W137 [CYPRESS]

Bx Notebook System Frequency Synthesizer; BX笔记本系统频率合成器
W137
型号: W137
厂家: CYPRESS    CYPRESS
描述:

Bx Notebook System Frequency Synthesizer
BX笔记本系统频率合成器

文件: 总10页 (文件大小:177K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
W137  
Bx Notebook System Frequency Synthesizer  
PCI_F, PCI1:5 Output to Output Skew:........................500 ps  
Features  
PCI_F, PCI1:5 Cycle to Cycle Jitter:............................250 ps  
• Maximized EMI suppression using Cypress’s Spread  
Spectrum Technology  
• Two copies of CPU output  
• Six copies of PCI output (Synchronous w/CPU output)  
• One 48-MHz output for USB support  
• One selectable 24-/48-MHz output  
• Two Buffered copies of 14.318-MHz input reference  
signal  
CPU to PCI Output Skew: ............... 1.5–4.0 ns (CPU Leads)  
Output Duty Cycle: .................................................... 45/55%  
PCI_F, PCI Edge Rate:.............................................. >1 V/ns  
CPU_STOP#, OE, SPREAD#, SEL48#, PCI_STOP#,  
PWR_DWN# all have a 250-kpull-up resistor.  
Table 1. Pin Selectable Frequency  
• Supports 100-MHz or 66-MHz CPU operation  
• Power management control input pins  
• Available in 28-pin SSOP (209 mils)  
• SS function can be disabled  
SEL100/66#  
OE  
0
CPU  
HI-Z  
PCI  
HI-Z  
33.3  
33.3  
Spread%  
Don’t Care  
See Table 2  
See Table 2  
0/1  
0
1
66.6 MHz  
100 MHz  
1
1
• See W40S11-02 for 2 SDRAM DIMM support  
Key Specifications  
Table 2. Spread Spectrum Feature  
SPREAD#  
Spread Profile  
Supply Voltages: ....................................... V  
V
= 3.3V±5%  
= 2.5V±5%  
DDQ3  
DDQ2  
0
1
–0.5% (down spread)  
0% (spread disabled)  
CPU0:1 Output to Output Skew: ................................ 175 ps  
CPU0:1 Cycle to Cycle Jitter: ..................................... 200 ps  
Block Diagram  
Pin Configuration  
2
X1  
X2  
XTAL  
OSC  
GND  
X1  
1
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
VDDQ3  
REF0:1  
CPU0:3  
2
REF0/SEL48#  
REF1/SPREAD#  
VDDQ2  
X2  
3
CPU_STOP#  
PCI_F  
PCI1  
4
5
CPU0  
STOP  
Clock  
Logic  
4
2
PCI2  
CPU1  
6
GND  
GND  
7
VDDQ3  
PCI3  
GND  
8
PCI_STOP#  
VDDQ3  
9
PCI4  
10  
11  
12  
13  
14  
PCI5  
CPU_STOP#  
PWR_DWN#  
SEL100/66#  
GND  
÷2  
CPUdiv2_0:1  
3V66_0:3  
SPREAD#  
SEL0  
VDDQ3  
48MHz  
24/48MHz/OE  
PLL 1  
SEL1  
STOP  
Clock  
Logic  
4
SEL133/100#  
÷2/÷1.5  
1
7
PCI_F  
PCI1:7  
STOP  
Clock  
Logic  
÷2  
PWRDWN#  
PCI_STOP#  
3
Power  
Down  
Logic  
÷2  
IOAPIC0:2  
Three-state  
Logic  
1
PLL2  
48MHz  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
October 12, 1999, rev. **  
W137  
Pin Definitions  
Pin  
No.  
Pin  
Type  
Pin Name  
Pin Description  
CPU0:1  
24, 23  
O
O
O
I
CPU Clock Outputs 0 and 1: These two CPU clock outputs are controlled by the  
CPU_STOP# control pin. Output voltage swing is controlled by voltage applied to  
VDDQ2. Frequency is selected per Table 1.  
PCI1:5  
5, 6, 9, 10,  
11  
PCI Bus Clock Outputs 1 through 5: These five PCI clock outputs are controlled  
by the PCI_STOP# control pin. Output voltage swing is controlled by voltage applied  
to VDDQ3. Frequency is selected per Table 1.  
PCI_F  
4
Fixed PCI Clock Output: Unlike PCI1:5 outputs, this output is not controlled by the  
PCI_STOP# control pin; it cannot be forced LOW by PCI_STOP#. Output voltage  
swing is controlled by voltage applied to VDDQ3. Frequency is selected per Table 1.  
CPU_STOP#  
PCI_STOP#  
REF0/SEL48#  
18  
20  
27  
CPU_STOP# Input: When brought LOW, clock outputs CPU0:1 are stopped LOW  
after completing a full clock cycle (23 CPU clock latency). When brought HIGH,  
clock outputs CPU0:1 start with a full clock cycle (23 CPU clock latency).  
I
PCI_STOP# Input: The PCI_STOP# input enables the PCI1:5 outputs when HIGH  
and causes them to remain at logic 0 when LOW. The PCI_STOP# signal is latched  
on the rising edge of PCI_F. Its effect takes place on the next PCI_F clock cycle.  
I/O  
