CYONS2110 [CYPRESS]

OvationONS? II Wired Laser Navigation System-on-Chip; 这款OvationONS ? II有线激光导航系统单芯片
CYONS2110
型号: CYONS2110
厂家: CYPRESS    CYPRESS
描述:

OvationONS? II Wired Laser Navigation System-on-Chip
这款OvationONS ? II有线激光导航系统单芯片

文件: 总36页 (文件大小:1296K)
中文:  中文翻译
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CYONS2000  
OvationONS™ II  
Wired Laser Navigation System-on-Chip  
Features  
Description  
Programmable blocks  
The CYONS2000 is a member of Cypress Semiconductor’s  
second generation laser navigation system-on-chip (SoC) family  
of products. Powered by the high speed and high precision  
OptiCheck™ technology, along with the world leading PSoC  
technology, this family integrates the sensor, USB, and MCU  
functions into one chip. Bundled with the VCSEL into one  
Highly integrated mouse-on-a-chip with PSoC®  
microcontroller unit (MCU)  
16 KB flash memory  
2 KB static RAM (SRAM)  
Internal 24-, 12-, or 6-MHz main oscillator (IMO)  
Internal 32-kHz low-speed oscillator (ILO)  
package, the combination forms the market’s first true  
mouse-on-a-chip solution.  
16-bit data report enables simultaneous high-speed and  
high-resolution tracking  
The CYONS2000 is the version that is designed for general  
purpose wired mouse applications. Enabled by the Cypress  
0.13-micron mixed signal process technology, the device  
integrates the OptiCheck sensor with full-speed USB into a  
single silicon chip that enables seamless communication  
between sensor and MCU/full-speed USB. The sensor provides  
the best translation of precise hand motion into cursor motion on  
the PC.  
Tracking performance  
Selectable resolution of 400, 800, or 1600 counts per inch  
(CPI), independent of speed  
High speed with high accuracy tracking  
Speed up to 30 inches per second (in/s)  
Acceleration up to 20 g  
This highly integrated solution is programmable. It provides  
mouse suppliers the ease of use to design a single PCB system  
and customize their product. With the VCSEL integrated in the  
same package, designers do not need to calibrate the laser  
power during the manufacturing process. This greatly increases  
production throughput and reduces manufacturing costs.  
Peripheral interface  
Integrated full-speed USB for wired applications  
SPI master for interface to external functions  
Fast or standard mode I2C  
28 general-purpose input/output (GPIO) pins  
Port 0 – 8 bits  
Port 1 – 8 bits with high current capability, regulated output  
voltage, and 5 V input tolerance  
Port 2 – 8 bits  
Port 3 – 4 bits  
The innovative OvationONS™ II technology provides high  
precision, high speed motion tracking, and low power  
consumption. Designers can select from a family of integration  
options, ranging from low power to high performance, to target  
different types of wired and wireless design applications.  
The CYONS2000 solutions have a small form factor. Along with  
the lens, each package forms a complete and compact laser  
tracking system. This datasheet describes the detailed  
technology capabilities of the CYONS2000.  
Power  
Internal power system enables operation from a 5-V USB or  
2.7 to 3.6 V external supply  
Self-adjusting power saving modes  
Figure 1. CYONS2000/CYONSLENS2000 (2-Piece System)  
On-chip laser  
Vertical cavity surface emitting laser (VCSEL) integrated  
within the sensor package  
No calibration or alignment needed  
Electrostatic discharge (ESD) immunity: 2000 V  
(human body model)  
Wavelength: 840 to 870 nm  
IEC 60825-1 Class 1 Safety: built-in eye-safe fault tolerant  
laser drive circuitry  
Snap-on lens  
Molded optic: Self aligning snap on molded lens  
6 mm distance between the printed circuit board (PCB) and  
tracking surface  
Cypress Semiconductor Corporation  
Document Number: 001-44044 Rev. *G  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised January 3, 2011  
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CYONS2000  
Contents  
OvationONS II Family Performance Table...................... 3  
OvationONS II Family Applications ................................ 3  
OvationONS II Family Functional Description............... 3  
Pin Description ................................................................. 5  
Microcontroller System.................................................... 7  
Features ...................................................................... 7  
PSoC Functional Overview.............................................. 8  
The PSoC Core........................................................... 8  
The Analog Multiplexer System................................... 8  
Additional System Resources ..................................... 8  
Getting Started.................................................................. 8  
Application Notes ........................................................ 8  
Development Kits ........................................................ 8  
Training ....................................................................... 8  
CYPros Consultants.................................................... 8  
Solutions Library.......................................................... 8  
Technical Support ....................................................... 8  
Development Tools .......................................................... 9  
PSoC Designer Software Subsystems........................ 9  
Designing with PSoC Designer..................................... 10  
Select User Modules ................................................. 10  
Configure User Modules............................................ 10  
Organize and Connect .............................................. 10  
Generate, Verify, and Debug..................................... 10  
Power Supply Connections........................................... 11  
Overview ................................................................... 11  
Understanding DVDD................................................ 11  
AVDD, VREGA, and VREGD.................................... 11  
Using USB Power...................................................... 11  
Using External Power................................................ 11  
Filtering and Grounding............................................. 11  
Wired Mouse Application Example............................... 12  
Electrical Specifications ................................................ 13  
Absolute Maximum Ratings....................................... 13  
Operating Conditions................................................. 13  
Power Consumption.................................................. 14  
Power Specifications................................................. 15  
DC General Purpose I/O Specifications.................... 16  
DC Analog Mux Bus Specifications........................... 17  
DC Low Power Comparator Specifications ............... 17  
DC POR and LVD Specifications .............................. 17  
DC Programming Specifications ............................... 18  
DC Characteristics - USB Interface........................... 18  
AC Chip Level Specifications .................................... 19  
AC General Purpose I/OI/O Specifications ............... 19  
AC External Clock Specifications.............................. 20  
AC Analog Mux Bus Specifications........................... 20  
AC Programming Specifications................................ 20  
AC SPI Specifications ............................................... 21  
AC Comparator Specifications .................................. 24  
AC I2C Specifications................................................ 24  
AC USB Specifications.............................................. 25  
PCB Land Pads and Keepout Zones ........................ 26  
Orientation of Axes.................................................... 27  
PCB Mounting Height and Thickness........................ 27  
Thermal Impedances ................................................ 28  
Solder Reflow Peak Temperature ............................. 28  
Laser Safety Considerations......................................... 29  
Laser Output Power .................................................. 29  
Laser Output Power Test Procedure......................... 29  
Registration Assistance............................................. 29  
Development Tool Selection ......................................... 30  
Software .................................................................... 30  
Mouse Design Kits .................................................... 30  
Development Kits ...................................................... 30  
Evaluation Tools........................................................ 30  
Device Programmers................................................. 31  
Third Party Tools....................................................... 31  
Package Diagrams.......................................................... 32  
Ordering Information...................................................... 34  
Ordering Code Definition........................................... 34  
Document Conventions ................................................. 35  
Acronyms Used......................................................... 35  
Units of Measure ....................................................... 35  
Numeric Naming........................................................ 35  
Document History Page................................................. 36  
Sales, Solutions, and Legal Information ...................... 36  
Worldwide Sales and Design Support....................... 36  
Products.................................................................... 36  
PSoC Solutions......................................................... 36  
Document Number: 001-44044 Rev. *G  
Page 2 of 36  
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CYONS2000  
OvationONS II Family Performance Table  
Parameter  
Variable resolution  
CYONS2000  
CYONS2001  
CYONS2100  
CYONS2101  
CYONS2110  
Unit  
CPI  
in/s  
g
400, 800, 1600 400, 800, 1600  
400–3200  
400–3200  
400–3200  
Maximum speed  
Maximum acceleration  
Integrated MCU  
CapSense®  
Flash  
30  
20  
Yes  
No  
16  
2
30  
20  
Yes  
No  
16  
2
75  
30  
Yes  
No  
32  
2
75  
30  
Yes  
No  
32  
2
75  
30  
Yes  
26 inputs  
32  
KB  
KB  
SRAM  
2
Interfaces  
Full-speed USB  
4-wire SPI  
up to 28 GPIOs  
4-wire SPI  
up to 28 GPIOs  
Full-speed USB  
4-wire SPI  
up to 28 GPIO  
4-wire SPI  
up to 28 GPIOs  
Full-speed USB  
4 wire SPI  
up to 28 GPIOs  
Battery supply voltage  
USB supply voltage  
External supply voltage  
Zero motion  
NA  
4.25 to 5.25  
2.7 to 3.6  
1
0.8 to 3.6  
NA  
NA  
4.25 to 5.25  
2.7 to 3.6  
1
0.8 to 3.6  
NA  
0.8 to 3.6  
4.25 to 5.25  
2.7 to 3.6  
1
V
V
2.7 to 3.6  
1
2.7 to 3.6  
1
V
count  
In addition to controlling the navigation engine, the PSoC MCU  
also serves as the main application processor. Based on  
Cypress’s M8C architecture, the PSoC supports a rich  
instruction set, multiple processor speeds, and flexible GPIOs.  
Its internal main oscillator requires no external crystal. On-chip  
flash and RAM allow entire navigation systems to be imple-  
mented with the single SoC.  
OvationONS II Family Applications  
Wired and wireless laser mice  
Gaming, graphic design, desktop, and mobile mice  
Optical trackballs  
Battery powered devices  
The OvationONS II family supports a wide range of powering  
options. Internal regulators minimize the need for external  
circuitry. Depending on the product selected, the device can be  
power from a USB 5 V supply, from a single battery, from dual  
batteries, or from an external supply. The configuration and use  
of the power blocks are controlled with the integrated PSoC.  
Motion sensing applications  
OvationONS II Family Functional Description  
The OvationONS II family is a two-piece laser navigation SoC kit  
containing the integrated IC package and the molded lens.  
Wired sensors include an integrated full-speed USB. As with the  
navigation engine and power system, the USB block is controlled  
by the integrated PSoC.  
The 2 kV ESD rated IC package integrates the VCSEL and laser  
sensor SoC. Depending on the product selected, the SoC  
includes an MCU, flash, SRAM, two internal oscillators,  
CapSense system, battery boost regulator, power regulator, and  
full-speed USB.  
All sensors support a 4-wire SPI interface. A typical use of the  
SPI interface is to provide access to a radio for wireless applica-  
tions. An I2C interface is also included with all devices.  
The molded lens collimates the VCSEL beam and images the  
light scattered from the tracking surface onto the sensor portion  
of the laser detector. The lens has features for registration to the  
package and easily snaps to the PC board.  
