STK17TA8RF25 [CYPRESS]

REAL TIME CLOCK, PDSO48, 0.300 INCH, 0.025 INCH PITCH, ROHS COMPLIANT, PLASTIC, SSOP-48;
STK17TA8RF25
型号: STK17TA8RF25
厂家: CYPRESS    CYPRESS
描述:

REAL TIME CLOCK, PDSO48, 0.300 INCH, 0.025 INCH PITCH, ROHS COMPLIANT, PLASTIC, SSOP-48

光电二极管
文件: 总27页 (文件大小:712K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
STK17TA8  
nvTimeTM Event Data Recorder  
128K x 8 AutoStoreTM nvSRAM  
With Real-Time Clock  
FEATURES  
DESCRIPTION  
Data Integrity of Simtek nvSRAM Combined  
with Full-Featured Real-Time Clock  
Watchdog Timer  
The Simtek STK17TA8 combines a 1 Mbit nonvola-  
tile static RAM with a full-featured real-time clock in  
a reliable, monolithic integrated circuit. The embed-  
ded nonvolatile elements incorporate Simtek’s  
QuantumTraptechnology producing the world’s  
most reliable nonvolatile memory. The SRAM can  
be read and written an unlimited number of times,  
while independent, nonvolatile data resides in the  
nonvolatile elements.  
Clock Alarm with programmable Interrupts  
Capacitor or battery backup for RTC  
25ns and 45ns Access Times  
“Hands-off” Automatic STORE on Power Down  
with only a small capacitor  
STORE to QuantumTrap™ Initiated by  
Software , device pin, or on Power Down  
RECALL to SRAM Initiated by Software or  
Power Up  
The Real-Time Clock function provides an accurate  
clock with leap year tracking and a programmable,  
high accuracy oscillator. The Alarm function is pro-  
grammable for one-time alarms or periodic seconds,  
minutes, hours, or days. There is also a programma-  
ble Watchdog Timer for process control.  
Unlimited READ, WRITE and RECALL Cycles  
High-reliability  
o
o
Endurance to 200K Cycles  
Retention to 20 years  
10mA Typical ICC at 200ns Cycle Time  
Single 3V +20%, -10% Operation  
SSOP Package, ROHS compliant  
BLOCK DIAGRAM  
VCC  
VCAP  
Quantum Trap  
1024 X 1024  
A5  
A6  
A7  
VRTCbat  
VRTCcap  
POWER  
CONTROL  
STORE  
A8  
A9  
STORE/  
RECALL  
CONTROL  
STATIC RAM  
ARRAY  
1024 X 1024  
RECALL  
A12  
A13  
A14  
A15  
A16  
HSB  
SOFTWARE  
DETECT  
A15 – A0  
DQ0  
COLUMN I/O  
DQ1  
DQ2  
DQ3  
DQ4  
DQ5  
DQ6  
DQ7  
X1  
COLUMN DEC  
RTC  
X2  
INT  
A0 A1 A2 A3 A4 A10 A11  
A16 – A0  
MUX  
G
E
W
Figure 1. Block Diagram  
July 2006  
1
Document Control #ML0025 rev 1.4  
STK17TA8  
PACKAGES  
VCAP  
A16  
A14  
1
2
3
4
VCC  
A15  
48  
47  
HSB  
46  
45  
A12  
A7  
W
A13  
5
44  
A6  
6
A8  
43  
A5  
INT  
A4  
7
8
9
10  
11  
12  
13  
14  
15  
16  
A9  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
A11  
Approximate PCB area usage.  
See website for detailed  
package size specifications.  
VSS  
VSS  
VRTCcap  
DQ6  
G
A10  
E
DQ7  
VRTCbat  
DQ0  
A3  
A2  
A1  
A0  
DQ1  
DQ2  
17  
18  
19  
20  
21  
22  
23  
24  
DQ5  
DQ4  
DQ3  
VCC  
X1  
X2  
48 Pin SSOP  
PIN DESCRIPTIONS  
Pin Name  
A16 – A0  
I/O  
Input  
I/O  
Description  
Address: The 17 address inputs select one of 131,056 bytes in the nvSRAM array or one of 16 bytes in the clock  
register map.  
DQ7 –DQ0  
E
Data: Bi-directional 8-bit data bus for accessing the nvSRAM array and RTC.  
Input  
Chip Enable: The active low  
Write Enable: The active low W enables data on the DQ pins to be written to the address location latched by the  
falling edge of E  
E
input selects the device.  
W
G
Input  
Input  
.
Output Enable: The active low G input enables the data output buffers during read cycles. De-asserting G high  
causes the DQ pins to tri-state.  
X1  
X2  
Output  
Input  
Crystal Connection, drives crystal on startup.  
Crystal Connection for 32.768 kHz crystal.  
VRTCcap  
VRTCbat  
VCC  
Power Supply  
Power Supply  
Power Supply  
Capacitor supplied backup RTC supply voltage. (Left unconnected if VRTCbat is used.)  
Battery supplied backup RTC supply voltage. (Left unconnected if VRTCcap is used.)  
Power 3.0V +20%, -10%  
Hardware Store Busy: When low this output indicates a Hardware Store is in progress. When pulled low external  
to the chip it will initiate a nonvolatile STORE operation. A weak internal pull up resistor keeps this pin high if not  
connected. (Connection Optional)  
HSB  
I/O  
Interrupt Output: Can be programmed to respond to the clock alarm, the watchdog timer and the power monitor.  
Programmable to either active high (push/pull) or active low (open-drain).  
Autostore Capacitor: Supplies power to nvSRAM during power loss to store data from SRAM to nonvolatile  
elements.  
INT  
Output  
VCAP  
Power Supply  
VSS  
(Blank)  
Power Supply  
No Connect  
Ground  
Unlabeled pins have no internal connection.  
July 2006  
2
Document Control #ML0025 rev 1.4  
STK17TA8  
ABSOLUTE MAXIMUM RATINGSa  
Notes  
-0.5V to +4.1V  
Power Supply Voltage  
Voltage on Input Relative to VSS  
Voltage on Outputs  
a: Stresses greater than those listed under “Absolute Maximum  
Ratings” may cause permanent damage to the device. This is a  
stress rating only, and functional operation of the device at con-  
ditions above those indicated in the operational sections of this  
specification is not implied. Exposure to absolute maximum rat-  
ing conditions for extended periods may affect reliability.  
-0.5V to (VCC + 0.5V)  
-0.5V to (VCC + 0.5V)  
–55°C to 125°C  
–55°C to 140°C  
–65°C to 150°C  
1W  
Temperature under Bias  
Junction Temperature  
Storage Temperature  
Power Dissipation  
DC Output Current (1 output at a time, 1s duration)  
15mA  
Package Thermal Characteristics see website: http://www.simtek.com/  
DC CHARACTERISTICS  
Commercial  
Industrial  
Symbol  
Parameter  
Units  
mA  
mA  
mA  
Notes  
MIN  
MAX  
65  
55  
50  
MIN  
MAX  
70  
60  
55  
tAVAV = 25ns  
tAVAV = 35ns  
Average VCC Current  
ICC1  
t
AVAV = 45ns  
Dependent on output loading and cycle  
rate. Values obtained without output loads.  
All Inputs Don’t Care, VCC = max  
Average current for duration of STORE  
cycle (tSTORE).  
Average VCC Current during STORE  
Average VCC Current at tAVAV = 200ns  
3V, 25°C, Typical  
ICC2  
ICC3  
ICC4  
ISB  
3
3
mA  
W
(VCC – 0.2V)  
All Others Inputs Cycling, at CMOS Levels.  
Dependent on output loading and cycle  
rate. Values obtained without output loads.  
All Inputs Don’t Care  
Average current for duration of STORE  
cycle (tSTORE).  
