Lock Loop (DLL) that is designed
to function between 80 MHz and the specified maximum clock
frequency. The DLL may be disabled by applying ground to the
DOFF pin. The DLL can also be reset by slowing the cycle time
of input clocks K and K to greater than 30 ns.
Document #:001-00350 Rev. **
Page 6 of 23
CY7C1292DV18
CY7C1294DV18
PRELIMINARY
Application Example[1]
R = 250οηµσ
SRAM #1
SRAM #4
R = 250οηµσ
ZQ
CQ/CQ#
Q
ZQ
CQ/CQ#
Q
R W
R
P
S
#
B
W
S
W
B
W
S
Vt
R
P
S
#
P
S
#
P
S
#
D
A
D
A
C
C#
K
K#
C C# K
K#
#
#
DATA IN
DATA OUT
Address
RPS#
WPS#
BWS#
CLKIN/CLKIN#
Vt
Vt
R
BUS
MASTER
(CPU
or
Source K
Source K#
ASIC)
Delayed K
Delayed K#
R
R = 50οηµσ
Vt = Vddq/2
Truth Table[2, 3, 4, 5, 6, 7]
Operation
K
RPS
WPS
DQ
DQ
D(A + 1) at K(t) ↑
Write Cycle:
L-H
X
L
D(A + 0)at K(t) ↑
Load address on the rising edge of K clock;
input write data on K and K rising edges.
Read Cycle:
L-H
L
X
Q(A + 0) at C(t + 1)↑ Q(A + 1) at C(t + 2) ↑
Load address on the rising edge of K clock;
wait one and a half cycle; read data on C
and C rising edges.
NOP: No Operation
L-H
H
X
H
X
D = X
Q = High-Z
D = X
Q = High-Z
Standby: Clock Stopped
Stopped
Previous State
Previous State
Write Cycle Descriptions (CY7C1292DV18) [2, 8]
BWS0/NWS0 BWS1 / NWS1
K
K
Comments
L
L
L
L
L-H
–
During the Data portion of a Write sequence:
CY7C1292DV18 - both bytes (D[17:0]) are written into the device.
L
–
L-H During the Data portion of a Write sequence:
CY7C1292DV18 - both bytes (D[17:0]) are written into the device.
H
L-H
–
During the Data portion of a Write sequence:
CY7C1292DV18 - only the lower byte (D[8:0]) is written into the device. D[17:9]
will remain unaltered.
L
H
L
–
L-H During the Data portion of a Write sequence:
CY7C1292DV18 - only the lower byte (D[8:0]) is written into the device. D[17:9]
will remain unaltered.
H
L-H
–
During the Data portion of a Write sequence:
CY7C1292DV18 - only the upper byte (D[17:9]) is written into the device. D[8:0]
will remain unaltered.
Notes:
1. The above application shows four QDR-II being used.
2. X = “Don't Care,” H = Logic HIGH, L= Logic LOW, ↑represents rising edge.
3. Device will power-up deselected and the outputs in a three-state condition.
4. “A” represents address location latched by the devices when transaction was initiated. A + 00, A + 01 represents the internal address sequence in the burst.
5. “t” represents the cycle at which a Read/Write operation is started. t + 1 and t + 2 are the first and second clock cycles respectively succeeding the “t” clock cycle.
6. Data inputs are registered at K and K rising edges. Data outputs are delivered on C and C rising edges, except when in single clock mode.
7. It is recommended that K = K and C = C = HIGH when clock is stopped. This is not essential, but permits most rapid restart by overcoming transmission line
charging symmetrically.
8. Assumes a Write cycle was initiated per the Write Port Cycle Description Truth Table. BWS , BWS , BWS and BWS can be altered on different portions of a
0
1
2
3
Write cycle, as long as the set-up and hold requirements are achieved.
Document #:001-00350 Rev. **
Page 7 of 23
CY7C1292DV18
CY7C1294DV18
PRELIMINARY
Write Cycle Descriptions (CY7C1292DV18) (continued)[2, 8]
BWS0/NWS0 BWS1 / NWS1
K
K
Comments
H
L
–
L-H During the Data portion of a Write sequence:
CY7C1292DV18 - only the upper byte (D[17:9]) is written into the device. D[8:0]
will remain unaltered.
H
H
H
H
L-H
–
–
No data is written into the devices during this portion of a Write operation.
L-H No data is written into the devices during this portion of a Write operation.
[2, 8]
Write Cycle Descriptions (CY7C1294DV18)
BWS0 BWS1 BWS2 BWS3
K
K
Comments
L
L
L
L
L-H
-
During the Data portion of a Write sequence, all four bytes (D[35:0]) are written
into the device.
L
L
L
L
-
L-H
-
L-H During the Data portion of a Write sequence, all four bytes (D[35:0]) are written
into the device.
L
H
H
L
H
H
H
H
L
H
H
H
H
H
H
L
-
During the Data portion of a Write sequence, only the lower byte (D[8:0]) is written
into the device. D[35:9] will remain unaltered.
