CY8C20180-LDX2I [CYPRESS]
CapSense Express⑩ -8 Configurable IOs; CapSense的Express⑩ -8的IO配置
| 型号： | CY8C20180-LDX2I |
| 厂家： | 
CYPRESS |
| 描述： | CapSense Express⑩ -8 Configurable IOs |
| 文件： | 总12页 (文件大小：333K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CY8C20180
CapSense Express™ -8 Configurable IOs
Features
Overview
■ 8 configurable IOs supporting
❐ CapSense buttons
❐ LED Drive
❐ Interrupt outputs
❐ WAKE on interrupt input
❐ User defined input or output
The CapSense ExpressTM controller allows the control of 8 IOs
configurable as capacitive sensing buttons or as GPIOs for
driving LEDs or interrupt signals based on various button
conditions. The GPIOs are also configurable for waking up the
device from sleep based on an interrupt input.
The user has the ability to configure buttons, outputs, and
parameters through specific commands sent to the I2C port. The
IOs have the flexibility in mapping to capacitive buttons and as
standard GPIO functions such as interrupt output or input, LED
drive and digital mapping of input to output using simple logical
operations. This enables easy PCB trace routing and reduces
the PCB size and stack up. CapSense Express products are
designed for easy integration into complex products.
■ 2.4V to 5.25V operating voltage
■ Industrial temperature range: –40°C to +85°C
■ I2C slave interface for configuration
❐ Selectable to 50 kHz,100 kHz and 400 kHz
■ Reduce BOM cost
❐ Internal oscillator - no external oscillators or crystal
❐ Free development tool - no external tuning components
Architecture
The logic block diagram illustrates the internal architecture of
CY8C20180.
■ Low operating current
❐ Active current: continuous sensor scan:1.5 mA
❐ Sleep current: no scan, continuous sleep: 2.6 uA
The user can configure registers with parameters needed to
adjust the operation and sensitivity of the CapSense system.
CY8C20180 supports a standard I2C serial communications
interface that allows the host to configure the device and to read
sensor information in real time through easy register access.
■ Available in 16-pin COL and 16-pin SOIC packages
The CapSense Express Core
The CapSense Express Core has a powerful configuration and
control block. It encompasses SRAM for data storage, an
interrupt controller, sleep and watchdog timers. System
resources provide additional capability, such as a configurable
I2C slave communication interface and various system resets.
The Analog System is composed of the CapSense PSoC block
which supports capacitive sensing of up to eight inputs.
Cypress Semiconductor Corporation
Document Number: 001-17346 Rev. *C
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised March 11, 2008
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CY8C20180
Logic Block Diagram
External
Vcc
8 Configurable IOs
2KB Flash
2.4 - 5.25V
TM
CapSense Express
Core
512B
SRAM
Document Number: 001-17346 Rev. *C
Page 2 of 12
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CY8C20180
Pinouts
Figure 1. Pin Diagram - 16 Pin COL
Table 1. Pin Definitions - 16 Pin COL
Pin Number
Name
Description
1
2
GP0[0]
GP0[1]
I2C SCL
I2C SDA
GP1[0]
GP1[1]
VSS
Configurable as CapSense or GPIO
Configurable as CapSense or GPIO
I2C clock
3
4
I2C data
5
Configurable as CapSense or GPIO
Configurable as CapSense or GPIO
Ground connection
6
7
8
GP1[2]
GP1[3]
GP1[4]
XRES
GP0[2]
VDD
Configurable as CapSense or GPIO
Configurable as CapSense or GPIO
Configurable as CapSense or GPIO
Active HIGH external reset with internal pull down
Configurable as CapSense or GPIO
Supply voltage
9
10
11
12
13
14
15
GP0[3]
CSInt
Configurable as CapSense or GPIO
Integrating Input.The external capacitance is required only if 5:1 SNR
cannot be achieved. Typical range is 10-100 nF.