10  
3
10  
3
mA  
mA  
Average VCAP Current during  
AutoStore™ Cycle  
VCC Standby Current  
E
(VCC – 0.2V)  
All Others VIN 0.2V or (VCC – 0.2V)  
Standby current level after nonvolatile  
cycle is complete.  
(Standby, Stable CMOS Input Levels)  
3
3
mA  
µA  
VCC = max  
Input Leakage Current  
IILK  
±1  
±1  
VIN = VSS to VCC  
VCC = max  
Off-State Output Leakage Current  
IOLK  
VIN = VSS to VCC  
, E or G VIH  
±1  
VCC + 0.3  
0.8  
±1  
VCC + 0.3  
0.8  
µA  
V
Input Logic “1” Voltage  
Input Logic “0” Voltage  
Output Logic “1” Voltage  
Output Logic “0” Voltage  
Operating Temperature  
Operating Voltage  
VIH  
VIL  
2.0  
VSS – 0.5  
2.4  
2.0  
VSS – 0.5  
2.4  
All Inputs  
V
All Inputs  
VOH  
V
IOUT = –2mA  
IOUT = 4mA  
VOL  
0.4  
70  
0.4  
85  
V
TA  
0
–40  
2.7  
17  
oC  
VCC  
2.7  
17  
3.6  
57  
3.6  
57  
V
3.0V +20%, -10%  
Storage Capacitor  
VCAP  
NVC  
DATAR  
µF  
K
Between Vcap pin and Vss, 5V rated.  
Nonvolatile STORE operations  
Data Retention  
200  
20  
200  
20  
Years  
@ 55°C  
July 2006  
3
Document Control #ML0025 rev 1.4  
STK17TA8  
AC TEST CONDITIONS  
0V to 3V  
Input Pulse Levels  
Input Rise and Fall Times  
Input and Output Timing Reference Levels  
5ns  
1.5V  
Output Load  
See Figure 2 and Figure 3  
CAPACITANCEb  
(TA = 25°C, f = 1.0MHz)  
SYMBOL  
PARAMETER  
MAX  
UNITS  
pF  
CONDITIONS  
V = 0 to 3V  
V = 0 to 3V  
CIN  
Input Capacitance  
Output Capacitance  
7
7
COUT  
pF  
Notes  
b: These parameters are guaranteed but not tested  
3.0V  
3.0V  
577 Ohms  
577 Ohms  
OUTPUT  
OUTPUT  
5 pF  
30 pF  
INCLUDING  
SCOPE AND  
FIXTURE  
F  
789 Ohms  
789 Ohms  
INCLUDING  
SCOPE AND  
FIXTURE  
Figure 3. AC Output Loading,  
for tristate specs (  
Figure 2. AC Output Loading  
tHZ, tLZ, tWLQZ, tWHQZ  
tGLQX, tGHQZ  
,
)
July 2006  
4
Document Control #ML0025 rev 1.4  
STK17TA8  
RTC DC CHARACTERISTICS  
Commercial  
Industrial  
Symbol  
Parameter  
Units  
Notes  
MIN  
MAX  
MIN  
MAX  
RTC Backup Current  
-
-
IBAK  
300  
350  
3.3  
2.7  
nA  
V
From either VRTCcap or VRTCbat  
Typical = 3.0 Volts during normal  
operation  
Typical = 2.4 Volts during normal  
operation  
RTC Battery Pin Voltage  
VRTCbat  
VRTCcap  
1.8  
1.2  
3.3  
2.7  
1.8  
1.2  
RTC Capacitor Pin Voltage  
V
@ MIN Temperature from Power up  
or Enable  
-
-
-
-
10  
5
10  
5
sec  
sec  
tOSCS  
RTC Oscillator time to start  
@25ºC from Power up or Enable  
RTC RECOMMENDED COMPONENT CONFIGURATION  
X1  
X2  
Recommended Values  
Y1 = 32.768 KHz  
RF = 10M Ohm  
C1 = 0  
C2 = 56 pF  
Figure 4. RTC COMPONENT CONFIGURATION  
July 2006  
5
Document Control #ML0025 rev 1.4  
STK17TA8  
SRAM READ CYCLES #1 & #2  
SYMBOLS  
STK17TA8-25  
STK17TA8-45  
NO.  
PARAMETER  
UNITS  
#1  
#2  
Alt.  
tACS  
MIN  
MAX  
MIN  
MAX  
tELQV  
1
2
Chip Enable Access Time  
25  
45  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
c
c
tAVAV  
tAVAV  
tRC  
tAA  
tOE  
tOH  
tLZ  
Read Cycle Time  
25  
45  
d
tAVQV  
3
Address Access Time  
25  
12  
45  
20  
tGLQV  
4
Output Enable to Data Valid  
Output Hold after Address Change  
Chip Enable to Output Active  
Chip Disable to Output Inactive  
Output Enable to Output Active  
Output Disable to Output Inactive  
Chip Enable to Power Active  
Chip Disable to Power Standby  
d
tAXQX  
5
3
3
3
3
tELQX  
tEHQZ  
tGLQX  
6
e
tHZ  
tOLZ  
tOHZ  
tPA  
tPS  
7
10  
10  
25  
15  
15  
45  
8
0
0
0
0
e
tGHQZ  
9
b
tELICC  
10  
b
tEHICC  
11  
Notes  
c:  
W
must be high during SRAM READ cycles  
and  
d: Device is continuously selected with  
E
G
both low  
e: Measured ± 200mV from steady state output voltage  
f: HSB must remain high during READ and WRITE cycles.  
SRAM READ CYCLE #1: Address Controlledc,d,f  
2
tAVAV  
ADDRESS  
3
tAVQV  
5
tAXQX  
DATA VALID  
DQ (DATA OUT)  
SRAM READ CYCLE #2: E Controlledc,f  
2
tAVAV  
ADDRESS  
1
tELQV  
11  
tEHICCL  
6
tELQX  
E
7
tEHQZ  
G
9
tGHQZ  
4
tGLQV  
8
tGLQX  
DQ (DATA OUT)  
DATA VALID  
10  
tELICCH  
ACTIVE  
STANDBY  
ICC  
July 2006  
6
Document Control #ML0025 rev 1.4  
STK17TA8  
SRAM WRITE CYCLES #1 & #2  
SYMBOLS  
NO.  
STK17TA8-25 STK17TA8-45  
UNITS  
PARAMETER  
#1  
#2  
Alt.  
tWC  
tWP  
tCW  
tDW  
tDH  
MIN  
25  
20  
20  
10  
0
MAX  
MIN  
45  
30  
30  
15  
0
MAX  
Write Cycle Time  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
tAVAV  
tWLWH  
tELWH  
tDVWH  
tWHDX  
tAVWH  
tAVWL  
tWHAX  
tAVAV  
tWLEH  
tELEH  
tDVEH  
tEHDX  
tAVEH  
tAVEL  
tEHAX  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Write Pulse Width  
Chip Enable to End of Write  
Data Set-up to End of Write  
Data Hold after End of Write  
Address Set-up to End of Write  
Address Set-up to Start of Write  
Address Hold after End of Write  
Write Enable to Output Disable  
Output Active after End of Write  
tAW  
tAS  
20  
0
30  
0
tWR  
tWZ  
tOW  
0
0
e,g  
tWLQZ  
tWHQX  
10  
15  
3
3
Notes  
g: If  
h:  
W
is low when E goes low, the outputs remain in the high-impedance state.  
E
or  
W
must be VIH during address transitions.  
