CY7C1399BN-12VC [CYPRESS]

256K (32K x 8) Static RAM; 256K ( 32K ×8 )静态RAM
CY7C1399BN-12VC
型号: CY7C1399BN-12VC
厂家: CYPRESS    CYPRESS
描述:

256K (32K x 8) Static RAM
256K ( 32K ×8 )静态RAM

文件: 总8页 (文件大小:307K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
CY7C1399BN  
256K (32K x 8) Static RAM  
expansion is provided by an active LOW Chip Enable (CE) and  
active LOW Output Enable (OE) and tri-state drivers. The  
device has an automatic power-down feature, reducing the  
power consumption by more than 95% when deselected.  
Features  
• Temperature Ranges  
— Industrial: –40°C to 85°C  
— Automotive-A: –40°C to 85°C  
• Single 3.3V power supply  
• Ideal for low-voltage cache memory applications  
• High speed: 12 ns  
An active LOW Write Enable signal (WE) controls the  
writing/reading operation of the memory. When CE and WE  
inputs are both LOW, data on the eight data input/output pins  
(I/O0 through I/O7) is written into the memory location  
addressed by the address present on the address pins (A0  
through A14). Reading the device is accomplished by selecting  
the device and enabling the outputs, CE and OE active LOW,  
while WE remains inactive or HIGH. Under these conditions,  
the contents of the location addressed by the information on  
address pins is present on the eight data input/output pins.  
• Low active power  
— 180 mW (max.)  
• Low-power alpha immune 6T cell  
• Available in Pb-free and non Pb-free Plastic SOJ and  
TSOP I packages  
The input/output pins remain in a high-impedance state unless  
the chip is selected, outputs are enabled, and Write Enable  
(WE) is HIGH. The CY7C1399BN is available in 28-pin  
standard 300-mil-wide SOJ and TSOP Type I packages.  
Functional Description[1]  
The CY7C1399BN is a high-performance 3.3V CMOS Static  
RAM organized as 32,768 words by 8 bits. Easy memory  
Logic Block Diagram  
Pin Configurations  
SOJ  
Top View  
A
A
6
V
CC  
28  
27  
26  
1
2
3
4
5
6
5
WE  
A
7
A
4
A
3
A
8
I/O  
0
I/O  
1
I/O  
2
I/O  
3
I/O  
4
I/O  
5
I/O  
6
25  
24  
INPUT BUFFER  
A
9
A
2
A
10  
23  
22  
A
0
A
1
A
1
A
11  
7
8
9
10  
11  
12  
13  
OE  
A
0
A
2
A
12  
21  
20  
19  
18  
17  
A
3
A
4
A
13  
CE  
I/O  
32K x 8  
ARRAY  
A
5
A
A
14  
6
A
7
7
A
I/O  
I/O  
6
0
8
A
9
I/O  
I/O  
5
1
16  
15  
I/O  
GND  
I/O  
2
4
CE  
WE  
I/O  
14  
3
POWER  
DOWN  
COLUMN  
DECODER  
I/O  
7
OE  
Selection Guide  
-12  
12  
-15  
-20  
Maximum Access Time (ns)  
15  
50  
20  
45  
Maximum Operating Current (mA)  
Maximum CMOS Standby Current (µA)  
55  
Commercial  
500  
50  
500  
50  
500  
50  
Commercial (L)  
Industrial  
500  
500  
500  
Automotive-A  
Note:  
1. For guidelines on SRAM system design, please refer to the ‘System Design Guidelines’ Cypress application note, available on the internet at www.cypress.com.  
Cypress Semiconductor Corporation  
Document #: 001-06490 Rev. *A  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised August 31, 2006  
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CY7C1399BN  
Pin Configuration  
TSOP  
Top View  
21  
20  
OE  
1
22  
23  
A
CE  
I/O  
I/O  
I/O  
I/O  
I/O  
0
A
A
19  
18  
17  
16  
24  
2
7
A
25  
26  
27  
28  
1
3
6
5
4
3
A
4
WE  
15  
14  
13  
V
CC  
5
6
A
GND  
I/O  
A
2
3
2
A7  
12  
11  
I/O  
I/O  
A
1
0
A
4
5
8
10  
9
A
14  
9
10  
11  
A
A
A
13  
6
7
8
A
12  
Output Current into Outputs (LOW)............................. 20 mA  
Maximum Ratings  
Static Discharge Voltage........................................... >2001V  
(per MIL-STD-883, Method 3015)  
(Above which the useful life may be impaired. For user guide-  
lines, not tested.)  
