W137 [CYPRESS]
Bx Notebook System Frequency Synthesizer; BX笔记本系统频率合成器型号: | W137 |
厂家: | CYPRESS |
描述: | Bx Notebook System Frequency Synthesizer |
文件: | 总10页 (文件大小:177K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
W137
Bx Notebook System Frequency Synthesizer
PCI_F, PCI1:5 Output to Output Skew:........................500 ps
Features
PCI_F, PCI1:5 Cycle to Cycle Jitter:............................250 ps
• Maximized EMI suppression using Cypress’s Spread
Spectrum Technology
• Two copies of CPU output
• Six copies of PCI output (Synchronous w/CPU output)
• One 48-MHz output for USB support
• One selectable 24-/48-MHz output
• Two Buffered copies of 14.318-MHz input reference
signal
CPU to PCI Output Skew: ............... 1.5–4.0 ns (CPU Leads)
Output Duty Cycle: .................................................... 45/55%
PCI_F, PCI Edge Rate:.............................................. >1 V/ns
CPU_STOP#, OE, SPREAD#, SEL48#, PCI_STOP#,
PWR_DWN# all have a 250-kΩ pull-up resistor.
Table 1. Pin Selectable Frequency
• Supports 100-MHz or 66-MHz CPU operation
• Power management control input pins
• Available in 28-pin SSOP (209 mils)
• SS function can be disabled
SEL100/66#
OE
0
CPU
HI-Z
PCI
HI-Z
33.3
33.3
Spread%
Don’t Care
See Table 2
See Table 2
0/1
0
1
66.6 MHz
100 MHz
1
1
• See W40S11-02 for 2 SDRAM DIMM support
Key Specifications
Table 2. Spread Spectrum Feature
SPREAD#
Spread Profile
Supply Voltages: ....................................... V
V
= 3.3V±5%
= 2.5V±5%
DDQ3
DDQ2
0
1
–0.5% (down spread)
0% (spread disabled)
CPU0:1 Output to Output Skew: ................................ 175 ps
CPU0:1 Cycle to Cycle Jitter: ..................................... 200 ps
Block Diagram
Pin Configuration
2
X1
X2
XTAL
OSC
GND
X1
1
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VDDQ3
REF0:1
CPU0:3
2
REF0/SEL48#
REF1/SPREAD#
VDDQ2
X2
3
CPU_STOP#
PCI_F
PCI1
4
5
CPU0
STOP
Clock
Logic
4
2
PCI2
CPU1
6
GND
GND
7
VDDQ3
PCI3
GND
8
PCI_STOP#
VDDQ3
9
PCI4
10
11
12
13
14
PCI5
CPU_STOP#
PWR_DWN#
SEL100/66#
GND
÷2
CPUdiv2_0:1
3V66_0:3
SPREAD#
SEL0
VDDQ3
48MHz
24/48MHz/OE
PLL 1
SEL1
STOP
Clock
Logic
4
SEL133/100#
÷2/÷1.5
1
7
PCI_F
PCI1:7
STOP
Clock
Logic
÷2
PWRDWN#
PCI_STOP#
3
Power
Down
Logic
÷2
IOAPIC0:2
Three-state
Logic
1
PLL2
48MHz
Cypress Semiconductor Corporation
•
3901 North First Street
•
San Jose
•
CA 95134
•
408-943-2600
October 12, 1999, rev. **
W137
Pin Definitions
Pin
No.
Pin
Type
Pin Name
Pin Description
CPU0:1
24, 23
O
O
O
I
CPU Clock Outputs 0 and 1: These two CPU clock outputs are controlled by the
CPU_STOP# control pin. Output voltage swing is controlled by voltage applied to
VDDQ2. Frequency is selected per Table 1.
PCI1:5
5, 6, 9, 10,
11
PCI Bus Clock Outputs 1 through 5: These five PCI clock outputs are controlled
by the PCI_STOP# control pin. Output voltage swing is controlled by voltage applied
to VDDQ3. Frequency is selected per Table 1.
PCI_F
4
Fixed PCI Clock Output: Unlike PCI1:5 outputs, this output is not controlled by the
PCI_STOP# control pin; it cannot be forced LOW by PCI_STOP#. Output voltage
swing is controlled by voltage applied to VDDQ3. Frequency is selected per Table 1.