SRAM WRITE CYCLE #1: W Controlledh,f  
12  
tAVAV  
ADDRESS  
19  
tWHAX  
14  
tELWH  
E
17  
tAVWH  
18  
13  
tWLWH  
tAVWL  
W
15  
16  
tDVWH  
tWHDX  
DATA VALID  
DATA IN  
20  
tWLQZ  
21  
tWHQX  
HIGH IMPEDANCE  
PREVIOUS DATA  
DATA OUT  
SRAM WRITE CYCLE #2: E Controlledh,f  
12  
tAVAV  
ADDRESS  
18  
14  
tELEH  
19  
tEHAX  
tAVEL  
E
17  
tAVEH  
13  
tWLEH  
W
16  
tEHDX  
15  
tDVEH  
DATA VALID  
DATA IN  
HIGH IMPEDANCE  
DATA OUT  
July 2006  
7
Document Control #ML0025 rev 1.4  
STK17TA8  
AutoStore™ /POWER-UP RECALL  
SYMBOLS  
NO.  
PARAMETER  
STK17TA8  
UNITS  
NOTES  
Standard  
Alternate  
MIN  
MAX  
22  
23  
24  
25  
tHRECALL  
40  
ms  
ms  
V
i
Power-up RECALL Duration  
tSTORE  
tHLHZ  
12.5  
j,k  
STORE Cycle Duration  
Low Voltage Trigger Level  
VCC Rise Time  
VSWITCH  
tVCCRISE  
2.65  
150  
µs  
Notes  
i: tHRECALL starts from the time VCC rises above VSWITCH  
j: If an SRAM WRITE has not taken place since the last nonvolatile cycle, no STORE will take place  
k: Industrial Grade Devices require 15ms MAX.  
STORE occurs only if a  
SRAM write has  
happened.  
No STORE occurs  
without at least one  
SRAM write.  
AutoStore™/POWER-UP RECALL  
VCC  
24  
VSWITCH  
25  
tVCCRISE  
AutoStoreTM  
23  
tSTORE  
23  
tSTORE  
POWER-UP RECALL  
22  
tHRECALL  
22  
tHRECALL  
Read & Write Inhibited  
POWER DOWN  
BROWN OUT  
POWER-UP  
RECALL  
POWER-UP  
RECALL  
AutoStoreTM  
AutoStoreTM  
Note: Read and Write cycles will be ignored during STORE, RECALL and while VCC is below VSWITCH  
July 2006  
8
Document Control #ML0025 rev 1.4  
STK17TA8  
SOFTWARE-CONTROLLED STORE/RECALL CYCLEl,m  
SYMBOLS  
STK17TA8-25  
STK17TA8-45  
NO.  
PARAMETER  
UNITS  
NOTES  
m
E
G
Alt.  
tRC  
MIN  
MAX  
MIN  
MAX  
cont  
cont  
26  
27  
tAVAV  
tAVAV  
25  
0
45  
0
ns  
ns  
ns  
ns  
µs  
STORE/RECALL Initiation Cycle Time  
Address Set-up Time  
Clock Pulse Width  
tAVEL  
tAVGL  
tAS  
28  
tELEH  
tELAX  
tGLGH  
tGLAX  
tCW  
20  
20  
30  
20  
29  
Address Hold Time  
30  
tRECALL  
tRECALL  
100  
100  
RECALL Duration  
Notes  
l: The software sequence is clocked with  
E
controlled READs or G controlled READs.  
m: The six consecutive addresses must be read in the order listed in the Mode Selection Table.  
W
must be high during all six consecutive cycles.  
SOFTWARE STORE/RECALL CYCLE: E Controlledm  
26  
tAVAV  
26  
tAVAV  
ADDRESS #1  
ADDRESS #6  
ADDRESS  
E
27  
tAVEL  
28  
tELEH  
29  
tELAX  
G
23  
30  
/
tSTORE tRECALL  
HIGH IMPEDENCE  
DATA VALID  
DATA VALID  
DQ (DATA)  
SOFTWARE STORE/RECALL CYCLE: G Controlledm  
26  
26  
tAVAV  
tAVAV  
ADDRESS #1  
ADDRESS #6  
ADDRESS  
E
28  
tGLGH  
27  
tAVGL  
G
30  
tRECALL  
23  
tSTORE  
/
29  
tGLAX  
HIGH IMPEDENCE  
DATA VALID  
DATA VALID  
DQ (DATA)  
July 2006  
Document Control #ML0025 rev 1.4  
9
STK17TA8  
HARDWARE STORE CYCLE  
SYMBOLS  
NO.  
STK17TA8  
PARAMETER  
UNITS  
NOTES  
n
Standard  
tDELAY  
tHLHX  
tHLBL  
Alternate  
MIN  
MAX  
tHLQZ  
31  
32  
33  
Time Allowed to Complete SRAM Cycle  
Hardware STORE Pulse Width  
1
µs  
ns  
ns  
15  
Hardware STORE Low to STORE Busy  
300  
Notes  
n: Read and Write cycles in progress before HSB is asserted are given this amount of time to complete.  
HARDWARE STORE CYCLE  
32  
tHLHX  
HSB (IN)  
23  
tSTORE  
33  
tHLBL  
HSB (OUT)  
HIGH IMPEDENCE  
DATA VALID  
HIGH IMPEDENCE  
31  
tDELAY  
DQ (DATA OUT)  
DATA VALID  
Soft Sequence Commands  
SYMBOLS  
STK17TA8  
NO.  
PARAMETER  
UNITS  
NOTES  
Standard  
MIN  
MAX  
tSS  
34  
Notes  
Soft Sequence Processing Time  
70  
µs  
o,p  
o: This is the amount of time that it takes to take action on a soft sequence command. Vcc power must remain high to effectively register command.  
p: Commands like Store and Recall lock out I/O until operation is complete which further increases this time. See specific command.  
34  
tSS  
34  
tSS  
Soft Sequence Command  
Soft Sequence Command  
ADDRESS #1  
ADDRESS #1  
ADDRESS #6  
ADDRESS #6  
ADDRESS  
Vcc  
July 2006  
10  
Document Control #ML0025 rev 1.4  
STK17TA8  
MODE SELECTION  
E
W
G
A15 - A0  
MODE  
I/O  
POWER  
NOTES  
H
L
L
X
H
L
X
L
X
X
X
Not Selected  
Read SRAM  
Write SRAM  
Output High Z  
Output Data  
Input Data  
Standby  
Active  
X
Active  
0x4E38  
0xB1C7  
0x83E0  
0x7C1F  
0x703F  
0x8FC0  
Read SRAM  
Read SRAM  
Read SRAM  
Read SRAM  
Read SRAM  
Nonvolatile Store  
Output Data  
Output Data  
Output Data  
Output Data  
Output Data  
Output High Z  
Active  
ICC2  
L
L
H
H
L
L
q,r,s  
q,r,s  
0x4E38  
0xB1C7  
0x83E0  
0x7C1F  
0x703F  
0x4C63  
Read SRAM  
Read SRAM  
Read SRAM  
Read SRAM  
Read SRAM  
Output Data  
Output Data  
Output Data  
Output Data  
Output Data  
Output High Z  
Active  
Nonvolatile Recall  
Notes  
q: The six consecutive addresses must be in the order listed.  
r: While there are 17 addresses on the STK17TA8, only the lower 16 are used to control software modes  
s: I/O state depends on the state of . The I/O table shown assumes low.  
W
must be high during all six consecutive cycles to enable a nonvolatile cycle.  