L
L-H During the Data portion of a Write sequence, only the lower byte (D[8:0]) is written
into the device. D[35:9] will remain unaltered.
H
H
H
H
H
H
L-H
-
-
During the Data portion of a Write sequence, only the byte (D[17:9]) is written into
the device. D[8:0] and D[35:18] will remain unaltered.
L
L-H During the Data portion of a Write sequence, only the byte (D[17:9]) is written into
the device. D[8:0] and D[35:18] will remain unaltered.
H
H
H
H
L-H
-
-
During the Data portion of a Write sequence, only the byte (D[26:18]) is written into
the device. D[17:0] and D[35:27] will remain unaltered.
L
L-H During the Data portion of a Write sequence, only the byte (D[26:18]) is written into
the device. D[17:0] and D[35:27] will remain unaltered.
H
H
L-H
-
During the Data portion of a Write sequence, only the byte (D[35:27]) is written into
the device. D[26:0] will remain unaltered.
L
L-H During the Data portion of a Write sequence, only the byte (D[35:27]) is written into
the device. D[26:0] will remain unaltered.
H
H
H
H
H
H
H
H
L-H
-
-
No data is written into the device during this portion of a Write operation.
L-H No data is written into the device during this portion of a Write operation.
Document #:001-00350 Rev. **
Page 8 of 23
CY7C1292DV18
CY7C1294DV18
PRELIMINARY
TDI and TDO pins as shown in TAP Controller Block Diagram.
Upon power-up, the instruction register is loaded with the
IDCODE instruction. It is also loaded with the IDCODE
instruction if the controller is placed in a reset state as
described in the previous section.
IEEE 1149.1 Serial Boundary Scan (JTAG)
These SRAMs incorporate a serial boundary scan test access
port (TAP) in the FBGA package. This part is fully compliant
with IEEE Standard #1149.1-1900. The TAP operates using
JEDEC standard 1.8V I/O logic levels.
When the TAP controller is in the Capture IR state, the two
least significant bits are loaded with a binary “01” pattern to
allow for fault isolation of the board level serial test path.
Disabling the JTAG Feature
It is possible to operate the SRAM without using the JTAG
feature. To disable the TAP controller, TCK must be tied LOW
(VSS) to prevent clocking of the device. TDI and TMS are inter-
nally pulled up and may be unconnected. They may alternately
be connected to VDD through a pull-up resistor. TDO should
be left unconnected. Upon power-up, the device will come up
in a reset state which will not interfere with the operation of the
device.
Bypass Register
To save time when serially shifting data through registers, it is
sometimes advantageous to skip certain chips. The bypass
register is a single-bit register that can be placed between TDI
and TDO pins. This allows data to be shifted through the
SRAM with minimal delay. The bypass register is set LOW
(VSS) when the BYPASS instruction is executed.
Test Access Port—Test Clock
Boundary Scan Register
The test clock is used only with the TAP controller. All inputs
are captured on the rising edge of TCK. All outputs are driven
from the falling edge of TCK.
The boundary scan register is connected to all of the input and
output pins on the SRAM. Several no connect (NC) pins are
also included in the scan register to reserve pins for higher
density devices.
Test Mode Select
The boundary scan register is loaded with the contents of the
RAM Input and Output ring when the TAP controller is in the
Capture-DR state and is then placed between the TDI and
TDO pins when the controller is moved to the Shift-DR state.
The EXTEST, SAMPLE/PRELOAD and SAMPLE Z instruc-
tions can be used to capture the contents of the Input and
Output ring.
The TMS input is used to give commands to the TAP controller
and is sampled on the rising edge of TCK. It is allowable to
leave this pin unconnected if the TAP is not used. The pin is
pulled up internally, resulting in a logic HIGH level.
Test Data-In (TDI)
The TDI pin is used to serially input information into the
registers and can be connected to the input of any of the
registers. The register between TDI and TDO is chosen by the
instruction that is loaded into the TAP instruction register. For
information on loading the instruction register, see the TAP
Controller State Diagram. TDI is internally pulled up and can
be unconnected if the TAP is unused in an application. TDI is
connected to the most significant bit (MSB) on any register.
The Boundary Scan Order tables show the order in which the
bits are connected. Each bit corresponds to one of the bumps
on the SRAM package. The MSB of the register is connected
to TDI, and the LSB is connected to TDO.
Identification (ID) Register
The ID register is loaded with a vendor-specific, 32-bit code
during the Capture-DR state when the IDCODE command is
loaded in the instruction register. The IDCODE is hardwired
into the SRAM and can be shifted out when the TAP controller
is in the Shift-DR state. The ID register has a vendor code and
other information described in the Identification Register
Definitions table.
Test Data-Out (TDO)
The TDO output pin is used to serially clock data-out from the
registers. The output is active depending upon the current
state of the TAP state machine (see Instruction codes). The
output changes on the falling edge of TCK. TDO is connected
to the least significant bit (LSB) of any register.
TAP Instruction Set
Performing a TAP Reset
Eight different instructions are possible with the three-bit
instruction register. All combinations are listed in the
Instruction Code table. Three of these instructions are listed
as RESERVED and should not be used. The other five instruc-
tions are described in detail below.