CPU_STOP#
PCI_STOP#
REF0/SEL48#
18
20
27
CPU_STOP# Input: When brought LOW, clock outputs CPU0:1 are stopped LOW
after completing a full clock cycle (2–3 CPU clock latency). When brought HIGH,
clock outputs CPU0:1 start with a full clock cycle (2–3 CPU clock latency).
I
PCI_STOP# Input: The PCI_STOP# input enables the PCI1:5 outputs when HIGH
and causes them to remain at logic 0 when LOW. The PCI_STOP# signal is latched
on the rising edge of PCI_F. Its effect takes place on the next PCI_F clock cycle.
I/O
I/O Dual-Function REF0 and SEL48# Pin: Upon power-up, the state of SEL48# is
latched. The state is set by either a 10K resistor to GND or to V . A 10K resistor to
DD
GND causes pin 14 to provide a 48-MHz clock. If the pin is strapped to V , pin 14
DD
will provide a 24-MHz clock. After 2 ms, the pin becomes a high-drive output that
produces a copy of 14.318 MHz.
REF1/SPREAD#
24/48MHz/OE
26
14
I/O
I/O
I/O Dual-Function REF1 and SPREAD# Pin: Upon power-up, the state of
SPREAD# is latched. The state is set by either a 10K resistor to GND or to V . A
10K resistor to GND enables Spread Spectrum function. If the pin is strapped to V
Spread Spectrum is disabled. After 2 ms, the pin becomes a high-drive output that
produces a copy of 14.318 MHz.
DD
,
DD
I/O Dual-Function 24-MHz or 48-MHz Output and Output Enable Input: Upon
power-up, the state of pin 14 is latched. The state is set by either a 10K resistor to
GND or to V . A 10K resistor to GND latches OE LOW, and all outputs are three-
DD
stated. If the pin is strapped to V , OE is latched HIGH and all outputs are active.
DD
After 2 ms, the pin becomes an output whose frequency is set by the state of pin 27
on power-up.
48MHz
SEL100/66#
X1
13
16
2
O
I
48-MHz Output: Fixed 48-MHz USB output. Output voltage swing is controlled by
voltage applied to VDDQ3.
Frequency Selection Input:Selectpower-up defaultCPU clock frequency as shown
in Table 1.
I
Crystal Connection or External Reference Frequency Input: This pin can either
be used as a connection to a crystal or to a reference signal.
X2
3
I
Crystal Connection: An input connection for an external 14.318-MHz crystal. If
using an external reference, this pin must be left unconnected.
PWR_DWN#
17
I
Power Down Control: When this input is LOW, device goes into a low-power standby
condition. All outputs are held LOW. CPU and PCI clock outputs are stopped LOW
after completing a full clock cycle (2–3 CPU clock cycle latency). When brought
HIGH, CPU and PCI outputs start with a full clock cycle at full operating frequency
(3 ms maximum latency).
VDDQ3
VDDQ2
GND
8, 12, 19, 28
25
P
P
G
Power Connection: Connected to 3.3V.
Power Connection: Power supply for CPU0:1 output buffers. Connected to 2.5V.
Ground Connection: Connect all ground pins to the common system ground plane.
1, 7, 15, 21,
22
2
W137
Figure 2 show two suggested methods for strapping resistor
connection.
Overview
The W137 was developed to meet the Intel® Mobile Clock
specification for the BX chipset, including Super I/O and USB
support. The W40S11-02 is the Intel-defined companion part
used for driving 2 SDRAM DIMM modules. Please see that
data sheet for additional information.
Upon W137 power-up, the first 2 ms of operation is used for
input logic selection. During this period, the output buffers are
three-stated, allowing the output strapping resistor on each l/O
pin to pull the pin and its associated capacitive clock load to
either a logic HIGH or logic LOW state. At the end of the 2-ms
period, the established logic 0 or 1 condition of each l/O pin is
then latched. Next, the output buffers are enabled, which con-
verts both l/O pins into operating clock outputs. The 2-ms timer
Cypress’s proprietary spread spectrum frequency synthesis
technique is a feature of the CPU and PCI outputs. When en-
abled, this feature reduces the peak EMI measurements of not
only the output signals and their harmonics, but also of any
other clock signals that are properly synchronized to them.
The –0.5% modulation profile matches that defined as accept-
able in Intel’s clock specification.
is started when V reaches 2.0V. The input latches can only
DD
be reset by turning V off and then back on again.