G
G
July 2006  
Document Control #ML0025 rev 1.4  
11  
STK17TA8  
nvSRAM  
DEVICE OPERATION  
SRAM WRITE  
The STK17TA8 nvSRAM is made up of two  
functional components paired in the same physical  
cell. These are a SRAM memory cell and a  
nonvolatile QuantumTrapcell. The SRAM  
memory cell operates as a standard fast static  
RAM. Data in the SRAM can be transferred to the  
nonvolatile cell (the STORE operation), or from  
A WRITE cycle is performed whenever E and W are  
low and HSB is high. The address inputs must be  
stable prior to entering the WRITE cycle and must  
remain stable until either E or W goes high at the  
end of the cycle. The data on the common I/O pins  
DQ0-7 will be written into the memory if it is valid tDVWH  
before the end of a W controlled WRITE or tDVEH  
before the end of an E controlled WRITE.  
the nonvolatile cell  
to SRAM (the RECALL  
operation). This unique architecture allows all cells  
to be stored and recalled in parallel. During the  
STORE and RECALL operations SRAM READ and  
WRITE operations are inhibited. The STK17TA8  
supports unlimited reads and writes just like a  
typical SRAM. In addition, it provides unlimited  
RECALL operations from the nonvolatile cells and  
up to 500K STORE operations.  
It is recommended that  
G
be kept high during the  
entire WRITE cycle to avoid data bus contention on  
common I/O lines. If G is left low, internal circuitry will  
turn off the output buffers tWLQZ after W goes low.  
AutoStore™ OPERATION  
The STK17TA8 stores data to nvSRAM using one of  
three storage operations. These three operations are  
Hardware Store, activated by HSB , Software Store,  
actived by an address sequence, and AutoStore™, on  
device power down.  
SRAM READ  
The STK17TA8 performs a READ cycle whenever  
E and  
G
are low while  
W
and HSB are high.  
The address specified on pins A16-0 determines  
which of the 131,056 data bytes will be accessed.  
When the READ is initiated by an address  
transition, the outputs will be valid after a delay of  
tAVQV (READ cycle #1). If the READ is initiated by  
E or G , the outputs will be valid at tELQV or at  
tGLQV, whichever is later (READ cycle #2). The data  
outputs will repeatedly respond to address  
changes within the tAVQV access time without the  
need for transitions on any control input pins, and  
will remain valid until another address change or  
AutoStore™ operation is a unique feature of Simtek  
QuantumTraptechnology and is enabled by default  
on the STK17TA8.  
During normal operation, the device will draw current  
from Vcc to charge a capacitor connected to the Vcap  
pin. This stored charge will be used by the chip to  
perform a single STORE operation. If the voltage on  
the Vcc pin drops below Vswitch, the part will  
automatically disconnect the Vcap pin from Vcc.  
A
STORE operation will be initiated with power provided  
by the Vcap capacitor.  
until E or G is brought high, or  
brought low.  
W
or HSB is  
Figure 5 shows the proper connection of the storage  
capacitor (Vcap) for automatic store operation. Refer to  
the DC CHARACTERISTICS table for the size of Vcap.  
The voltage on the Vcap pin is driven to 5V by a  
charge pump internal to the chip. A pull up should be  
placed on W to hold it inactive during power up.  
VCC  
VCAP  
VCC  
W
To reduce unneeded nonvolatile stores, AutoStore™  
and Hardware Store operations will be ignored unless  
at least one WRITE operation has taken place since  
the most recent STORE or RECALL cycle. Software  
initiated STORE cycles are performed regardless of  
whether a WRITE operation has taken place. The  
HSB signal can be monitored by the system to detect  
an AutoStore™ cycle is in progress.  
Figure 5: AutoStoreTM Mode  
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SOFTWARE STORE  
HARDWARE STORE ( HSB )  
Data can be transferred from the SRAM to the  
nonvolatile memory by a software address sequence.  
The STK17TA8 software STORE cycle is initiated by  
executing sequential E controlled READ cycles from  
six specific address locations in exact order. During  
the STORE cycle an erase of the previous nonvolatile  
data is first performed, followed by a program of the  
nonvolatile elements. Once a STORE cycle is  
initiated, further input and output are disabled until the  
cycle is completed.  
OPERATION  
The STK17TA8 provides the HSB pin for controlling  
and acknowledging the STORE operations. The  
HSB pin can be used to request a hardware STORE  
cycle. When the HSB pin is driven low, the  
STK17TA8 will conditionally initiate a STORE  
operation after tDELAY. An actual STORE cycle will  
only begin if a WRITE to the SRAM took place since  
the last STORE or RECALL cycle. The HSB pin also  
acts as an open drain driver that is internally driven  
low to indicate a busy condition while the STORE  
(initiated by any means) is in progress.  
Because a sequence of READs from specific  
addresses is used for STORE initiation, it is important  
that no other READ or WRITE accesses intervene in  
the sequence, or the sequence will be aborted and no  
STORE or RECALL will take place.  
SRAM READ and WRITE operations that are in  
progress when HSB is driven low by any means are  
given time to complete before the STORE operation  
is initiated. After HSB goes low, the STK17TA8 will  
To initiate the software STORE cycle, the following  
READ sequence must be performed:  
continue SRAM operations for tDELAY. During tDELAY  
,
1. Read address  
2. Read address  
3. Read address  
4. Read address  
5. Read address  
6. Read address  
0x4E38  
0xB1C7  
0x83E0  
0x7C1F  
0x703F  
0x8FC0  
Valid READ  
Valid READ  
Valid READ  
Valid READ  
Valid READ  
Initiate STORE cycle  
multiple SRAM READ operations may take place. If a  
WRITE is in progress when HSB is pulled low it will  
be allowed a time, tDELAY, to complete. However, any  
SRAM WRITE cycles requested after HSB goes low  
will be inhibited until HSB returns high.  
The software sequence may be clocked with  
controlled READs or G controlled READs.  
E
During any STORE operation, regardless of how it  
was initiated, the STK17TA8 will continue to drive the  
HSB pin low, releasing it only when the STORE is  
complete. Upon completion of the STORE operation  
the STK17TA8 will remain disabled until the HSB pin  
returns high.  
Once the sixth address in the sequence has been  
entered, the STORE cycle will commence and the  
chip will be disabled. It is important that READ cycles  
and not WRITE cycles be used in the sequence,  
although it is not necessary that G be low for the  
sequence to be valid. After the tSTORE cycle time has  
been fulfilled, the SRAM will again be activated for  
READ and WRITE operation.  
If HSB is not used, it should be left unconnected.  
HARDWARE RECALL (POWER-UP)  
During power up, or after any low-power condition  
(VCC < VSWITCH), an internal RECALL request will be  
latched. When VCC once again exceeds the sense  
voltage of VSWITCH, a RECALL cycle will automatically  
be initiated and will take tHRECALL to complete.  
SOFTWARE RECALL  
Data can be transferred from the nonvolatile memory  
to the SRAM by a software address sequence. A  
software RECALL cycle is initiated with a sequence of  
READ operations in a manner similar to the software  
STORE initiation. To initiate the RECALL cycle, the  
following sequence of E controlled READ operations  
must be performed:  
1. Read address  
2. Read address  
3. Read address  
4. Read address  
5. Read address  
6. Read address  
0x4E38  
0xB1C7  
0x83E0  
0x7C1F  
0x703F  
0x4C63  
Valid READ  
Valid READ  
Valid READ  
Valid READ  
Valid READ  
Initiate RECALL cycle  
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Internally, RECALL is a two-step procedure. First,  
the SRAM data is cleared, and second, the  
nonvolatile information is transferred into the SRAM  
cells. After the tRECALL cycle time the SRAM will  
once again be ready for READ and WRITE  
operations. The RECALL operation in no way alters  
the data in the nonvolatile elements.  
NOISE CONSIDERATIONS  
The STK17TA8 is a high-speed memory and so must  
have  
a
high-frequency bypass capacitor of  
approximately 0.1µF connected between VCC and VSS,  
using leads and traces that are as short as possible. As  
with all high-speed CMOS ICs, careful routing of power,  
ground and signals will reduce circuit noise.  
DATA PROTECTION  
LOW AVERAGE ACTIVE POWER  
The STK17TA8 protects data from corruption  
during low-voltage conditions by inhibiting all  
externally initiated STORE and WRITE operations.  