Latch-Up Current.................................................... >200 mA  
Storage Temperature .................................65°C to +150°C  
Operating Range  
Ambient Temperature with  
Power Applied.............................................55°C to +125°C  
Ambient  
Supply Voltage on VCC to Relative GND[2] .... –0.5V to +4.6V  
Range  
Commercial  
Industrial  
Temperature  
VCC  
0°C to +70°C  
–40°C to +85°C  
–40°C to +85°C  
3.3V ±300 mV  
DC Voltage Applied to Outputs  
in High Z State[2] ....................................–0.5V to VCC + 0.5V  
DC Input Voltage[2].................................–0.5V to VCC + 0.5V  
Automotive-A  
Electrical Characteristics Over the Operating Range[1]  
-12  
-15  
-20  
Parameter  
VOH  
Description  
Test Conditions  
Min. Max. Min. Max. Min. Max. Unit  
Output HIGH Voltage VCC = Min., IOH = –2.0 mA  
Output LOW Voltage VCC = Min., IOL = 4.0 mA  
Input HIGH Voltage  
2.4  
2.4  
2.4  
V
V
V
VOL  
0.4  
2.2 VCC  
0.3V  
0.8 –0.3 0.8  
0.4  
2.2 VCC  
0.3V  
0.4  
VIH  
+
+
2.2 VCC +  
0.3V  
0.8  
+1  
VIL  
IIX  
Input LOW Voltage[2]  
Input Leakage Current  
–0.3  
–1  
–0.3  
–1  
V
+1  
+5  
–1  
–5  
+1  
+5  
µA  
µA  
IOZ  
Output Leakage  
Current  
GND VI VCC  
,
–5  
–5  
+5  
Output Disabled  
ICC  
VCC Operating  
Supply Current  
VCC = Max., IOUT = 0 mA,  
f = fMAX = 1/tRC  
55  
50  
45  
5
mA  
ISB1  
Automatic CE  
Power-Down  
Current—  
Max. VCC, CE VIH,  
VIN VIH, or VIN VIL,  
f = fMAX  
Comm’l  
Comm’l (L)  
Ind’l  
5
4
5
5
4
mA  
mA  
TTL Inputs  
5
Auto-A  
5
ISB2  
Automatic CE  
Power-Down  
Current— CMOS  
Inputs[3]  
Max. VCC, CE VCC – 0.3V, Comm’l  
VIN VCC – 0.3V, or VIN 0.3V,  
500  
50  
500  
50  
500  
500  
500 µA  
Comm’l (L)  
µA  
µA  
µA  
WE VCC – 0.3V or WE 0.3V,  
f = fMAX  
Ind’l  
500  
Auto-A  
Notes:  
2. Minimum voltage is equal to 2.0V for pulse durations of less than 20 ns.  
3. Device draws low standby current regardless of switching on the addresses.  
Document #: 001-06490 Rev. *A  
Page 2 of 8  
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CY7C1399BN  
Capacitance[4]  
Parameter  
Description  
Test Conditions  
Max.  
Unit  
pF  
CIN: Addresses  
CIN: Controls  
COUT  
Input Capacitance  
TA = 25°C, f = 1 MHz,  
CC = 3.3V  
5
6
6
V
pF  
Output Capacitance  
pF  
AC Test Loads and Waveforms[5]  
R1 317Ω  
ALL INPUT PULSES  
90%  
3.3V  
Equivalent to: THÉVENINEQUIVALENT  
3.0V  
90%  
10%  
OUTPUT  
167Ω  
10%  
OUTPUT  
1.73V  
GND  
R2  
351Ω  
C
L
3 ns  
3 ns  
INCLUDING  
JIG AND  
SCOPE  
Switching Characteristics Over the Operating Range[5]  
-12  
-15  
-20  
Parameter  
Read Cycle  
tRC  
Description  
Min.  
12  
3
Max.  
Min.  
15  
3
Max.  
Min.  
Max.  