I/O Dual-Function REF0 and SEL48# Pin: Upon power-up, the state of SEL48# is  
latched. The state is set by either a 10K resistor to GND or to V . A 10K resistor to  
DD  
GND causes pin 14 to provide a 48-MHz clock. If the pin is strapped to V , pin 14  
DD  
will provide a 24-MHz clock. After 2 ms, the pin becomes a high-drive output that  
produces a copy of 14.318 MHz.  
REF1/SPREAD#  
24/48MHz/OE  
26  
14  
I/O  
I/O  
I/O Dual-Function REF1 and SPREAD# Pin: Upon power-up, the state of  
SPREAD# is latched. The state is set by either a 10K resistor to GND or to V . A  
10K resistor to GND enables Spread Spectrum function. If the pin is strapped to V  
Spread Spectrum is disabled. After 2 ms, the pin becomes a high-drive output that  
produces a copy of 14.318 MHz.  
DD  
,
DD  
I/O Dual-Function 24-MHz or 48-MHz Output and Output Enable Input: Upon  
power-up, the state of pin 14 is latched. The state is set by either a 10K resistor to  
GND or to V . A 10K resistor to GND latches OE LOW, and all outputs are three-  
DD  
stated. If the pin is strapped to V , OE is latched HIGH and all outputs are active.  
DD  
After 2 ms, the pin becomes an output whose frequency is set by the state of pin 27  
on power-up.  
48MHz  
SEL100/66#  
X1  
13  
16  
2
O
I
48-MHz Output: Fixed 48-MHz USB output. Output voltage swing is controlled by  
voltage applied to VDDQ3.  
Frequency Selection Input:Selectpower-up defaultCPU clock frequency as shown  
in Table 1.  
I
Crystal Connection or External Reference Frequency Input: This pin can either  
be used as a connection to a crystal or to a reference signal.  
X2  
3
I
Crystal Connection: An input connection for an external 14.318-MHz crystal. If  
using an external reference, this pin must be left unconnected.  
PWR_DWN#  
17  
I
Power Down Control: When this input is LOW, device goes into a low-power standby  
condition. All outputs are held LOW. CPU and PCI clock outputs are stopped LOW  
after completing a full clock cycle (23 CPU clock cycle latency). When brought  
HIGH, CPU and PCI outputs start with a full clock cycle at full operating frequency  
(3 ms maximum latency).  
VDDQ3  
VDDQ2  
GND  
8, 12, 19, 28  
25  
P
P
G
Power Connection: Connected to 3.3V.  
Power Connection: Power supply for CPU0:1 output buffers. Connected to 2.5V.  
Ground Connection: Connect all ground pins to the common system ground plane.  
1, 7, 15, 21,  
22  
2
W137  
Figure 2 show two suggested methods for strapping resistor  
connection.  
Overview  
The W137 was developed to meet the Intel® Mobile Clock  
specification for the BX chipset, including Super I/O and USB  
support. The W40S11-02 is the Intel-defined companion part  
used for driving 2 SDRAM DIMM modules. Please see that  
data sheet for additional information.  
Upon W137 power-up, the first 2 ms of operation is used for  
input logic selection. During this period, the output buffers are  
three-stated, allowing the output strapping resistor on each l/O  
pin to pull the pin and its associated capacitive clock load to  
either a logic HIGH or logic LOW state. At the end of the 2-ms  
period, the established logic 0 or 1 condition of each l/O pin is  
then latched. Next, the output buffers are enabled, which con-  
verts both l/O pins into operating clock outputs. The 2-ms timer  
Cypresss proprietary spread spectrum frequency synthesis  
technique is a feature of the CPU and PCI outputs. When en-  
abled, this feature reduces the peak EMI measurements of not  
only the output signals and their harmonics, but also of any  
other clock signals that are properly synchronized to them.  
The 0.5% modulation profile matches that defined as accept-  
able in Intels clock specification.  
is started when V reaches 2.0V. The input latches can only  
DD  
be reset by turning V off and then back on again.  
DD  
It should be noted that the strapping resistors have no signifi-  
cant effect on clock output signal integrity. The drive imped-  
ance of the clock output is <40(nominal) which is minimally  