The low-voltage condition is detected when VCC  
VSWITCH .  
CMOS technology provides the STK17TA8 this the  
benefit of drawing significantly less current when it is  
cycled at times longer than 50ns. Figure 6 shows the  
relationship between ICC and READ/WRITE cycle time.  
Worst-case current consumption is shown for  
commercial temperature range, VCC = 3.6V, and chip  
enable at maximum frequency. Only standby current is  
drawn when the chip is disabled. The overall average  
current drawn by the STK17TA8 depends on the  
following items:  
<
If the STK17TA8 is in a WRITE mode (both E and  
W low ) at power-up, after a RECALL, or after a  
STORE, the WRITE will be inhibited until a  
negative transition on E or  
protects against inadvertent writes during power up  
or brown out conditions.  
W
is detected. This  
1. The duty cycle of chip enable.  
2. The overall cycle rate for accesses.  
3. The ratio of READs to WRITEs.  
4. The operating temperature.  
5. The VCC level.  
6. I/O loading.  
50  
40  
30  
Writes  
20  
10  
Reads  
0
50 100 150 200 300  
Cycle Time (ns)  
Figure 6 Current vs. Cycle time  
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PREVENTING AUTOSTORETM  
Because of the use of nvRAM to store critical RTC  
data the AutoStore™ function can not be  
disabled in the STK17TA8.  
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REAL TIME CLOCK OPERATION  
nvTIME OPERATION  
SETTING THE CLOCK  
The STK17TA8 offers internal registers that contain Setting the write bit “W” (in the flags register at  
Clock, Alarm, Watchdog, Interrupt, and Control 0x1FFF0) to a “1” halts updates to the STK17TA8  
functions. Internal double buffering of the clock and registers. The correct day, date and time can then be  
the clock/timer information registers prevents written into the registers in 24-hour BCD format. The  
accessing transitional internal clock data during a time written is referred to as the “Base Time.” This  
read or write operation. Double buffering also cir- value is stored in nonvolatile registers and used in  
cumvents disrupting normal timing counts or clock calculation of the current time. Resetting the write bit  
accuracy of the internal clock while accessing clock to “0” transfers those values to the actual clock  
data. Clock and Alarm Registers store data in BCD counters, after which the clock resumes normal  
format.  
operation.  
BACKUP POWER  
CLOCK OPERATIONS  
The RTC in the STK17TA8 is intended for  
permanently powered operation. Either the VRTCcap or  
VRTCbat pin is connected depending on whether a  
capacitor or battery is chosen for the application.  
When primary power, Vcc, fails and drops below Vswitch  
the device will switch to the backup power supply.  
The clock registers maintain time up to 9,999 years in  
one second increments. The user can set the time to  
any calendar time and the clock automatically keeps  
track of days of the week and month, leap years and  
century transitions. There are eight registers  
dedicated to the clock functions which are used to set  
time with a write cycle and to read time during a read  
cycle. These registers contain the Time of Day in  
BCD format. Bits defined as “X” are currently not used  
and are reserved for future use by Simtek.  
The clock oscillator uses very little current, which  
maximizes the backup time available from the backup  
source. Regardless of clock operation with the  
primary source removed, the data stored in nvSRAM  
is secure, having been stored in the nonvolatile  
elements as power was lost. Factors to be considered  
when choosing a backup power source include: the  
expected duration of power outages and the cost  
trade-off of using a battery versus a capacitor.  
READING THE CLOCK  
While the double-buffered RTC register structure  
reduces the chance of reading incorrect data from the  
clock, the user should halt internal updates to the  
STK17TA8 clock registers before reading clock data  
to prevent the reading of data in transition. Stopping  
the internal register updates does not affect clock  
accuracy.  
During backup operation the STK17TA8 consumes a  
maximum of 300 nanoamps at 2 volts. Capacitor or  
battery values should be chosen according to the  
application. Backup time values based on maximum  
current specs are shown below. Nominal times are  
approximately 3 times longer.  
The updating process is stopped by writing a “1” to  
the read bit “R” (in the flags register at 0x1FFF0), and  
will not restart until a “0” is written to the read bit. The  
RTC registers can then be read while the internal  
clock continues to run.  
Capacitor Value  
Backup Time  
0.1 F  
72 hours  
14 days  
30 days  
0.47 F  
1.0 F  
Within 20ms after a “0” is written to the read bit, all  
STK17TA8 registers are simultaneously updated.  
Using a capacitor has the obvious advantage of  
recharging the backup source each time the system is  
powered up.  
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If a battery is used, a 3V lithium is recommended and calibration circuit adds or subtracts counts from the  
the STK17TA8 will only source current from the bat- oscillator divider circuit.  
tery when the primary power is removed. The battery  
The number of times pulses are suppressed (sub-  
will not, however, be recharged at any time by the  
tracted, negative calibration) or split (added, positive  
STK17TA8. The battery capacity should be chosen  
calibration) depends upon the value loaded into the  
for total anticipated cumulative down-time required  
five calibration bits found in calibration register at  
over the life of the system.  
0x1FFF8. Adding counts speeds the clock up;  
subtracting counts slows the clock down. The  
Calibration bits occupy the five lower order bits in the  
control register 8. These bits can be set to represent  
STOPPING AND STARTING THE OSCIL-  
LATOR  
The OSCEN bit in calibration register at 0x1FFF8  
controls the starting and stopping of the oscillator.  
This bit is nonvolatile and shipped to customers in the  
"enabled" (set to 0) state. To preserve battery life  
while system is in storage OSCEN should be set to a  
1. This will turn off the oscillator circuit extending the  
battery life. If the OSCEN bit goes from disabled to  
enabled, it will take approximately 5 seconds (10  
seconds max) for the oscillator to start.  
any value between 0 and 31 in binary form. Bit D5 is a  
Sign bit, where a “1” indicates positive calibration and  
a “0” indicates negative calibration. Calibration occurs  
within a 64 minute cycle. The first 62 minutes in the  
cycle may, once per minute, have one second either  
shortened by 128 or lengthened by 256 oscillator  
cycles.  
If a binary “1” is loaded into the register, only the first  
2 minutes of the 64 minute cycle will be modified; if a  
binary 6 is loaded, the first 12 will be affected, and so  
on. Therefore each calibration step has the effect of  
adding 512 or subtracting 256 oscillator cycles for  
every 125,829,120 actual oscillator cycles. That is  
+4.068 or -2.034 ppm of adjustment per calibration  
step in the calibration register.  
The STK17TA8 has the ability to detect oscillator  
failure. This is recorded in the OSCF (Oscillator  
Failed bit) of the flags register at address 0x1FFF0.  
When the device is powered on (VCC goes above  
Vswitch) the OSCEN bit is checked for "enabled" status.  
If the OSCEN bit is enabled and the oscillator is not  
active, the OSCF bit is set. The user should check for  
this condition and then write a 0 to clear the flag. It  
should be noted that in addition to setting the OSCF  
flag bit, the time registers are reset to the “Base Time”  
(see the section “Setting the Clock”), which is the  
value last written to the timekeeping registers. The  
Control/Calibration register and the OSCEN bit are not  
affected by the oscillator failed condition.  
In order to determine how to set the calibration one  
may set the CAL bit in the flags register at 0x1FFF0 to  
1, which causes the INT pin to toggle at a nominal  
512 Hz. Any deviation measured from the 512 Hz will  
indicate the degree and direction of the required  
correction. For example, a reading of 512.010124 Hz  
would indicate a +20 ppm error, requiring a -10  
(001010) to be loaded into the Calibration register.  
Note that setting or changing the calibration register  
does not affect the frequency test output frequency.  
If the voltage on the backup supply (either VRTCcap or  
VRTCbat) falls below their respective minimum level the  
oscillator may fail, leading to the oscillator failed  
condition which can be detected when system power  
is restored.  