The CYONS2110 device also supports CapSense functions,  
allowing additional features and differentiation in end products.  
All features of the OvationONS II family are configured using  
Cypress’s PSoC Designer™ software, allowing fast application  
development and time to market.  
At the heart of the system is the OptiCheck laser navigation  
engine. It supports all functions required for tracking, including  
laser power control, resolution control, and self-adjusting power  
reduction, which reduces power consumption when motion  
stops. The laser output power is pre-calibrated to meet the eye  
safety requirements of IEC 60825 Class 1.  
The OvationONS II family block diagram is shown on Figure 2 on  
page 4. It shows a true SoC solution that enables design cycle  
reductions along with savings on manufacturing, PCB area, and  
component inventory management. The packaged solution  
delivers a fully integrated system that demonstrates tracking  
performance with efficient power consumption.  
The navigation engine is accessed and controlled by an  
integrated PSoC-based MCU. The interface between the two  
blocks is through a system bus and a collection of navigation  
engine interrupts. Full details are available in the OvationONS II  
Laser Navigation System-on-Chip TRM (Technical Reference  
Manual) or in the PSoC Designer integrated development  
environment (IDE) software.  
Document Number: 001-44044 Rev. *G  
Page 3 of 36  
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CYONS2000  
Figure 2. Block Diagram  
OptiCheckTM  
Navigation  
System  
Ovation II  
Power  
System  
3.3V Regulator  
Boost Regulator  
Resolution  
Control  
VCSEL  
Laser  
Control  
DSP  
Battery  
Filter  
Power Control  
POWER BUS  
Port 3  
1.8V  
PSoC  
Core  
Port 2  
Port 1  
Port 0  
Analog  
Regulator  
Regulator  
PSoC CORE  
SYSTEM BUS  
Global Analog Interconnect  
Flash  
Nonvolatile Memory  
SRAM  
Supervisory ROM (SROM)  
Interrupt  
Controller  
Sleep and  
Watchdog  
CPU Core (M8C)  
32 kHz Internal Low Speed  
Oscillator (ILO)  
6/12/24 MHz Internal Main Oscillator (IMO)  
Multiple Clock Sources  
SYSTEM BUS  
Full  
Speed  
USB  
Internal  
Voltage  
References  
POR  
and  
LVD  
SPI  
Master/  
Slave  
Three 16-Bit  
Programmable  
Timers  
System  
Resets  
Digital  
Clocks  
I2C  
Slave  
ADC  
CapSense  
System  
SYSTEM RESOURCES  
NOTE: Shaded blocks indicate optional functions - Refer to OvationONSTM II Family Performance Table for details  
Document Number: 001-44044 Rev. *G  
Page 4 of 36  
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CYONS2000  
Pin Description  
This section describes, lists, and illustrates the CYONS2000 device pins and pinout configurations. The CYONS2000 is available in  
a 42-pin quad flat no-leads (QFN) package.  
Table 1. CYONS2000 Pin Description  
Pin  
Name  
Digital  
I
Analog  
Description  
Active high external reset with internal pull-down  
Digital ground  
1
2
3
4
5
XRES  
DVSS  
DNU  
Power  
Power  
Do not use  
DVSS  
DVDD  
Power  
Power  
Power  
Power  
Digital ground  
Digitalsupplyvoltageandregulatedoutput(see PowerSupply  
Connections on page 11)  
6
VREGD  
AVDD  
VREGA  
P2[7]  
P1[5]  
P1[3]  
P2[3]  
P2[5]  
P1[7]  
P1[1]  
P3[3]  
P1[0]  
P3[5]  
P1[6]  
P1[2]  
P2[2]  
P3[7]  
P3[1]  
OCDE  
AVSS  
P2[1]  
P2[0]  
P1[4]  
P2[4]  
DVSS  
P2[6]  
P0[0]  
P0[2]  
P0[4]  
P0[6]  
P0[1]  
Power  
Power  
Power  
I/O  
Power  
Digital VREG  
7
Power  
Analog supply voltage  
8
Power  
Analog VREG  
9
I
GPIO port 2 pin 7  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
IOHR  
IOHR  
I/O  
I
SPI MISO, I2C_SDA, GPIO port 1 pin 5  
SPI CLK, GPIO port 1 pin 3  
GPIO port 2 pin 3  
I
I
I/O  
I
GPIO port 2 pin 5  
IOHR  
IOHR  
IOHR  
I/O  
I
SPI SS, I2C_SCL, GPIO port 1 pin 7  
SPI MOSI, ISSP CLK[1], I2C_SCL, GPIO port 1 pin 1  
HCLK (OCD high speed clock output), GPIO port 3 pin 3  
ISSP DATA[1], I2C_SDA, GPIO port 1 pin 0  
CCLK (OCD CPU clock output), GPIO port 3 pin 5  
GPIO port 1 pin 6  
I
I
I
I/O  
I
IOHR  
IOHR  
I/O  
I
I
GPIO port 1 pin 2  
I
GPIO port 2 pin 2  
I/O  
I
OCDOE (OCD mode direction pin), GPIO port 3 pin 7  
OCDO (OCD odd data output), GPIO port 3 pin 1  
OCDE (OCD even data output)  
Analog ground  
I/O  
I
OCD  
Power  
I/O  
OCD  
Power  
I
GPIO port 2 pin 1  
I/O  
I
GPIO port 2 pin 0  
IOHR  
I/O  
I
EXT CLK, GPIO port 1 pin 4  
GPIO port 2 pin 4  
I
Power  
I/O  
Power  
Digital ground  
I
I
I
I
I
I
GPIO port 2 pin 6  
I/O  
GPIO port 0 pin 0  
I/O  
GPIO port 0 pin 2  
I/O  
GPIO port 0 pin 4  
I/O  
GPIO port 0 pin 6  
I/O  
GPIO port 0 pin 1  
Document Number: 001-44044 Rev. *G  
Page 5 of 36  
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CYONS2000  
Table 1. CYONS2000 Pin Description (continued)  
Pin  
Name  
Digital  
I/O  
Analog  
Description  
37  
38  
39  
40  
41  
42  
CP  
P0[3]  
P0[5]  
P0[7]  
D-  
I
I
I
GPIO port 0 pin 3  
GPIO port 0 pin 5  
GPIO port 0 pin 7  
USB data  
I/O  
I/O  
I/O  
D+  
I/O  
USB data  
VDD5V  
DVSS  
Power  
Power  
Power  
Power  
5-V power  
Center pad (CP) must be connected to digital ground  
Legend: I=Input; O=Output; H=5 mA High Output Drive, R=Regulated Output, OCD = On-Chip-Debug  
Figure 3. Pin Diagram  
1
34  
33  
32  
XRES  
DVSS  
DNU  
DVSS  
DVDD  
VREGD  
AVDD  
VREGA  
AI, P0[4]  
AI, P0[2]  
AI, P0[0]  
AI, P2[6]  
DVSS  
AI, P2[4]  
AI, EXT CLK, P1[4]  
AI, P2[0]  
AI, P2[1]  
AVSS  
2
3
4
5
6
7
8
9
31  
CYONS2000  
30  
29  
28  
27  
26  
QFN  
(Top View)  
AI, P2[7]  
25  
24  
OCDE  
AI, OCDO, P3[1]  
23  
Note  
1. These are the in-system serial programming (ISSP) pins. Unlike other GPIOs, they are not high impedance at power on reset (POR). See the Technical Reference  
Manual (TRM) or in the PSoC Designer development software for more details.  
Document Number: 001-44044 Rev. *G  
Page 6 of 36  
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CYONS2000  
Precision programmable clocking  
Internal ±5.0% 6-,12-, 24-MHz main oscillator  
Internal 32-kHz low speed oscillator  
Microcontroller System  
Features  
Supports optional external 32-kHz crystal  
0.25% accuracy for USB with no external crystal  
Powerful Harvard-architecture processor  
M8C processor speed up to 24 MHz  
Low power at high speed  
Programmable pin configurations  
25-mA sink current on all GPIOs  
Interrupt controller  
Operating temperature range: +5 °C to +45 °C  
Pull-up, high-Z, open drain, or strong drive modes on all  
GPIOs  
Flexible on-chip memory  
16 KB flash program storage  
50,000 erase and write cycles  
2 KB SRAM data storage  
Partial flash updates  
Flexible protection modes  
In-system serial programming (ISSP)  
Up to 28 analog inputs on GPIO  
Configurable inputs on all GPIOs  
Selectable, regulated digital I/O on port 1  
• 3.3-, 2.5-, or 1.8-V output  
3.0 V, 20 mA total port 1 source current  
5-mA source current mode on ports 0 and 1  
Hot swap capable  
Full-speed USB (12 Mbps)  
Eight unidirectional endpoints  
One bidirectional control endpoint  
USB 2.0 compliant  
Dedicated 512-byte buffer  
Internal 3.3-V output regulator  
Versatile analog mux  
Common internal analog bus  
Simultaneous connection of I/O combinations  
High power supply rejection ratio (PSRR) comparator  
Low dropout voltage regulator for the analog array  
Additional system resources  
SPI master and SPI slave  
• Clock speed up to 12 MHz  
Three 16-bit timers  
Complete development tools  
Free development tool (PSoC Designer)  
Full featured in-circuit emulator (ICE) and programmer  
Full speed emulation  
Watchdog and sleep timers  
Internal voltage reference  
Integrated supervisory circuit  
Analog-to-digital converter (ADC)  
I2C slave  
Complex breakpoint structure  
128 KB trace memory  
Document Number: 001-44044 Rev. *G  
Page 7 of 36  
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CYONS2000  
PSoC Functional Overview  
Getting Started  
Cypress's PSoC on-chip controllers combine dynamic,  
configurable analog and digital blocks and an 8-bit MCU on a  
single chip, replacing multiple discrete components while  
delivering optimal flexibility and advanced functionality. A PSoC  
device includes configurable analog and digital blocks, and  
programmable interconnect. This architecture enables the  
creation of customized peripheral configurations, to match the  
requirements of each individual application. Additionally, a fast  
CPU, Flash program memory, SRAM data memory, and  
configurable I/O are included in a range of convenient pinouts.  
For in depth information, along with detailed programming  
details, see the PSoC® Technical Reference Manual.  
For up-to-date ordering, packaging, and electrical specification  
information, see the latest PSoC device datasheets on the web.  
Application Notes  
Cypress application notes are an excellent introduction to the  
wide variety of possible PSoC designs.  