Unit  
Read Cycle Time  
20  
3
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tAA  
Address to Data Valid  
Data Hold from Address Change  
CE LOW to Data Valid  
OE LOW to Data Valid  
OE LOW to Low Z[6]  
OE HIGH to High Z[6, 7]  
CE LOW to Low Z[6]  
CE HIGH to High Z[6, 7]  
CE LOW to Power-Up  
CE HIGH to Power-Down  
12  
15  
20  
tOHA  
tACE  
12  
5
15  
6
20  
7
tDOE  
tLZOE  
tHZOE  
tLZCE  
tHZCE  
tPU  
0
3
0
0
3
0
0
3
0
5
6
6
7
6
7
tPD  
12  
15  
20  
Write Cycle[8, 9]  
tWC  
tSCE  
tAW  
Write Cycle Time  
12  
8
15  
10  
10  
0
20  
12  
12  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
CE LOW to Write End  
Address Set-Up to Write End  
Address Hold from Write End  
Address Set-Up to Write Start  
WE Pulse Width  
8
tHA  
0
tSA  
0
0
0
tPWE  
tSD  
8
10  
8
12  
10  
0
Data Set-Up to Write End  
Data Hold from Write End  
WE LOW to High Z[8]  
7
tHD  
0
0
tHZWE  
7
7
7
tLZWE  
WE HIGH to Low Z[6]  
3
3
3
Notes:  
4. Tested initially and after any design or process changes that may affect these parameters.  
5. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified  
/I and capacitance C = 30 pF.  
I
OL OH  
L
6. At any given temperature and voltage condition, t  
is less than t  
, t  
is less than t  
, and t  
is less than t  
for any given device.  
HZCE  
LZCE HZOE  
LZOE  
HZWE  
LZWE  
7. t  
, t  
, t  
are specified with C = 5 pF as in AC Test Loads. Transition is measured ±500 mV from steady state voltage.  
HZOE HZCE HZWE L  
8. The internal write time of the memory is defined by the overlap of CE LOW and WE LOW. Both signals must be LOW to initiate a write and either signal can  
terminate a write by going HIGH. The data input set-up and hold timing should be referenced to the rising edge of the signal that terminates the write.  
9. The minimum write cycle time for write cycle #3 (WE controlled, OE LOW) is the sum of t  
and t  
.
HZWE  
SD  
Document #: 001-06490 Rev. *A  
Page 3 of 8  
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CY7C1399BN  
Data Retention Characteristics (Over the Operating Range - L version only)  
Parameter  
Description  
VCC for Data Retention  
Data Retention Current  
Conditions  
Min.  
2.0  
0
Max.  
Unit  
V
VDR  
ICCDR  
tCDR  
VCC = VDR = 2.0V,  
CE > VCC – 0.3V,  
IN > VCC – 0.3V or  
IN < 0.3V  
20  
µA  
ns  
Chip Deselect to Data  
Retention Time  
0
V
V
tR  
Operation Recovery Time  
tRC  
ns  
Data Retention Waveform  
DATA RETENTION MODE  
> 2V  
3.0V  
3.0V  
V
V
CC  
DR  
t
t
R
CDR  
CE  
Switching Waveforms  
Read Cycle No. 1[10, 11]  
t
RC  
ADDRESS  
t
AA  
t
OHA  
DATA OUT  
PREVIOUS DATA VALID  
DATA VALID  
Read Cycle No. 2[11, 12]  
t
RC  
CE  
OE  
t
ACE  
t
t
HZOE  
t
DOE  
HZCE  
t
LZOE  
HIGH  
IMPEDANCE  
HIGH IMPEDANCE  
DATA OUT  
DATA VALID  
t
LZCE  
t
PD  
t
PU  
V
ICC  
ISB  
CC  
SUPPLY  
CURRENT  
50%  
50%  
Notes:  
10. Device is continuously selected. OE, CE = V  
11. WE is HIGH for read cycle.  
.
IL  
12. Address valid prior to or coincident with CE transition LOW.  
Document #: 001-06490 Rev. *A  
Page 4 of 8  
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CY7C1399BN  
Switching Waveforms (continued)  
Write Cycle No. 1 (WE Controlled)[8, 13, 14]  
t
WC  
ADDRESS  
CE  
t
t
HA  
AW  
t
SA  
t
PWE  
WE  
OE  
t
SD  
t
HD  
NOTE 15  
DATA VALID  
DATA I/O  
IN  
t
HZOE  
Write Cycle No. 2 (CE Controlled)[8, 13, 14]  
t
WC  
ADDRESS  
CE  
t
SCE  
t
SA  
t
t
HA  
AW  
WE  
t
t
HD  
SD  
DATA I/O  
DATA VALID  
IN  
Write Cycle No. 3 (WE Controlled, OE LOW)[9, 14]  
t
WC  
ADDRESS  
CE  
t
t
AW  
HA  
t
SA  
WE  
t
t
HD  
SD  
DATA VALID  
DATA I/O  
NOTE 15  
IN  
t
t
LZWE  
HZWE  
Notes:  
13. Data I/O is high impedance if OE = V  
.