ALARM  
The alarm function compares a user-programmable  
alarm time/date (stored in registers 01xFFF1-5) with  
the real time clock time-of-day/date values. When a  
match occurs, the alarm flag (AF) is set and an  
interrupt is generated if the alarm interrupt is  
enabled. The alarm flag is automatically reset when it  
is read.  
The value of OSCF should be reset to 0 when the  
time registers are written for the first time. This will  
initialize the state of this bit which may have become  
set when the system was first powered on.  
CALIBRATING THE CLOCK  
The RTC is driven by a quartz controlled oscillator  
with a nominal frequency of 32.768 KHz. Clock  
accuracy will depend on the quality of the crystal,  
usually specified to 35 ppm limits at 25°C. This error  
could equate to + 1.53 minutes per month. The  
STK17TA8 employs a calibration circuit that can  
improve the accuracy to +1/-2 ppm at 25°C. The  
Each of the alarm registers has a match bit as its  
MSB. Setting the match bit to a 1 disables this alarm  
register from the alarm comparison. When the match  
bit is 0, the alarm register is compared with the  
equivalent real time clock register. Using the match  
bits, the alarm can occur as specifically as one  
particular second on one day of the month  
or as frequently as once per minute.  
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controls the internal switch to backup power for the  
clock and protects the memory from low-VCC access.  
The power monitor is based on an internal band-gap  
reference circuit that compares the VCC voltage to  
various thresholds.  
Setting all match bits to 0 will  
require an exact time/date match. Note: The product  
requires match bit for seconds alarm register  
(1x1FFF2 – D7) be set to 0 for proper operation of  
the Alarm Flag and Interrupt.  
As described in the AutoStore™ section previously,  
when Vswitch is reached as VCC decays from power  
loss, a data store operation is initiated from SRAM to  
the nonvolatile elements, securing the last SRAM  
data state. Power is also switched from VCC to the  
backup supply (battery or capacitor) to operate the  
RTC oscillator.  
The alarm value should be initialized on power-up by  
software since the alarm registers are not non-  
volatile.  
WATCHDOG TIMER  
When operating from the backup source no data may  
be read or written and the clock functions are not  
available to the user. The clock continues to operate  
in the background. Updated clock data is available to  
the user after tHRECALL delay (See AutoStore™  
/POWER-UP RECALL) after VCC has been restored  
to the device.  
The watchdog timer is intended to interrupt to  
processor should its program get hung in a loop and  
not respond in a timely manner. The software must  
reload the watchdog timer before it counts down to  
zero to prevent this interrupt.  
The watchdog timer is a free running down counter INTERRUPTS  
that uses the 32 Hz clock (31.25 ms) derived from the  
crystal oscillator. The watchdog timer function does  
no operate unless the oscillator is running.  
The STK17TA8 provides three potential interrupt  
sources. They include the watchdog timer, the power  
monitor, and the clock/calendar alarm. Each can be  
individually enabled and assigned to drive the INT pin.  
The watchdog counter is loaded with a starting value In addition, each has an associated flag bit that the  
from the load register and then counts down to zero host processor can use to determine the cause of the  
setting the watchdog flag (WDF) and generating an interrupt.  
interrupt if the watchdog interrupt is enabled. The  
Some of the sources have additional control bits that  
watchdog flag bit is reset when the flag register is  
determine functional behavior. In addition, the pin  
read. The operating software would normally reload  
driver has three bits that specify its behavior when an  
the counter by setting and then resetting the  
interrupt occurs. A functional diagram of the interrupt  
watchdog strobe bit (WDS) within the timing interval  
logic is shown below.  
programmed in the load register.  
WDF  
Watchdog  
Timer  
WIE  
The procedure to set a new value into the load  
VCC  
register begins when the watchdog write bit (/WDW)  
PF  
PFE  
AF  
P/L  
is set to zero and then a new value is written into the  
watchdog register at 01x1FFF7). Once the new value  
is loaded, the watchdog write bit is set to 1 and the  
watchdog strobe bit (WDS) is set to 1 to load this  
value into the load register. The watchdog strobe bit  
is then set to zero. Note: Setting the load register to  
zero will disable the watchdog timer function.  
The system software should initialize the watchdog  
load register on power-up to the desired value since  
the register is not non-volatile.  
Power  
Monitor  
Pin  
Driver  
INT  
H/L  
VINT  
VSS  
Clock  
Alarm  
AIE  
Figure 7. Interrupt Block Diagram  
The three interrupts each have a source and an  
enable. Both the source and the enable must be  
active (true high) in order to generate an interrupt  
output. Only one source is necessary to drive the pin.  
The user can identify the source by reading the  
Flags/Control register, which contains the flags  
associated with each source. All flags are cleared to 0  
POWER MONITOR  
The STK17TA8 provides a power management  
scheme with power-fail interrupt capability. It also  
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when the register is read. The cycle must be a will be cleared when the register is read. If the INT pin  
complete read cycle ( WE high); otherwise the flags is programmed for Level mode, then the condition will  
will not be cleared. The power monitor has two pro- clear and the INT pin will return to its inactive state. If  
grammable settings that are explained in the power the pin is programmed for Pulse mode, then reading  
monitor section.  
the flag also will clear the flag and the pin. The pulse  
will not complete its specified duration if the  
Flags/Control register is read. If the INT pin is used as  
a host reset, then the Flags/Control register should  
not be read during a reset.  
Once an interrupt source is active, the pin driver  
determines the behavior of the output. It has two  
programmable settings as shown below. Pin driver  
control bits are located in the Interrupts register.  
During a power-on reset with no battery, the interrupt  
register is automatically loaded with the value 24h.  
This causes power-fail interrupt to be enabled with an  
active-low pulse.  
According to the programming selections, the pin can  
be driven in the backup mode for an alarm interrupt.  
In addition, the pin can be an active low (open-drain)  
or an active high (push-pull) driver. If programmed for  
operation during backup mode, it can only be active  
low. Lastly, the pin can provide a one-shot function so  
that the active condition is a pulse or a level condition.  
In one-shot mode, the pulse width is internally fixed at  
approximately 200 ms. This mode is intended to reset  
a host microcontroller. In level mode, the pin goes to  
its active polarity until the Flags/Control register is  
read by the user. This mode is intended to be used as  
an interrupt to a host microcontroller. The control bits  
are summarized as follows:  
Watchdog Interrupt Enable - WIE. When set to 1, the  
watchdog timer drives the INT pin as well as an  
internal flag when a watchdog time-out occurs. When  
WIE is set to 0, the watchdog timer affects only the  
internal flag.  
Alarm Interrupt Enable - AIE. When set to 1, the alarm  
match drives the INT pin as well as an internal flag.  
When set to 0, the alarm match only affects to internal  
flag.  
Power Fail Interrupt Enable - PFE. When set to 1, the  
power fail monitor drives the pin as well as an internal  
flag. When set to 0, the power fail monitor affects only  
the internal flag.  
High/Low - H/L. When set to a 1, the INT pin is active  
high and the driver mode is push-pull. The INT pin  
can drive high only when VCC>Vswitch. When set to a 0,  
the INT pin is active low and the drive mode is open-  
drain. Active low (open drain) is operational even in  
battery backup mode.  
Pulse/Level - P/L. When set to a 1 and an interrupt  
occurs, the INT pin is driven for approximately 200  
ms. When P/L is set to a 0, the INT pin is driven high  
or low (determined by H/L) until the Flags/Control  
register is read.  