Development Kits  
The architecture for this device family, as illustrated in the Block  
Diagram on page 4, contains: the core, the navigation sensor,  
the power system, and the system resources (including a  
full-speed USB port). A common, versatile bus enables  
connection between I/O and the analog system. GPIO is also  
included. The GPIO provides access to the MCU and analog  
mux.  
PSoC Development Kits are available online from and through a  
growing number of regional and global distributors, which  
include Arrow, Avnet, Digi-Key, Farnell, Future Electronics, and  
Newark.  
Training  
Free PSoC technical training (on demand, webinars, and  
workshops), which is available online via www.cypress.com,  
covers a wide variety of topics and skill levels to assist you in  
your designs.  
The PSoC Core  
The PSoC core is a powerful engine that supports a rich  
instruction set. The PSoC core encompasses SRAM for data  
storage, an interrupt controller, sleep and watchdog timers, an  
Internal Main Oscillator (IMO), and an Internal Low Speed Oscil-  
lator (ILO). The CPU core, called the M8C, is a powerful  
processor with speeds up to 24 MHz. The M8C is a 4 MIPS, 8-bit  
Harvard architecture microprocessor.  
CYPros Consultants  
Certified PSoC Consultants offer everything from technical  
assistance to completed PSoC designs. To contact or become a  
PSoC Consultant go to the CYPros Consultants web site.  
System resources provide additional capability, such as config-  
urable USB and SPI master-slave communication interface,  
three 16-bit programmable timers, and various system resets  
supported by the M8C.  
Solutions Library  
Visit our growing library of solution focused designs. Here you  
can find various application designs that include firmware and  
hardware design files that enable you to complete your designs  
quickly.  
The Analog Multiplexer System  
The analog mux bus connects to every GPIO pin. Pins are  
connected to the bus individually or in any combination. Analog  
signals may be routed to an internal analog-to-digital converter.  
Technical Support  
Technical support – including a searchable Knowledge Base  
articles and technical forums – is also available online. If you  
cannot find an answer to your question, call our Technical  
Support hotline at 1-800-541-4736.  
Other multiplexer applications include:  
Chip-wide mux that enables analog input from any I/O pin  
Crosspoint connection between any I/O pin combinations  
Additional System Resources  
System resources, some previously listed, provide additional  
capability useful to complete systems. Additional resources  
include low-voltage detection (LVD) and power on reset. Brief  
statements describing the merits of each system resource follow:  
The SPI master/slave module  
Provides communication over three or four wires  
Runs at speeds of 46.9 kHz to 3 MHz (lower for a slower  
system clock).  
An I2C slave module  
Low voltage detection (LVD) interrupts can signal the appli-  
cation of falling voltage levels, while the advanced Power On  
Reset (POR) circuit eliminates the need for a system  
supervisor.  
An internal reference provides an absolute reference for capac-  
itive sensing.  
Document Number: 001-44044 Rev. *G  
Page 8 of 36  
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CYONS2000  
Code Generation Tools  
Development Tools  
The code generation tools work seamlessly within the  
PSoC Designer interface and have been tested with a full range  
of debugging tools. You can develop your design in C, assembly,  
or a combination of the two.  
PSoC Designer™ is the revolutionary Integrated Design  
Environment (IDE) that you can use to customize PSoC to meet  
your specific application requirements. PSoC Designer software  
accelerates system design and time to market. Develop your  
applications using a library of precharacterized analog and digital  
peripherals (called user modules) in a drag-and-drop design  
environment. Then, customize your design by leveraging the  
dynamically generated application programming interface (API)  
libraries of code. Finally, debug and test your designs with the  
integrated debug environment, including in-circuit emulation and  
standard software debug features. PSoC Designer includes:  
Assemblers. The assemblers allow you to merge assembly  
code seamlessly with C code. Link libraries automatically use  
absolute addressing or are compiled in relative mode, and linked  
with other software modules to get absolute addressing.  
C Language Compilers. C language compilers are available  
that support the PSoC family of devices. The products allow you  
to create complete C programs for the PSoC family devices. The  
optimizing C compilers provide all of the features of C, tailored  
to the PSoC architecture. They come complete with embedded  
libraries providing port and bus operations, standard keypad and  
display support, and extended math functionality.  
Application editor graphical user interface (GUI) for device and  
user module configuration and dynamic reconfiguration  
Extensive user module catalog  
Integrated source-code editor (C and assembly)  
Free C compiler with no size restrictions or time limits  
Built-in debugger  
Debugger  
PSoC Designer has a debug environment that provides  
hardware in-circuit emulation, allowing you to test the program in  
a physical system while providing an internal view of the PSoC  
device. Debugger commands allow you to read and program and  
read and write data memory, and read and write I/O registers.  
You can read and write CPU registers, set and clear breakpoints,  
and provide program run, halt, and step control. The debugger  
also allows you to create a trace buffer of registers and memory  
locations of interest.  
In-circuit emulation  
Built-in support for communication interfaces:  
Hardware and software I2C slaves and masters  
Full-speed USB 2.0  
Up to four full-duplex universal asynchronous receiver/trans-  
mitters (UARTs), SPI master and slave, and wireless  
Online Help System  
PSoC Designer supports the entire library of PSoC 1 devices and  
runs on Windows XP, Windows Vista, and Windows 7.  
The online help system displays online, context-sensitive help.  
Designed for procedural and quick reference, each functional  
subsystem has its own context-sensitive help. This system also  
provides tutorials and links to FAQs and an Online Support  
Forum to aid the designer.  
PSoC Designer Software Subsystems  
Design Entry  
In the chip-level view, choose a base device to work with. Then  
select different onboard analog and digital components that use  
the PSoC blocks, which are called user modules. Examples of  
user modules are analog-to-digital converters (ADCs),  
digital-to-analog converters (DACs), amplifiers, and filters.  
Configure the user modules for your chosen application and  
connect them to each other and to the proper pins. Then  
generate your project. This prepopulates your project with APIs  
and libraries that you can use to program your application.  
In-Circuit Emulator  
A low-cost, high-functionality In-Circuit Emulator (ICE) is  
available for development support. This hardware can program  
single devices.  
The emulator consists of a base unit that connects to the PC  
using a USB port. The base unit is universal and operates with  
all PSoC devices. Emulation pods for each device family are  
available separately. The emulation pod takes the place of the  
PSoC device in the target board and performs full-speed  
(24-MHz) operation.  
The tool also supports easy development of multiple configura-  
tions and dynamic reconfiguration. Dynamic reconfiguration  
makes it possible to change configurations at run time. In  
essence, this allows you to use more than 100 percent of PSoC's  
resources for a given application.  
Document Number: 001-44044 Rev. *G  
Page 9 of 36  
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CYONS2000  
Organize and Connect  
Designing with PSoC Designer  
You build signal chains at the chip level by interconnecting user  
modules to each other and the I/O pins. You perform the  
selection, configuration, and routing so that you have complete  
control over all on-chip resources.  
The development process for the PSoC® device differs from that  
of a traditional fixed function microprocessor. The configurable  
analog and digital hardware blocks give the PSoC architecture a  
unique flexibility that pays dividends in managing specification  
change during development and by lowering inventory costs.  
These configurable resources, called PSoC Blocks, have the  
ability to implement a wide variety of user-selectable functions.  
The PSoC development process is summarized in four steps:  
Generate, Verify, and Debug  
When you are ready to test the hardware configuration or move  
on to developing code for the project, you perform the “Generate  
Configuration Files” step. This causes PSoC Designer to  
generate source code that automatically configures the device to  
your specification and provides the software for the system. The  
generated code provides application programming interfaces  
(APIs) with high-level functions to control and respond to  
hardware events at run time and interrupt service routines that  
you can adapt as needed.  
1. Select User Modules.  
2. Configure user modules.  
3. Organize and connect.  
4. Generate, verify, and debug.  
Select User Modules  
A complete code development environment allows you to  
develop and customize your applications in either C, assembly  
language, or both.  
PSoC Designer provides a library of prebuilt, pretested hardware  
peripheral components called “user modules.” User modules  
make selecting and implementing peripheral devices, both  
analog and digital, simple.  
The last step in the development process takes place inside  
PSoC Designer’s debugger (access by clicking the Connect  
icon). PSoC Designer downloads the HEX image to the ICE  
where it runs at full speed. PSoC Designer debugging capabil-  
ities rival those of systems costing many times more. In addition  
to traditional single-step, run-to-breakpoint and watch-variable  
features, the debug interface provides a large trace buffer and  
allows you to define complex breakpoint events that include  
monitoring address and data bus values, memory locations and  
external signals.  
Configure User Modules  
Each user module that you select establishes the basic register  
settings that implement the selected function. They also provide  
parameters and properties that allow you to tailor their precise  
configuration to your particular application. For example, a pulse  
width modulator (PWM) User Module configures one or more  
digital PSoC blocks, one for each 8 bits of resolution. The user  
module parameters permit you to establish the pulse width and  
duty cycle. Configure the parameters and properties to corre-  
spond to your chosen application. Enter values directly or by  
selecting values from drop-down menus. All the user modules  
are documented in datasheets that may be viewed directly in  
PSoC Designer or on the Cypress website. These user module  
datasheets explain the internal operation of the user module and  
provide performance specifications. Each datasheet describes  
the use of each user module parameter, and other information  
you may need to successfully implement your design.  
Document Number: 001-44044 Rev. *G  
Page 10 of 36  
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CYONS2000  
Power Supply Connections  
Figure 4. Power Connections Block Diagram  
CYONS2000  
VDD5V 42  
4.25 - 5.25 V  
3.3V  
Regulator  
USB IO  
Regulator  
External 3.3V  
Supply, 15  
mA max  
5
7
DVDD  
AVDD  
10 nH  
10 10  
uF uF  
VREGD  
VREGA  
6
8
Analog  
GND  
Digital  
GND  
1.8V PSoC  
1.8V Analog  
Regulator  
Core  
Regulator  
1.8V Digital  
Circuitry  
3V Digital  
Circuitry  
1.8V Analog  
Circuitry  
3V Analog  
Circuitry  
Digital  
GND  
Analog  
GND  
Digital  
GND  
Digital  
GND  
Digital  
GND  
Analog  
GND  
Overview  
Using USB Power  
The CYONS2000 incorporates a powerful and flexible powering  
system. It can be powered from one of two sources: a 5-V supply  
(typically from the USB VBUS line) or an external 3.3-V supply.  