Functional Description  
affected by the 10-kstrap to ground or V . As with the se-  
DD  
ries termination resistor, the output strapping resistor should  
be placed as close to the l/O pin as possible in order to keep  
the interconnecting trace short. The trace from the resistor to  
I/O Pin Operation  
Pins 14, 26, and 27 are dual-purpose l/O pins. Upon power-up  
these pins act as logic inputs, allowing the determination of  
assigned device functions. A short time after power-up, the  
logic state of each pin is latched and the pins then become  
clock outputs. This feature reduces device pin count by com-  
bining clock outputs with input select pins.  
ground or V should be kept less than two inches in length to  
DD  
prevent system noise coupling during input logic sampling.  
When the clock outputs are enabled following the 2-ms input  
period, target (normal) output frequency is delivered assuming  
that V has stabilized. If V  
has not yet reached full value,  
DD  
DD  
An external 10-kstrappingresistor is connected between  
each l/O pin and ground or V . Connection to ground sets a  
latch to 0, connection to V sets a latch to 1. Figure 1 and  
output frequency initially may be below target but will increase  
to target once V voltage has stabilized. In either case, a  
DD  
DD  
DD  
short output clock cycle may be produced from the CPU clock  
outputs when the outputs are enabled.  
V
DD  
Output Strapping Resistor  
Series Termination Resistor  
10 k  
(Load Option 1)  
Clock Load  
W137  
Output  
Buffer  
R
Power-on  
Reset  
Timer  
Hold  
Output  
Low  
Output Three-state  
10 k  
(Load Option 0)  
Q
D
Data  
Latch  
Figure 1. Input Logic Selection Through Resistor Load Option  
Jumper Options  
Output Strapping Resistor  
V
DD  
Series Termination Resistor  
10 k  
Clock Load  
W137  
R
Output  
Buffer  
Power-on  
Reset  
Timer  
Hold  
Output  
Low  
Output Three-state  
Q
D
Data  
Latch  
Figure 2. Input Logic Selection Through Jumper Option  
3
W137  
Where P is the percentage of deviation and F is the frequency  
in MHz where the reduction is measured.  
Spread Spectrum Clocking  
The device generates a clock that is frequency modulated in  
order to increase the bandwidth that it occupies. By increasing  
the bandwidth of the fundamental and its harmonics, the am-  
plitudes of the radiated electromagnetic emissions are re-  
duced. This effect is depicted in Figure 3.  
The output clock is modulated with a waveform depicted in  
Figure 4. This waveform, as discussed in Spread Spectrum  
Clock Generation for the Reduction of Radiated Emissionsby  
Bush, Fessler, and Hardin produces the maximum reduction  
in the amplitude of radiated electromagnetic emissions. The  
deviation selected for this chip is 0.5% of the selected fre-  
quency. Figure 4 details the Cypress spreading pattern.  
Cypress does offer options with more spread and greater EMI  
reduction. Contact your local Sales representative for details  
on these devices.  
As shown in Figure 3, a harmonic of a modulated clock has a  
much lower amplitude than that of an unmodulated signal. The  
reduction in amplitude is dependent on the harmonic number  
and the frequency deviation or spread. The equation for the  
reduction is  
dB = 6.5 + 9*log (P) + 9*log (F)  
Spread Spectrum clocking is activated or deactivated through  
I/O pin #26.  
10  
10  
EMI Reduction  
Spread  
Spectrum  
Enabled  
Non-  
Spread  
Spectrum  
Figure 3. Clock Harmonic with and without SSCG Modulation Frequency Domain Representation  
MAX  
MIN  
Figure 4. Typical Modulation Profile  
4
W137  
Absolute Maximum Ratings  
Stresses greater than those listed in this table may cause per-  
manent damage to the device. These represent a stress rating  
above those specified in the operating sections of this specifi-  
cation is not implied. Maximum conditions for extended peri-  
ods may affect reliability.  
only. Operation of the device at these or any other conditions  