16
GP0[4]
Configurable as CapSense or GPIO
Document Number: 001-17346 Rev. *C
Page 3 of 12
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CY8C20180
Figure 2. Pin Diagram - 16 Pin SOIC
GP0[3]
1
2
3
VDD
16
15
CSInt
GP0[4]
GP0[0]
GP0[1]
I2CSCL
I2CSDA
GP0[2]
XRES
14
13
12
4
5
GP1[4]
GP1[3]
GP1[2]
SOIC
(Top View)
6
7
8
11
10
9
V
SS
GP1[0]
GP1[1]
Table 2. Pin Definitions - 16 Pin SOIC
Pin Number
Name
GP0[3]
Description
1
2
Configurable as CapSense or GPIO
CSInt
Integrating Input.The external capacitance is required only if 5:1 SNR
cannot be achieved. Typical range is 10-100 nF.
3
4
GP0[4]
GP0[0]
GP0[1]
I2C SCL
I2C SDA
GP1[0]
GP1[1]
VSS
Configurable as CapSense or GPIO
Configurable as CapSense or GPIO
Configurable as CapSense or GPIO
I2C clock
5
6
7
I2C data
8
Configurable as CapSense or GPIO
Configurable as CapSense or GPIO
Ground connection
9
10
11
12
13
14
15
16
GP1[2]
GP1[3]
GP1[4]
XRES
Configurable as CapSense or GPIO
Configurable as CapSense or GPIO
Configurable as CapSense or GPIO
Active HIGH external reset with internal pull down.
Configurable as CapSense or GPIO
Supply voltage
GP0[2]
VDD
Document Number: 001-17346 Rev. *C
Page 4 of 12
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CY8C20180
2
The CapSense Analog System
I C Interface
The CapSense analog system contains the capacitive sensing
hardware. which supports CapSense Successive Approximation
(CSA) algorithm.This hardware performs capacitive sensing and
scanning without external components. Capacitive sensing is
configurable on each pin.
The two modes of operation for the I2C interface are:
■ Device register configuration and status read or write for
controller.
■ Command execution.
The I2C address is programmable during configuration. It can be
locked to prevent accidental change by setting a flag in a config-
uration register.
Additional System Resources
System resources provide additional capability useful to
complete systems. Additional resources are low voltage
detection and power on reset (POR).
CapSense Express Software Tool
■ The I2C slave provides 50, 100, or 400 kHz communication
over two wires.
An easy to use software tool integrated with PSoC Express is
available for configuring and tuning CapSense Express devices.
Refer to the Application Note AN42137 for details of the software
tool.
■ Low Voltage Detection (LVD) interrupts signal the application
of falling voltage levels and the advanced POR circuit elimi-
nates the need for a system supervisor.
CapSense Express Register Map
An internal 1.8V reference provides a stable internal reference
so that capacitive sensing functionality is not affected by minor
VDD changes.
CapSense Express supports user configurable registers through
which the device functionality and parameters are configured.
For details, refer to CY8C201xx Register Reference document.
Electrical Specifications
Absolute Maximum Ratings
Parameter
Description
Storage temperature
Min
Typ
Max
Unit
Notes
TSTG
–55
25
+100
°C Higher storage temperatures reduce
data retention time. Recommended
storage temperature is +25°C ± 25°C
(0°C to 50°C). Extended duration
storage temperatures above 65°C
degrade reliability.
TA
Ambient temperature with power
applied
–40
–
+85
ºC
VDD
VIO
Supply voltage on VDD relative to VSS
DC input voltage
–0.5
VSS – 0.5
VSS – 0.5
–25
–
–
–
–
–
–
+6.0
VDD + 0.5
VDD + 0.5
+50
V
V
VIOZ
IMIO
ESD
LU
DC voltage applied to tri-state
Maximum current into any GPIO pin
Electro static discharge voltage
Latch up current
V
mA
2000
–
V
Human body model ESD
–
200
mA
Operating Temperature
Parameter
Description
Min
–40
–40
Typ
–
Max
+85
Unit
°C
Notes
TA
TJ
Ambient temperature
Junction temperature
–
+100
°C
Document Number: 001-17346 Rev. *C
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CY8C20180
DC Electrical Characteristics
DC Chip-Level Specifications
Parameter
VDD
Description
Supply voltage
Min
2.40
–
Typ
–
Max
5.25
2.5
4
Unit
Notes
V
IDD
Supply current
1.5
2.6
mA Conditions are VDD = 3.0V, TA = 25°C
µA VDD = 2.55V, 0°C < TA < 40°C
ISB
Sleep mode current with POR and
LVD active. Mid temperature range
–
ISB
ISB
Sleep mode current with POR and
LVD active.