DD
It should be noted that the strapping resistors have no signifi-
cant effect on clock output signal integrity. The drive imped-
ance of the clock output is <40Ω (nominal) which is minimally
Functional Description
affected by the 10-kΩ strap to ground or V . As with the se-
DD
ries termination resistor, the output strapping resistor should
be placed as close to the l/O pin as possible in order to keep
the interconnecting trace short. The trace from the resistor to
I/O Pin Operation
Pins 14, 26, and 27 are dual-purpose l/O pins. Upon power-up
these pins act as logic inputs, allowing the determination of
assigned device functions. A short time after power-up, the
logic state of each pin is latched and the pins then become
clock outputs. This feature reduces device pin count by com-
bining clock outputs with input select pins.
ground or V should be kept less than two inches in length to
DD
prevent system noise coupling during input logic sampling.
When the clock outputs are enabled following the 2-ms input
period, target (normal) output frequency is delivered assuming
that V has stabilized. If V
has not yet reached full value,
DD
DD
An external 10-kΩ “strapping” resistor is connected between
each l/O pin and ground or V . Connection to ground sets a
latch to “0”, connection to V sets a latch to “1”. Figure 1 and
output frequency initially may be below target but will increase
to target once V voltage has stabilized. In either case, a
DD
DD
DD
short output clock cycle may be produced from the CPU clock
outputs when the outputs are enabled.
V
DD
Output Strapping Resistor
Series Termination Resistor
10 k
Ω
(Load Option 1)
Clock Load
W137
Output
Buffer
R
Power-on
Reset
Timer
Hold
Output
Low
Output Three-state
10 k
(Load Option 0)
Ω
Q
D
Data
Latch
Figure 1. Input Logic Selection Through Resistor Load Option
Jumper Options
Output Strapping Resistor
V
DD
Series Termination Resistor
10 kΩ
Clock Load
W137
R
Output
Buffer
Power-on
Reset
Timer
Hold
Output
Low
Output Three-state
Q
D
Data
Latch
Figure 2. Input Logic Selection Through Jumper Option
3
W137
Where P is the percentage of deviation and F is the frequency
in MHz where the reduction is measured.
Spread Spectrum Clocking
The device generates a clock that is frequency modulated in
order to increase the bandwidth that it occupies. By increasing
the bandwidth of the fundamental and its harmonics, the am-
plitudes of the radiated electromagnetic emissions are re-
duced. This effect is depicted in Figure 3.
The output clock is modulated with a waveform depicted in
Figure 4. This waveform, as discussed in “Spread Spectrum
Clock Generation for the Reduction of Radiated Emissions” by
Bush, Fessler, and Hardin produces the maximum reduction
in the amplitude of radiated electromagnetic emissions. The
deviation selected for this chip is –0.5% of the selected fre-
quency. Figure 4 details the Cypress spreading pattern.
Cypress does offer options with more spread and greater EMI
reduction. Contact your local Sales representative for details
on these devices.
As shown in Figure 3, a harmonic of a modulated clock has a
much lower amplitude than that of an unmodulated signal. The
reduction in amplitude is dependent on the harmonic number
and the frequency deviation or spread. The equation for the
reduction is
dB = 6.5 + 9*log (P) + 9*log (F)
Spread Spectrum clocking is activated or deactivated through
I/O pin #26.
10
10
EMI Reduction
Spread
Spectrum
Enabled
Non-
Spread
Spectrum
Figure 3. Clock Harmonic with and without SSCG Modulation Frequency Domain Representation
MAX
MIN
Figure 4. Typical Modulation Profile
4
W137
Absolute Maximum Ratings
Stresses greater than those listed in this table may cause per-
manent damage to the device. These represent a stress rating
above those specified in the operating sections of this specifi-
cation is not implied. Maximum conditions for extended peri-
ods may affect reliability.
only. Operation of the device at these or any other conditions
.
Parameter
Description
Voltage on any pin with respect to GND
Storage Temperature
Rating
–0.5 to +7.0
–65 to +150
0 to +70
Unit
V
V
, V
DD IN
T
°C
°C
°C
kV
STG
T
Operating Temperature
A
T
Ambient Temperature under Bias
Input ESD Protection
–55 to +125
2 (min.)
B
ESD
PROT
DC Electrical Characteristics:
T = 0°C to +70°C; V
= 3.3V±5%; V = 2.5V±5%; CPU0:1 = 66.6/100 MHz
A
DDQ3
DDQ2
Parameter
Description
Test Condition
Min.
Typ.
Max.