A Reset is performed by forcing TMS HIGH (VDD) for five
rising edges of TCK. This RESET does not affect the operation
of the SRAM and may be performed while the SRAM is
operating. At power-up, the TAP is reset internally to ensure
that TDO comes up in a high-Z state.
Instructions are loaded into the TAP controller during the
Shift-IR state when the instruction register is placed between
TDI and TDO. During this state, instructions are shifted
through the instruction register through the TDI and TDO pins.
To execute the instruction once it is shifted in, the TAP
controller needs to be moved into the Update-IR state.
TAP Registers
Registers are connected between the TDI and TDO pins and
allow data to be scanned into and out of the SRAM test
circuitry. Only one register can be selected at a time through
the instruction registers. Data is serially loaded into the TDI pin
on the rising edge of TCK. Data is output on the TDO pin on
the falling edge of TCK.
IDCODE
The IDCODE instruction causes a vendor-specific, 32-bit code
to be loaded into the instruction register. It also places the
instruction register between the TDI and TDO pins and allows
the IDCODE to be shifted out of the device when the TAP
controller enters the Shift-DR state. The IDCODE instruction
Instruction Register
Three-bit instructions can be serially loaded into the instruction
register. This register is loaded when it is placed between the
Document #:001-00350 Rev. **
Page 9 of 23
CY7C1292DV18
CY7C1294DV18
PRELIMINARY
is loaded into the instruction register upon power-up or
whenever the TAP controller is given a test logic reset state.
The shifting of data for the SAMPLE and PRELOAD phases
can occur concurrently when required—that is, while data
captured is shifted out, the preloaded data can be shifted in.
SAMPLE Z
BYPASS
The SAMPLE Z instruction causes the boundary scan register
to be connected between the TDI and TDO pins when the TAP
controller is in a Shift-DR state. The SAMPLE Z command puts
the output bus into a High-Z state until the next command is
given during the “Update IR” state.
When the BYPASS instruction is loaded in the instruction
register and the TAP is placed in a Shift-DR state, the bypass
register is placed between the TDI and TDO pins. The
advantage of the BYPASS instruction is that it shortens the
boundary scan path when multiple devices are connected
together on a board.
SAMPLE/PRELOAD
SAMPLE/PRELOAD is a 1149.1 mandatory instruction. When
the SAMPLE/PRELOAD instructions are loaded into the
instruction register and the TAP controller is in the Capture-DR
state, a snapshot of data on the inputs and output pins is
captured in the boundary scan register.
EXTEST
The EXTEST instruction enables the preloaded data to be
driven out through the system output pins. This instruction also
selects the boundary scan register to be connected for serial
access between the TDI and TDO in the shift-DR controller
state.
The user must be aware that the TAP controller clock can only
operate at a frequency up to 20 MHz, while the SRAM clock
operates more than an order of magnitude faster. Because
there is a large difference in the clock frequencies, it is
possible that during the Capture-DR state, an input or output
will undergo a transition. The TAP may then try to capture a
signal while in transition (metastable state). This will not harm
the device, but there is no guarantee as to the value that will
be captured. Repeatable results may not be possible.
EXTEST OUTPUT BUS THREE-STATE
IEEE Standard 1149.1 mandates that the TAP controller be
able to put the output bus into a three-state mode.
The boundary scan register has a special bit located at bit #47.
When this scan cell, called the “extest output bus three-state,”
is latched into the preload register during the “Update-DR”
state in the TAP controller, it will directly control the state of the
output (Q-bus) pins, when the EXTEST is entered as the
current instruction. When HIGH, it will enable the output
buffers to drive the output bus. When LOW, this bit will place
the output bus into a High-Z condition.
To guarantee that the boundary scan register will capture the
correct value of a signal, the SRAM signal must be stabilized
long enough to meet the TAP controller's capture set-up plus
hold times (tCS and tCH). The SRAM clock input might not be
captured correctly if there is no way in a design to stop (or
slow) the clock during a SAMPLE/PRELOAD instruction. If this
is an issue, it is still possible to capture all other signals and
simply ignore the value of the CK and CK captured in the
boundary scan register.
This bit can be set by entering the SAMPLE/PRELOAD or
EXTEST command, and then shifting the desired bit into that
cell, during the “Shift-DR” state. During “Update-DR”, the value
loaded into that shift-register cell will latch into the preload
register. When the EXTEST instruction is entered, this bit will
directly control the output Q-bus pins. Note that this bit is
pre-set LOW to enable the output when the device is
powered-up, and also when the TAP controller is in the
“Test-Logic-Reset” state.
Once the data is captured, it is possible to shift out the data by
putting the TAP into the Shift-DR state. This places the
boundary scan register between the TDI and TDO pins.
PRELOAD allows an initial data pattern to be placed at the
latched parallel outputs of the boundary scan register cells
prior to the selection of another boundary scan test operation.
Reserved
These instructions are not implemented but are reserved for
future use. Do not use these instructions.