–
–
2.8
5.2
5
µA VDD = 3.3V, –40°C < TA < 85°C
µA VDD = 5.25V, –40°C < TA < 85°C
Sleep mode current with POR and
LVD active.
6.4
ri
5 and 3.3V DC General Purpose IO Specifications
This Table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C<
TA<85°C, 3.0V to 3.6V and -40°C<TA<85°C respectively. Typical parameters apply to 5V and 3.3V at 25°C. These are for design
guidance only.
Parameter
RPU
Description
Pull up resistor
Min
4
Typ
5.6
–
Max
8
Unit
kΩ
V
Notes
VOH1
High output voltage
Port 0 pins
VDD – 0.2
–
IOH = 10 µA, VDD > 3.0V, maximum of
20 mA source current in all IOs.
VOH2
VOH3
VOH
High output voltage
Port 0 pins
VDD – 0.9
VDD – 0.2
VDD – 0.9
2.75
–
–
–
–
V
V
V
V
IOH = 1 mA, VDD > 3.0V, maximum of
20 mA source current in all IOs.
High output voltage
Port 1 pins
IOH < 10 µA, VDD> 3.0V, maximum of
10 mA source current in all IOs.
High output voltage
Port 1 pins
–
–
IOH = 5 mA, VDD> 3.0V, maximum of
20 mA source current in all IOs.
VOH5
High output voltage.
Port 1 pins with 3.0V LDO regulator
enabled
3.0
3.2
IOH < 10 µA, VDD> 3.1V, maximum of
4 IOs all sourcing 5mA.
VOH6
VOH7
VOH8
VOL
High Output Voltage
2.2
2.1
2
–
2.4
–
–
2.5
–
V
V
V
V
IOH = 5 mA, VDD> 3.1V, maximum of
20 mA source current in all IOs.
Port 1 pins with 3.0V LDO regulator
enabled
High Output Voltage.
IOH < 10 µA, VDD> 3.0V, maximum of
20 mA source current in all IOs.
Port 1 pins with 2.4V LDO regulator
enabled
High Output Voltage.
IOH < 200 µA, VDD > 3.0V, maximum
of 20 mA source current in all IOs.
Port 1 pins with 2.4V LDO regulator
enabled
Low output voltage
–
–
0.75
IOL = 20 mA, VDD > 3V, maximum of 60
mA sink current on even port pins and
60 mA sink current on odd port pins
VIL
Input low voltage
Input high voltage
–
–
–
0.75
–
V
V
VDD = 3 to 3.6V
VIH
1.6
VDD = 3 to 3.6V
VIL
VIH
VH
Input low voltage
–
2.0
–
–
–
0.8
–
V
V
VDD = 3.6 to 5.25V.
VDD = 3.6 to 5.25V.
Input high voltage
Input hysteresis voltage
140
–
mV
Document Number: 001-17346 Rev. *C
Page 6 of 12
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CY8C20180
5 and 3.3V DC General Purpose IO Specifications (continued)
This Table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C<
TA<85°C, 3.0V to 3.6V and -40°C<TA<85°C respectively. Typical parameters apply to 5V and 3.3V at 25°C. These are for design
guidance only.
Parameter
Description
Input leakage
Min
–
Typ
1
Max
–
Unit
nA
Notes
IL
Gross tested to 1 µA.
CIN
Capacitive load on pins as input
0.5
1.7
5
pF
Package and pin dependent.
Temp = 25°C
COUT
Capacitive load on pins as output
0.5
1.7
5
pF
Package and pin dependent.
Temp = 25°C
2.7 V DC General Purpose IO Specifications
This Table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 2.4V to 3.0V and -40°C<.
TA <85°C, respectively. Typical parameters apply to 2.7V at 25°C. These are for design guidance only.
Parameter
RPU
Description
Pull up resistor
Min
4
Typ
5.6
–
Max
8
Unit
kΩ
V
Notes
VOH1
High output voltage
Port 0 pins
VDD – 0.2
–
IOH < 10 µA, maximum of 10 mA
source current in all IOs.
VOH2
VOH3
VOH4
VOL
High output voltage
Port 0 pins
VDD – 0.5
VDD – 0.2
VDD – 0.5
–
–
–
–
–
–
–
V
V
V
V
IOH = 0.2 mA, maximum of 10 mA
source current in all IOs.