Additionally, the CYONS2000’s internal regulators can supply  
current to external devices. This section describes the  
capabilities and usage of the power system. Refer to Figure 4 for  
a block diagram of the CYONS2000’s power system.  
For most USB applications, the device is powered from the USB  
VBUS signal. In this case, the 5-V VBUS signal should be  
connected directly to the CYONS2000’s VDD5V pin.  
Using External Power  
The CYONS2000 can also be powered from an external source.  
In this case, the external 3.3-V source should connect to DVDD,  
and the VDD5V pin should be left unconnected.  
Understanding DVDD  
Filtering and Grounding  
DVDD is a unique pin because it serves as either an input or an  
output. When the device is powered from USB (using the 3.3-V  
regulator), DVDD acts as an output, providing a 3.3-V voltage  
that can be used to power AVDD, VREGD, VREGA, and external  
parts. When the device is powered from an external 3.3-V supply,  
DVDD acts as an input only.  
For all designs, it is important to provide proper grounding, and  
proper isolation between the analog and digital power supplies.  
The analog and digital grounds should be isolated, except for a  
single connection point that is placed as close as possible to the  
device. On the supply side, an L-C filter should be placed  
between AVDD and DVDD, as shown in Figure 4.  
AVDD, VREGA, and VREGD  
As with DVDD, these signals power the internal circuitry of the  
device. Unlike DVDD, these are always inputs. They should be  
connected as shown in Figure 4.  
Document Number: 001-44044 Rev. *G  
Page 11 of 36  
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CYONS2000  
Wired Mouse Application Example  
Figure 5 shows an implementation of a wired mouse. For complete details, refer to the CY4631 - OvationONS™ II Laser Gaming  
Mouse Reference Design Kit.  
Figure 5. Wired Mouse  
V R E G D  
6
D V S S  
3 0  
V D D 5 V  
4 2  
D V D D  
5
A V S S  
2 5  
V R E G A  
8
A V D D  
7
C P  
4 3  
Document Number: 001-44044 Rev. *G  
Page 12 of 36  
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CYONS2000  
Electrical Specifications  
This section presents the DC and AC electrical specifications of the CYONS2000 device. For the most up-to-date electrical  
specifications, confirm that you have the most recent datasheet by visiting http://www.cypress.com.  
Absolute Maximum Ratings  
Parameter  
Storage temperature[2]  
Min  
–40  
–5  
Typ  
Max  
65  
Unit  
°C  
°C  
°C  
V
Conditions  
Case temperature  
25  
Operating temperature  
Lead solder temperature  
55  
Case temperature  
10 seconds  
260  
3.6  
Supply voltage, DVDD, AVDD, VREGA,  
and VREGD relative to DVSS)  
Supply voltage, VDD5V relative to DVSS  
Electrostatic discharge (ESD)  
I/O Voltage relative to DVSS  
I/O voltage relative to DVSS  
Latch up current  
5.5  
2.0  
V
kV  
V
All pins, HBM MIL 883 method 3015  
GPIO ports 0, 2, and 3  
GPIO port 1  
–0.5  
DVDD + 0.5  
5.5  
V
100  
mA  
mA  
Maximum current into any GPIO pin  
–25  
+50  
Operating Conditions  
Parameter  
Min  
Typ  
Max  
Unit  
°C  
Conditions  
Operating temperature  
5
45  
Power supply voltage  
VDD5V  
DVDD, AVDD, VREGD  
VREGA  
V
4.35  
2.70  
1.71  
5.25  
3.60  
3.60  
Power supply rise time  
100  
6
µs  
Supply noise – AVDD (sinusoidal)  
Supply noise – VDD, DVDD (sinusoidal)  
Distance from PCB to tracking surface  
PCB thickness  
25  
mV pp 10 kHz to 50 MHz  
mV pp 10 kHz to 50 MHz  
100  
6.20  
1.79  
5.80  
1.54  
mm  
mm  
See Figure 15 on page 26  
See Figure 15 on page 26  
Note  
2. High storage temperature reduces flash data retention time specified in Table 7 on page 18. Recommended storage temperature is 25 ± 25 °C. Extended duration  
above 65 °C can degrade reliability.  
Document Number: 001-44044 Rev. *G  
Page 13 of 36  
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CYONS2000  
with four sets of sleep mode settings, enabling four levels of  
sleep. By controlling the parameters of these four sleep modes,  
the designer can tailor the solution to make appropriate tradeoffs  
between power consumption and wakeup latency.  
Power Consumption  
Introduction  
As described in Overview on page 11, the CYONS2000 has a  
highly advanced power system that can be used to develop very  
low-power applications. This section describes and specifies the  
power consumption performance of the device.  
The transition between sleep modes is under the control of the  
CYONS2000’s digital signal processor (DSP) – no firmware  
needs to be written to manage the transition between modes.  
Each of the four available sleep modes is defined by three  
parameters. These parameters are defined as registers that can  
be controlled by firmware, either through direct register writes or  
by using the NAV User Module in PSoC Designer.  
Enabling Low Power Modes  
In some cases, designers may want to develop “always-on”  
applications, with no power-saving modes and consequently no  
wakeup latency in performance. In other applications,  
conserving power is crucial, and power saving modes are a firm  
requirement. The CYONS2000 enables low-power modes to be  
enabled or disabled in firmware, either through register writes or  
through the application programming interface in Cypress’s  
PSoC Designer development software. The remainder of this  
section applies to applications requiring power saving modes.  
Sleep time: This is the amount of time that the device is in its  
low power inactive state.  
Motion threshold: This is the amount of motion that is required  
to bring the device out of sleep.  
Sleep mode time: This is the amount of time that the device  
stays in a particular sleep mode before transitioning to the next  
lowest sleep mode. Longer sleep times save power but have  
higher wakeup latency.  
Operating Modes  
From a power consumption standpoint, consider these three  
operating modes:  
Figure 6 shows the flowchart for a particular sleep mode,  
showing how the three parameters affect behavior.  
Tracking mode: In this mode, the device is actively tracking on  
a surface. It is the highest power mode of the device. The  
current consumption has a slight dependence on speed and  
surface. The current, however, is independent of resolution.  
Calculating Power for Sleep Mode  
The power consumption in sleep mode can be found by using a  
duty cycle calculation. The sleep mode current is determined by  
the tracking mode current, the inactive current, the time required  
to check for motion (typically 2.9 ms), and the time between  
check-for-motion events. The expected current consumption is  
given by the formula  
Inactive mode: In this mode, the device is in its lowest power  
state. In inactive mode, the device cannot sense motion, but a  
timer is running. This timer can generate an interrupt that can  
wake the rest of the device and start tracking motion.  
Sleep modes: In sleep modes, the device self-transitions  
between tracking mode and inactive mode. The typical use of  
sleep modes is when the device is at rest, but might still be  
moved. In Sleep modes, the CYONS2000 stays in inactive  
mode for a fixed time, then wakes up and checks for motion. If  
motion is detected, the device fully wakes up and begins  
tracking. If no motion is detected, the device can go back to  
Sleep mode.  
ITRACK × 2.9 + IINACT × TSLEEP  
----------------------------------------------------------------------------------  
=
ISLEEP  
2.9 + TSLEEP  
where ISLEEP is the sleep current, ITRACK is the tracking current,  
IINACT is the inactive current, and TSLEEP is the time (in ms) in  
the low power state. As an example, if the tracking current is  
8.5 mA, the inactive current is 7.5 µA and the sleep time is  
100 ms, then the expected sleep current is 0.25 mA.  
Power Management Through Sleep Mode Control  
Power management for the CYONS2000 consists of setting the  
parameters that define the sleep modes. The device is equipped  
Figure 6. Sleep Mode Flowchart  
Enter from  
higher sleep  
mode  
Go to sleep for N ms  
Wake up, check for motion  
Y
Go to active  
tracking mode  
Motion > threshold T?  
N
Go to deeper  
sleep mode  
Y
Time in mode > M sec?  
N
Document Number: 001-44044 Rev. *G  
Page 14 of 36  
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CYONS2000  
Power Specifications  
There are two ways to power the CYONS2000 – external  
powering and USB powering. Table 4 provides the current  
consumption values for each mode.  
Modes” in Cypress’s PSoC Designer development environment.  
Doing so enables the sleep mode progressions described in  
Operating Modes on page 14. If sleep modes are not activated,  
the device current stays at tracking levels, even when the device  
is not sensing motion.  
With external powering, a 3-V supply is connected to DVDD,  
AVDD, VREGD, and VREGA, and the internal regulator is turned  
off. In this case, the current consumption during tracking is  
ISB_EXT is the current in the lowest-power mode of the device. In  
I
TRACK_EXT, and the consumption during sleep is ISLEEP  
.
this mode, the CPU is halted and operation can only be restarted  
with an external reset at the XRES pin.  
With USB powering, the 5-V USB supply is connected to VDD5V,  
and DVDD, AVDD, VREGD, and VREGA are driven by the  
internal regulator. Tracking current is specified by ITRACK_USB  
Sleep current must include the current consumption of the  
regulator itself, and is specified by the sum of ISLEEP and IREG5V  
For designs using the CYONS2000, low-power operation is often  
only needed to support USB Suspend. The reference code for  
this is available in the CY4631 - OvationONS™ II Laser Gaming  
Mouse Reference Design Kit.  
.
.
Sleep current is achieved by activating “Navigation Sleep  
Table 2. Power Specifications  
Symbol  
ITRACK_EXT Tracking current into DVDD, 3.0 V, 25 °C, 5 in/s, 24-MHz IMO, 6-MHz CPU clock,  
AVDD, VREGD, VREGA white surface, nominal tracking height  
Description  
Conditions  
Min  
Typ  
Max  
Units  
9
12.5  
mA  
ITRACK_USB Tracking current into VDD5V 5.25 V, 25 °C, 5 in/s, 24-MHz IMO, 6-MHz CPU clock,  
whitesurface,nominaltrackingheight, DVDD, AVDD,  
12.5  
7
16  
14  
mA  
µA  
VREGD, and VREGA powered by internal regulator  
IINACT  
Inactive current into DVDD, 3.0 V, 25 °C, CPU in sleep state  
AVDD, VREGD, VREGA  
ISLEEP  
IREG5V  
ISB_EXT  
Sleep current into DVDD,  
AVDD, VREGD, VREGA  
3.0 V, 25 °C  
See Calculating Power for Sleep  
Mode on page 14 for equation  
5 V-to-3 V regulator current VDD5V = 5.25 V, regulator active  
consumption  
250  
µA  
ShutdowncurrentintoDVDD, 3.0 V, 25 °C, 5-V supply not present  
AVDD, VREGD, VREGA, all  
4
11  
µA  
blocks off  
ISB_USB  
Shutdown current, all blocks 5.25 V, 25 °C, DVDD, AVDD, VREGA, VREGD  
80  
µA  
off, into VDD5V  
powered by internal 5-V-to-3-V regulator in standby  
mode  
Document Number: 001-44044 Rev. *G  
Page 15 of 36  
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CYONS2000  
DC General Purpose I/O Specifications  
GPIOs are arranged into four ports. Ports 0, 1, and 2 have eight GPIO pins and Port 3 has four GPIO pins. Port 1 has an optional low  
drop out (LDO) regulator that adjusts the port’s output voltage to 1.8, 2.5, or 3.0 V. Additionally, each GPIO pin can be independently  
set to one of the four drive modes: strong drive, open drain, pull-up, or high-Z analog.  