Unit
Supply Current
I
I
I
I
3.3V Supply Current in Power-down mode
3.3V Supply Current
PWR_DWN# = 0
1
80
5
100
45
1
mA
mA
mA
mA
DD3PD
DD3
[1]
Outputs Loaded
Outputs Loaded
[1]
2.5V Supply Current
30
DD2
2.5V Supply Current in Power-down mode
PWR_DWN# = 0
0.2 µA
DD2PD
Logic Inputs
V
V
Input Low Voltage
Input High Voltage
GND – 0.3
0.8
V
IL
2.0
V
+ 0.3
DD
V
IH
[2]
I
I
I
I
Input Low Current
–25
10
µA
µA
µA
µA
IL
[2]
Input High Current
IH
IL
Input Low Current (SEL100/66#)
Input High Current (SEL100/66#)
–5
+5
IH
Clock Outputs
V
Output Low Voltage
Output High Voltage
I
I
= 1 mA
50
mV
V
OL
OL
V
PCI_F, PCI1:5,
REF0:1
= –1 mA
3.1
OH
OH
V
Output High Voltage
Output Low Current:
CPU0:1
I
= –1 mA
2.2
80
70
50
80
70
50
V
OH
OH
I
CPU0:1
V
= 1.25V
= 1.5V
= 1.5V
= 1.25V
= 1.5V
= 1.5V
120
110
70
180
140
90
mA
mA
mA
mA
mA
mA
OL
OL
PCI_F, PCI1:5
REF0:1
V
OL
V
OL
I
Output High Current
CPU0:1
V
120
110
70
180
140
90
OH
OH
PCI_F, PCI1:5
REF0:1
V
OH
V
OH
Crystal Oscillator
X1 Input Threshold Voltage
[3]
V
VDDQ3 = 3.3V
1.65
14
V
TH
[4]
C
C
Load Capacitance, As Seen by External Crystal
pF
pF
LOAD
IN,X1
[5]
X1 Input Capacitance
Pin X2 unconnected
28
Notes:
1. All clock outputs loaded with 6" 60Ω transmission lines with 20-pF capacitors.
2. CPU_STOP#, PCI_STOP#, PWR_DWN#, SPREAD#, and SEL48# logic inputs have internal pull-up resistors (not CMOS level).
3. X1 input threshold voltage (typical) is VDD/2.
4. The W137 contains an internal crystal load capacitor between pin X1 and ground and another between pin X2 and ground. Total load placed on crystal is
14 pF; this includes typical stray capacitance of short PCB traces to crystal.
5. X1 input capacitance is applicable when driving X1 with an external clock source (X2 is left unconnected).
5
W137
DC Electrical Characteristics: (continued)
T = 0°C to +70°C; V
= 3.3V±5%; V = 2.5V±5%; CPU0:1 = 66.6/100 MHz
A
DDQ3
DDQ2
Parameter
Description
Test Condition
Min.
Typ.
Max.
Unit
Pin Capacitance/Inductance
C
C
Input Pin Capacitance
Except X1 and X2
5
6
7
pF
pF
nH
IN
Output Pin Capacitance
Input Pin Inductance
OUT
IN
L
AC Electrical Characteristics
T = 0°C to +70°C; V
= 3.3V±5%; V
= 2.5V±5%; f
= 14.31818 MHz
XTL
A
DDQ3
DDQ2
AC clock parameters are tested and guaranteed over stated operating conditions using the stated lump capacitive load at the
clock output.
CPU Clock Outputs, CPU0:1 (Lump Capacitance Test Load = 20 pF)
CPU = 66.6 MHz
CPU = 100 MHz
Parameter
Description
Period
Test Condition/Comments
Measured on rising edge at 1.25V
Duration of clock cycle above 2.0V
Duration of clock cycle below 0.4V
Min. Typ. Max. Min. Typ. Max. Unit
t
15
5.2
5.0
1
15.5
10
3.0
2.8
1
10.5
ns
ns
P
H
L
t
t
t
t
t
High Time
Low Time
ns
Output Rise Edge Rate Measured from 0.4V to 2.0V
Output Fall Edge Rate Measured from 2.0V to 0.4V
4
4
4
4
V/ns
V/ns
%
R
F
D
1
1
Duty Cycle
Measured on rising and falling edge at
45
55
45
55
1.25V
t
Jitter, Cycle-to-Cycle
Measured on rising edge at 1.25V. Max-
imum difference of cycle time between
two adjacent cycles.