Document #:001-00350 Rev. **
Page 10 of 23
CY7C1292DV18
CY7C1294DV18
PRELIMINARY
TAP Controller State Diagram[9]
TEST-LOGIC
1
RESET
0
1
1
1
TEST-LOGIC/
IDLE
SELECT
DR-SCAN
SELECT
IR-SCAN
0
0
0
1
1
CAPTURE-DR
CAPTURE-IR
0
0
SHIFT-DR
0
SHIFT-IR
0
1
1
EXIT1-DR
0
1
EXIT1-IR
0
1
0
0
PAUSE-DR
1
PAUSE-IR
1
0
0
EXIT2-DR
1
EXIT2-IR
1
UPDATE-DR
UPDATE-IR
1
1
0
0
Note:
9. The 0/1 next to each state represents the value at TMS at the rising edge of TCK.
Document #:001-00350 Rev. **
Page 11 of 23
CY7C1292DV18
CY7C1294DV18
PRELIMINARY
TAP Controller Block Diagram
0
Bypass Register
Selection
Circuitry
Selection
Circuitry
2
1
1
0
TDO
TDI
Instruction Register
29
31 30
.
.
2
0
0
Identification Register
106
.
.
.
.
2
1
Boundary Scan Register
TCK
TMS
TAP Controller
TAP Electrical Characteristics Over the Operating Range [10, 11, 12]
Parameter
VOH1
Description
Output HIGH Voltage
Test Conditions
IOH = −2.0 mA
Min.
1.4
Max.
Unit
V
VOH2
VOL1
VOL2
VIH
Output HIGH Voltage
Output LOW Voltage
Output LOW Voltage
Input HIGH Voltage
IOH = −100 µA
IOL = 2.0 mA
IOL = 100 µA
1.6
V
0.4
0.2
V
V
0.65VDD
–0.3
VDD + 0.3
0.35VDD
5
V
VIL
Input LOW Voltage
V
IX
Input and Output Load Current
GND ≤ VI ≤ VDD
−5
µA
Notes:
10. These characteristic pertain to the TAP inputs (TMS, TCK, TDI and TDO). Parallel load levels are specified in the Electrical Characteristics table.
11. Overshoot: V (AC) < V +0.85V (Pulse width less than t /2), Undershoot: V (AC) > –1.5V (Pulse width less than t /2).
IH
DDQ
CYC
IL
CYC
12. All voltage referenced to Ground.
Document #:001-00350 Rev. **
Page 12 of 23
CY7C1292DV18
CY7C1294DV18
PRELIMINARY
TAP AC Switching Characteristics Over the Operating Range[13, 14]
Parameter
tTCYC
Description
Min.
Max.
Unit
ns
TCK Clock Cycle Time
TCK Clock Frequency
TCK Clock HIGH
50
tTF
20
MHz
ns
tTH
40
40
tTL
TCK Clock LOW
ns
Set-up Times
tTMSS
tTDIS
TMS Set-up to TCK Clock Rise
TDI Set-up to TCK Clock Rise
Capture Set-up to TCK Rise
10
10
10
ns
ns
ns
tCS
Hold Times
tTMSH
tTDIH
TMS Hold after TCK Clock Rise
TDI Hold after Clock Rise
10
10
10
ns
ns
ns
tCH
Capture Hold after Clock Rise
Output Times
tTDOV TCK Clock LOW to TDO Valid
tTDOX TCK Clock LOW to TDO Invalid
20
ns
ns
0
TAP Timing and Test Conditions[13]
0.9V
50Ω
ALL INPUT PULSES
0.9V
1.8V
TDO
Z = 50Ω
0
0V
C = 20 pF
L
tTL
tTH
GND
(a)
tTCYC
Test Clock
TCK
tTMSS
tTMSH
Test Mode Select
TMS
tTDIS
tTDIH
Test Data-In
TDI
Test Data-Out
TDO
tTDOV
tTDOX
Notes:
13. Test conditions are specified using the load in TAP AC test conditions. t /t = 1 ns.
R
F
14. t and t refer to the set-up and hold time requirements of latching data from the boundary scan register.
CS
CH
Document #:001-00350 Rev. **
Page 13 of 23
CY7C1292DV18
CY7C1294DV18
PRELIMINARY
Identification Register Definitions
Value
Instruction Field
Revision Number (31:29)
Cypress Device ID (28:12)
Cypress JEDEC ID (11:1)
CY7C1292DV18
CY7C1294DV18
Description
Version number.
000
000
11010011010010110
00000110100
11010011010100110
00000110100
Defines the type of SRAM.
Unique identification of
SRAM vendor.
ID Register Presence (0)
1
1
Indicates the presence of an
ID register.
Scan Register Sizes
Register Name
Instruction
Bit Size
3
1
Bypass
ID
32
107
Boundary Scan Cells
Instruction Codes
Instruction
EXTEST
Code
000
Description
Captures the Input/Output ring contents.
IDCODE
001
Loads the ID register with the vendor ID code and places the register between
TDI and TDO. This operation does not affect SRAM operation.