Rise and fall times are specified for 10% and 90% voltage values.  
The following tables list guaranteed maximum and minimum specifications for the voltage range of 2.7 V to 3.6 V at the DVDD pin,  
and over the temperature range 5 °C TA 45 °C. Typical parameters apply to 3.3 V at 25 °C and are for design guidance only.  
Table 3. 2.7 V to 3.6 V DC GPIO Specifications  
Symbol  
RPU  
Description  
Pull-up resistor  
Conditions  
Min  
Typ  
5.6  
Max  
8.0  
Units  
kΩ  
Pin configured for pull-up mode.  
4.0  
VOH1  
High output voltage  
Port 2 or 3 pins  
IOH < 10 μA, maximum of 10-mA source DVDD – 0.2  
current in all I/Os.  
V
VOH2  
VOH3  
High output voltage  
Port 2 or 3 pins  
IOH = 1 mA, maximum of 20-mA source DVDD – 0.9  
current in all I/Os.  
V
V
High output voltage  
Port 0 or 1 pins with LDO regulator current in all I/Os.  
disabled for Port 1  
IOH < 10 μA, maximum of 10-mA source DVDD – 0.2  
VOH4  
VOH5  
VOH6  
VOH7  
VOH8  
VOH9  
VOH10  
VOL  
High output voltage  
Port 0 or 1 pins with LDO regulator current in all I/Os.  
disabled for Port 1  
IOH = 5 mA, maximum of 20-mA source DVDD – 0.9  
3.00  
3.30  
V
V
V
V
V
V
V
V
High output voltage  
Port 1 pins with LDO regulator  
enabled for 3 V Out  
IOH < 10 μA, DVDD > 3.1 V, maximum of  
4 I/Os all sourcing 5 mA.  
2.85  
2.20  
2.35  
1.90  
1.60  
1.20  
High output voltage  
Port 1 pins with LDO regulator  
enabled for 3 V Out  
IOH = 5 mA, DVDD > 3.1 V, maximum of  
20 mA source current in all I/Os.  
High output voltage  
Port 1 pins with LDO enabled for  
2.5 V Out  
IOH < 10 μA, DVDD > 2.7 V, maximum of  
2.50  
2.75  
20 mA source current in all I/Os.  
High output voltage  
Port 1 pins with LDO enabled for  
2.5 V Out  
IOH = 2 mA, DVDD > 2.7 V, maximum of  
20 mA source current in all I/Os.  
High output voltage  
Port 1 pins with LDO enabled for  
1.8 V Out  
I
OH < 10 μA, DVDD > 2.7 V, maximum of  
1.80  
2.10  
20 mA source current in all I/Os.  
High output voltage  
Port 1 pins with LDO enabled for  
1.8 V Out  
IOH = 1 mA, DVDD > 2.7 V, maximum of  
20 mA source current in all I/Os.  
Low output voltage  
IOL = 25 mA, DVDD > 3.3 V, maximum of  
60-mA sink current on even port pins (for  
example, P0[2] and P1[4]) and 60-mA sink  
current on odd port pins (for example,  
P0[3] and P1[5]).  
0.75  
VIL  
VIH  
VH  
Input low voltage  
2.00  
0.80  
V
V
Input high voltage  
Input hysteresis voltage  
Input leakage (absolute value)  
Pin capacitance  
80  
0.5  
1.7  
mV  
µA  
pF  
IIL  
Gross tested to 1 μA.  
1.0  
8.0  
CPIN  
Temp = 25 °C.  
0.5  
Document Number: 001-44044 Rev. *G  
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CYONS2000  
DC Analog Mux Bus Specifications  
The analog mux bus can connect signals from GPIOs to and from internal analog blocks and other GPIOs. Table 4 lists guaranteed  
maximum and minimum specifications for the entire voltage and temperature ranges.  
Table 4. DC Analog Mux Bus Specifications  
Parameter  
RSW  
Description  
Conditions  
Min  
Typ  
Max  
800  
800  
Unit  
Ω
Switch resistance to common analog bus  
Pin voltage < 1.8 V  
RGND  
Resistance of initialization switch to DVSS Pin voltage < 1.8 V  
Ω
DC Low Power Comparator Specifications  
The device includes two general-purpose comparators, using internal or external signals from the analog mux bus. Table 5 lists  
guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.  
Table 5. DC Comparator Specifications  
Parameter  
Description  
Conditions  
Min  
Typ  
Max  
Unit  
VLPC  
Low power comparator (LPC) common  
mode  
Maximum voltage limited to  
DVDD.  
0.0  
1.8  
V
ILPC  
LPC supply current  
LPC voltage offset  
10  
40  
30  
μA  
VOSLPC  
2.5  
mV  
DC POR and LVD Specifications  
The device features two mechanisms for dealing with low power supply voltages. Both power-on reset (POR) and LVD events occur  
when DVDD falls below a threshold. A POR completely resets the device. An LVD generates an interrupt to the MCU, allowing the  
application developer to better manage power supply drops.  
The POR threshold is defined by bits 7 (HPOR) and 5:4 (PORLEV) and of the VLT_CR register at address E3h in register bank 1.  
The LVD threshold is defined by bits 2:0 (VM) of the same register. Refer to the technical reference manual for more details.  
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.  
Table 6. DC POR and LVD Specifications  
Parameter  
Description  
Conditions  
Min  
Typ  
Max  
Unit  
DVDD Value for POR trip  
DVDD must be greater than or  
equalto1.71Vduringstartup, reset  
from the XRES pin, or reset from  
watchdog.  
VPOR0  
VPOR1  
VPOR2  
VPOR3  
PORLEV[1:0] = 00b, HPOR = 0  
PORLEV[1:0] = 00b, HPOR = 1  
PORLEV[1:0] = 01b, HPOR = 1  
PORLEV[1:0] = 10b, HPOR = 1  
1.61  
1.66  
2.36  
2.60  
2.82  
1.71  
2.40  
2.65  
2.95  
V
V
V
V
DVDD Value for LVD trip  
VM[2:0] = 000b  
VM[2:0] = 001b  
VM[2:0] = 010b  
VM[2:0] = 011b  
VM[2:0] = 100b  
VM[2:0] = 101b  
VM[2:0] = 110b  
VLVD0  
VLVD1  
VLVD2  
VLVD3  
VLVD4  
VLVD5  
VLVD6  
2.40[3]  
2.64[4]  
2.85[5]  
2.95  
2.45  
2.71  
2.92  
3.02  
3.13  
1.90  
1.80  
2.51  
2.78  
2.99  
3.09  
3.20  
1.96  
1.84  
V
V
V
V
V
V
V
3.06  
1.84  
1.75[6]  
Notes  
3. Always greater than 50 mV above V  
4. Always greater than 50 mV above V  
5. Always greater than 50 mV above V  
6. Always greater than 50 mV above V  
voltage for falling supply.  
voltage for falling supply.  
voltage for falling supply.  
voltage for falling supply.  
POR1  
POR2  
POR3  
POR0  
Document Number: 001-44044 Rev. *G  
Page 17 of 36  
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CYONS2000  
DC Programming Specifications  
Table 7 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.  
The CYONS2000 must be properly powered for flash programming, with DVDD, AVDD, VREGD, and VREGA all held within the  
specified range. A suitable option for in-circuit programming USB designs is to apply 5 V to the VDD5V pin and use the internal  
regulator to drive DVDD, AVDD, VREGD, and VREGA. This enables direct connection to Cypress’s CY3210-Miniprog. For in-circuit  
programming of externally powered designs, the designer must include provisions for supplying DVDD, AVDD, VREGD, and VREGA  
externally.  
Table 7. DC Programming Specifications  
Parameter  
Description  
Conditions  
Min Typ Max  
Unit  
VIW  
Supply voltage for flash write operations  
VIW applied to DVDD, AVDD,  
VREGD, and VREGA  
2.7  
3.6  
V
IDDP  
VILP  
Supply current during programming or verify  
Input low voltage during programming or verify  
5
25  
mA  
V
See DC General Purpose I/O  
Specifications on page 16.  
VIL  
VIHP  
IILP  
Input high voltage during programming or verify  
See DC General Purpose I/O  
Specifications on page 16.  
VIH  
V
mA  
mA  
V
Input current when applying VILP to ISSP CLK and Driving internal pull-down resistor.  
ISSP DATA pins during programming or verify  
0.2  
1.5  
IIHP  
Input current when applying VIHP to ISSP CLK and Driving internal pull-down resistor.  
ISSP DATA pins during programming or verify  
VOLP  
VOHP  
Output low voltage during programming or verify  
DVSS  
+ 0.75  
Output high voltage during programming or verify DC General Purpose I/O  
Specifications on page 16. For  
VOH  
DVDD  
V
DVDD > 3 V use the value with  
I
OH = 5 mA.  
FlashENPB Flash write endurance  
Erase/write cycles by block.  
50,000  
5
Cycles  
Years  
FlashDR  
Flash data retention  
Following maximum flash write  
cycles at ambient temp of 45 °C  
10  
DC Characteristics - USB Interface  
The device includes an integrated full-speed USB block. Table 8 lists guaranteed maximum and minimum specifications for the entire  
voltage and temperature ranges.  