.
Parameter  
Description  
Voltage on any pin with respect to GND  
Storage Temperature  
Rating  
0.5 to +7.0  
65 to +150  
0 to +70  
Unit  
V
V
, V  
DD IN  
T
°C  
°C  
°C  
kV  
STG  
T
Operating Temperature  
A
T
Ambient Temperature under Bias  
Input ESD Protection  
55 to +125  
2 (min.)  
B
ESD  
PROT  
DC Electrical Characteristics:  
T = 0°C to +70°C; V  
= 3.3V±5%; V = 2.5V±5%; CPU0:1 = 66.6/100 MHz  
A
DDQ3  
DDQ2  
Parameter  
Description  
Test Condition  
Min.  
Typ.  
Max.  
Unit  
Supply Current  
I
I
I
I
3.3V Supply Current in Power-down mode  
3.3V Supply Current  
PWR_DWN# = 0  
1
80  
5
100  
45  
1
mA  
mA  
mA  
mA  
DD3PD  
DD3  
[1]  
Outputs Loaded  
Outputs Loaded  
[1]  
2.5V Supply Current  
30  
DD2  
2.5V Supply Current in Power-down mode  
PWR_DWN# = 0  
0.2 µA  
DD2PD  
Logic Inputs  
V
V
Input Low Voltage  
Input High Voltage  
GND 0.3  
0.8  
V
IL  
2.0  
V
+ 0.3  
DD  
V
IH  
[2]  
I
I
I
I
Input Low Current  
25  
10  
µA  
µA  
µA  
µA  
IL  
[2]  
Input High Current  
IH  
IL  
Input Low Current (SEL100/66#)  
Input High Current (SEL100/66#)  
5  
+5  
IH  
Clock Outputs  
V
Output Low Voltage  
Output High Voltage  
I
I
= 1 mA  
50  
mV  
V
OL  
OL  
V
PCI_F, PCI1:5,  
REF0:1  
= 1 mA  
3.1  
OH  
OH  
V
Output High Voltage  
Output Low Current:  
CPU0:1  
I
= 1 mA  
2.2  
80  
70  
50  
80  
70  
50  
V
OH  
OH  
I
CPU0:1  
V
= 1.25V  
= 1.5V  
= 1.5V  
= 1.25V  
= 1.5V  
= 1.5V  
120  
110  
70  
180  
140  
90  
mA  
mA  
mA  
mA  
mA  
mA  
OL  
OL  
PCI_F, PCI1:5  
REF0:1  
V
OL  
V
OL  
I
Output High Current  
CPU0:1  
V
120  
110  
70  
180  
140  
90  
OH  
OH  
PCI_F, PCI1:5  
REF0:1  
V
OH  
V
OH  
Crystal Oscillator  
X1 Input Threshold Voltage  
[3]  
V
VDDQ3 = 3.3V  
1.65  
14  
V
TH  
[4]  
C
C
Load Capacitance, As Seen by External Crystal  
pF  
pF  
LOAD  
IN,X1  
[5]  
X1 Input Capacitance  
Pin X2 unconnected  
28  
Notes:  
1. All clock outputs loaded with 6" 60transmission lines with 20-pF capacitors.  
2. CPU_STOP#, PCI_STOP#, PWR_DWN#, SPREAD#, and SEL48# logic inputs have internal pull-up resistors (not CMOS level).  
3. X1 input threshold voltage (typical) is VDD/2.  
4. The W137 contains an internal crystal load capacitor between pin X1 and ground and another between pin X2 and ground. Total load placed on crystal is  
14 pF; this includes typical stray capacitance of short PCB traces to crystal.  
5. X1 input capacitance is applicable when driving X1 with an external clock source (X2 is left unconnected).  
5
W137  
DC Electrical Characteristics: (continued)  
T = 0°C to +70°C; V  
= 3.3V±5%; V = 2.5V±5%; CPU0:1 = 66.6/100 MHz  
A
DDQ3  
DDQ2  
Parameter  
Description  
Test Condition  
Min.  
Typ.  
Max.  
Unit  
Pin Capacitance/Inductance  
C
C
Input Pin Capacitance  
Except X1 and X2  
5
6
7
pF  
pF  
nH  
IN  
Output Pin Capacitance  
Input Pin Inductance  
OUT  
IN  
L
AC Electrical Characteristics  
T = 0°C to +70°C; V  
= 3.3V±5%; V  
= 2.5V±5%; f  
= 14.31818 MHz  
XTL  
A
DDQ3  
DDQ2  
AC clock parameters are tested and guaranteed over stated operating conditions using the stated lump capacitive load at the  
clock output.  
CPU Clock Outputs, CPU0:1 (Lump Capacitance Test Load = 20 pF)  
CPU = 66.6 MHz  
CPU = 100 MHz  
Parameter  
Description  
Period  
Test Condition/Comments  
Measured on rising edge at 1.25V  
Duration of clock cycle above 2.0V  
Duration of clock cycle below 0.4V  
Min. Typ. Max. Min. Typ. Max. Unit  
t
15  
5.2  
5.0  
1
15.5  
10  
3.0  
2.8  
1
10.5  
ns  
ns  
P
H
L
t
t
t
t
t
High Time  
Low Time  
ns  
Output Rise Edge Rate Measured from 0.4V to 2.0V  
Output Fall Edge Rate Measured from 2.0V to 0.4V  
4
4
4
4
V/ns  
V/ns  
%
R
F
D
1
1
Duty Cycle  
Measured on rising and falling edge at  
45  
55  
45  
55  
1.25V  
t
Jitter, Cycle-to-Cycle  
Measured on rising edge at 1.25V. Max-  
imum difference of cycle time between  
two adjacent cycles.  
200  
200  
ps  
JC  
t
f
Output Skew  