SAMPLE Z
010
Captures the Input/Output contents. Places the boundary scan register
between TDI and TDO. Forces all SRAM output drivers to a High-Z state.
RESERVED
011
100
Do Not Use: This instruction is reserved for future use.
SAMPLE/PRELOAD
Captures the Input/Output ring contents. Places the boundary scan register
between TDI and TDO. Does not affect the SRAM operation.
RESERVED
RESERVED
BYPASS
101
110
111
Do Not Use: This instruction is reserved for future use.
Do Not Use: This instruction is reserved for future use.
Places the bypass register between TDI and TDO. This operation does not
affect SRAM operation.
Boundary Scan Order
Boundary Scan Order (continued)
Bit #
0
Bump ID
6R
Bit #
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
Bump ID
9M
1
6P
9N
2
6N
11L
11M
9L
3
7P
4
7N
5
7R
10L
11K
10K
9J
6
8R
7
8P
8
9R
9
11P
10P
10N
9P
9K
10
11
12
13
14
10J
11J
11H
10G
9G
10M
11N
Document #:001-00350 Rev. **
Page 14 of 23
CY7C1292DV18
CY7C1294DV18
PRELIMINARY
Boundary Scan Order (continued)
Boundary Scan Order (continued)
Bit #
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
Bump ID
Bit #
74
Bump ID
2D
2E
1E
2F
11F
11G
9F
75
76
10F
11E
10E
10D
9E
77
78
3F
79
1G
1F
80
81
3G
2G
1J
10C
11D
9C
82
83
84
2J
9D
85
3K
3J
11B
11C
9B
86
87
2K
1K
2L
88
10B
11A
Internal
9A
89
90
3L
91
1M
1L
92
8B
93
3N
3M
1N
2M
3P
2N
2P
1P
3R
4R
4P
5P
5N
5R
7C
94
6C
95
8A
96
7A
97
7B
98
6B
99
6A
100
101
102
103
104
105
106
5B
5A
4A
5C
4B
3A
1H
1A
2B
3B
1C
1B
3D
3C
1D
2C
3E
Document #:001-00350 Rev. **
Page 15 of 23
CY7C1292DV18
CY7C1294DV18
PRELIMINARY
Power-Up Sequence in QDR-II SRAM[15, 16]
QDRII SRAMs must be powered up and initialized in a
predefined manner to prevent undefined operations.
DLL Constraints
• DLL uses either K or C clock as its synchronizing input, the
input should have low phase jitter which is specified as TKC
var.
• The lower end of the frequency at which the DLL can oper-
ate is 80 MHz.
• If the incoming clock is unstable and the DLL is enabled,
then the DLL may lock onto a wrong frequency and this may
cause the failure in the initial stage.
Power-Up Sequence
• Apply power and keep DOFF at low state (All other inputs
may be undefined)
— Apply VDD before VDDQ
— Apply VDDQ before VREF or the same time with VREF
• Just after the stable power and clock (K,K, C, C), take DOFF
to be high.
• The additional 1024 cycles of clock input is required to lock
the DLL after enabling DLL
Power Up Waveforms
Power Up and Initialization Sequence (DOFF pin controlled)
K, K
1024 cycle
Status
Unstable CLKstage
Power-Up
Any Command
DLL Locking Range
Inputs Clock must be stable
VDD
VDDQ
VREF
D
OFF
Power Up and Initialization Sequence (DOFF pin Fixed high, Clock controlled)
K, K
Min 30 ns
1024 cycle
Status
Unstable CLKstage
Power-Up
Any Command
Stop Clock
DLL Locking Range
Inputs Clock must be stable
VDD
VDDQ
VREF
Notes:
15. If DOFF is to be tied high with unstable clock, then the clock should be stopped for a few (Min. 30 ns) to reset the DLL after it become a stable clock status.
16. DLL must be reset again if the operating frequency is changed. After DLL reset, the minimum number of clock cycles required to lock the DLL is 1024 cycles
Document #:001-00350 Rev. **
Page 16 of 23
CY7C1292DV18
CY7C1294DV18
PRELIMINARY
Current into Outputs (LOW)......................................... 20 mA
Maximum Ratings
Static Discharge Voltage.......................................... > 2001V
(per MIL-STD-883, Method 3015)
(Above which the useful life may be impaired.)
Storage Temperature .................................–65°C to +150°C
Latch-up Current.................................................... > 200 mA
Ambient Temperature with
Power Applied...............................................–10°C to +85°C
Operating Range
Supply Voltage on VDD Relative to GND........ –0.5V to +2.9V
Ambient
[19]
[19]
Range Temperature (TA)
VDD
VDDQ
1.4V to VDD
DC Voltage Applied to Outputs
in High-Z State .................................... –0.5V to VDDQ + 0.3V
DC Input Voltage[11] ............................ –0.5V to VDDQ + 0.3V
Com’l
Ind’l
0°C to +70°C
1.8 ± 0.1 V
–40°C to +85°C
Electrical Characteristics Over the Operating Range[12, 19]
DC Electrical Characteristics
Parameter
VDD
Description
Power Supply Voltage
I/O Supply Voltage
Test Conditions
Min.