High output voltage
Port 1 pins
IOH < 10 µA, maximum of 10 mA
source current in all IOs.
High output voltage
Port 1 pins
–
IOH = 2 mA, maximum of 10 mA source
current in all IOs.
Low output voltage
0.75
IOL = 10 mA, maximum of 30 mA sink
current on even port pins and 30 mA
sink current on odd port pins
VOLP1
Low output voltage port 1 pins
–
–
0.4
V
IOL=5mA Maximum of 50mA sink
current on even port pins and 50mA
sink current on odd port pins
2.4<Vdd<3.6V
VIL
Input low voltage
–
1.4
1.6
–
–
–
0.75
–
V
V
VDD = 2.4 to 3.6V.
VDD = 2.4 to 2.7V.
VDD = 2.7 to 3.6V.
VIH1
VIH2
VH
Input high voltage
Input high voltage
V
Input hysteresis voltage
Input leakage
60
1
–
–
5
mV
nA
pF
IIL
–
Gross tested to 1 µA.
CIN
Capacitive Load On Pins As Input
0.5
1.7
Package and pin dependent.
Temp = 25°C.
COUT
0.5
1.7
5
pF
Package and pin dependent.
Temp = 25°C.
Capacitive load on pins as output
Document Number: 001-17346 Rev. *C
Page 7 of 12
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CY8C20180
DC POR and LVD Specifications
Parameter
Description
VDD Value PPOR Trip
VDD= 2.7V
DD= 3.3V,5V
VDD Value for LVD trip
Min
Typ
Max
Unit
Notes
VDD must be greater than or equal to
2.5V during startup, reset from the
XRES pin, or reset from Watchdog.
VPPOR0
VPPOR1
–
–
2.36
2.60
2.40
2.65
V
V
V
VLVD0
VLVD2
VLVD6
V
V
DD= 2.7V
DD= 3.3V
2.39
2.75
3.98
2.45
2.92
4.05
2.51
2.99
4.12
V
V
V
VDD= 5V
AC Electrical Characteristics
5.0V and 3.3V AC General Purpose IO Specifications
Parameter
Description
Rise time, strong mode,
Cload = 50pF, Port 0
Min
Max
Unit
Notes
TRise0
15
10
10
80
50
50
ns
VDD = 3.0V to 3.6V and 4.75V to 5.25V,
10% - 90%
TRise1
TFall
Rise time, strong mode,
Cload = 50pF, Port 1
ns
ns
VDD = 3.0V to 3.6V, 10% - 90%
Fall time, strong mode,
Cload = 50pF, all ports
VDD = 3.0V to 3.6V and 4.75V to 5.25V,
10% - 90%
2.7V AC General Purpose IO Specifications
Parameter
Description
Rise time, strong mode,
Min
Max
Unit
Notes
TRise0
15
100
ns
VDD = 2.4V to 3.0V, 10% - 90%
Cload = 50pF, Port 0
TRise1
TFall
Rise time, strong mode,
Cload = 50pF, Port 1
10
10
70
70
ns
ns
VDD = 2.4V to 3.0V, 10% - 90%
Fall time, strong mode,
Cload = 50pF, all ports
VDD = 2.4V to 3.0V, 10% - 90%
2
AC I C Specifications
Standard Mode
Fast Mode
Parameter
Description
SCL clock frequency
Unit
Notes
Min
Max
Min
Max
FSCLI2C
0
100
0
400
KHz Fast mode not supported for
VDD < 3.0V
THDSTAI2C Hold time (repeated) START
condition. After this period, the
first clock pulse is generated.