Measured on rising edge at 1.25V  
175  
3
175  
3
ps  
SK  
FrequencyStabilization Assumes full supply voltage reached  
from Power-up (cold  
start)  
ms  
ST  
within 1 ms from power-up. Shortcycles  
exist prior to frequency stabilization.  
Z
AC Output Impedance Average value during switching transi-  
tion. Used for determining series termi-  
nation value.  
13.5  
13.5  
o
6
W137  
PCI Clock Outputs, PCI1:5 and PCI_F (Lump Capacitance Test Load = 30 pF)  
CPU = 66.6/100 MHz  
Parameter  
Description  
Period  
Test Condition/Comments  
Measured on rising edge at 1.5V  
Duration of clock cycle above 2.4V  
Duration of clock cycle below 0.4V  
Min.  
30  
Typ.  
Max.  
Unit  
ns  
t
P
t
t
t
t
t
t
High Time  
Low Time  
12.0  
12.0  
1
ns  
H
L
ns  
Output Rise Edge Rate Measured from 0.4V to 2.4V  
Output Fall Edge Rate Measured from 2.4V to 0.4V  
4
4
V/ns  
V/ns  
%
R
F
1
Duty Cycle  
Measured on rising and falling edge at 1.5V  
45  
55  
250  
D
JC  
Jitter, Cycle-to-Cycle  
Measured on rising edge at 1.5V. Maximum differ-  
ence of cycle time between two adjacent cycles.  
ps  
t
t
Output Skew  
Measured on rising edge at 1.5V  
500  
4.0  
ps  
ns  
SK  
CPU to PCI Clock  
Offset  
Covers all CPU/PCI outputs. Measured on rising  
edge at 1.5V. CPU leads PCI output.  
1.5  
O
f
Frequency Stabiliza-  
tion from Power-up  
(cold start)  
Assumes full supply voltage reached within 1 ms  
from power-up. Short cycles exist prior to frequency  
stabilization.  
3
ms  
ST  
Z
AC Output Impedance Average value during switching transition. Used for  
determining series termination value.  
20  
o
REF0:1 Clock Output (Lump Capacitance Test Load = 20 pF)  
CPU = 66.6/100 MHz  
Parameter  
Description  
Frequency, Actual  
Output Rise Edge Rate  
Output Fall Edge Rate  
Duty Cycle  
Test Condition/Comments  
Determined by crystal oscillator frequency  
Measured from 0.4V to 2.4V  
Min.  
Typ.  
Max.  
Unit  
MHz  
V/ns  
V/ns  
%
f
14.318  
t
t
t
f
0.5  
0.5  
45  
2
2
R
Measured from 2.4V to 0.4V  
F
Measured on rising and falling edge at 1.5V  
55  
3
D
Frequency Stabilization  
Assumes full supply voltage reached within  
ms  
ST  
from Power-up (cold start) 1 ms from power-up. Short cycles exist prior to  
frequency stabilization.  
Z
AC Output Impedance  
Average value during switching transition.  
25  
o
Used for determining series termination value.  
7
W137  
48-MHz and 24-MHz Clock Outputs (Lump Capacitance Test Load = 20 pF)  
CPU = 66.6/100 MHz  
Parameter  
Description  
Test Condition/Comments  
Min.  
Typ.  
Max.  
Unit  
f
Frequency, Actual  
Determined by PLL divider ratio (see n/m below)  
48.008  
24.004  
MHz  
f
Deviation from 48 MHz  
PLL Ratio  
(48.008 48)/48  
+167  
ppm  
D
m/n  
(14.31818 MHz x 57/17 = 48.008 MHz)  
Measured from 0.4V to 2.4V  
57/17, 57/34  
t
t
t
f
Output Rise Edge Rate  
Output Fall Edge Rate  
Duty Cycle  
0.5  
0.5  
45  
2
2
V/ns  
V/ns  
%
R
Measured from 2.4V to 0.4V  
F
Measured on rising and falling edge at 1.5V  
Assumes full supply voltage reached within 1 ms  
55  
3
D
Frequency Stabilization  
ms  
ST  
from Power-up (cold start) from power-up. Short cycles exist prior to  
frequency stabilization.  
Z
AC Output Impedance  
Average value during switching transition. Used  
for determining series termination value.  
25  
o
Ordering Information  
Package  
Name  
Ordering Code  
Package Type  
28-pin SSOP (209 mils)  
28-pin TSSOP (173 mils)  
W137  
H
X
Intel is a registered trademark of Intel Corporation.  
Document #: 38-00821  
8
W137  
Package Diagrams  
28-Pin Thin Small Shrink Outline Package (TSSOP, 173 mils)  
9
W137  
Package Diagrams (continued)  
28-Pin Small Shrink Outline Package (SSOP, 209 mils)  
© Cypress Semiconductor Corporation, 1999. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use  
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize  
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress  
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.  