1.7
Typ.
1.8
Max.
Unit
V
1.9
VDDQ
VOH
1.4
1.5
VDD
V
Output HIGH Voltage
Output LOW Voltage
Output HIGH Voltage
Output LOW Voltage
Input HIGH Voltage[11]
Input LOW Voltage[11]
Input Load Current
Note 17
Note 18
VDDQ/2 – 0.12
VDDQ/2 – 0.12
VDDQ/2 + 0.12
V
VOL
VDDQ/2 + 0.12
VDDQ
0.2
V
VOH(LOW)
VOL(LOW)
VIH
IOH = −0.1 mA, Nominal Impedance
VDDQ – 0.2
VSS
V
IOL = 0.1 mA, Nominal Impedance
V
VREF + 0.1
–0.3
VDDQ+0.3
VREF – 0.1
5
V
VIL
V
IX
GND ≤ VI ≤ VDDQ
−5
µA
µA
V
IOZ
Output Leakage Current
Input Reference Voltage[20] Typical Value = 0.75V
GND ≤ VI ≤ VDDQ, Output Disabled
−5
5
VREF
IDD
0.68
0.75
0.95
VDD Operating Supply
VDD = Max.,
OUT = 0 mA,
f = fMAX = 1/tCYC
167 MHz
200 MHz
250 MHz
300 MHz
900
mA
mA
mA
mA
mA
mA
mA
mA
I
1050
1300
1575
300
ISB1
Automatic Power-down
Current
Max. VDD, Both Ports 167 MHz
Deselected, VIN ≥ VIH
200 MHz
350
or VIN ≤ VIL
250 MHz
300 MHz
400
f = fMAX = 1/tCYC
,
Inputs Static
485
Shaded areas contain advance information. Please contact your local Cypress Sales representative for availability of these parts.
AC Input Requirements Over the Operating Range
Parameter
VIH
Description
Test Conditions
Min.
Typ.
Max.
Unit
Input High (Logic 1) Voltage
VREF
0.2
+
–
–
V
VIL
Input Low (Logic 0) Voltage
–
–
VREF
0.2
-
V
Notes:
17. Output are impedance controlled. I = –(V
/2)/(RQ/5) for values of 175Ω <= RQ <= 350Ω.
OH
DDQ
18. Output are impedance controlled. I = (V
/2)/(RQ/5) for values of 175Ω <= RQ <= 350Ω.
OL
DDQ
19. Power-up: Assumes a linear ramp from 0V to V (min.) within 200 ms. During this time V < V and V
< V
DD
.
DD
IH
DD
DDQ
20. V
(Min.) = 0.68V or 0.46V
, whichever is larger, V
(Max.) = 0.95V or 0.54V
, whichever is smaller.
REF
DDQ
REF
DDQ
Document #:001-00350 Rev. **
Page 17 of 23
CY7C1292DV18
CY7C1294DV18
PRELIMINARY
Switching Characteristics Over the Operating Range[21, 22]
300 MHz
250 MHz
200 MHz
167 MHz
Cypress Consortium
Parameter Parameter
Description
Min. Max. Min. Max. Min. Max. Min. Max. Unit
tPOWER
VDD(Typical) to the first Access[25]
K Clock and C Clock Cycle Time
Input Clock (K/K and C/C) HIGH
Input Clock (K/K and C/C) LOW
1
1
1
1
ms
ns
ns
ns
ns
tCYC
tKH
tKHKH
tKHKL
tKLKH
tKHKH
3.30 5.25 4.0
6.3
–
5.0 7.9 6.0 7.9
1.32
1.32
–
–
–
1.6
1.6
1.8
2.0
2.0
2.2
–
–
–
2.4
2.4
2.7
–
–
–
tKL
–
tKHKH
K Clock Rise to K Clock Rise and C to C 1.49
Rise (rising edge to rising edge)
–
tKHCH
tKHCH
K/K Clock Rise to C/C Clock Rise (rising 0.0 1.45 0.0
edge to rising edge)
1.8
0.0 2.2 0.0 2.7
ns
Set-up Times
tSA tSA
tSC
Address Set-up to K Clock Rise
0.3
0.4
–
–
0.35
0.5
–
–
0.4
0.6
–
–
0.5
0.5
–
–
ns
ns
tSC
tSC
tSD
Control Set-up to Clock (K, K) Rise (RPS,
WPS)
tSCDDR
DoubleDataRateControlSet-uptoClock 0.3
(K, K) Rise (BWS0, BWS1, BWS3, BWS4)
–
–
0.35
0.35
–
–
0.4
0.4
–
–
0.5
0.5
–
–
ns
ns
tSD
D[X:0] Set-up to Clock (K and K) Rise
0.3
Hold Times
tHA
tHC
tHA
tHC
Address Hold after Clock (K and K) Rise 0.3
–
–
0.35
0.5
–
–
0.4
0.6
–
–
0.5
0.5
–
–
ns
ns
Control Hold after Clock (K and K) Rise
(RPS, WPS)
0.4
tHCDDR
tHC
Double Data Rate Control Hold after Clock 0.3
(K and K) Rise (BWS0, BWS1, BWS3,
BWS4)