Table 8. DC USB Characteristics  
Symbol  
Rusbi  
Description  
USB D+ pull-up resistance  
Conditions  
With idle bus  
Min  
0.900  
1.425  
2.8  
Typ Max Units  
5
1.575  
3.090  
3.6  
0.3  
kΩ  
kΩ  
V
Rusba  
Vohusb  
Volusb  
Vdi  
USB D+ pull-up resistance  
Static output high  
While receiving traffic  
Static output low  
V
Differential input sensitivity  
Differential input common mode range  
Single-ended receiver threshold  
Transceiver capacitance  
High-Z state data line leakage  
PS/2 pull-up resistance  
0.2  
0.8  
0.8  
V
Vcm  
Vse  
2.5  
2.0  
50  
V
V
Cin  
pF  
uA  
kΩ  
Ω
Iio  
On D+ or D- line  
–10  
3
+10  
7
Rps2  
Rext  
External USB series resistor  
In series with each USB pin  
21.78 22 22.22  
Document Number: 001-44044 Rev. *G  
Page 18 of 36  
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CYONS2000  
AC Chip Level Specifications  
The device has two internal oscillators. The IMO controls the clock speeds for the CPU. A programmable frequency divider allows the  
CPU to run at lower speeds than the IMO. The ILO is a typically active in sleep modes, clocking sleep, and watchdog timers. Other  
internal timers can be clocked by either the CPU clock or the ILO.  
Table 9 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.  
Table 9. AC Chip Level Specifications  
Parameter  
FIMO24  
FIMO12  
FIMO6  
Description  
IMO frequency for 24-MHz setting  
Min  
Typ  
24  
12  
6.0  
50  
Max  
25.2  
12.6  
6.3  
60  
Unit  
MHz  
MHz  
MHz  
%
22.8  
IMO frequency for 12-MHz setting  
IMO frequency for 6-MHz setting  
IMO output duty cycle at 6 and 12-MHz setting[7]  
CPU frequency[8]  
11.4  
5.7  
DCIMO  
FCPU  
40  
FIMO / 256  
FIMO  
50  
MHz  
kHz  
μs  
F32K1  
ILO frequency[9]  
19  
20  
1
32  
TRAMP  
TXRST  
TXRST2  
TMOT  
Supply ramp time  
External reset pulse width at power-up  
External reset pulse width after power-up  
Motion delay from reset to valid tracking data[10]  
ms  
10  
μs  
30  
ms  
AC General Purpose I/OI/O Specifications  
GPIOs are arranged into four ports. Ports 0, 1, and 2 have eight GPIO pins and Port 3 has four GPIO pins. Port 1 has an optional  
LDO regulator that adjusts the port’s output voltage to 1.8, 2.5, or 3.0 V. Additionally, each GPIO pin can be independently set to one  
of four drive modes: strong drive, open drain, pull-up, or high-Z analog.  
Rise and fall times are specified for 10% and 90% voltage values.  
Specifications are for the entire operating temperature range.  
Table 10. AC GPIO Specs  
Parameter  
FGPIO  
Description  
GPIO operating frequency  
Rise time, ports 0 -1  
Conditions  
Min Typ Max Units  
Strong drive  
Strong drive, CLOAD = 50 pF, DVDD = 3.0 - 3.6  
0
12  
50  
70  
50  
70  
100  
80  
50  
70  
50  
70  
80  
MHz  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
TRISE_01  
TRISE_01_L  
TRISE_LDO_3  
Rise time, ports 0 -1, low supply Strong drive, CLOAD = 50 pF, DVDD = 2.7 - 3.0  
Rise time, port 1, 3 V LDO enabled Strong drive, CLOAD = 50 pF, DVDD > 3.1 V  
TRISE_LDO_2.5 Rise time, port 1, 2.5 LDO enabled Strong drive, CLOAD = 50 pF, DVDD > 2.7 V  
TRISE_LDO_1.8 Rise time, port 1, 1.8 LDO enabled Strong drive, CLOAD = 50 pF, DVDD > 2.7 V  
TRISE_23  
TFALL  
Rise time, ports 2 - 3  
Fall time, all ports  
Strong drive, CLOAD = 50 pF, DVDD = 2.7 - 3.6  
Strong drive, CLOAD = 50 pF, DVDD = 3.0 - 3.6  
Strong drive, CLOAD = 50 pF, DVDD = 2.7 - 3.0  
TFALL_L  
Fall time, all ports, low supply  
TFALL_LDO_3  
Fall time, port 1, 3 V LDO enabled Strong drive, CLOAD = 50 pF, DVDD > 3.1 V  
TFALL_LDO_2.5 Fall time, port 1, 2.5 LDO enabled Strong drive, CLOAD = 50 pF, DVDD > 2.7 V  
TFALL_LDO_1.8 Fall time, port 1, 1.8 LDO enabled Strong drive, CLOAD = 50 pF, DVDD > 2.7 V  
Notes  
7. IMO can be output from chip by routing to GPIO. Maximum GPIO output frequency is 12 MHz, so duty cycle at 24 MHz is not defined. See Technical Reference Manual  
at www.cypress.com or in Cypress's PSoC Designer software for details on routing IMO to GPIO pin.  
8. Available frequency divisors are 1, 2, 4, 8, 16, 32, 128, and 256.  
9. 32 kHz oscillator can be locked to external crystal. See technical reference manual available at www.cypress.com or in Cypress’ PSoC Designer software.  
10. Value provided represents maximum startup time for typical application. Applications requiring additional startup code, processing, or delay may increase TMOT.  
Document Number: 001-44044 Rev. *G  
Page 19 of 36  
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AC External Clock Specifications  
The IMO can be replaced with an external clock at the EXT CLK / P[1]4 pin. Refer to the technical reference manual for more details.  
Table 11 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.  
Table 11. AC External Clock Specifications  
Parameter  
Description  
Min  
0.750  
20.6  
20.6  
150  
Typ  
Max  
25.2  
5300  
Unit  
MHz  
ns  
FOSCEXT  
Frequency  
High period  
Low period  
ns  
Required time to run from IMO before switching to external clock  
μs  
AC Analog Mux Bus Specifications  
Table 12 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.  
Table 12. AC Analog Mux Bus Specifications  
Parameter  
Description  
Conditions  
Min  
Typ  
Max  
Unit  
FSW  
Switch rate  
Pin voltage < 1.8 V  
6.3  
MHz  
AC Programming Specifications  
The analog mux bus can connect signals from GPIOs to and from internal analog blocks and other GPIOs. Table 13 lists guaranteed  
maximum and minimum specifications for the entire voltage and temperature ranges.  
Table 13. AC Programming Specifications  
Symbol  
TRSCLK  
TFSCLK  
TSSCLK  
Description  
Rise time of ISSP CLK  
Fall time of ISSP CLK  
Conditions  
Min  
1
Typ  
Max  
20  
20  
Units  
ns  
1
ns  
Data setup time to falling edge of  
ISSP CLK  
40  
ns  
THSCLK  
Data hold time from falling edge of  
ISSP CLK  
40  
ns  
FSCLK  
Frequency of ISSP CLK  
Flash erase time (Block)  
Flash block write time  
0
8
MHz  
ms  
ms  
ns  
TERASEB  
TWRITE  
TDSCLK2  
18  
25  
85  
Data out delay from falling edge of 3.0 DVDD 3.6  
ISSP CLK  
Document Number: 001-44044 Rev. *G  
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AC SPI Specifications  
Table 14 lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.  
Table 14. AC SPI Master Specifications  
Parameter  
fSCLK  
Description  
Min  
Typ  
Max  
Unit  
MHz  
ns  
SPI CLK frequency[11]  
FIMO/2  
tSETUP  
SPI MISO to SPI CLK setup time  
SPI CLK to SPI MISO hold time  
SPI MOSI to SPI CLK setup time  
SPI CLK to SPI MOSI hold time  
60  
40  
40  
40  
tHOLD  
ns  
tOUT_SU  
tOUT_H  
ns  
ns  
Table 15. AC SPI Slave Specifications  
Parameter  
fSCLK  
Description  
Min  
Typ  
Max  
12  
Unit  
MHz  
ns  
SPI CLK frequency[11]  
tLOW  
Minimum SPI CLK low width[12]  
Minimum SPI CLK high width[12]  
SPI MOSI to SPI CLK setup time  
SPI CLK to SPI MOSI hold time  
SPI CLK to SPI MISO hold time  
SPI SS to SPI MISO valid  
41.67  
41.67  
25  
25  
35  
tHIGH  
ns  
tSETUP  
tHOLD  
tOUT_H  
tSS_MISO  
ns  
ns  
ns  
100  
140  
35  
20  
25  
ns  
tSCLK_MISO SPI CLK to SPI MISO valid  
ns  
tSS_HIGH  
tSS_CLK  
tCLK_SS  
Minimum SPI SS high width  
ns  
Time from SPI SS low to first SPI CLK  
Time from last SPI CLK to SPI SS high  
ns  
ns  
Notes  
11. Clock frequency is half of clock input to SPI block.  
12. Value corresponds to 50% duty cycle at 12 MHz.  
Document Number: 001-44044 Rev. *G  
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Figure 7. SPI Master Timing Diagram, Modes 0 and 2  
Figure 8. SPI Master Timing Diagram, Modes 1 and 3  
Document Number: 001-44044 Rev. *G  
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Figure 9. SPI Slave Timing Diagram, Modes 0 and 2  
Figure 10. SPI Slave Timing Diagram, Modes 1 and 3  
Document Number: 001-44044 Rev. *G  
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AC Comparator Specifications  
The device includes two general-purpose comparators, using internal or external signals from the analog mux bus. Table 16 lists  
guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.  
Table 16. AC Low Power Comparator Specifications  
Symbol  
Description  
Comparator response time, 50 mV 50 mV overdrive does not include  
overdrive offset voltage  
Conditions  
Min  
Typ  
Max  
Units  
TLPC  
100  
ns  
2
AC I C Specifications  
The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges.  