4.0
–
0.6
–
µs
TLOWI2C
THIGHI2C
LOW period of the SCL clock
HIGH period of the SCL clock
4.7
4.0
4.7
–
–
–
1.3
0.6
0.6
–
–
–
µs
µs
µs
TSUSTAI2C Setup time for a repeated START
condition
THDDATI2C Data hold time
0
–
–
–
–
0
–
–
–
–
µs
ns
µs
µs
TSUDATI2C Data setup time
250
4.0
4.7
100
0.6
1.3
TSUSTOI2C Setup time for STOP condition
TBUFI2C
BUS free time between a STOP
and START condition
TSPI2C
Pulse width of spikes suppressed
by the input filter
–
–
0
50
ns
Document Number: 001-17346 Rev. *C
Page 8 of 12
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CY8C20180
Figure 3. Definition for Timing for Fast/Standard Mode on the I2C Bus
Document Number: 001-17346 Rev. *C
Page 9 of 12
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CY8C20180
Ordering Information
Operating
Temperature
Ordering Code
Package Diagram
Package Type
CY8C20180-LDX2I
CY8C20180-SX2I
001-09116
51-85068
16 COL[3]
16 SOIC
Industrial
Industrial
Thermal Impedances by Package
[1]
Package
16 COL[3]
16 SOIC
Typical θJA
46 °C
79.96 °C
Solder Reflow Peak Temperature
Package
16 COL[3]
16 SOIC
Minimum Peak Temperature[2]
Maximum Peak Temperature
240 °C
240 °C
260 °C
260 °C
.
Notes
1.
T = T + Power x θ
J A JA.
2. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5°C with Sn-Pb or 245 ± 5°C with Sn-Ag-Cu paste.
Refer to the solder manufacturer specifications.
3. Earlier termed as QFN package.
Document Number: 001-17346 Rev. *C
Page 10 of 12
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CY8C20180
Package Diagram
Figure 4. 16L Chip On Lead 3 X 3 mm Package Outline (SAWN) - 001-09116 - (Pb-Free)
DIMENSIONS IN mm MIN.
MAX.
2.9
3.1
0.20 min
0.45
0.55
1.5 (NOM)
1
2
2
1
2.9
3.1
0.152 REF.
0.05 MAX
0.20 DIA TYP.
PIN #1 ID
0.30
0.18
0.60 MAX
0.50
SEATING PLANE
1.5
SIDE VIEW
BOTTOM VIEW
TOP VIEW
JEDEC # MO-220
DESCRIPTION
PART NO.
Package Weight: 0.014g
LEAD-FREE
STANDARD
LG16A
LD16A
001-09116-*C
Figure 5. 16 - Pin (150-Mil) SOIC (51-85068)
51-85068-*B
Document Number: 001-17346 Rev. *C
Page 11 of 12
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CY8C20180
Document History Page
Document Title: CY8C20180 CapSense Express™ -8 Configurable IOs
Document Number: 001-17346
Orig. of
Change
REV.
ECN.
Description of Change
**
1341766
1494145
TUP/FSU
New Data Sheet
*A
TUP/AESA Changed to FINAL Datasheet
Removed table - 2.7V DC General Purpose IO Specifications - Open Drain with a pull up to
1.8V
Updated Logic Block Diagram
*B
*C
1773608
2091026
TUP/AESA Removed table - 3V DC General Purpose IO Specifications
Updated Logic Block Diagram
Updated table - DC POR and LVD Specifications
Updated table - DC Chip Level Specifications
Updated table - 5V and 3.3V DC General Purpose IO Specifications
Updated table - 2.7V DC General Purpose IO Specifications
Updated table - AC GPIO Specifications and split it into two tables for 5V/3.3V and 2.7V
Added section on CapSense ExpressTM Software tool
Updated 16-QFN Package Diagram
DZU/MOHD Updated table-DC Chip Level Specifications
/AESA
Updated table-Pin Definitions 16 pin COL
Updated table-Pin Definitions 16 pin SOIC
Updated table-5V and 3.3V DC General Purpose IO Specifications
Updated table - 2.7V DC General Purpose IO Specifications
Changed definition for Timing for Fast/Standard Mode on the I2C Bus diagram
© Cypress Semiconductor Corporation, 2007-2008. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
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United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 001-17346 Rev. *C
Revised March 11, 2008
Page 12 of 12
PSoC Designer™, Programmable System-on-Chip™, and PSoC Express™ are trademarks and PSoC® is a registered trademark of Cypress Semiconductor Corp. All other trademarks or registered
2
trademarks referenced herein are property of the respective corporations. Purchase of I C components from Cypress or one of its sublicensed Associated Companies conveys a license under the
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Philips I C Patent Rights to use these components in an I C system, provided that the system conforms to the I C Standard Specification as defined by Philips. All products and company names
mentioned in this document may be the trademarks of their respective holders.
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