When an enabled interrupt source activates the INT  
pin, an external host can read the Flags/Control reg-  
ister to determine the cause. Remember that all flags  
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RTC Register Map  
BCD Format Data  
Register  
0x1FFFF  
0x1FFFE  
Function / Range  
Years: 00-99  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
10s Years  
Years  
10s  
Months  
0
0
0
0
Months  
Months: 01-12  
10s Day of  
Month  
0x1FFFD  
0
Day of Month  
Day of Month: 01-31  
0x1FFFC  
0x1FFFB  
0x1FFFA  
0x1FFF9  
0
0
0
0
0
0
0
0
Day of Week  
Day of week: 01-07  
Hours: 00-23  
Minutes: 00-59  
Seconds: 00-59  
10s Hours  
10s Minutes  
10s Seconds  
Cal  
Hours  
Minutes  
Seconds  
0x1FFF8  
0x1FFF7  
0x1FFF6  
0x1FFF5  
OSCEN  
WDS  
WIE  
0
Calibration  
WDT  
H/L  
Calibration values*  
Watchdog*  
Sign  
WDW  
AIE  
0
PFE  
ABE  
P/L  
0
0
Interrupts*  
10s Alarm  
Date  
Alarm, Day of Month:  
01-31  
M
Alarm Day  
10s Alarm  
Hours  
0x1FFF4  
0x1FFF3  
0x1FFF2  
M
M
M
0
Alarm Hours  
Alarm, hours: 00-23  
Alarm, minutes: 00-59  
Alarm, seconds: 00-59  
10 Alarm Minutes  
10 Alarm Seconds  
Alarm Minutes  
Alarm Seconds  
Centuries  
0x1FFF1  
0x1FFF0  
10s Centuries  
AF PF  
Centuries: 00-99  
Flags*  
WDF  
OSCF  
0
CAL  
W
R
* - Is a binary value, not a BCD value.  
0 - Not implemented, reserved for future use.  
July 2006  
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Document Control #ML0025 rev 1.4  
STK17TA8  
Register Map Detail  
Timekeeping – Years  
D4 D3  
0x1FFFF  
D7  
D6  
D5  
10s Years  
D2  
D1  
Years  
D0  
Contains the lower two BCD digits of the year. Lower nibble contains the value for years; upper  
nibble contains the value for 10s of years. Each nibble operates from 0 to 9. The range for the  
register is 0-99.  
Timekeeping – Months  
0x1FFFE  
0x1FFFD  
0x1FFFC  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
0
0
0
10s Month  
Months  
Contains the BCD digits of the month. Lower nibble contains the lower digit and operates from 0 to  
9; upper nibble (one bit) contains the upper digit and operates from 0 to 1. The range for the  
register is 1-12.  
Timekeeping – Date  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
0
0
10s Day of month  
Day of month  
Contains the BCD digits for the date of the month. Lower nibble contains the lower digit and  
operates from 0 to 9; upper nibble contains the upper digit and operates from 0 to 3. The range for  
the register is 1-31. Leap years are automatically adjusted for.  
Timekeeping – Day  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
0
0
0
0
0
Day of week  
Lower nibble contains a value that correlates to day of the week. Day of the week is a ring counter  
that counts from 1 to 7 then returns to 1. The user must assign meaning to the day value, as the  
day is not integrated with the date.  
Timekeeping – Hours  
0x1FFFB  
0x1FFFA  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
12/24  
0
10s Hours  
Hours  
Contains the BCD value of hours in 24 hour format. Lower nibble contains the lower digit and  
operates from 0 to 9; upper nibble (two bits) contains the upper digit and operates from 0 to 2. The  
range for the register is 0-23.  
Timekeeping – Minutes  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
0
10s Minutes  
Minutes  
Contains the BCD value of minutes. Lower nibble contains the lower digit and operates from 0 to 9;  
upper nibble contains the upper minutes digit and operates from 0 to 5. The range for the register  
is 0-59.  
Timekeeping – Seconds  
0x1FFF9  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
0
10s Seconds  
Seconds  
Contains the BCD value of seconds. Lower nibble contains the lower digit and operates from 0 to  
9; upper nibble contains the upper digit and operates from 0 to 5. The range for the register is 0-  
59.  
July 2006  
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Document Control #ML0025 rev 1.4  
STK17TA8  
Calibration / Control  
D4 D3  
0x1FFF8  
D7  
D6  
D5  
D2  
D1  
D0  
Calibration  
Sign  
OSCEN  
0
Calibration  
Oscillator Enable. When set to 1, the oscillator is halted. When set to 0, the oscillator runs.  
Disabling the oscillator saves battery/capacitor power during storage. On a no-battery power-up,  
this bit is set to 0.  
OSCEN  
Calibration  
Sign  
Determines if the calibration adjustment is applied as an addition to or as a subtraction from the  
time-base.  
These five bits control the calibration of the clock.  
Calibration  
Watchdog Timer  
0x1FFF7  
D7  
D6  
D5  
D4  
D3  
D2  
WDT  
D1  
D0  
WDS  
WDW  
Watchdog Strobe. Setting this bit to 1 reloads and restarts the watchdog timer. Setting the bit to 0  
has no affect. The bit is cleared automatically once the watchdog timer is reset. The WDS bit is  
write only. Reading it always will return a 0.  
WDS  
Watchdog Write Enable. Setting this bit to 1 masks the watchdog time-out value (WDT5-WDT0) so  
it cannot be written. This allows the user to strobe the watchdog without disturbing the time-out  
value. Setting this bit to 0 allows bits 5-0 to be written on the next write to the Watchdog register.  
The new value will be loaded on the next internal watchdog clock after the write cycle is complete.  
This function is explained in more detail in the watchdog timer section.  
WDW  
Watchdog time-out selection. The watchdog timer interval is selected by the 6-bit value in this  
register. It represents a multiplier of the 32 Hz count (31.25 ms). The minimum range or time-out  
value is 31.25 ms (a setting of 1) and the maximum time-out is 2 seconds (setting of 3Fh). Setting  
the watchdog timer register to 0 disables the timer. These bits can be written only if the WDW bit  
was cleared to 0 on a previous cycle.  
WDT  
Interrupt Status / Control  
0x1FFF6  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
WIE  
AIE  
PFIE  
ABE  
H/L  
P/L  
0
0
Watchdog Interrupt Enable. When set to 1 and a watchdog time-out occurs, the watchdog timer  
drives the INT pin as well as the WDF flag. When set to 0, the watchdog time-out affects only the  
WDF flag.  
WIE  
Alarm Interrupt Enable. When set to 1, the alarm match drives the INT pin as well as the AF flag.  
When set to 0, the alarm match only affects the AF flag.  
Power-Fail Enable. When set to 1, the alarm match drives the INT pin as well as the AF flag. When  
set to 0, the power-fail monitor affects only the PF flag.  
AIE  
PFIE  
ABE  
H/L  
Alarm Battery-backup Enable. When set to 1, the alarm interrupt (as controlled by AIE) will function  
even in battery backup mode. When set to 0, the alarm will occur only when Vcc>Vswitch  
.
High/Low. When set to a 1, the INT pin is driven active high. When set to 0, the INT pin is open  
drain, active low.  
Pulse/Level. When set to a 1, the INT pin is driven active (determined by H/L ) by an interrupt  
source for approximately 200 ms. When set to a 0, the INT pin is driven to an active level (as set  
by H/L ) until the Flags/Control register is read.  
P/L  
July 2006  
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Document Control #ML0025 rev 1.4  
STK17TA8  
Alarm – Day  
D3  
0x1FFF5  
D7  
D6  
D5  
D4  
D2  
D1  
D0  
M
0
10s Alarm Date  
Alarm Date  
Contains the alarm value for the date of the month and the mask bit to select or deselect the date  
value.  
Match. Setting this bit to 0 causes the date value to be used in the alarm match. Setting this bit to 1  
causes the match circuit to ignore the date value.  
M
Alarm – Hours  
0x1FFF4  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
M
0
10s Alarm Hours  
Alarm Hours  
Contains the alarm value for the hours and the mask bit to select or deselect the hours value.  