–
–
0.35
0.35
–
–
0.4
0.4
–
–
0.5
0.5
–
–
ns
ns
tHD
tHD
D[X:0] Hold after Clock (K and K) Rise
0.3
Output Times
tCO
tCHQV
C/C Clock Rise (or K/K in Single Clock
Mode) to Data Valid
0.45
–
–
0.45
–
–
0.45
–
–
0.50 ns
ns
tDOH
tCHQX
Data Output Hold after Output C/C Clock –0.45
Rise (Active to Active)
–0.45
-0.45
-0.50
–
tCCQO
tCQOH
tCQD
tCHCQV
tCHCQX
tCQHQV
tCQHQX
tCHZ
C/C Clock Rise to Echo Clock Valid
Echo Clock Hold after C/C Clock Rise
Echo Clock High to Data Valid
–
0.45
–
–
–0.45
–
0.45
–
–
–0.45
–
0.45
–
–
–0.50
–
0.50 ns
ns
0.40 ns
ns
0.50 ns
–0.45
–
0.27
–
0.30
–
0.35
–
tCQDOH
tCHZ
Echo Clock High to Data Invalid
–0.27
–
–0.30
–
–0.35
–
–0.40
–
–
Clock (C and C) Rise to High-Z (Active to
High-Z)[23,24]
0.45
0.45
0.45
tCLZ
tCLZ
Clock (C and C) Rise to Low-Z[23,24]
–0.45
–
–0.45
–
–0.45
–
–0.50
–
ns
DLL Timing
tKC Var
tKC Var
Clock Phase Jitter
–
0.20
–
–
0.20
–
–
0.20
–
–
0.20 ns
tKC lock
tKC lock
tKC Reset
DLL Lock Time (K, C)
K Static to DLL Reset
1024
30
1024
30
1024
30
1024
30
–
–
cycles
ns
tKC Reset
–
–
–
Shaded areas contain advance information. Please contact your local Cypress Sales representative for availability of these parts.
Notes:
21. All devices can operate at clock frequencies as low as 119 MHz. When a part with a maximum frequency above 133 MHz is operating at a lower clock frequency,
it requires the input timings of the frequency range in which it is being operated and will output data with the output timings of that frequency range.
22. Unless otherwise noted, test conditions assume signal transition time of 2V/ns, timing reference levels of 0.75V, Vref = 0.75V, RQ = 250Ω, V
= 1.5V, input
DDQ
pulse levels of 0.25V to 1.25V, and output loading of the specified I /I and load capacitance shown in (a) of AC Test Loads.
OL OH
23. t
, t
, are specified with a load capacitance of 5 pF as in (b) of AC Test Loads. Transition is measured ± 100 mV from steady-state voltage.
CHZ CLZ
24. At any given voltage and temperature t
is less than t
and t
less than t
.
CO
CHZ
CLZ
CHZ
25. This part has a voltage regulator internally; t
is the time that the power needs to be supplied above V minimum initially before a read or write operation
POWER
DD
can be initiated.
Document #:001-00350 Rev. **
Page 18 of 23
CY7C1292DV18
CY7C1294DV18
PRELIMINARY
Thermal Resistance[26]
Parameter
Description
Thermal Resistance
(Junction to Ambient)
Test Conditions
165 FBGA Package Unit
ΘJA
Test conditions follow standard test
methods and procedures for
measuring thermal impedance, per
EIA/JESD51.
28.51
°C/W
ΘJC
Thermal Resistance
(Junction to Case)
5.91
°C/W
Capacitance[26]
Parameter
Description
Test Conditions
Max.
Unit
CIN
Input Capacitance
TA = 25°C, f = 1 MHz,
5
6
7
pF
pF
pF
V
DD = 1.8V
CCLK
CO
Clock Input Capacitance
Output Capacitance
VDDQ = 1.5V
AC Test Loads and Waveforms
V
REF = 0.75V
0.75V
VREF
VREF
OUTPUT
Device
0.75V
R = 50Ω
OUTPUT
[11]
ALL INPUT PULSES
Z = 50Ω
0
1.25V
Device
R = 50Ω
L
0.75V
Under
Test
0.25V
5 pF
Slew Rate = 2V/ns
Under
Test
VREF = 0.75V
ZQ
ZQ
(a)
RQ =
250Ω
RQ =
250Ω
INCLUDING
JIG AND
SCOPE
(b)
Note:
26. Tested initially and after any design or process change that may affect these parameters.
Document #:001-00350 Rev. **
Page 19 of 23
CY7C1292DV18
CY7C1294DV18
PRELIMINARY
Switching Waveforms[27, 28, 29]
Read/Write/Deselect Sequence
READ
WRITE
READ
WRITE
READ
WRITE
NOP
WRITE
NOP
6
1
2
3
4
5
7
8
10
9
K
t
t
t
t
KH
KL
CYC
KHKH
K
RPS
t
t
HC
SC
WPS
A
A5
A6
A0
A1
t
A2
t
A3
A4
t
t
SA HA
D11
SA HA
D30
D
Q
D10
D31
D50
D51
D60
Q20
D61
Q21
t
t
HD
t
t
HD
SD
SD
Q00
Q01
Q40
Q41
t
CHZ
t
CLZ
t
t
t
CQD
DOH
DOH
t
KHCH
t
t
KL
t
t
CO
CO
C
C
t
KH
t
t
KHKH
CYC
KHCH
t
CCQO
CQOH
t
CQ
CQ
t
CCQO
CQOH
t
DON’T CARE
UNDEFINED
Notes:
27. Q00 refers to output from address A0. Q01 refers to output from the next internal burst address following A0, i.e., A0 + 1.
28. Output are disabled (High-Z) one clock cycle after a NOP.
29. In this example, if address A2 = A1,then data Q20 = D10 and Q21 = D11. Write data is forwarded immediately as read results. This note applies to the whole
diagram.
Document #:001-00350 Rev. **
Page 20 of 23
CY7C1292DV18
CY7C1294DV18
PRELIMINARY
Ordering Information
Speed
Package
Operating
Range
(MHz)
Ordering Code
Name
Package Type
13 x 15 x 1.4 mm FBGA
300
CY7C1292DV18-300BZC
CY7C1294DV18-300BZC
BB165D
Commercial
Commercial
Industrial
CY7C1292DV18-300BZXC
CY7C1294DV18-300BZXC
BB165D
BB165D
BB165D
BB165D
BB165D
BB165D
BB165D
BB165D
BB165D
BB165D
BB165D
BB165D
BB165D
BB165D
BB165D
13 x 15 x 1.4 mm FBGA (Lead-Free)
13 x 15 x 1.4 mm FBGA
CY7C1292DV18-300BZI
CY7C1294DV18-300BZI
CY7C1292DV18-300BZXI
CY7C1294DV18-300BZXI
13 x 15 x 1.4 mm FBGA (Lead-Free)
13 x 15 x 1.4 mm FBGA
Industrial
250
200
167
CY7C1292DV18-250BZC
CY7C1294DV18-250BZC
Commercial
Commercial
Industrial
CY7C1292DV18-250BZXC
CY7C1294DV18-250BZXC
13 x 15 x 1.4 mm FBGA (Lead-Free)
13 x 15 x 1.4 mm FBGA
CY7C1292DV18-250BZI
CY7C1294DV18-250BZI
CY7C1292DV18-250BZXI
CY7C1294DV18-250BZXI
13 x 15 x 1.4 mm FBGA (Lead-Free)
13 x 15 x 1.4 mm FBGA
Industrial
CY7C1292DV18-200BZC
CY7C1294DV18-200BZC
Commercial
Commercial
Industrial
CY7C1292DV18-200BZXC
CY7C1294DV18-200BZXC
13 x 15 x 1.4 mm FBGA (Lead-Free)
13 x 15 x 1.4 mm FBGA
CY7C1292DV18-200BZI
CY7C1294DV18-200BZI
CY7C1292DV18-200BZXI
CY7C1294DV18-200BZXI
13 x 15 x 1.4 mm FBGA (Lead-Free)
13 x 15 x 1.4 mm FBGA
Industrial
CY7C1292DV18-167BZC
CY7C1294DV18-167BZC
Commercial
Commercial
Industrial
CY7C1292DV18-167BZXC
CY7C1294DV18-167BZXC
13 x 15 x 1.4 mm FBGA (Lead-Free)
13 x 15 x 1.4 mm FBGA
CY7C1292DV18-167BZI
CY7C1294DV18-167BZI
CY7C1292DV18-167BZXI
CY7C1294DV18-167BZXI
13 x 15 x 1.4 mm FBGA (Lead-Free)
Industrial
Shaded areas contain advance information. Please contact your local Cypress Sales representative for availability of these parts.
Document #:001-00350 Rev. **
Page 21 of 23
CY7C1292DV18
CY7C1294DV18
PRELIMINARY
Package Diagram
165 FBGA 13 x 15 x 1.40 mm BB165D
51-85180-**
QDR RAMs and Quad Data Rate RAMs comprise a new family of products developed by Cypress, Hitachi, IDT, NEC, and Samsung
technology. All product and company names mentioned in this document are the trademarks of their respective holders.
Document #:001-00350 Rev. **
Page 22 of 23
© Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
CY7C1292DV18
CY7C1294DV18
PRELIMINARY
Document History Page
Document Title: CY7C1292DV18/CY7C1294DV18 9-Mbit QDR- II™ SRAM 2-Word Burst Architecture
Document Number: 001-00350
Orig. of
REV.
ECN No. Issue Date Change
Description of Change
**
380737
See ECN
SYT
New data sheet
Document #:001-00350 Rev. **
Page 23 of 23
相关型号：
CY7C1292DV18-300BZXC
QDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-165
CYPRESS
CY7C1292DV18-300BZXI
QDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-165
CYPRESS
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