Table 17. AC Characteristics of the I2C SDA and SCL Pins  
Standard Mode  
Fast Mode  
Min Max  
Symbol  
Description  
Units  
Min  
0
Max  
100  
FSCLI2C  
I2C_SCL clock frequency  
0
0.6  
1.3  
0.6  
0.6  
0
400  
kHz  
μs  
μs  
μs  
μs  
μs  
ns  
μs  
μs  
ns  
THDSTAI2C Hold time for START and Repeated START condition  
4.0  
4.7  
4.0  
4.7  
0
TLOWI2C  
THIGHI2C  
LOW period of the I2C_SCL clock  
HIGH period of I2C_SCL clock  
TSUSTAI2C Setup time for a START and Repeated START condition  
THDDATI2C Data hold time  
TSUDATI2C Data setup time  
250  
4.0  
4.7  
100[13]  
0.6  
1.3  
0
TSUSTOI2C Setup time for STOP condition  
TBUFI2C  
TSPI2C  
Bus free time between a STOP and START condition  
Pulse width of spikes that are suppressed by the input filter  
50  
Figure 11. Timing for Fast/Standard Mode on the I2C Bus  
I2C_SDA  
TSUDATI2C  
TSPI2C  
TSUSTAI2C  
TBUFI2C  
THDDATI2C  
THDSTAI2C  
I2C_SCL  
THIGHI2C TLOWI2C  
TSUSTOI2C  
P
S
S
Sr  
Repeated START Condition  
STOP Condition  
START Condition  
Note  
13. A Fast-Mode I2C-bus device can be used in a Standard Mode I2C-bus system, but the requirement t  
250 ns must then be met. This automatically is the  
SUDATI2C  
case if the device does not stretch the LOW period of the SCL signal. If such device does stretch the LOW period of the SCL signal, it must output the next data bit  
to the SDA line t + t = 1000 + 250 = 1250 ns (according to the Standard-Mode I2C-bus specification) before the SCL line is released.  
rmax  
SUDATI2C  
Document Number: 001-44044 Rev. *G  
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AC USB Specifications  
The device includes an integrated full-speed USB block. Table 18 lists guaranteed maximum and minimum specifications for the entire  
voltage and temperature ranges.  
Table 18. AC Characteristics – USB Data Timing Specifications  
Symbol  
Tdrate  
Description  
Full speed data rate  
Conditions  
Average bit rate  
Min  
12–0.25%  
–18.5  
–9  
Typ  
12  
Max  
Units  
12 + 0.25 MHz  
Tdjr1  
Tdjr2  
Tudj1  
Tudj2  
Tfdeop  
Tfeopt  
Tfeopr  
Tfst  
Receiver data jitter tolerance  
Receiver data jitter tolerance  
Driver differential jitter  
To next transition  
To pair transition  
To next transition  
To pair transition  
To SE0 transition  
18.5  
9
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
–3.5  
–4.0  
–2  
3.5  
4.0  
5
Driver differential jitter  
Source jitter for differential transition  
Source SE0 interval of EOP  
Receiver SE0 interval of EOP  
160  
175  
82  
Width of SE0 interval during differential  
transition  
14  
Table 19. AC Characteristics – USB Driver  
Symbol Description  
Tr Transition rise time  
Conditions  
50 pF  
Min  
4
Typ  
Max  
20  
Units  
ns  
Tf  
Transition fall time  
50 pF  
4
20  
ns  
TR  
Vcrs  
Rise/fall time matching  
Output signal crossover voltage  
0.8 V to 2.5 V  
90  
1.3  
111  
2.0  
%
V
Document Number: 001-44044 Rev. *G  
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PCB Land Pads and Keepout Zones  
Figure 12 and Figure 13 show the recommended land pad architecture and keepout zones. The pads on the 42-pin device are a  
subset of the JEDEC MO-220 52-pin QFN standard. For detailed layout instructions, see the application note AN48995, Mechanical  
Design Considerations for the OvationONSTM II Laser Navigation System-on-Chip.  
Figure 12. Land Pad Architecture and Spacing  
Figure 13. PCB Keep Out Zones  
Document Number: 001-44044 Rev. *G  
Page 26 of 36  
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Orientation of Axes  
Figure 14 describes the relationship between the package and the x/y axes when using the API provided by Cypress’s PSoC Designer  
software. Note that there is a 90-degree rotation between the orientation below and the orientation described in the register section  
of the technical reference manual. If PSoC Designer is not used, the application firmware should read and invert the Y count register  
for X data, and read the X count register for Y data.  
Figure 14. Sensor Orientation when using Cypress PSoC Designer Software  
PCB Mounting Height and Thickness  
Figure 15 shows the recommended thickness and mounting height of the PCB above the tracking surface.  
Figure 15. PCB Height and Thickness  
Document Number: 001-44044 Rev. *G  
Page 27 of 36  
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Thermal Impedances  
[14]  
Package  
Typical θJA  
42 PQFN[15]  
24 °C/W  
Solder Reflow Peak Temperature  
Following is the minimum solder reflow peak temperature to achieve good solderability.  
Package  
Minimum Peak Temperature[16]  
Maximum Peak Temperature  
42 PQFN  
240 °C  
260 °C  
Notes  
14. T = T + Power x θ .  
JA  
J
A
15. To achieve the thermal impedance specified for the QFN package, the center thermal pad must be soldered to the PCB ground plane.  
16. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5°C with Sn-Pb or 245 ± 5°C with Sn-Ag-Cu paste.  
Refer to the solder manufacturer specifications. For a recommended soldering profile, refer to Application Note 49035, Manufacturing Considerations for the Ovation-  
TM  
ONS Laser Navigation System-on-Chip.  
Document Number: 001-44044 Rev. *G  
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Laser Safety Considerations  
The CYONS2000 laser navigation SoC and the CYONSLENS2000  
lens are designed and tested to enable manufacturers to achieve  
eye-safety certification with minimal effort. This section provides  
guidelines for complying with the Class 1 emission requirements of  
IEC/EN 60825-1.  
Laser Output Power Test Procedure  
To verify the laser output level, follow the steps shown in the  
“VCSEL Power Calibration and Verification” section of the  
technical reference manual.  
Registration Assistance  
When installed and operated in accordance with all requirements in  
this datasheet, the kit consisting of the CYONS2000 laser  
navigation SoC and CYONSLENS2000 satisfies CDRH 21 CFR  
1040 per Laser Notice 50 and IEC/EN 60825-1 Class 1.  
The mouse or end-product supplier is responsible for certifying  
the end-use product with respect to the drive voltage, manuals  
and labels, and operating temperature specifications.  
Additionally, for products sold in the US, a CDRH report must be  
filed for each model produced, and test and inspection of the  
product’s characteristics as they relate to laser safety and the  
CDRH requirements must be performed.  
Laser Output Power  
The CYONS2000 sensor package contains an integrated  
VCSEL and drive circuitry. Before shipping, Cypress adjusts the  
laser output power to eye-safe levels, taking into account  
specified variations in supply voltage, temperature, lens  
transmission, and VCSEL polarization, and factors such as  
VCSEL aging and test equipment accuracy. The output remains  
within eye-safe limits under reasonably foreseeable  
single-faults, as required by the IEC standard.  
When filing a report with the CDRH, the supplier can refer to the  
product report filed by Cypress for the CYONS2xxx family of  
products. The Cypress report is based on the previously-noted  
limits for voltage and temperature, and describes how the sensor  
design includes consideration of drive circuit failures, laser  
output variation with temperature, drive circuit variation with  
temperature and voltage, polarization sensitivity of molded  
optics, and measurement uncertainties.  
From the perspective of a manufacturer, laser emission remains  
within the Class 1 limit, as defined in IEC 60825-1, Edition 2,  
2007, provided the following requirements are met.  
Cypress can provide assistance to customers who want to obtain  
registration. Supporting documentation, including a verification  
test procedure to demonstrate end-product compliance with IEC  
and CDRH requirements is available.  
The supply voltage applied to pins DVDD and AVDD of the SoC  
must be in the range of 2.7 to 3.6 V.  
The operating temperature must be between 5 and 45 °C.  
The laser output power must not be increased by any means,  
including but not limited to firmware, hardware, or mechanical  
modifications to the sensor or lens.  
The mechanical housing must be designed such that the  
CYONSLENS2000 cannot be removed by the user.  
The device firmware must initialize the VCSEL driver as  
described in the “VCSEL Driver” chapter of the OvationONS II  
technical reference manual, or by using the NAV or LaserNAV  
User Modules in Cypress’s PSoC Designer software.  
The manufacturer must ensure that these conditions are always  
met and demonstrate end-product compliance to the appropriate  
regulatory standards.  
Document Number: 001-44044 Rev. *G  
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Development Tool Selection  
This section presents the development tools available for all  
current PSoC device families including the CYONS2000.  
iMAGEcraft C compiler (registration required)  
ISSP cable  
Software  
USB 2.0 cable and Blue Cat-5 cable  
Two CY8C29466-24PXI 28-PDIP chip samples  
PSoC Designer  
At the core of the PSoC development software suite is PSoC  
Designer, used to generate PSoC firmware applications. PSoC  
Evaluation Tools  
Designer  
is  
available  
free  
of  
charge  
at  
You can purchase the evaluation tools from the Cypress Online  
Store.  
http://www.cypress.com/psocdesigner and includes a free C  
compiler with version Service Pack 4.5 or later.  
CY3210-MiniProg1  
PSoC Programmer  
The CY3210-MiniProg1 kit enables a user to program PSoC  
devices using the MiniProg1 programming unit. The MiniProg is  
a small, compact prototyping programmer that connects to the  
PC through a provided USB 2.0 cable. The kit includes:  
Flexible enough to be used on the bench in development, yet  
suitable for factory programming, PSoC Programmer works  
either as a standalone programming application or operates  
directly from PSoC Designer. PSoC Programmer software is  
compatible with both PSoC ICE-Cube In-Circuit Emulator and  
PSoC MiniProg. PSoC programmer is available free of charge at  
http://www.cypress.com/psocprogrammer.  
MiniProg programming unit  
MiniEval socket programming and evaluation board  
28-pin CY8C29466-24PXI PDIP PSoC device sample  
28-pin CY8C27443-24PXI PDIP PSoC device sample  
PSoC Designer software CD  
Mouse Design Kits  
Two kits featuring the OvationONS II family of products are  
available. The reference design kit provides a complete  
hardware, firmware, and software solution, ready for production.  
The demonstration kit provides tested hardware and firmware  
that demonstrate the capabilities of the OvationONS II device.  
Getting Started guide  
USB 2.0 cable  
CY4631 Wired Mouse reference design kit  
Wireless Mouse demonstration kit  
CY3210-PSoCEval1  
The CY3210-PSoCEval1 kit features an evaluation board and  
the MiniProg1 programming unit. The evaluation board includes  
an LCD module, potentiometer, LEDs, and plenty of bread-  
boarding space to meet all your evaluation needs. The kit  
includes:  
Development Kits  
You can purchase the development kits from the Cypress Online  
Store.  
Evaluation board with LCD module  
MiniProg programming unit  
CY3215-DK Basic Development Kit  
The CY3215-DK kit enables prototyping and development with  
PSoC Designer. This kit supports in-circuit emulation and the  
software interface enables users to run, halt, and single step the  
processor and view the content of specific memory locations.  