200
200
ps
JC
t
f
Output Skew
Measured on rising edge at 1.25V
175
3
175
3
ps
SK
FrequencyStabilization Assumes full supply voltage reached
from Power-up (cold
start)
ms
ST
within 1 ms from power-up. Shortcycles
exist prior to frequency stabilization.
Z
AC Output Impedance Average value during switching transi-
tion. Used for determining series termi-
nation value.
13.5
13.5
Ω
o
6
W137
PCI Clock Outputs, PCI1:5 and PCI_F (Lump Capacitance Test Load = 30 pF)
CPU = 66.6/100 MHz
Parameter
Description
Period
Test Condition/Comments
Measured on rising edge at 1.5V
Duration of clock cycle above 2.4V
Duration of clock cycle below 0.4V
Min.
30
Typ.
Max.
Unit
ns
t
P
t
t
t
t
t
t
High Time
Low Time
12.0
12.0
1
ns
H
L
ns
Output Rise Edge Rate Measured from 0.4V to 2.4V
Output Fall Edge Rate Measured from 2.4V to 0.4V
4
4
V/ns
V/ns
%
R
F
1
Duty Cycle
Measured on rising and falling edge at 1.5V
45
55
250
D
JC
Jitter, Cycle-to-Cycle
Measured on rising edge at 1.5V. Maximum differ-
ence of cycle time between two adjacent cycles.
ps
t
t
Output Skew
Measured on rising edge at 1.5V
500
4.0
ps
ns
SK
CPU to PCI Clock
Offset
Covers all CPU/PCI outputs. Measured on rising
edge at 1.5V. CPU leads PCI output.
1.5
O
f
Frequency Stabiliza-
tion from Power-up
(cold start)
Assumes full supply voltage reached within 1 ms
from power-up. Short cycles exist prior to frequency
stabilization.
3
ms
ST
Z
AC Output Impedance Average value during switching transition. Used for
determining series termination value.
20
Ω
o
REF0:1 Clock Output (Lump Capacitance Test Load = 20 pF)
CPU = 66.6/100 MHz
Parameter
Description
Frequency, Actual
Output Rise Edge Rate
Output Fall Edge Rate
Duty Cycle
Test Condition/Comments
Determined by crystal oscillator frequency
Measured from 0.4V to 2.4V
Min.
Typ.
Max.
Unit
MHz
V/ns
V/ns
%
f
14.318
t
t
t
f
0.5
0.5
45
2
2
R
Measured from 2.4V to 0.4V
F
Measured on rising and falling edge at 1.5V
55
3
D
Frequency Stabilization
Assumes full supply voltage reached within
ms
ST
from Power-up (cold start) 1 ms from power-up. Short cycles exist prior to
frequency stabilization.
Z
AC Output Impedance
Average value during switching transition.
25
Ω
o
Used for determining series termination value.
7
W137
48-MHz and 24-MHz Clock Outputs (Lump Capacitance Test Load = 20 pF)
CPU = 66.6/100 MHz
Parameter
Description
Test Condition/Comments
Min.
Typ.
Max.
Unit
f
Frequency, Actual
Determined by PLL divider ratio (see n/m below)
48.008
24.004
MHz
f
Deviation from 48 MHz
PLL Ratio
(48.008 – 48)/48
+167
ppm
D
m/n
(14.31818 MHz x 57/17 = 48.008 MHz)
Measured from 0.4V to 2.4V
57/17, 57/34
t
t
t
f
Output Rise Edge Rate
Output Fall Edge Rate
Duty Cycle
0.5
0.5
45
2
2
V/ns
V/ns
%
R
Measured from 2.4V to 0.4V
F
Measured on rising and falling edge at 1.5V
Assumes full supply voltage reached within 1 ms
55
3
D
Frequency Stabilization
ms
ST
from Power-up (cold start) from power-up. Short cycles exist prior to
frequency stabilization.
Z
AC Output Impedance
Average value during switching transition. Used
for determining series termination value.
25
Ω
o
Ordering Information
Package
Name
Ordering Code
Package Type
28-pin SSOP (209 mils)
28-pin TSSOP (173 mils)
W137
H
X
Intel is a registered trademark of Intel Corporation.
Document #: 38-00821
8
W137
Package Diagrams
28-Pin Thin Small Shrink Outline Package (TSSOP, 173 mils)
9
W137
Package Diagrams (continued)
28-Pin Small Shrink Outline Package (SSOP, 209 mils)
© Cypress Semiconductor Corporation, 1999. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
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