IH  
14. If CE goes HIGH simultaneously with WE HIGH, the output remains in a high-impedance state.  
15. During this period, the I/Os are in the output state and input signals should not be applied.  
Document #: 001-06490 Rev. *A  
Page 5 of 8  
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CY7C1399BN  
Truth Table  
CE  
H
L
WE  
X
OE  
X
Input/Output  
High Z  
Mode  
Deselect/Power-Down  
Power  
Standby (ISB  
Active (ICC  
Active (ICC  
Active (ICC  
)
H
L
Data Out  
Data In  
High Z  
Read  
)
L
L
X
Write  
)
L
H
H
Deselect, Output Disabled  
)
Ordering Information  
Speed  
Package  
Diagram  
Operating  
(ns)  
Ordering Code  
CY7C1399BN-12VC  
CY7C1399BN-12VXC  
CY7C1399BN-12ZC  
CY7C1399BN-12ZXC  
CY7C1399BNL-12ZC  
CY7C1399BNL-12ZXC  
CY7C1399BN-12VXI  
CY7C1399BN-15VC  
CY7C1399BN-15VXC  
CY7C1399BN-15ZC  
CY7C1399BN-15ZXC  
CY7C1399BNL-15ZXC  
CY7C1399BNL-15VXC  
CY7C1399BN-15VI  
CY7C1399BN-15VXI  
CY7C1399BN-15ZI  
Package Type  
Range  
12  
51-85031 28-Lead Molded SOJ  
28-Lead Molded SOJ (Pb-free)  
51-85071 28-Lead TSOP I  
28-Lead TSOP I (Pb-free)  
Commercial  
28-Lead TSOP I  
28-Lead TSOP I (Pb-free)  
51-85031 28-Lead Molded SOJ (Pb-free)  
28-Lead Molded SOJ  
Industrial  
15  
Commercial  
28-Lead Molded SOJ (Pb-free)  
51-85071 28-Lead TSOP I  
28-Lead TSOP I (Pb-free)  
28-Lead TSOP I (Pb-free)  
51-85031 28-Lead Molded SOJ (Pb-free)  
28-Lead Molded SOJ  
Industrial  
28-Lead Molded SOJ (Pb-free)  
51-85071 28-Lead TSOP I  
28-Lead TSOP I (Pb-free)  
CY7C1399BN-15ZXI  
CY7C1399BN-15VXA  
CY7C1399BN-20ZXC  
51-85031 28-Lead Molded SOJ (Pb-free)  
51-85071 28-Lead TSOP I (Pb-free)  
Automotive-A  
Commercial  
20  
Please contact local sales representative regarding availability of these parts.  
Document #: 001-06490 Rev. *A  
Page 6 of 8  
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CY7C1399BN  
Package Diagrams  
NOTE :  
28-Lead (300-Mil) Molded SOJ (51-85031)  
1. JEDEC STD REF MO088  
2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH  
MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.006 in (0.152 mm) PER SIDE  
MIN.  
3. DIMENSIONS IN INCHES  
MAX.  
DETAIL  
A
PIN 1 ID  
EXTERNAL LEAD DESIGN  
14  
1
0.291  
0.300  
0.330  
0.350  
0.026  
0.032  
0.013  
0.019  
15  
28  
0.014  
0.020  
OPTION 1  
OPTION 2  
0.697  
0.713  
SEATING PLANE  
0.120  
0.140  
0.007  
0.013  
0.004  
A
0.262  
0.272  
0.050  
TYP.  
51-85031-*C  
0.025 MIN.  
28-Lead TSOP 1 (8x13.4 mm) (51-85071)  
51-85071-*G  
All products and company names mentioned in this document may be the trademarks of their respective holders.  
Document #: 001-06490 Rev. *A  
Page 7 of 8  
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use  
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be  
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its  
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress  
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.  
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CY7C1399BN  
Document History Page  
Document Title: CY7C1399BN 256K (32K x 8) Static RAM  
Document Number: 001-06490  
ISSUE  
DATE  
ORIG. OF  
CHANGE  
REV.  
**  
ECN NO.  
423877  
498575  
DESCRIPTION OF CHANGE  
See ECN  
See ECN  
NXR  
NXR  
New Data Sheet  
Added Automotive-A range  
*A  
Removed IOS parameter from DC Electrical Characteristics table  
Updated Ordering Information table.  
Document #: 001-06490 Rev. *A  
Page 8 of 8  
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