Advanced emulation features are also supported through PSoC  
Designer. The kit includes:  
28-pin CY8C29466-24PXI PDIP PSoC device sample (2)  
PSoC Designer software CD  
Getting Started guide  
USB 2.0 cable  
PSoC Designer software CD  
ICE-Cube In-Circuit Emulator  
ICE Flex-Pod for the CY8C29x66 family  
Cat-5 adapter  
Mini-Eval programming board  
110 ~ 240 V power supply, Euro-Plug adapter  
Document Number: 001-44044 Rev. *G  
Page 30 of 36  
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CY3214-PSoCEvalUSB  
CY3207ISSP In-System Serial Programmer (ISSP)  
The CY3214-PSoCEvalUSB evaluation kit features  
a
The CY3207ISSP is a production programmer. It includes  
protection circuitry and an industrial case that is more robust than  
the MiniProg in a production-programming environment.  
development board for the CY8C24794-24LFXI PSoC device.  
Special features of the board include both USB and capacitive  
sensing development and debugging support. This evaluation  
board also includes a LCD module, potentiometer, LEDs, an  
enunciator and plenty of breadboarding space to meet all of your  
evaluation needs. The kit includes:  
Note CY3207ISSP needs special software and is not compatible  
with PSoC Programmer.  
The kit includes:  
CY3207 programmer unit  
PSoC ISSP software CD  
110 ~ 240 V power supply, Euro-Plug adapter  
USB 2.0 cable  
PSoCEvalUSB board  
LCD module  
MIniProg programming unit  
Mini USB cable  
PSoC Designer and example projects CD  
Getting Started guide  
Wire pack  
Third Party Tools  
Several tools have been specially designed by third-party  
vendors to accompany PSoC devices during development and  
production. Specific details for each of these tools are found at  
http://www.cypress.com.  
Device Programmers  
You can purchase the device programmers from the Cypress  
Online Store.  
CY3216 Modular Programmer  
The CY3216 Modular Programmer kit features a modular  
programmer and the MiniProg1 programming unit. The modular  
programmer includes three programming module cards and  
supports multiple Cypress products. The kit includes:  
Modular programmer base  
Three programming module cards  
MiniProg programming unit  
PSoC Designer software CD  
Getting Started guide  
USB 2.0 cable  
Document Number: 001-44044 Rev. *G  
Page 31 of 36  
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CYONS2000  
Package Diagrams  
Figure 16. QFN Package  
TOP VIEW  
SIDE VIEW  
BOTTOM VIEW  
0.50-0.60  
0.05 MAX  
1.40 MAX  
8.300 SQ  
[2X]  
SEE DETAIL - B  
SEE DETAIL - A  
2
Pin  
1
0.20 MAX  
+0.05  
(PIN1 ID)  
0.50-0.60  
0.42-0.00 X 45° [4X]  
SEATING PLANE  
+0.025  
[2X] Ø0.64 -0.025 THRU  
DETAIL - A  
SCALE: 2/1  
NOTES:  
1. ALL DIMENSIONS ARE IN MM , [ MIN/MAX]  
2. REFRENCE JEDEC # MO-220  
3. PKG WEIGHT: 0.2 grams  
+0.025  
Ø0.64 -0.025 THRU  
4. APERTURE MOLD CAVITY I.D.  
001-44934 *C  
DETAIL - B  
SCALE: 2/1  
NON-SOLDERABLE PADS  
Document Number: 001-44044 Rev. *G  
Page 32 of 36  
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CYONS2000  
Figure 17. Lens  
001-44677 *B  
Document Number: 001-44044 Rev. *G  
Page 33 of 36  
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CYONS2000  
Ordering Information  
The CYONS2000 and CYONSLENS2000 are sold separately. When placing orders, order both part numbers.  
Part Number  
CYONS2000-LBXC  
Package  
Application  
Desktop wired  
Molded optic  
42 pin PQFN  
Lens - 4 mm height  
CYONSLENS2000-C  
Ordering Code Definition  
XXXX  
CYONS  
-XXX C  
Temperature range:  
Commercial  
42-pin PQFN package  
Wired laser navigation system-on-chip  
Optical navigation sensor  
Company ID: CY = Cypress  
Document Number: 001-44044 Rev. *G  
Page 34 of 36  
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CYONS2000  
Numeric Naming  
Document Conventions  
Hexadecimal numbers are represented with all letters in  
uppercase with an appended lowercase ‘h’ (for example, ‘14h’ or  
‘3Ah’). Hexadecimal numbers may also be represented by a ‘0x’  
prefix, the C coding convention. Binary numbers have an  
appended lowercase ‘b’ (for example, ‘01010100b’ or  
‘01000011b’). Numbers not indicated by an ‘h’, ‘b’, or ‘0x’ are  
decimal.  
Acronyms Used  
Table 20 lists the acronyms used in this document.  
Units of Measure  
A units of measure table in Table 21 lists the abbreviations used  
to measure the devices.  
Table 20. Acronyms  
Acronym  
Description  
Acronym  
Description  
AC  
Alternating Current  
LDO  
Low Drop Out (regulator)  
Light Emitting Diode  
Low Power Comparator  
Least-significant Bit  
ADC  
API  
Analog to Digital Converter  
Application Programming Interface  
Center for Devices and Radiological Health  
Counts per Inch  
LED  
LPC  
CDRH  
CPI  
LSb  
LVD  
Low Voltage Detect  
CPU  
DAC  
DC  
Central Processing Unit  
Digital to Analog Converter  
Direct Current  
M8C  
Cypress’ 8-bit CPU Core  
Microcontroller Unit  
MCU  
MIPS  
MSb  
Million Instructions per Second  
Most-significant Bit  
DSP  
ESD  
GND  
GPIO  
HEX  
High-Z  
Digital Signal Processor  
Electrostatic Discharge  
Ground  
MUX  
PC, PCB  
PDIP  
PGA  
Multiplexer  
Printed Circuit, Printed Circuit Board  
Plastic Dual In-Line Package  
Programmable Gain Amplifier  
Power On Reset  
General Purpose I/O  
Hexadecimal  
High Impedance  
POR  
PQFN  
PSoC  
PSRR  
PWM  
QFN  
2
I C  
Inter-Integrated Circuit (bus)  
In-circuit Emulator  
Plastic Quad Flat No-Leads (package)  
Programmable System-on-Chip  
Power Supply Rejection Ratio  
Pulse Width Modulator  
ICE  
IDAC  
IDE  
DAC-Controlled Current Source  
Integrated Development Environment  
International Electrotechnical Commission  
Internal Low Speed Oscillator  
Internal Main Oscillator  
Input/Output  
IEC  
Quad Flat No-Leads (package)  
System on Chip  
ILO  
SoC  
IMO  
I/O  
SPI  
Serial Peripheral Interface (bus)  
Static Random Access Memory  
Universal Serial Bus  
SRAM  
USB  
JEDEC  
LCD  
Joint Electron Devices Engineering Council  
Liquid Crystal Display  
VCSEL  
Vertical Cavity Surface Emitting Laser  
Table 21. Units of Measure  
Symbol  
Unit of Measure  
Symbol  
Unit of Measure  
°C  
degree Celsius  
μV  
mA  
ms  
mV  
nH  
nm  
ns  
microvolts  
milliampere  
millisecond  
millivolt  
g
acceleration of gravity  
1024 bytes  
inches per second  
kilohertz  
KB  
in/s  
kHz  
kΩ  
kV  
nanohenry  
nanometer  
nanosecond  
ohm  
kilohm  
kilovolt  
MHz  
μA  
μF  
μH  
μs  
megahertz  
Ω
microampere  
microfarad  
pF  
pp  
V
picofarad  
peak-to-peak  
volt  
microhenry  
microsecond  
W
watt  
Document Number: 001-44044 Rev. *G  
Page 35 of 36  
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CYONS2000  
Document History Page  
Document Title: CYONS2000 OvationONS™ II Wired Laser Navigation System-on-Chip  
Document Number: 001-44044  
Orig. of  
Change  
Submission  
Date  
Revision  
ECN  
Description of Change  
**  
2261927  
FJZ  
See ECN New datasheet.  
*A  
*B  
2580125 FJZ/PYRS  
2769396 FJZ/AESA  
10/07/08  
25/09/09  
Extensive Updates  
Updated Getting Started and Development Tools sections. Updated thermal  
impedance, wireless kit part number, Flash specs, storage temperature, I2C  
footnote, pin table, and c compiler information.  
*C  
*D  
2889331  
2903558  
FJZ  
FJZ  
03/09/10  
04/20/10  
Added Table of Contents. Updated package diagram and sales links.  
Update LVD, USB, SPI Master and SPI Slave specs.  
Numerous minor updates for improved clarity and consistency.  
*E  
*F  
*G  
2936335  
3092209  
3126503  
MMCY  
FJZ  
05/24/2010 Updated content to match the new template and style guide.  
No technical updates.  
11/22/2010 Corrected error in Pin Description.  
Removed invalid reference to application note in Registration Assistance.  
FJZ  
01/03/2011 Updated Figure 17. Changed posting to external web  
Sales, Solutions, and Legal Information  
Worldwide Sales and Design Support  
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office  
closest to you, visit us at Cypress Locations.  
Products  
PSoC Solutions  
Automotive  
cypress.com/go/automotive  
cypress.com/go/clocks  
cypress.com/go/interface  
cypress.com/go/powerpsoc  
cypress.com/go/plc  
psoc.cypress.com/solutions  
PSoC 1 | PSoC 3 | PSoC 5  
Clocks & Buffers  
Interface  
Lighting & Power Control  
Memory  
cypress.com/go/memory  
cypress.com/go/image  
cypress.com/go/psoc  
Optical & Image Sensing  
PSoC  
Touch Sensing  
USB Controllers  
Wireless/RF  
cypress.com/go/touch  
cypress.com/go/USB  
cypress.com/go/wireless  
© Cypress Semiconductor Corporation, 2008-2011. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of  
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for  
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as  
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems  
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.  
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),  
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,  
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress  
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without  
the express written permission of Cypress.  
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES  
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not  
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where  
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer  
assumes all risk of such use and in doing so indemnifies Cypress against all charges.  
Use may be limited by and subject to the applicable Cypress software license agreement.  
Document Number: 001-44044 Rev. *G  
Revised January 3, 2011  
Page 36 of 36  
OvationONS™, OptiCheck™, and PSoC Designer™ are trademarks and PSoC and CapSense are registered trademarks of Cypress Semiconductor Corp. All other trademarks or registered trademarks  
referenced herein are property of the respective corporations.  
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