Match. Setting this bit to 0 causes the hours value to be used in the alarm match. Setting this bit to  
1 causes the match circuit to ignore the hours value.  
M
Alarm – Minutes  
0x1FFF3  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
M
10s Alarm Minutes  
Alarm Minutes  
Contains the alarm value for the minutes and the mask bit to select or deselect the minutes value.  
Match. Setting this bit to 0 causes the minutes value to be used in the alarm match. Setting this bit  
to 1 causes the match circuit to ignore the minutes value.  
M
Alarm – Seconds  
0x1FFF2  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
M
10s Alarm Seconds  
Alarm Seconds  
Contains the alarm value for the seconds and the mask bit to select or deselect the seconds’  
value.  
Match. Setting this bit to 0 causes the seconds’ value to be used in the alarm match. Setting this  
bit to 1 causes the match circuit to ignore the seconds value.  
M
Timekeeping – Centuries  
0x1FFF1  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
0
0
10s Centuries  
Centuries  
July 2006  
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Document Control #ML0025 rev 1.4  
STK17TA8  
Flags  
D3  
0x1FFF0  
D7  
D6  
D5  
D4  
D2  
D1  
D0  
WDF  
AF  
PF  
OSCF  
0
CAL  
W
R
Watchdog Timer Flag. This read-only bit is set to 1 when the watchdog timer is allowed to reach 0  
without being reset by the user. It is cleared to 0 when the Flags/Control register is read.  
Alarm Flag. This read-only bit is set to 1 when the time and date match the values stored in the  
alarm registers with the match bits = 0. It is cleared when the Flags/Control register is read.  
Power-fail Flag. This read-only bit is set to 1 when power falls below the power-fail threshold  
Vswitch. It is cleared to 0 when the Flags/Control register is read.  
WDF  
AF  
PF  
Oscillator Fail Flag. Set to 1 on power-up only if the oscillator is not running in the first 5ms of  
power-on operation. This indicates that time counts are no longer valid. The user must reset this  
bit to 0 to clear this condition. The chip will not clear this flag. This bit survives power cycles.  
Calibration Mode. When set to 1, a 512Hz square wave is output on the INT pin. When set to 0,  
the INT pin resumes normal operation. This bit defaults to 0 (disabled) on power up.  
Write Time. Setting the W bit to 1 freeze updates of the timekeeping registers. The user can then  
write them with updated values. Setting the W bit to 0 causes the contents of the time registers to  
be transferred to the timekeeping counters.  
OSCF  
CAL  
W
Read Time. Setting the R bit to 1 copies a static image of the timekeeping registers and places  
them in a holding register. The user can then read them without concerns over changing values  
causing system errors. The R bit going from 0 to 1 causes the timekeeping capture, so the bit must  
be returned to 0 prior to reading again.  
R
July 2006  
24  
Document Control #ML0025 rev 1.4  
STK17TA8  
ORDERING INFORMATION  
STK17TA8 – R F 45 I  
Temperature Range  
Blank = Commercial (0 to 70º C)  
I = Industrial (-40 to 85ºC)  
Access Time  
25 = 25ns  
45 = 45ns  
Lead Finish  
F = 100% Sn (Matte Tin) ROHS Compliant  
Package  
R = Plastic 48-pin 300 mil SSOP (25 mil pitch)  
July 2006  
25  
Document Control #ML0025 rev 1.4  
STK17TA8  
Document Revision History  
Revision  
Date  
Summary  
Publish new datasheet  
0.0  
February 2003  
Remove 525 mil SOIC, Add 48 Pin SSOP and 40 Pin DIP packages; Modified Block  
Diagram in AutoStore description section  
0.1  
March 2003  
Modify 600 mil DIP pin-out (switch pins 32 and 33), Update Power-up Recall specs,  
Update Software Controlled Store/Recall Cycle, Added Hardware Store Description,  
Modified Mode Selection Table, Updated VSWITCH, Updated tSTORE, Modify IBAK and VBAK  
0.2  
0.3  
June 2003  
Change part number from STK17CA8 to STK17TA8; Add lead-free finish option  
February 2004  
Parameter  
Vcap Min  
tVCCRISE  
ICC1 Max Com.  
ICC1 Max Com.  
ICC1 Max Com.  
ICC1 Max Ind.  
ICC1 Max Ind.  
ICC1 Max Ind.  
ICC2 Max  
Old Value  
10µF  
New Value  
17 µF  
Notes  
NA  
150 µs  
50 mA  
55 mA  
65 mA  
55 mA  
60 mA  
70 mA  
3.0 mA  
3 mA  
New Spec  
35 mA  
40 mA  
50 mA  
35 mA  
45 mA  
55 mA  
1.5 mA  
0.5 mA  
5 ms  
@ 45ns access  
@ 35ns access  
@ 25ns access  
@ 45ns access  
@ 35ns access  
@ 25ns access  
Com. & Ind.  
1.0  
December 2004  
ICC4 Max  
tHRECALL  
Com & Ind.  
20 ms  
tSTORE  
tRECALL  
10 ms  
20 µs  
12.5 ms  
40 µs  
tGLQV  
10 ns  
12 ns  
@ 25 ns access  
Changed RTC register unused bits “X” to require zero “0” value when writing values.  
1.1  
April 2005  
Parameter  
ICC3 Max Com.  
ICC3 Max Ind.  
ISB Max Com.  
ISB Max Ind.  
tRECALL  
Old Value  
5 mA  
New Value  
10 mA  
10 mA  
3 mA  
Notes  
5 mA  
3 mA  
3 mA  
40 µs  
3 mA  
60 µs  
Soft Recall  
Industrial Grade  
Only  
Contact Simtek for  
details.  
tSTORE  
12.5 ms  
1x106  
15 ms  
5x105  
10 sec  
5 sec  
1.2  
September 2005  
Max. STORE  
Cycles  
@ MIN  
tOSCS  
tOSCS  
1 min  
Temperature  
@ 25ºC from  
Power up  
10 sec  
C1  
C2  
2.2 pF  
47 pF  
0 pF  
56 pF  
RTC Output Cap.  
RTC Input Cap  
Removed Plastic DIP 40 pin package offering. Package type “W”.  
Parameter  
tRECALL  
Old Value  
60 µs  
Undefined  
New Value  
100 µs  
Notes  
Soft Recall  
New Spec  
tSS  
70 µs  
1.3  
December 2005  
100 Years at  
Unspecified  
Temperature  
20 Years @ Max  
Temperature  
Data Retention  
New Specification  
DATAR  
Discontinued 35 ns speed grade option.  
July 2006  
26  
Document Control #ML0025 rev 1.4  
STK17TA8  
Parameter  
Old Value  
New Value  
Notes  
Power-up RECALL  
Duration  
Nonvolatile  
STORE operations  
tHRECALL  
20 ms  
40 ms  
1.4  
July 2006  
NVC  
5x105  
2x105  
20 Years  
@ Max Temperature  
20 Years  
@ 55ºC  
Data Retention  
DATAR  
SIMTEK STK17TA8 Data Sheet, July 2006  
Copyright 2006, Simtek Corporation. All rights reserved.  
This datasheet may only be printed for the express use of Simtek Customers. No part of this datasheet may be reproduced in any other form or  
means without express written permission from Simtek Corporation. The information contained in this publication is believed to be accurate, but  
changes may be made without notice. Simtek does not assume responsibility for, or grant or imply any warranty, including MERCHANTABILITY  
or FITNESS FOR A PARTICULAR PURPOSE regarding this information, the product or its use. Nothing herein constitutes a license, grant or  
transfer of any rights to any Simtek patent, copyright, trademark or other proprietary right.  
July 2006  
27  
Document Control #ML0025 rev 1.4  

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