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W137HT

FTG for Mobile 440BX & Transmeta’s Crusoe CPU

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SPECTRALINEAR

W137HT

Processor Specific Clock Generator, 100MHz, CMOS, PDSO28, 0.209 INCH, SSOP-28

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CYPRESS

W137XT

Processor Specific Clock Generator, 100MHz, CMOS, PDSO28, 0.173 INCH, TSSOP-28

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CYPRESS

W1384AD/GD

Single Color LED, Green, Diffused, 3.4mm,

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KINGBRIGHT

W1384AD/ID

Single Color LED, High Efficiency Red, Diffused Red, 3.4mm,

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KINGBRIGHT

W1384AD/SRD

Single Color LED, Super Bright Red, Diffused Red, 3.4mm,

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KINGBRIGHT

W1384AD/YD

Single Color LED, Yellow, Diffused, 3.4mm,

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KINGBRIGHT

W1384AL/ID

Single Color LED, High Efficiency Red, Diffused Red, 3.4mm,

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KINGBRIGHT

W1387QMP/EGW

Dual Color LED, High Efficiency Red/green, Diffused White, 3.4mm, SURFACE MOUNT PACKAGE-2

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KINGBRIGHT

W1387QMP/GYW

Dual Color LED, Yellow/green, Diffused White, 3.4mm, SMT, 2 PIN

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KINGBRIGHT

W1387QMP/SGMBW

Dual Color LED, Super Bright Green/blue, Diffused White, 3.4mm, SURFACE MOUNT PACKAGE-2

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KINGBRIGHT